Vapor chamber, radiator and electronic equipment

Abstract

The utility model discloses a vapor chamber, a radiator and electronic equipment, and the vapor chamber comprises a heat exchange part which stores a heat transfer working medium which can be converted between a gas phase and a liquid phase; and the liquid storage chamber communicates with the heat exchange part, and a heat transfer working medium is stored in the liquid storage chamber so as to supplement the heat transfer working medium. According to the vapor chamber, the problem that heat efficiency becomes poor due to boiling and condensation long-term circulation heat exchange can be solved, meanwhile, flow resistance and air resistance losses of air and liquid particles in the vapor chamber can be reduced, and the heat efficiency and the service life of the whole vapor chamber are guaranteed from the macroscopic level to the microscopic level.

Description

Technical Field

[0001] The utility model relates to the technical field of heat transfer, in particular to a heat pipe and a radiator and an electronic device with the heat pipe. Background Art

[0002] The common heat dissipation methods of a notebook computer are air convection heat dissipation, liquid convection heat dissipation, and gas-liquid phase change convection heat dissipation. Among them, the heat transfer coefficient of gas-liquid phase change convection heat dissipation is the highest. At present, CPUs, GPUs, MOS transistors, inductors, etc. are developing towards functional integration, miniaturized packaging, and high input / output power and high power consumption, making it more challenging to design ultra-thin e-sports game notebooks. Heat pipes are widely used because they have higher heat transfer efficiency and can take away more heat in the same space.

[0003] The common design idea for designing ultra-thin e-sports game notebooks on the market is that after the heat pipe absorbs the heat of the heat source, the heat is conducted to the end of the heat pipe, and the heat at the end of the heat pipe is then transferred to the fins at both ends of the heat dissipation module, and then the heat on the fins at both ends is taken out by fan convection. However, such a design also has deficiencies:

[0004] After the heat pipe absorbs the heat of the heat source, the high-temperature liquid in the cavity is easily evaporated and participates in condensation heat transfer after contacting the condensation end. The original heat pipe design has a liquid injection port, but after evacuating and injecting liquid as the heat transfer medium, the liquid injection port will be sealed. During the operation of the heat pipe, the cycle of boiling, evaporation, and condensation continuously occurs. After long-term cyclic operation, the filled liquid will decrease or even be depleted. Once the filled liquid is insufficient, the heat transfer between the boiling end and the condensation end will be greatly reduced. Microscopically, the interaction between the vaporized particles in the endothermic evaporation part and the liquid particles at the condensation end will be weakened. The liquid content of the heat pipe decreases, affecting the heat transfer performance of the heat pipe, making the heat transfer limit of the heat pipe smaller, and ultimately resulting in a reduction in the energy efficiency of the heat pipe. Content of the Utility Model

[0005] The utility model aims to solve at least one of the technical problems existing in the prior art.

[0006] The additional aspects and advantages of the utility model will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the utility model.

[0007] In the first aspect of the utility model, a heat pipe structure is disclosed, including: a heat exchange part that stores a heat transfer working medium that can be converted between a gas phase and a liquid phase; a liquid storage chamber that is connected to the heat exchange part and stores the heat transfer working medium to supplement the heat transfer working medium.

[0008] In one embodiment, the heat exchange part includes a first heat exchange part. After the heat transfer working medium absorbs the heat emitted by the heat source in the first heat exchange part, it changes from a liquid phase to a gas phase. The liquid storage chamber is connected to the first heat exchange part to supplement the heat transfer working medium in the first heat exchange part.

[0009] In one embodiment, the heat exchange part includes a second heat exchange part. The second heat exchange part is connected to the first heat exchange part, and the liquid storage chamber is connected to the second heat exchange part to supplement the heat transfer working medium in the second heat exchange part.

[0010] In one embodiment, along the direction perpendicular to the heat exchange part, the thickness of the liquid storage chamber is h1, and the thickness of the heat exchange part is h2, where h1 > h2.

[0011] In one embodiment, the liquid storage chamber is connected to the end of the second heat exchange part.

[0012] In one embodiment, it further includes an upper cover plate and a lower cover plate. The upper cover plate and the lower cover plate enclose a sealed cavity by welding.

[0013] In one embodiment, the upper cover plate and the lower cover plate are provided with liquid injection ports at corresponding positions of the first heat exchange part.

[0014] In one embodiment, a capillary structure is clamped between the upper cover plate and the lower cover plate. The capillary structure is used to conduct the heat transfer working medium to condense and flow back to the first heat exchange part.

[0015] In one embodiment, the capillary structure includes a capillary net and a heat absorption and evaporation plate. The capillary net is laid under the upper cover plate, and the heat absorption and evaporation plate is a capillary structure sintered with metal powder and is attached to the lower cover plate.

[0016] The heat pipe of the present utility model aims to optimize the deficiencies of the prior art. Two liquid storage chambers are provided at the left and right ends of the heat pipe, and the thickness in the vertical direction is increased compared to the thickness of the heat pipe. In this way, there is liquid storage space at both ends of the heat pipe. When the filling liquid evaporates and boils and decreases, the liquid in the storage chamber will flow towards the boiling end due to the capillary force, so that the heat pipe can always maintain a moderate liquid filling level. A sufficient amount of liquid working medium exists in the heat pipe, enabling strong convective heat transfer to continuously occur between the first heat exchange part and the second heat exchange part. At the same time, the bubbles boiling at the first heat exchange part break and flow into the liquid storage chamber of the second heat exchange part, and the disturbance of the liquid level of the second heat exchange part causes the thickness of the condensation film to decrease, strengthening the heat exchange capacity of the second heat exchange part. Secondly, the thickness of the liquid storage chamber is increased compared to the heat pipe, which is equivalent to an increase in the vertical radial volume. This helps to reduce the "liquid bridge" phenomenon at the heat exchange interface between the boiling bubbles and the second heat exchange part, and the gas-liquid flow resistance and pressure loss are also weakened, ultimately promoting the improvement of the heat exchange efficiency. Therefore, the heat pipe structure of the present utility model can avoid the problem of deteriorated thermal efficiency caused by long-term cyclic heat transfer of boiling and condensation, and at the same time can reduce the flow resistance and gas resistance loss of gas and liquid particles in the heat pipe, ensuring the thermal efficiency and service life of the entire heat pipe from macroscopic to microscopic.

[0017] In a second aspect, the present utility model provides a radiator. The radiator includes the heat pipe of the first aspect, and fins are provided at the part of the lower cover plate corresponding to the second heat exchange part. The fins are used to absorb the heat of the gas-phase heat transfer working medium, so that the gas-phase heat transfer working medium condenses into a liquid-phase heat transfer working medium.

[0018] The radiator provided by the present utility model improves the heat exchange efficiency of the heat pipe by adding two liquid storage chambers to the heat pipe, thereby improving the heat dissipation efficiency of the radiator and ensuring the heat dissipation efficiency of the entire radiator.

[0019] In a third aspect, the present utility model provides an electronic device, including the radiator of the second aspect and a fan. The fan is used to conduct the heat of the fins out of the radiator.

[0020] The electronic device provided by the present utility model can dissipate heat from the electronic device in a timely manner by configuring a radiator with a liquid storage chamber, thereby improving the working performance of the electronic device and extending its service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and / or additional aspects and advantages of the present utility model will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0022] Figure 1 is a schematic top view of a radiator structure;

[0023] Figure 2 is a schematic left side view of a radiator structure;

[0024] Figure 3 It is a schematic diagram of the upper surface of a heat pipe structure;

[0025] Figure 4 It is a schematic diagram of the left side of a heat pipe structure;

[0026] Figure 5 It is a schematic diagram of the 3D structure of a heat pipe;

[0027] Figure 6 It is an exploded view of the structure of the end liquid storage chamber of a heat pipe;

[0028] Figure 7 It is a schematic diagram of the principle of the structure of the end liquid storage chamber of a heat pipe;

[0029] Figure 8 It is a sectional view of the structure of the end liquid storage chamber of a heat pipe;

[0030] Reference numerals:

[0031] 1. Left fin, 2. Right fin, 3. Lower cover plate, 4. Liquid injection port, 5. Left liquid storage chamber, 6. Right liquid storage chamber, 7. Upper cover plate, 8. Capillary network, 9. Vapor-phase heat transfer working fluid, 10. Heat absorption and evaporation plate. Detailed implementation manners

[0032] In order to understand the features and technical content of the embodiments of the present invention in more detail, the implementation of the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for reference and illustration purposes only and are not used to limit the embodiments of the present invention. In the following technical description, for the sake of explanation, multiple details are provided to provide a full understanding of the disclosed embodiments. However, one or more embodiments can still be implemented without these details. In other cases, well-known structures and devices can be shown in a simplified manner to simplify the drawings.

[0033] Such as Figures 1-6As shown in the figure, the left fin 1 and the right fin 2 of the heat dissipation module mainly conduct the heat of the heat pipe to the outside of the system through the fan; the lower cover plate 3 of the heat pipe is in direct contact with the heat source and absorbs the heat of the heat source; the liquid injection port 4, and the liquid heat transfer working medium is filled into the heat pipe through the liquid injection port 4; the left liquid storage chamber 5 and the right liquid storage chamber 6 at the end of the heat pipe, and a part of the liquid injected through the liquid injection port 4 is stored here; the upper cover plate 7 of the heat pipe is connected to the edge of the lower cover plate 3 by welding; the capillary structure capillary mesh 8, specifically a mesh net, is used to passively drive the liquid condensate from the second heat exchange part to the first heat exchange part through capillary pressure, and can effectively distribute the liquid evenly to the entire evaporation part in the first heat exchange part; the gas-phase heat transfer working medium 9, the gas-phase medium absorbs heat and evaporates in the first heat exchange part, quickly transfers the heat to the cooling end of the radiator through the inner cavity of the heat pipe, releases the latent heat and then returns to the cavity of the heat pipe through the capillary structure of the second heat exchange part to complete the cycle; the heat absorption and evaporation plate 10 is the capillary structure copper powder attached to the lower cover plate 3 of the heat pipe, and has the same working principle as the capillary mesh 8, and also plays the role of providing capillary force.

[0034] Please refer to Figure 3 , the function of the lower cover plate 3 of the heat pipe is to absorb the heat generated by the heat source in the system, so that the liquid medium in the cavity evaporates and boils to produce a physical phase change, and the latent heat generated by the phase change conducts energy transfer in the cavity, and finally the heat is transferred to the end of the heat pipe. The left liquid storage chamber 5 and the right liquid storage chamber 6 at the end of the heat pipe are connected to the upper cover plate 7 of the heat pipe, and the internal heat transfer working medium is stored.

[0035] Please refer to Figure 6 , a capillary structure is clamped between the upper cover plate 7 and the lower cover plate 3. Along the capillary structure, the heat transfer working medium condenses and flows back to the first heat exchange part. The capillary structure includes the capillary mesh 8 and the heat absorption and evaporation plate 10. The capillary mesh 8 is laid under the upper cover plate 7, and the heat absorption and evaporation plate 10 is a capillary structure sintered with metal powder, and the heat absorption and evaporation plate 10 is attached to the lower cover plate 3. Among them, the capillary mesh 8 is the capillary structure mesh net in the liquid storage chambers 5 and 6 at the end of the heat pipe, and the capillary structure heat absorption and evaporation plate 10 in the liquid storage chambers 5 and 6 at the end of the heat pipe is copper powder. Due to the heating of the liquid in the cavity of the heat pipe, the filled liquid boils and vaporizes. After boiling and vaporizing in the first heat exchange part, the pressure increases. Compared with the second heat exchange part, there is a certain pressure difference. Under the action of the pressure difference, the gas-liquid working medium flows to the condensation and heat dissipation end, and transfers its own heat to the fins through the heat exchange with the left fin 1 and the right fin 2 of the second heat exchange part, and finally blows out of the system through the fan.

[0036] Meanwhile, since the heat of the gas in the heat pipe chamber is taken away, it condenses into a liquid working medium. Due to the existence of the left liquid storage chamber 5 and the right liquid storage chamber 6 at the end of the heat pipe, even if a small amount of the filling liquid boils and evaporates, there will still be liquid in the liquid storage chambers 5 and 6 flowing to the evaporation and boiling end through the capillary structure. In this way, the originally scarce liquid in the heat pipe can be replenished, preventing the interior of the heat pipe from drying out and avoiding the phenomenon that heat exchange between evaporation and the second heat exchange part cannot occur due to insufficient liquid inside the heat pipe.

[0037] In addition, please refer to Figure 4 、 Figures 6-7 , because the left liquid storage chamber 5 and the right liquid storage chamber 6 at the end of the heat pipe are thickened in the vertical diameter direction compared with the heat pipe chamber. Specifically, along the direction perpendicular to the heat exchange part, the thickness of the liquid storage chambers 5 and 6 is h1, and the thickness of the heat exchange part is h2, where h1 > h2. Since the first heat exchange part (i.e., the boiling end) and the second heat exchange part (i.e., the condensation end) of the heat pipe are interconnected in the same channel, a large number of bubbles are generated when the liquid in the chamber boils at a high temperature. With the massive rupture and regeneration of the bubbles, a "liquid bridge" phenomenon will occur between the bubbles at the boiling end and the liquid at the condensation end. This phenomenon will inhibit boiling and condensation heat transfer to a certain extent, and the gas-liquid flow resistance will increase, reducing the heat transfer coefficient of the boiling surface and the condensation surface, thereby limiting the heat transfer efficiency of the heat pipe. Therefore, the liquid storage chambers 5 and 6 are thickened in the vertical diameter direction. The increased volume is usually convenient for storing a small amount of filling liquid and can also prevent the steam expansion phenomenon at the end of the chamber. At the intersection of the first heat exchange part and the second heat exchange part, because two liquid storage chambers 5 and 6 are added to this heat pipe, the cross-sectional volume of the original integrally formed chamber is expanded, providing a more open space for the gas-liquid to flow and exchange heat. Moreover, the "liquid bridge" phenomenon generated in the narrow channel of the second heat exchange part can also be reduced. The expanded volume of the second heat exchange part for heat exchange reduces the gas-liquid flow resistance and pressure loss, improving the heat transfer efficiency of the entire heat pipe.

[0038] Please refer to Figures 6-8 , in an embodiment, the capillary mesh 8 in the structure of the liquid storage chambers 5 and 6 is a mesh net, laid under the upper cover plate 7 of the heat pipe, and the wire diameter is less than 0.1 mm. The heat absorption and evaporation plate 10 is copper powder, which is also distributed in the heat pipe chamber, with a particle size less than 250 um, and is firmly attached to the inner wall by high-temperature sintering. Specifically, the gas-liquid in the second heat exchange part of evaporation returns to the first heat exchange part under the capillary action of the capillary liquid absorption cores arranged in the left and right liquid storage chambers 5 and 6, continuously repeating the above steps to form a continuous cycle. This not only optimizes the condensation heat transfer in the liquid storage chambers 5 and 6, but also the capillary structure mesh net and powder added in the liquid storage chambers 5 and 6 can lock the liquid usually. When the first heat exchange part lacks liquid, it can be evenly distributed to the entire chamber through the capillary structure.

[0039] In one embodiment, the heat pipe is sealed and welded with a metal upper cover plate 7 and a lower cover plate 3. To balance the ultra-high thermal conductivity, good processability, easy welding, and cost-effectiveness advantages of the heat pipe, the shell material is selected as oxygen-free copper C1020 with a relatively high thermal conductivity and is subjected to antioxidant treatment. The reason for choosing oxygen-free copper is mainly that it contains a relatively high content of oxygen elements, which exist in the form of eutectic between copper atoms, increasing the fatigue limit and plastic strength of copper. From the perspective of heat transfer, this is conducive to the heat of the heat source being transferred to the first heat exchange part, and the heat of the first heat exchange part is more quickly conducted to the inside of the heat pipe, reducing the thermal resistance of the material layer of the upper and lower covers inside the heat pipe. Before the heat pipe is sealed, vacuum treatment is performed at the liquid injection port 4 to ensure a good vacuum degree, and an appropriate amount of phase change medium pure water is filled as the medium. The reason for choosing pure water as the medium is to consider the phase change temperature, wettability, and compatibility with the capillary core of the medium. Pure water does not chemically react with the upper cover plate 7 of the heat pipe, the lower cover plate 3 of the heat pipe, the capillary network 8, and the heat absorption and evaporation plate 10, is relatively stable, and also prevents the influence of media such as air and ions dissolved in the water on the heat pipe.

[0040] The key points of the present utility model are the left liquid storage chamber structure 5 and the right liquid storage chamber structure 6 at the end of the heat pipe, which make up for the reduction of the pure water medium originally caused by the boiling and evaporation of the first heat exchange part inside the heat pipe, and prevent the phenomenon that the liquid medium reaching the second heat exchange part decreases or even dries up as the medium evaporates. Moreover, the reduction of the medium in the second heat exchange part will cause the evaporation and condensation processes to be independent of each other and not affect each other, resulting in a weakening of the heat exchange in the second heat exchange part. The small amount of heat transfer working medium pure water existing in the left and right liquid storage chamber structures 5 and 6 can play a role in this process. The supplementary water will flow from the second heat exchange part to the first heat exchange part, strengthening the condensation heat exchange while ensuring the efficiency of the boiling heat exchange. In addition, when the first heat exchange part intersects with the second heat exchange part, the liquid in contact with the capillary core structure inside the heat pipe and the wall surface of the heat pipe reaches the critical saturation temperature and generates boiling bubbles, which is the common "liquid bridge and liquid film" phenomenon. The critical boiling bubbles will leave the liquid surface, blocking the integration of the boiling heat exchange and the condensation heat exchange, resulting in a sharp increase in the heat transfer resistance, and then the temperature of the heat pipe surface will also rise rapidly. In the present utility model, the liquid storage chamber structures 5 and 6 at the end of the heat pipe provide a wider channel for the original heat pipe cavity. The liquid storage chamber structures 5 and 6 are thicker than the radial dimension of the heat pipe, increasing the volume of the evaporation surface and the condensation surface and reducing the diffusion thermal resistance, reducing the fluid flow resistance and the flow pressure loss. The boiling bubbles can also be dispersed to the ends of the two liquid storage chambers 5 and 6, so that they will not cause more interference to the boiling and condensation heat exchanges, increasing the heat transfer efficiency of the heat pipe.

[0041] In one embodiment, the liquid storage chambers 5 and 6 are communicated with the first heat exchange part to supplement the evaporated heat transfer working medium, so as to ensure that there is sufficient liquid in the first heat exchange part for evaporation and heat absorption, thereby enhancing the heat absorption capacity of the first heat exchange part.

[0042] In another embodiment, the liquid storage chambers 5 and 6 are communicated with the second heat exchange part, that is, the area of the condensation end is enlarged, so that the volume of heat exchange of the second heat exchange part is enlarged. Due to the evaporation of the liquid-phase heat transfer working medium in the first heat exchange part, the liquid medium reaching the second heat exchange part is reduced or even dried up, and the reduction of the medium in the second heat exchange part will cause the evaporation and condensation to be independent of each other and not affect each other. In this way, the heat exchange of the second heat exchange part will be weakened. The communication between the liquid storage chambers 5 and 6 and the second heat exchange part can enlarge the area of the condensation zone, enhance the condensation and reflux of the gas-phase working medium, reduce the gas-liquid flow resistance and pressure loss, improve the heat transfer efficiency of the whole heat pipe, and at the same time, can supplement the liquid quality moisture to the second heat exchange part to ensure sufficient reflux liquid, and introduce the liquid-phase heat transfer working medium into the first heat exchange part for heat absorption through the capillary structure, thereby enhancing the gas-liquid circulation rate in the heat pipe.

[0043] In the present utility model, two liquid storage chambers 5 and 6 are arranged at the left and right ends of the heat pipe, and the vertical diameter direction is thickened compared with the thickness of the heat pipe. In this way, there is liquid storage space at both ends of the heat pipe. When the filling liquid evaporates and boils and decreases, the liquid in the storage chamber will flow to the boiling end due to the action of capillary force, so that the heat pipe can always maintain a moderate filling level. The sufficient liquid working medium exists in the heat pipe, so that strong convective heat transfer can continuously occur between the evaporation surface and the condensation surface. At the same time, the bubbles boiling on the evaporation surface break and flow into the liquid storage chambers 5 and 6 of the second heat exchange part, and the disturbance of the liquid surface of the second heat exchange part causes the thickness of the condensation film to be thinned, strengthening the heat exchange capacity of the second heat exchange part. Secondly, the liquid storage chambers 5 and 6 are increased in thickness compared with the heat pipe, which is equivalent to an increase in the vertical diameter volume. This helps to reduce the "liquid bridge" phenomenon at the heat exchange junction of the boiling bubbles and the second heat exchange part, and the gas-liquid flow resistance and pressure loss are also weakened, ultimately promoting the improvement of the heat exchange efficiency. Therefore, the liquid storage chambers 5 and 6 at the ends of the heat pipe of the present utility model can avoid the problem of poor heat efficiency caused by long-term cyclic heat exchange of boiling and condensation, and at the same time can reduce the gas-liquid particle flow resistance and gas resistance loss in the heat pipe, ensuring the heat efficiency and service life of the whole heat pipe from macro to micro.

[0044] Second, the present utility model provides a radiator. Please refer to Figures 1-2 , the radiator includes the heat pipe structure of the first aspect, and fins are arranged on the part of the lower cover plate 3 corresponding to the second heat exchange part. The fins are used to absorb the heat of the gas-phase heat transfer working medium, so that the gas-phase heat transfer working medium is condensed into the liquid-phase heat transfer working medium.

[0045] The heat sink provided by the present utility model improves the heat exchange efficiency of the heat spreader by adding two heat spreaders with liquid storage chambers 5 and 6, thereby improving the heat dissipation efficiency of the heat sink and ensuring the heat dissipation efficiency of the entire heat sink.

[0046] In a third aspect, the present utility model provides an electronic device, including the heat sink of the second aspect and a fan, and the fan is used to conduct the heat of the fins out of the heat sink.

[0047] The electronic device provided by the present utility model can dissipate heat from the electronic device in a timely manner by configuring a heat sink with liquid storage chambers 5 and 6, thereby improving the working performance of the electronic device and extending its service life.

[0048] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments" or "examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless otherwise clearly specified in the context, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "include" and / or "comprise" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0049] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by orientation words such as "upper, lower, left, right", "horizontal, vertical, perpendicular, horizontal", etc. is usually based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description. Without contrary instructions, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the protection scope of the present utility model; the orientation words "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0050] Although the embodiments of the present utility model have been shown and described above, the above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A temperature equalizing plate, characterized in that: include: A heat exchange part storing a heat transfer medium that can be converted between a gas phase and a liquid phase; A liquid storage chamber is communicated with the heat exchange part, and the heat transfer medium is stored in the liquid storage chamber to replenish the heat transfer medium.

2. The temperature equalizing plate according to claim 1, characterized in that: The heat exchange part includes a first heat exchange part, and the heat transfer medium is transformed from liquid phase to gas phase after absorbing heat from a heat source in the first heat exchange part. The liquid storage chamber is connected to the first heat exchange part to replenish the heat transfer medium in the first heat exchange part.

3. The temperature equalizing plate according to claim 2, characterized in that: The heat exchange part includes a second heat exchange part, the second heat exchange part is communicated with the first heat exchange part, and the liquid storage chamber is communicated with the second heat exchange part to replenish the heat transfer medium in the second heat exchange part.

4. The temperature equalizing plate according to claim 2 or 3, characterized in that: Along the direction perpendicular to the heat exchange part, the thickness of the liquid storage chamber is h1, the thickness of the heat exchange part is h2, and h1>h2.

5. The temperature homogenizing plate according to claim 3, characterized in that: The liquid storage chamber is communicated with a terminal end of the second heat exchange portion.

6. The temperature equalizing plate according to claim 2, characterized in that: It also includes an upper cover plate and a lower cover plate, and the upper cover plate and the lower cover plate are welded together to form a sealed cavity.

7. The temperature equalizing plate according to claim 6, characterized in that: The upper cover plate and the lower cover plate are provided with liquid injection ports at positions corresponding to the first heat exchange part.

8. The temperature equalizing plate according to claim 6, characterized in that: A capillary structure is sandwiched between the upper cover plate and the lower cover plate, and the capillary structure is used to conduct the heat transfer medium to condense and flow back to the first heat exchange part.

9. The temperature equalizing plate according to claim 8, characterized in that: The capillary structure comprises a capillary net and a heat absorbing evaporation plate, wherein the capillary net is laid under the upper cover plate, the heat absorbing evaporation plate is a capillary structure sintered by metal powder, and the heat absorbing evaporation plate is attached to the lower cover plate.

10. A radiator, characterized in that: It includes the temperature averaging plate as described in any one of claims 1 to 9, the heat exchange part includes a second heat exchange part, the temperature averaging plate includes an upper cover plate and a lower cover plate, and the portion of the lower cover plate corresponding to the second heat exchange part is provided with fins, and the fins are used to absorb the heat of the gas phase of the heat transfer medium, thereby condensing the gas phase of the heat transfer medium into the liquid phase of the heat transfer medium.

11. An electronic device, characterized in that: It comprises the heat sink as claimed in claim 10 and a fan, wherein the fan is used to conduct the heat absorbed by the fins out of the heat sink.

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