Fingerprint packaging module and fingerprint card

Abstract

The utility model discloses a fingerprint packaging module and a fingerprint card comprising the fingerprint packaging module, the fingerprint card is provided with an open slot, the fingerprint packaging module is embedded in the open slot, a first carrier tape is fixed on the inner wall of the open slot, the idle part of the open slot is filled with a non-conductive material, and the fingerprint packaging module is basically flush with the outer surface of the fingerprint card. According to the utility model, the fingerprint module is electrically connected with the main module through the metal line layer on the second carrier tape, and the first carrier tape is electrically connected with the second carrier tape through the metal line layer, so that external independent line connection is reduced, and the fingerprint module, the main module, the first carrier tape and the second carrier tape are packaged and integrated into a whole; when the fingerprint card is produced, the fingerprint packaging module is directly fixed in the fingerprint card, and the fingerprint card can be manufactured according to the fingerprint packaging module by using the traditional intelligent card production process, so that the mass production is convenient, and the cost is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic devices, and particularly relates to a fingerprint encapsulation module and a fingerprint card. Background Art

[0002] Fingerprint devices can store users' fingerprint information and use users' fingerprints to unlock during use, thus ensuring the security of the devices. In the prior art, fingerprint chips, security chips, central processing units and other chips in fingerprint devices are usually arranged on a PCB (English full name: Printed Circuit Board, Chinese name: printed circuit board or printed wiring board), and are electrically connected to each other. This method results in many circuits on the PCB, which is not conducive to the mass production of fingerprint devices. Summary of the Invention

[0003] The purpose of the utility model is to solve the mass production problem of fingerprint devices in the prior art, and provide a fingerprint encapsulation module and a fingerprint card.

[0004] The utility model provides a fingerprint encapsulation module, which includes: a first carrier tape, a fingerprint module, a second carrier tape and a main module. The second carrier tape includes a substrate and circuit layers constructed by metals on the front and back surfaces of the substrate. Through holes are provided on the substrate, and the circuit layers constructed by metals on the front and back surfaces of the substrate are electrically connected through conductive media in the through holes. The fingerprint module and the main module are both arranged on the circuit layer constructed by metals on the front surface of the substrate and are electrically connected through the circuit layer constructed by metals on the front surface of the substrate. The outer surface of the circuit layer constructed by metals on the back surface of the substrate is encapsulated with a non-conductive material. The first carrier tape is electrically connected to the second carrier tape. The first carrier tape is fixedly arranged above the four surrounding sides on the front surface of the second carrier tape. The idle space above the front surface of the second carrier tape is filled with a non-conductive material and the non-conductive material is flush with the surface of the first carrier tape. The fingerprint module, the main module, the first carrier tape and the second carrier tape are encapsulated as a whole.

[0005] The utility model also provides a fingerprint card including the above fingerprint encapsulation module. An opening groove is provided on the fingerprint card. The fingerprint encapsulation module is embedded in the opening groove and the first carrier tape is fixed on the inner wall of the opening groove. The idle part of the opening groove is filled with a non-conductive material, and the fingerprint encapsulation module is flush with the outer surface of the fingerprint card.

[0006] Advantages of the present utility model: The present utility model electrically connects the fingerprint module and the main module through the circuit layer constructed by the metal on the second carrier tape. The first carrier tape and the second carrier tape are also electrically connected through the circuit layer constructed by the metal, reducing the external independent circuit connections. The fingerprint module, the main module, the first carrier tape, and the second carrier tape are encapsulated and integrated into one. When producing the fingerprint card, the fingerprint encapsulation module is directly fixed in the fingerprint card, and the traditional smart card production process can be used to produce the fingerprint card according to the fingerprint encapsulation module of the present utility model, which is convenient for mass production and saves costs. Description of the Drawings

[0007] Figure 1 It is a cross-sectional schematic diagram of a fingerprint encapsulation module provided in Embodiment 1 of the present utility model;

[0008] Figure 2 It is a cross-sectional schematic diagram of a fingerprint encapsulation module in which the second carrier tape and the first carrier tape with a three-layer straight plate structure are connected by wire bonding and welding provided in Embodiment 1 of the present utility model;

[0009] Figure 3 It is a cross-sectional schematic diagram of a fingerprint encapsulation module in which the second carrier tape and the first carrier tape with a two-layer straight plate structure are wire-bonded and welded provided in Embodiment 1 of the present utility model;

[0010] Figure 4 It is a cross-sectional schematic diagram of a fingerprint encapsulation module in which the second carrier tape and the first carrier tape with a three-layer straight plate structure are soldered through pads provided in Embodiment 1 of the present utility model;

[0011] Figure 5 It is a cross-sectional schematic diagram of a fingerprint encapsulation module in which the second carrier tape and the first carrier tape with a three-layer straight plate structure are wire-bonded and welded provided in Embodiment 1 of the present utility model;

[0012] Figure 6 It is a cross-sectional schematic diagram of a fingerprint encapsulation module in which the second carrier tape and the first carrier tape with a two-layer straight plate structure are wire-bonded and welded provided in Embodiment 1 of the present utility model;

[0013] Figure 7 It is a cross-sectional schematic diagram of a fingerprint encapsulation module in which the second carrier tape and the first carrier tape with a three-layer straight plate structure are soldered through pads provided in Embodiment 1 of the present utility model;

[0014] Figure 8 It is a cross-sectional schematic diagram of a fingerprint encapsulation module with a three-layer flexible plate structure of the first carrier tape provided in Embodiment 1 of the present utility model;

[0015] Figure 9 It is a front view schematic diagram of a fingerprint card with the first carrier tape being 6PIN and having a normal size provided in Embodiment 1 of the present utility model;

[0016] Figure 10 provided in Embodiment 1 of the present utility model andFigure 9 The corresponding first carrier tape is a schematic diagram of the back of a straight fingerprint card;

[0017] Figure 11 This is provided by Embodiment 1 of the present utility model and is Figure 9 The corresponding first carrier tape is a schematic diagram of the back of a fingerprint card with a flexible board;

[0018] Figure 12 This is a schematic diagram of the front of a fingerprint card provided by Embodiment 1 of the present utility model, where the first carrier tape is 6PIN and has an extended size;

[0019] Figure 13 This is provided by Embodiment 1 of the present utility model and is Figure 12 The corresponding first carrier tape is a schematic diagram of the back of a straight fingerprint card;

[0020] Figure 14 This is provided by Embodiment 1 of the present utility model and is Figure 12 The corresponding first carrier tape is a schematic diagram of the back of a fingerprint card with a flexible board;

[0021] Figure 15 This is a schematic cross-sectional view of a fingerprint card provided by Embodiment 1 of the present utility model, where the first carrier tape is a straight board;

[0022] Figure 16 This is a schematic cross-sectional view of a fingerprint card provided by Embodiment 1 of the present utility model, where the first carrier tape is a flexible board. Detailed implementation manners

[0023] Next, in conjunction with the drawings of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present utility model.

[0024] Embodiment 1

[0025] This Embodiment 1 provides a fingerprint encapsulation module, as Figure 1As shown in the figure, it includes: a first carrier tape 11, a fingerprint module 10, a second carrier tape 20, and a main module 30. The second carrier tape 20 includes a substrate 202 and circuit layers 201 and 203 made of metal on the front and back sides of the substrate 202. A through hole 204 is provided on the substrate 202, and the circuit layers made of metal on the front and back sides of the substrate 202 are electrically connected through a conductive medium in the through hole 204. The fingerprint module 10 and the main module 30 are both arranged on the circuit layer 201 made of metal on the front side of the substrate 202 and are electrically connected through the circuit layer 201 made of metal on the front side of the substrate 202. The outer surface of the circuit layer 203 made of metal on the back side of the substrate 202 is encapsulated with a non-conductive material 205. The first carrier tape 11 is electrically connected to the second carrier tape 20. The first carrier tape 11 is fixedly arranged above the four surrounding sides on the front side of the second carrier tape 20. The idle space above the front side of the second carrier tape 20 is filled with a non-conductive material 40, and the non-conductive material 40 is flush with the surface of the first carrier tape 11. The fingerprint module 10, the main module 30, the first carrier tape 11, and the second carrier tape 20 are encapsulated as a whole.

[0026] In this embodiment, the main module 30 includes an MCU (Chinese full name: Microcontroller Unit; English full name: Microcontroller Unit) and an SE (Chinese full name: Secure Element; English full name: Secure Element), or only includes an SE.

[0027] The fingerprint module 10 in this embodiment includes a fingerprint chip.

[0028] In this embodiment, the conductive medium can be solder balls, solder paste, or conductive adhesive, and the non-conductive material can be non-conductive adhesive, such as hot melt adhesive.

[0029] Optionally, the fingerprint module 10 and the main module 30 are fixedly connected by soldering to the contacts on the circuit layer 201 made of metal on the front side of the substrate 202 through the metal pads on them.

[0030] Or, the fingerprint module 10 and the main module 30 are fixed on the circuit layer 201 made of metal on the front side of the substrate 202 through a conductive chip adhesive; if the chip adhesive is non-conductive, that is, the fingerprint module 10 and the main module 30 are fixed on the circuit layer 201 made of metal on the front side of the substrate through a non-conductive chip adhesive, a conductive wire 50 is arranged in the through hole 204, and both ends of the conductive wire 50 are connected to the circuit layers 201 and 203 made of metal on the front and back sides of the substrate respectively, and the through hole 204 is filled with hot melt adhesive (as Figures 2 - 8 shown).

[0031] Optionally, Figures 2 - 7As shown, an opening is provided at the middle position of the first carrier tape 11. The opening is smaller than the second carrier tape 20 or matches the size of the second carrier tape 20. The second carrier tape 20 is disposed below the first carrier tape 11, and the fingerprint module 30 and the main module 10 are located in the opening of the first carrier tape 11. The edge position of the upper surface of the second carrier tape 20 is fixedly connected to the edge position of the lower surface of the first carrier tape 11.

[0032] Optionally, in this embodiment, as Figure 2 , Figure 4 , Figure 5 and Figure 7 shown, the first carrier tape 11 includes a substrate 111 and circuit layers 112 and 113 made of metal on the upper and lower surfaces of the substrate. Through holes 114 are provided on the substrate 111 of the first carrier tape 11, and conductive media are filled in the through holes 114. The circuit layers 112 and 113 made of metal on the upper and lower surfaces of the substrate 111 of the first carrier tape 11 are electrically connected through the conductive media in the through holes 114. The circuit layer 203 made of metal on the reverse side of the substrate 202 of the second carrier tape 20 is welded to the circuit layer 113 made of metal on the lower surface of the substrate 111 of the first carrier tape 11 through a conductive binding wire 80, and the conductive binding wire 80 is encapsulated in a non-conductive material 205 (as Figure 2 and Figure 5 shown); or the circuit layer 201 made of metal on the front surface of the substrate 202 of the second carrier tape 20 is directly welded or welded through a conductive wire to the circuit layer 113 made of metal on the lower surface of the substrate 111 of the first carrier tape 11 (as Figure 4 and Figure 7 shown).

[0033] The conductive medium in this embodiment can be conductive glue.

[0034] Optionally, in this embodiment, as Figure 3 and Figure 6 shown, the first carrier tape 11 includes a circuit layer 112 made of metal on the upper part and an isolation layer 115 on the lower part. Through holes 114 are provided on the isolation layer 115 of the first carrier tape 11. The circuit layer 203 made of metal on the lower surface of the substrate 202 of the second carrier tape 20 is connected to the circuit layer 112 made of metal of the first carrier tape 11 through a conductive binding wire 80 passing through the through holes 114 on the isolation layer 115 of the first carrier tape 11. The conductive binding wire 80 is encapsulated with a non-conductive material 70 for waterproofing and leakage prevention, and the through holes 114 of the isolation layer 115 of the first carrier tape 11 are filled with a non-conductive material.

[0035] Optionally, in this embodiment, as Figure 8As shown in the figure, the first carrier tape 11 is a flexible board with a three-layer structure. The upper and lower surface layers of the flexible board are circuit layers 112 and 113 made of metal. There is a groove in the middle of the flexible board. The second carrier tape 20 is arranged in the groove and fixed on the flexible board. The circuit layer 203 made of metal on the reverse side of the second carrier tape 20 is electrically connected to the circuit layer 112 made of metal on the upper surface of the flexible board. The other idle parts of the groove are filled with a non-conductive material 17. Among them, this part of the non-conductive material 17 and the non-conductive material filling the through hole 114, the non-conductive material encapsulating the conductive binding wire 80, the non-conductive material 205 encapsulating the circuit layer 203 made of metal on the reverse side of the second carrier tape 20, and the non-conductive material 40 filling the idle space directly above the second carrier tape 20 can be the same or different.

[0036] Further, there is an opening smaller than the second carrier tape in the middle of the groove of the flexible board. The second carrier tape 20 is arranged above the opening and the outer edge of the second carrier tape 20 is fixed at the inner edge position of the flexible board.

[0037] Optionally, the second carrier tape 20 and the inner edge position of the flexible board are fixed by soldering through pads or bonded by conductive adhesive.

[0038] Optionally, the flexible board can be a flexible printed circuit board (FPC flexible board material) or an FR-4 board (an epoxy board with high mechanical properties and dielectric properties, good heat resistance and moisture resistance, and good mechanical workability) or an aluminum substrate or a thermoelectric separation copper substrate or a Rogers high-frequency board or a Teflon high-frequency board (PTFE), etc.

[0039] In this embodiment, the first carrier tape 11 can be a 6PIN empty carrier tape or an 8PIN empty carrier tape. Preferably, in this embodiment, the 6PIN empty carrier tape with normal size and extended size is taken as an example for illustration. Among them, the size of the 6PIN empty carrier tape with extended size can be the same as that of the 8PIN empty carrier tape with normal size.

[0040] If the first carrier tape 11 in this embodiment is a 6PIN empty carrier tape with normal size, the front schematic diagram of the fingerprint encapsulation module is as Figure 9 shown. The fingerprint encapsulation module has 6 contact areas 18 for the machine to read fingerprint card data. The size of each contact area is 1.7mm×2mm. The middle position of the fingerprint encapsulation module is a non-conductive material 40, which is used as the finger pressing area. The user presses the finger in this area to input fingerprint information. Among them Figure 10 is the back perspective view of the first carrier tape 11 being a straight board, Figure 11 is the back perspective view of the first carrier tape 11 being a flexible board;

[0041] If the first carrier tape 11 in this embodiment is a 6PIN empty carrier tape with extended size, the front schematic diagram of the fingerprint encapsulation module is as Figure 12As shown, the fingerprint encapsulation module has 6 contact areas 18 for the machine to read the fingerprint card data. The size of each contact area is 1.7mm×2mm. The middle position of the fingerprint encapsulation module is made of non-conductive material 40, which is used as the finger pressing area. The user presses the finger in this area to input fingerprint information, where Figure 13 is the rear perspective view of the first carrier tape 11 being a straight plate, Figure 14 is the rear perspective view of the first carrier tape 11 being a flexible plate.

[0042] This embodiment also provides a fingerprint card including the fingerprint encapsulation module, as shown in Figure 15 and Figure 16 shown. Among them, Figure 15 the first carrier tape in Figure 16 is a straight plate, and the first carrier tape in

[0043] is a flexible plate. The fingerprint card includes a card base 15 and a transparent layer 16 on the outer surface of the card base 15. There is a slot 17 on the fingerprint card. The fingerprint encapsulation module is embedded in the slot 17 and the first carrier tape 11 is fixed on the inner wall of the slot 17. The idle part of the slot 17 is filled with non-conductive material 400. The fingerprint encapsulation module is flush with the outer surface of the fingerprint card.

[0044] Preferably, the outer end of the first carrier tape 11 is fixed on the inner wall of the slot 17 by hot melt adhesive 90.

[0045] The utility model electrically connects the fingerprint module and the main module by the circuit layer constructed by the metal on the second carrier tape. The first carrier tape and the second carrier tape are also electrically connected by the circuit layer constructed by the metal, reducing the outside independent circuit connections. The fingerprint module, the main module, the first carrier tape and the second carrier tape are encapsulated into one body. When producing the fingerprint card, the fingerprint encapsulation module is directly fixed in the fingerprint card. The fingerprint card can be made according to the fingerprint encapsulation module of the utility model by using the traditional smart card production process, which is convenient for mass production and saves costs.

[0046] The above is only the preferred specific embodiment of the utility model, but the protection scope of the utility model is not limited thereto. Any change or replacement that can be easily thought of by those skilled in the art within the technical scope disclosed by the utility model should be covered within the protection scope of the utility model. Therefore, the protection scope of the utility model should be subject to the protection scope of the claims.

Claims

1. A fingerprint encapsulation module, characterized in that: include: A first carrier, a fingerprint module, a second carrier and a main module, wherein the second carrier comprises a substrate and a circuit layer constructed of metal on the front and back sides of the substrate, the substrate is provided with a through hole, the circuit layers constructed of metal on the front and back sides of the substrate are electrically connected through the conductive medium in the through hole, the fingerprint module and the main module are both arranged on the circuit layer constructed of metal on the front side of the substrate and are electrically connected through the circuit layer constructed of metal on the front side of the substrate, the outer surface of the circuit layer constructed of metal on the back side of the substrate is encapsulated with a non-conductive material, the first carrier is electrically connected to the second carrier, the first carrier is fixedly arranged above the four sides of the front side of the second carrier, the free space above the front side of the second carrier is filled with a non-conductive material and the non-conductive material is flush with the surface of the first carrier, and the fingerprint module, the main module, the first carrier and the second carrier are encapsulated as a whole.

2. The fingerprint encapsulation module according to claim 1, characterized in that: The main module includes a micro control unit and a security element, or the main module includes a security element.

3. The fingerprint encapsulation module according to claim 1, characterized in that: The fingerprint module and the main module are fixedly connected by welding the metal pads thereon to the contacts on the metal-constructed circuit layer on the front side of the substrate.

4. The fingerprint encapsulation module according to claim 1, characterized in that: The fingerprint module and the main module are fixed on the metal-constructed circuit layer on the front side of the substrate by means of a conductive chip adhesive.

5. The fingerprint encapsulation module according to claim 1, characterized in that: The fingerprint module and the main module are fixed on the metal circuit layer on the front side of the substrate by means of a non-conductive chip adhesive, a conductive wire is arranged in the through hole, two ends of the conductive wire are respectively connected to the metal circuit layer on the front and back sides of the substrate, and the through hole is filled with hot melt adhesive.

6. The fingerprint encapsulation module according to claim 1, characterized in that: An opening is provided in the middle of the first carrier tape, the opening is smaller than the second carrier tape or is of the same size as the second carrier tape, the second carrier tape is arranged below the first carrier tape and the fingerprint module and the main module are located in the opening, and the upper surface edge position of the second carrier tape is fixedly connected to the lower surface edge position of the first carrier tape.

7. The fingerprint encapsulation module according to claim 1, characterized in that: The first carrier tape comprises a substrate and a circuit layer constructed of metal on the upper and lower surfaces of the substrate, a through hole is provided on the substrate of the first carrier tape and a conductive medium is filled in the through hole, and the circuit layers constructed of metal on the upper and lower surfaces of the substrate of the first carrier tape are electrically connected through the conductive medium in the through hole; The metal-constructed circuit layer on the back side of the substrate of the second carrier is welded to the metal-constructed circuit layer on the lower surface of the substrate of the first carrier via conductive binding wires, and the conductive binding wires are sealed in the non-conductive material; or the metal-constructed circuit layer on the front side of the substrate of the second carrier is welded to the metal-constructed circuit layer on the lower surface of the substrate of the first carrier via soldering pads.

8. The fingerprint encapsulation module according to claim 1, characterized in that: The first carrier includes an upper metal-constructed circuit layer and a lower isolation layer, the isolation layer of the first carrier is provided with through holes, the metal-constructed circuit layer on the back side of the substrate of the second carrier is connected to the metal-constructed circuit layer of the first carrier by conductive binding wires passing through the through holes on the isolation layer of the first carrier, the through holes on the isolation layer of the first carrier are filled with non-conductive material, and the conductive binding wires are encapsulated with non-conductive material.

9. The fingerprint encapsulation module according to claim 1, characterized in that: The first carrier is a flexible board with a three-layer structure, the upper and lower surfaces of the flexible board are circuit layers constructed of metal, and there is a groove in the middle of the flexible board. The second carrier is arranged in the groove and fixed on the flexible board. The circuit layer constructed of metal on the back of the second carrier is electrically connected to the circuit layer constructed of metal on the upper surface of the flexible board, and the other idle parts of the groove are filled with non-conductive material.

10. The fingerprint encapsulation module according to claim 9, characterized in that: An opening smaller than the second carrier tape is provided in the middle of the groove of the flexible board, the second carrier tape is arranged above the opening and the outer edge of the second carrier tape is fixed to the inner edge position of the flexible board.

11. The fingerprint encapsulation module according to claim 10, characterized in that: The second carrier tape is fixed to the inner edge of the flexible board by welding with a soldering pad or by bonding with a conductive adhesive.

12. The fingerprint encapsulation module according to claim 1, characterized in that: The first carrier tape is a 6PIN empty carrier tape or an 8PIN empty carrier tape.

13. A fingerprint card comprising the fingerprint encapsulation module according to any one of claims 1 to 12, characterized in that: The fingerprint card is provided with a slot, the fingerprint packaging module is embedded in the slot and the first carrier is fixed on the inner wall of the slot, the idle part of the slot is filled with non-conductive material, and the fingerprint packaging module is flush with the outer surface of the fingerprint card.

14. The fingerprint card according to claim 13, characterized in that: The outer end of the first carrier tape is fixed to the inner wall of the slot by hot melt adhesive.

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