Wafer transfer structure

Abstract

The utility model relates to a wafer transfer structure. Comprising a horizontal fixing frame, a movable tray and a driving structure, two feeding frames are arranged on the horizontal fixing frame, and wafer cassettes placed in a feeding cache area can be accurately transferred and placed on a feeding waiting area in cooperation with lifting or horizontal movement of the movable tray driven by the driving structure; the center line of the wide edge of the penetrating channel, the center line of the wide edge of the horizontal fixing frame and the moving route of the horizontal moving piece are located on the same plane, the moving and placing accuracy of the wafer box is further ensured, the procedure that an operator adjusts the wafer box on the feeding waiting area for many times is omitted, feeding is convenient, and time is saved. When the first wafer box is transferred to the feeding waiting area through the driving structure and the movable tray, an operator can immediately place the second wafer box on the feeding buffer area, the two wafer boxes can be operated at the same time, and the time of waiting for the grabbing structure to move to the feeding waiting area to grab the wafer boxes by the operator is saved.

Description

Technical Field

[0001] The utility model relates to the field of wafers, and particularly relates to a wafer transfer structure. Background Art

[0002] A wafer refers to a silicon wafer used for fabricating silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystal silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed, that is, a wafer.

[0003] When wafers are produced and processed in a wafer cleaning machine, generally, an operator is used to horizontally place a wafer cassette containing wafers in the loading area, and then a grasping structure grabs the wafer cassette and moves it to the subsequent process. Since the stroke of the grasping structure is fixed, in order to avoid damage to the wafer caused by improper grasping, the placement position of the wafer cassette in the loading area needs to be precise. However, it is difficult for manual placement to be in place at one time, and generally, it needs to be adjusted multiple times, which is inconvenient and time-consuming for loading. Moreover, during the loading process, it is necessary to wait for the grasping structure to take away the wafer cassette before loading the second wafer cassette, which leads to an extended loading time of the wafer cassette and a long waiting time for the operator. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is to provide a wafer transfer structure.

[0005] To solve the above technical problem, the technical solution of the utility model is: a wafer transfer structure, the innovation of which lies in: including

[0006] A horizontal fixed frame, on both sides of the length at the top of the horizontal fixed frame, a loading buffer area and a loading waiting area are respectively provided, and a through channel is provided in the middle of the horizontal fixed frame, and the extending direction of the through channel is the same as the extending direction of the horizontal fixed frame;

[0007] A moving tray, a limiting structure is provided at the top of the moving tray for limiting and clamping the bottom of the wafer cassette;

[0008] A driving structure, which is arranged at the bottom of the moving tray and connected to the moving tray, includes a lifting member and a horizontal moving member. The lifting member is used to drive the moving tray to rise in the through channel to lift the wafer cassette out of the loading buffer area, or drive the moving tray to descend in the through channel until the wafer cassette is completely placed on the loading buffer area or the loading waiting area. The horizontal moving member is used to drive the moving tray to move along the extending direction of the horizontal fixed frame;

[0009] The center line of the wide side of the through channel, the center line of the wide side of the horizontal fixed frame, and the moving route of the horizontal moving member are in the same plane.

[0010] Further, the loading buffer area has the same structure as the loading waiting area, including a plurality of fixing blocks distributed in a rectangular shape on both sides of the width of the through-channel, and a card slot is provided on one side of each fixing block close to the through-channel.

[0011] Further, there are two limiting structures which are parallel and symmetric to each other. The limiting structure includes two adjacent cushion blocks, and a through groove is provided at the center of the tops of the two cushion blocks and is on the same straight line.

[0012] Further, the limiting structure further includes a limiting block. The limiting block is arranged on the moving tray between the two cushion blocks, and the limiting block is connected to one of the cushion blocks through a limiting gasket.

[0013] Further, the horizontal moving member is a horizontally arranged slide cylinder, and a horizontal connecting plate is provided on its slide table, and the lifting member is installed on the horizontal connecting plate;

[0014] The lifting member is a lifting cylinder, the output end of which is arranged vertically upward and is connected to the moving tray through a horizontal support top plate, and it is installed on the horizontal connecting plate through a horizontal support bottom plate.

[0015] Further, a support plate is provided on one side of the horizontal support top plate and the lifting cylinder, and on the other side of the horizontal support bottom plate and the lifting cylinder.

[0016] The advantages of the present utility model are as follows:

[0017] 1. In this patent, two loading racks are provided on the horizontal fixing frame. Cooperating with the lifting or horizontal movement of the moving tray driven by the driving structure, the wafer cassette placed in the loading buffer area can be accurately transferred and placed on the loading waiting area. Moreover, the center line of the wide side of the through-channel, the center line of the wide side of the horizontal fixing frame, and the movement route of the horizontal moving member are in the same plane, further ensuring the accuracy of the movement and placement of the wafer cassette, eliminating the process of the operator adjusting multiple times on the loading waiting area, facilitating loading and saving time.

[0018] 2. The through groove of the limiting structure is used to limit the bottom end of the wafer cassette, and the limiting block is used to further limit the middle part of the bottom end of the wafer cassette. The combination of the two ensures the stability of the moving tray during the process of loading the wafer cassette and avoids damage to the internal wafers.

[0019] 3. A support plate is provided on one side of the horizontal support top plate and the lifting cylinder, and on the other side of the horizontal support bottom plate and the lifting cylinder, to improve the stability of the connection structure between the horizontal support top plate and the lifting cylinder, and between the horizontal support bottom plate and the lifting cylinder through the support plate.

[0020] 4. When the first wafer cassette is transferred to the loading waiting area via the driving structure and the moving tray, the operator can immediately place the second wafer cassette on the loading buffer area, enabling the simultaneous operation of two wafer cassettes, saving the time for the operator to wait for the grasping structure to move to the loading waiting area to grasp the wafer cassette. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 FIG. is a perspective view of a wafer transfer structure of the present invention.

[0022] Figure 2 FIG. is a top view of a wafer transfer structure of the present invention.

[0023] Figure 3 FIG. is a side view of a wafer transfer structure of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] To further elaborate on the technical means and effects adopted by the present invention to achieve the predetermined utility model purpose, the following, in conjunction with the accompanying drawings and preferred embodiments, details the specific implementation manners, structures, features, and their effects of the present invention as follows.

[0025] As Figures 1 - 3 shown, a wafer transfer structure includes a horizontal fixed frame 1, a moving tray 2, and a driving structure.

[0026] The horizontal fixed frame 1 is a rectangular plate, and a loading buffer area 11 and a loading waiting area 12 are respectively provided at both length sides of the top end thereof. A rectangular through-channel 13 is provided in the middle of the horizontal fixed frame 1, and the extending direction of the through-channel 13 is the same as the extending direction of the horizontal fixed frame 1;

[0027] The loading buffer area 11 and the loading waiting area 12 have the same structure, including 4 fixing blocks 14 distributed in a rectangular shape on both width sides of the through-channel 13, and a card slot 15 is provided on one side of each fixing block 14 close to the through-channel 13.

[0028] The top end of the moving tray 2 is provided with a limiting structure for limiting and clamping the bottom of the wafer cassette;

[0029] There are two limiting structures, which are arranged parallel and symmetrically to each other. The limiting structure includes a limiting block 21 and two adjacent pads 22. A through-channel 23 is provided in the center of the top of each of the two pads 22, and the two through-channels 23 are on the same straight line.

[0030] The limiting block 21 is arranged on the moving tray 2 between the two pads 22, and the limiting block 21 is connected to one of the pads 22 through a limiting gasket. The further limiting of the middle part of the bottom end of the wafer cassette is realized by using the limiting block 21. The combination of the two ensures the stability of the moving tray 2 during the process of loading the wafer cassette and avoids damage to the internal wafers.

[0031] The top of the wafer cassette is used to accommodate wafers placed vertically, and both sides of the bottom have vertically downwardly provided connecting and supporting portions, and a ∧-shaped groove is further provided at the center of the bottom of the connecting and supporting portion.

[0032] The driving structure is arranged at the bottom end of the moving tray 2 and is connected to the moving tray 2. It includes a lifting member 3 and a horizontal moving member 4. The lifting member 3 is used to drive the moving tray 2 to rise in the through-channel 13 to lift the wafer cassette out of the loading buffer area 11, or drive the moving tray 2 to descend in the through-channel 13 until the wafer cassette is completely placed on the loading buffer area 11 or the loading waiting area 12. The horizontal moving member 4 is used to drive the moving tray 2 to move along the extending direction of the horizontal fixing frame 1.

[0033] The horizontal moving member 4 is a horizontally arranged slide cylinder, and a horizontal connecting plate is provided on its slide table. The lifting member 3 is installed on the horizontal connecting plate.

[0034] The lifting member 3 is a lifting cylinder, and its output end is arranged vertically upward and is connected to the moving tray 2 through a horizontal support top plate. It is installed on the horizontal connecting plate through a horizontal support bottom plate.

[0035] A support plate 5 is provided on one side of the lifting cylinder 3 and the horizontal support top plate, and on the other side of the lifting cylinder 3 and the horizontal support bottom plate. The stability of the connection structure between the horizontal support top plate and the lifting cylinder, and between the horizontal support bottom plate and the lifting cylinder 3 is improved through the support plate 5.

[0036] The center line of the wide side of the through-channel 13, the center line of the wide side of the horizontal fixing frame 1, and the moving route of the horizontal moving member 4 are in the same plane, which further ensures the accuracy of the movement and placement of the wafer cassette, eliminates the need for the operator to make multiple adjustments in the loading waiting area 12, and is convenient for loading and time-saving.

[0037] The working principle of this patent:

[0038] The lifting cylinder then drives the movable tray 2 to move to the upper position of the loading waiting area 12, and then the lifting cylinder drives the movable tray 2 to descend until the connecting bearing part of the wafer box is placed on the four slots 15 of the loading buffer area 11, and the movable tray 2 is moved to the lower position of the loading buffer area 11 by the sliding cylinder. Then, the movable tray 2 is driven to rise until the connecting bearing part of the wafer box is clamped in the through slot 23 of the limiting structure, and the limiting gasket of the limiting structure is in the ∧-shaped slot of the wafer box. The movable tray 2 is continued to be driven to rise until the wafer box is completely separated from the four slots 15 of the loading buffer area 11 and then stops. Then, the sliding cylinder is used to drive the movable tray 2 to move to the upper position of the loading waiting area 12 and then stop. The lifting cylinder is used to drive the movable tray 2 to descend until the connecting bearing part of the wafer box is placed on the four slots 15 of the loading waiting area 12, and the movable tray 2 is completely separated from the wafer box and stops. Then, the next wafer box is placed on the four slots 15 of the loading buffer area 11. Two wafer boxes can be operated at the same time, which saves the operator time waiting for the grasping structure to move to the loading waiting area 12 to grasp the wafer box.

[0039] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A wafer transfer structure, characterized in that: include A horizontal fixed frame, wherein a loading buffer area and a loading waiting area are respectively arranged on both sides of the length of the top of the horizontal fixed frame, and a through channel is arranged in the middle of the horizontal fixed frame, and the extension direction of the through channel is consistent with the extension direction of the horizontal fixed frame; A movable tray, wherein a limiting structure is provided on the top of the movable tray for limiting and clamping the bottom of the wafer box; a driving structure, which is arranged at the bottom end of the mobile tray and connected to the mobile tray, and includes a lifting member and a horizontal moving member, the lifting member drives the mobile tray to rise in the through channel to lift the wafer box out of the loading buffer area, or drives the mobile tray to descend in the through channel until the wafer box is completely placed in the loading buffer area or the loading waiting area, and the horizontal moving member drives the mobile tray to move along the extension direction of the horizontal fixed frame; The wide side center line of the through channel, the wide side center line of the horizontal fixing frame, and the moving route of the horizontal moving member are on the same plane.

2. The wafer transfer structure according to claim 1, characterized in that: The loading buffer area has the same structure as the loading waiting area, including a plurality of rectangular fixed blocks distributed on both sides of the through channel, and each of the fixed blocks has a card slot on one side close to the through channel.

3. The wafer transfer structure according to claim 1, characterized in that: The limiting structure has two mutually parallel and symmetrically arranged blocks, and the limiting structure includes two adjacently arranged cushion blocks, and a through groove which is in the same straight line is provided at the center of the top of the two cushion blocks.

4. The wafer transfer structure according to claim 3, characterized in that: The limiting structure further includes a limiting block, which is arranged on the movable tray between two cushion blocks, and is connected to one of the cushion blocks via a limiting gasket.

5. The wafer transfer structure according to claim 1, characterized in that: The horizontal moving member is a horizontally arranged slide cylinder, a horizontal connecting plate is arranged on the slide, and the lifting member is mounted on the horizontal connecting plate; The lifting member is a lifting cylinder, the output end of which is vertically arranged upward and connected to the moving tray through a horizontal supporting top plate, and is installed on the horizontal connecting plate through a horizontal supporting bottom plate.

6. The wafer transfer structure according to claim 5, characterized in that: A support plate is provided on one side of the horizontal support top plate and the lifting cylinder, and on the other side of the horizontal support bottom plate and the lifting cylinder.

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