Wafer chuck and semiconductor device

Abstract

The embodiment of the utility model provides a wafer chuck and a semiconductor device, when the wafer chuck is used for clamping a wafer, one end of the wafer abuts against a clamping part, the clamping part is fixedly arranged on a wafer carrying disc and is used for ensuring the initial positioning of the wafer, and after the wafer is initially positioned by using the clamping part, the wafer slides towards the clamping part through a clamping block, so that the wafer is clamped by the clamping block. And the wafer is fixed on the wafer carrying disc at the clamping position. When the semiconductor equipment works, in order to match wafers of different sizes, a plurality of wafer chucks with placement areas of different sizes are designed, and the wafer chucks are fixed on the electrostatic chuck through attraction force. In this way, wafers of different sizes can be fixed through one electrostatic chuck and the wafer chucks of the multiple placement areas of different sizes, and the flexibility and efficiency of wafer processing are improved.

Description

Technical Field

[0001] The embodiments of the present utility model relate to the field of semiconductor technology, and particularly to a wafer chuck and a semiconductor device. Background Art

[0002] A wafer refers to a silicon wafer used for fabricating semiconductor integrated circuits. Various circuit element structures can be processed on the silicon wafer to form an IC product with specific electrical functions.

[0003] A wafer chuck, also known as a carrier, is one of the indispensable components in the semiconductor manufacturing process. Its main function is to safely carry and transfer wafers in semiconductor manufacturing equipment. The wafer chuck needs to ensure the stability of the wafer during high-precision processing while reducing any contact that may damage the wafer surface. The integrity of the wafer is crucial for manufacturing high-performance and highly reliable semiconductor chips. Therefore, the design of the wafer chuck directly affects the quality and yield of the chips.

[0004] During the wafer processing, the wafer is fixed and supported by an electrostatic chuck. The electrostatic chuck generates an electrostatic field by applying a voltage, so that an attractive force is generated between the wafer surface and the chuck surface, and the wafer can be fixed without physical clamping and kept stable during the processing. Currently, an electrostatic chuck for placing large-sized wafers (such as 12 inches) is difficult to provide fixation and support for small-sized wafers (such as 8 inches or 4 inches) during the wafer processing. Summary of the Utility Model

[0005] The problem solved by the embodiments of the present utility model is to provide a wafer chuck and a semiconductor device for improving the flexibility and efficiency of wafer processing.

[0006] To solve the above problems, the embodiments of the present utility model provide a wafer chuck, including: a wafer carrier for placing a wafer; a clamping part fixedly arranged on the wafer carrier; a clamping block corresponding to the clamping part, the clamping block having a clamping position on the wafer carrier, and when the clamping block is in the clamping position, the clamping block and the clamping part cooperate to clamp the wafer.

[0007] Optionally, the clamping block is slidably arranged on the wafer carrier, and the clamping position is located on the sliding path of the clamping block.

[0008] Optionally, the wafer chuck further includes: a sliding groove located in the clamping block or the wafer carrier, and the clamping block and the wafer carrier are slidably matched through the sliding groove.

[0009] Optionally, the wafer chuck further includes: an elastic member, one end of the elastic member is connected to the wafer carrier, and the other end of the elastic member is connected to the clamping block.

[0010] Optionally, the wafer chuck further includes: a fixing member fixedly connected to the wafer carrier, the clamping block being slidably disposed on the fixing member, and the clamping position being located on the sliding path of the clamping block.

[0011] Optionally, the wafer chuck further includes: a chute located in the clamping block or the fixing member, and the clamping block and the fixing member are slidably engaged through the chute.

[0012] Optionally, the wafer chuck further includes: an elastic member, one end of the elastic member being connected to the fixing member, and the other end of the elastic member being connected to the clamping block.

[0013] Optionally, the wafer carrier has a placement area for placing the wafer; the fixing member is located in the placement area, and when the wafer is in the placement area, the fixing member is covered by the wafer.

[0014] Optionally, the clamping portion includes a limiting member having an arc surface for abutting against the wafer.

[0015] Optionally, the wafer carrier has a placement area for placing the wafer; the clamping portion includes a plurality of limiting members circumferentially spaced apart along the placement area.

[0016] Optionally, the limiting member has a first clamping surface facing the placement area, and the first clamping surface is an arc-shaped curved surface.

[0017] Optionally, the clamping block has a second clamping surface facing the center of the wafer carrier, and the second clamping surface is an arc-shaped curved surface.

[0018] Optionally, a convex ring is provided on the wafer carrier, and the clamping portion is provided on the convex ring.

[0019] Optionally, the clamping portion has a first clamping surface facing the center of the wafer carrier, and the first clamping surface is disposed at an acute angle or a right angle with the surface of the wafer carrier, or the first clamping surface is provided with a card slot for embedding the edge of the wafer.

[0020] Optionally, the clamping block has a second clamping surface facing the center of the wafer carrier, and the second clamping surface is disposed at an acute angle or a right angle with the surface of the wafer carrier, or the second clamping surface is provided with a card slot for embedding the edge of the wafer.

[0021] Optionally, the wafer carrier has a placement area for placing the wafer; the wafer chuck further includes: a raised positioning portion located at the edge of the placement area for circumferential positioning of the wafer, the positioning portion including a positioning surface facing the placement area; or the positioning portion includes one or more raised points.

[0022] Optionally, a notch is provided on the wafer carrier for positioning the wafer carrier.

[0023] Optionally, through holes are provided on the wafer carrier.

[0024] Optionally, the material of the clamping block includes one or more of graphite, silicon, ceramic, plastic, and quartz.

[0025] Optionally, the material of the wafer carrier includes one or more of graphite, silicon, ceramic, plastic, and quartz.

[0026] An embodiment of the present invention provides a semiconductor device, including: an electrostatic chuck; and the wafer chuck disposed on the electrostatic chuck.

[0027] Compared with the prior art, the technical solution of the embodiment of the present invention has the following advantages:

[0028] The wafer chuck provided by the embodiment of the present invention includes a wafer carrier for placing a wafer; a clamping portion fixedly disposed on the wafer carrier; and a clamping block corresponding to the clamping portion. The clamping block has a clamping position on the wafer carrier. When the clamping block is in the clamping position, the clamping block and the clamping portion cooperate to clamp the wafer. When using the wafer chuck to clamp the wafer, one end of the wafer abuts against the clamping portion. The clamping portion is fixedly disposed on the wafer carrier to ensure the initial positioning of the wafer. After the wafer is initially positioned by the clamping portion, the clamping block slides towards the clamping portion and fixes the wafer on the wafer carrier at the clamping position.

[0029] The semiconductor device provided by the embodiment of the present invention includes an electrostatic chuck; the wafer chuck is disposed on the electrostatic chuck. For example, the wafer chuck can be adsorbed and fixed on the electrostatic chuck. When the semiconductor device is working, in order to match wafers of different sizes, wafer chucks with multiple placement areas of different sizes are designed, and the electrostatic chuck fixes the wafer chuck on the electrostatic chuck through attraction. In this way, different-sized wafers can be fixed by one electrostatic chuck and wafer chucks with multiple placement areas of different sizes, improving the flexibility and efficiency of wafer processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a schematic structural diagram of the wafer chuck according to the embodiment of the present invention;

[0031] Figure 2 is a schematic structural diagram of the front view of the wafer carrier in the wafer chuck according to the embodiment of the present invention;

[0032] Figure 3 is a schematic structural diagram of the right view of the wafer carrier in the wafer chuck according to the embodiment of the present invention;

[0033] Figure 4 Schematic diagram of the structure of the clamping block and the fixing member in the wafer chuck according to the embodiment of the present utility model;

[0034] Figure 5 Schematic diagram of the structure of the fixing member in the wafer chuck according to the embodiment of the present utility model;

[0035] Figure 6 is Figure 5 The sectional view at AA in

[0036] Figure 7 Schematic diagram of the structure of the clamping block in the wafer chuck according to the embodiment of the present utility model;

[0037] Figure 8 Schematic diagram of the structure of the wafer chuck when clamping a wafer according to the embodiment of the present utility model;

[0038] Figure 9 is Figure 8 The sectional view at BB in

[0039] Figure 10 is Figure 9 The partial enlarged view at C in

[0040] Figure 11 is Figure 9 The partial enlarged view at D in Detailed implementation manners

[0041] As can be seen from the background art, during the processing of wafers, the wafers are fixed and supported by an electrostatic chuck. The electrostatic chuck generates an electrostatic field by applying a voltage, so that an attractive force is generated between the wafer surface and the chuck surface, so that the wafer can be fixed without physical clamping and the wafer can be kept stable during the processing. At present, for an electrostatic chuck used to place large-sized wafers, it is difficult to provide fixation and support for small-sized wafers during the wafer processing.

[0042] To solve the above technical problems, an embodiment of the present utility model provides a wafer chuck, including: a wafer carrier for placing wafers; a clamping portion fixedly arranged on the wafer carrier; a clamping block corresponding to the clamping portion, the clamping block has a clamping position on the wafer carrier, and in the state where the clamping block is in the clamping position, the clamping block and the clamping portion cooperate to clamp the wafer.

[0043] The wafer chuck provided by an embodiment of the present utility model includes a wafer carrier for placing a wafer; a clamping portion fixedly arranged on the wafer carrier; and a clamping block corresponding to the clamping portion. The clamping block has a clamping position on the wafer carrier. When the clamping block is in the clamping position, the clamping block and the clamping portion cooperate to clamp the wafer. When using the wafer chuck to clamp the wafer, one end of the wafer abuts against the clamping portion. The clamping portion is fixedly arranged on the wafer carrier to ensure the initial positioning of the wafer. After the wafer is initially positioned by using the clamping portion, the clamping block slides towards the clamping portion and fixes the wafer on the wafer carrier at the clamping position.

[0044] The semiconductor device provided by an embodiment of the present utility model includes an electrostatic chuck; the wafer chuck can be adsorbed and fixed on the electrostatic chuck. When the semiconductor device is working, in order to match wafers of different sizes, wafer chucks with multiple placement areas of different sizes are designed. The electrostatic chuck fixes the wafer chuck on the electrostatic chuck through attraction. In this way, different-sized wafers can be fixed by one electrostatic chuck and wafer chucks with multiple placement areas of different sizes, improving the flexibility and efficiency of wafer processing.

[0045] In order to make the above-mentioned objects, features, and advantages of the embodiments of the present utility model more obvious and understandable, the following specifically describes the embodiments of the present utility model in detail with reference to the accompanying drawings.

[0046] Reference Figure 1 , Figure 1 is a schematic diagram of the wafer chuck of the embodiment of the present utility model.

[0047] The wafer chuck provided by an embodiment of the present utility model includes: a wafer carrier 10 for placing a wafer; a clamping portion 20 fixedly arranged on the wafer carrier 10; and a clamping block 32 corresponding to the clamping portion 20. The clamping block 32 can move towards or away from the clamping portion 20. The clamping block 32 has a clamping position on the wafer carrier 10. When the clamping block 32 is in the clamping position, the clamping portion 20 and the clamping block 32 cooperate to clamp the wafer.

[0048] When using the wafer chuck to clamp the wafer, one end of the wafer abuts against the clamping portion 20. The clamping portion 20 is fixedly arranged on the wafer carrier 10 to ensure the initial positioning of the wafer. After the wafer is initially positioned by using the clamping portion 20, the clamping block 32 slides towards the clamping portion 20 and fixes the wafer on the wafer carrier 10 at the clamping position.

[0049] The wafer carrier 10 is used to carry the wafer during the process of transferring and processing the wafer.

[0050] In this embodiment, the wafer carrier 10 is circular, and the wafer carrier 10 has placement areas of various sizes to accommodate the clamping of wafers of different sizes, such as placement areas for 4-inch, 6-inch, 8-inch, 10-inch, or 12-inch wafers, and the clamping positions of different placement areas are different.

[0051] In this embodiment, the material of the wafer carrier 10 includes one or more of graphite, silicon, ceramics, plastics, and quartz.

[0052] In this embodiment, a notch (not shown in the figure) is provided on the wafer carrier 10. During wafer processing, the wafer chuck is disposed on the electrostatic chuck, and the notch on the wafer carrier is used for positioning between the wafer chuck and the electrostatic chuck.

[0053] Reference Figure 2 and Figure 3 , Figure 2 is a schematic structural diagram of the front view of the wafer carrier in the wafer chuck of the embodiment of the present invention; Figure 3 is a schematic structural diagram of the right view of the wafer carrier in the wafer chuck of the embodiment of the present invention.

[0054] A through hole 101 (as shown in Figure 2 ) is provided on the wafer carrier 10. During the process of wafer processing, the temperature of the wafer is relatively high, and the through hole 101 is beneficial to dissipating heat from the wafer placed on the wafer carrier 10.

[0055] In this embodiment, a convex ring 102 (as shown in Figure 2 ) is provided on the wafer carrier 10. The convex ring 102 protrudes from the surface of the wafer carrier 10, and the convex ring 102 is used to contact the wafer to support the wafer.

[0056] It should be noted that the wafer carrier 10 has a placement area for placing the wafer. Specifically, the convex ring 102 and the area inside the convex ring 102 serve as the placement area.

[0057] It should be noted that when the wafer is placed on the convex ring 102, there is a certain gap between the wafer and the surface of the wafer carrier 10, which is beneficial to the wafer dissipating heat through the through hole 101 on the wafer carrier 10.

[0058] The wafer chuck further includes: a protruding positioning portion located at the edge of the placement area for circumferential positioning of the wafer.

[0059] In this embodiment, the positioning portion includes one or more convex points 30, and the sides of the plurality of convex points 30 form a positioning surface. Specifically, as shown in Figure 2As shown, the positioning part includes two protruding points 30. In other embodiments, the positioning part includes a positioning surface facing the placement area, and the positioning surface is a vertical plane perpendicular to the surface of the wafer carrier for circumferential positioning of the wafer. In other embodiments, for a wafer with a notch on the edge, the positioning part may have only one protruding point (not shown), and this one protruding point cooperates with the notch on the edge of the above-mentioned wafer to achieve circumferential positioning of the wafer.

[0060] As an example, the positioning part is arranged on the convex ring 102.

[0061] When the wafer chuck clamps the wafer, the clamping part 20 is used to ensure the initial positioning of the wafer.

[0062] In this embodiment, the clamping part 20 includes a plurality of limiting members 21 that are circumferentially spaced apart along the placement area. The number of limiting members 21 being multiple is beneficial for constraining the wafer from multiple positions. Specifically, the limiting members 21 include but are not limited to arc protrusions, strip protrusions, protruding points, and cylinders.

[0063] Specifically, the clamping part 20 includes two limiting members 21 that are circumferentially spaced apart along the placement area, and the limiting members 21 are arc protrusions (as Figure 2 shown).

[0064] In other embodiments, the clamping part may include only one limiting member. When the clamping part includes only one limiting member, to facilitate firm clamping of the wafer, the arc length of the arc-shaped protrusion is greater than or equal to one-tenth of the wafer circumference.

[0065] In this embodiment, the clamping part 20 is arranged on the outer edge of the convex ring 102 (as Figure 2 shown), and the clamping part 20 and the convex ring 102 are an integral structure. In other embodiments, the clamping part and the convex ring may also be a split structure.

[0066] Refer to Figures 4 to 7 , Figure 4 is a schematic structural diagram of the cooperation between the clamping block and the fixing member in the wafer chuck of the embodiment of the present invention; Figure 5 is a schematic structural diagram of the fixing member in the wafer chuck of the embodiment of the present invention; Figure 6 is Figure 5 the sectional view at AA in Figure 7 is a schematic structural diagram of the clamping block in the wafer chuck of the embodiment of the present invention.

[0067] The clamping block 32 can move towards or away from the clamping part 20 to clamp the wafer.

[0068] The wafer chuck further includes: a fixing member 33 (as Figure 4As shown in the figure), it is fixedly connected to the wafer carrier 10. The clamping block 32 is slidably arranged on the fixed member 33, and the clamping position is located on the sliding path of the clamping block 32; the chute 31 (as Figure 6 shown) is located in the clamping block 32 or the fixed member 33, and the clamping block 32 and the fixed member 33 are slidably matched through the chute 31.

[0069] As an example, the chute 31 is located in the fixed member 33.

[0070] The clamping block 32 is slidably arranged in the chute 31. When the clamping block 32 moves away from the clamping portion 20 through the chute 31, the wafer can be released. When the clamping block 32 moves towards the clamping portion 20 through the chute 31, the wafer can be clamped tightly.

[0071] In this embodiment, the material of the clamping block 32 includes one or more of graphite, silicon, ceramics, plastics, and quartz.

[0072] Specifically, the clamping block 32 includes a sliding portion 321 (as Figure 4 shown) and a stop portion 322 (as Figure 4 shown) connected to the sliding portion 321. The sliding portion 321 is slidably arranged in the chute 31, and the stop portion 322 is located outside the chute 31.

[0073] Specifically, the fixed member 33 includes: a fixing plate 331 (as Figure 5 shown), which is fixedly connected to the wafer carrier 10; two spaced-apart first bosses 332 (as Figure 5 shown), which are located on the fixing plate 331; there are two chutes 31, which are respectively located at the bottoms of the opposite side walls of the two first bosses 332, and the top of the fixing plate 331 and the bottoms of the side walls of the first bosses 332 enclose the chute 31.

[0074] As an example, fixing holes (not shown in the figure) are provided at the edge of the fixing plate 331, and bolts pass through the fixing holes of the fixed member 33 to be fixedly connected to the wafer carrier 10. In other embodiments, the fixing plate can also be fixedly connected to the wafer carrier in other forms, such as welding, etc.

[0075] In this embodiment, the part of the first boss 332 that exposes the top edge of the fixing plate 331, and the first boss 332 and the fixing plate 331 enclose the chute 31 (as Figure 6 shown), and the chute 31 is slidably mated with the sliding portion 321 of the clamping block 32.

[0076] It should be noted that when the sliding portion 321 of the clamping block 32 slides in the sliding groove 31, the stopping portion 322 is blocked outside the sliding groove 31 by the first boss 332 to limit the sliding position of the clamping block 32. As an example, the top of the stopping portion 322 protrudes from the top of the first boss 332, so that when the clamping block 32 moves towards the clamping portion 20, the stopping portion 322 of the clamping block 32 can abut against the wafer.

[0077] It should also be noted that the fixing member 33 is located in the placement area, and when the wafer is in the placement area, the fixing member is covered by the wafer. When the material of the fixing member 33 is metal, in order to avoid the situation that the ion beam hits the fixing structure 33 during the wafer processing and the metal of the fixing member 33 contaminates the machine tool, therefore, the wafer located in the placement area needs to completely cover the fixing structure 33.

[0078] The wafer chuck further includes: an elastic member 34, one end of the elastic member 34 is connected to the fixing member 33, and the other end of the elastic member 34 is connected to the clamping block 32.

[0079] The elastic member 34 provides a clamping force for the clamping block 32 to abut against the wafer, and the clamping block 32 is slidably arranged in the sliding groove 31 under the action of the elastic member 34. In this embodiment, the elastic member 34 is a tension spring, and the number of the tension springs is one or more. As an example, the number of the elastic members 34 is two.

[0080] In this embodiment, the elastic member 34 is located on the surface of the wafer carrier 10 for placing the wafer. In other embodiments, the elastic member can also be located at the bottom of the wafer carrier.

[0081] It should be noted that the wafer chuck further includes: a first elastic fixing member 35 (as Figure 4 shown), which is arranged in the fixing member 33 and is connected to one end of the elastic member 34; a second elastic fixing member 36 (as Figure 4 shown), which is arranged in the clamping block 32 and is connected to the other end of the elastic member 34.

[0082] The first elastic fixing member 35 and the second elastic fixing member 36 respectively arrange the two ends of the elastic member 34 in the fixing member 33 and the clamping block 32.

[0083] In this embodiment, the fixing member 33 further includes: a second boss 333, which is located on the fixing plate 331, and the two first bosses 332 are located on the same side of the second boss 333.

[0084] As an example, the first elastic fixing member 35 is arranged between the second boss 333 and the two first bosses 332, and the second elastic fixing member 36 is arranged at the end of the sliding portion 321 close to the second boss 333.

[0085] In other embodiments, the elastic member can also be disposed on the side of the clamping block away from the placement area. The clamping block abuts against the wafer by using the thrust provided by the elastic member to fix the wafer. Specifically, on the wafer carrier, an elastic fixing portion is provided on the side of the clamping block away from the placement area; the elastic member is disposed between the clamping block and the elastic fixing portion, one end of the elastic member is connected to the elastic fixing portion, and the other end of the elastic member is connected to the clamping block. When a wafer is placed on the placement area and the clamping block abuts against the wafer, the elastic member is in a compressed state.

[0086] In some other embodiments, the clamping block is directly slidably disposed on the wafer carrier, and the clamping position is on the sliding path of the clamping block. As an example, the wafer chuck further includes: a chute located in the clamping block or the wafer carrier, and the clamping block and the wafer carrier are slidably engaged through the chute; an elastic member, one end of the elastic member is connected to the wafer carrier, and the other end of the elastic member is connected to the clamping block, so that the clamping block fixes the wafer under the elastic force of the elastic member. Specifically, the elastic member is located on the surface of the wafer carrier for placing the wafer or at the bottom of the wafer carrier.

[0087] In other embodiments, the elastic member may not be provided. After the clamping block slides to abut against the wafer in the placement area, the clamping block is restricted from sliding only by the static friction force between the clamping block and the wafer carrier or the fixing member, and then the wafer is restricted in the placement area.

[0088] In other embodiments, the clamping block may not be slidably engaged with the fixing member / wafer carrier, but the clamping block is fixed to the fixing member or the wafer carrier by means of buckling, threaded connection, etc. The specific operation process is to place the wafer in the placement area, and after the wafer is clamped by the clamping block and the clamping portion, the clamping block is fixed to the fixing member or the wafer carrier by means of buckling, threaded connection, etc., so that the wafer is fixedly arranged on the wafer carrier.

[0089] Reference Figures 8 to 11 shown in Figure 8 is a schematic structural diagram of the wafer chuck of the embodiment of the present invention for clamping a wafer; Figure 9 is Figure 8 the cross-sectional view at BB in Figure 10 is Figure 9 the partial enlarged view at C in Figure 11 is Figure 9 the partial enlarged view at D in

[0090] In this embodiment, the limiting member 21 of the clamping portion 20 has a first clamping surface 22 facing the placement area (such as Figure 11As shown, the first clamping surface 22 is an arc-shaped curved surface for abutting against the wafer. Compared with the case where the first clamping surface is a flat surface, the arc-shaped curved surface of the first clamping surface 22 can better match the outer diameter of the wafer, that is, when clamping the wafer, there is a larger abutting area with the wafer, which is more conducive to fixing the wafer.

[0091] The first clamping surface 22 is arranged at an acute angle with the wafer carrier 10 (such as Figure 11 shown as β in the figure), that is, the dimension from the bottom of the first clamping surface 22 to the center of the wafer carrier 10 is greater than the dimension from the top of the first clamping surface 22 to the center of the wafer carrier 10. In other embodiments, the first clamping surface can also be arranged at a right angle with the wafer carrier. In some other embodiments, the first clamping surface can also be provided with a clamping groove for embedding the edge of the wafer, so that the wafer is not prone to vibration or movement during the wafer processing.

[0092] In this embodiment, the clamping block 32 has a second clamping surface 323 facing the placement area (such as Figure 10 shown), and the second clamping surface 323 is an arc-shaped curved surface for abutting against the wafer. The arc-shaped curved surface of the second clamping surface 323 can better match the outer diameter of the wafer, that is, when clamping the wafer, there is a larger abutting area with the wafer, which is more conducive to fixing the wafer.

[0093] The second clamping surface 323 is arranged at an acute angle (such as Figure 10 shown as α in the figure) with the surface of the wafer carrier 10, that is, the dimension from the bottom of the second clamping surface 323 to the center of the wafer carrier 10 is greater than the dimension from the top of the second clamping surface 323 to the center of the wafer carrier 10, so that after the wafer is clamped by the clamping part 20 and the clamping block 32, the wafer will not fall off the wafer chuck. In other embodiments, the second clamping surface can also be arranged at a right angle with the wafer carrier. In some other embodiments, the second clamping surface can also be provided with a clamping groove for embedding the edge of the wafer, so that the wafer is not prone to vibration or movement during the wafer processing.

[0094] An embodiment of the present invention also provides a semiconductor device, including: an electrostatic chuck, and the aforementioned wafer chuck is arranged on the electrostatic chuck.

[0095] The semiconductor device provided by the embodiment of the present invention includes an electrostatic chuck; the wafer chuck is arranged on the electrostatic chuck. For example, the wafer chuck can be adsorbed and fixed on the electrostatic chuck. When the semiconductor device is working, in order to match wafers of different sizes, wafer chucks with multiple placement areas of different sizes are designed, and the electrostatic chuck fixes the wafer chuck on the electrostatic chuck through attraction. In this way, wafers of different sizes can be fixed by one electrostatic chuck and wafer chucks with multiple placement areas of different sizes, improving the flexibility and efficiency of wafer processing.

[0096] In this embodiment, the electrostatic chuck for placing large-sized wafers (such as 12-inch wafers) can adsorb and fix the wafer carrier 10. By setting placement areas of corresponding sizes (4-inch, 6-inch, 8-inch or 10-inch) on different wafer carriers 10, the purpose of adsorbing and fixing wafers of different sizes on one electrostatic chuck is achieved.

[0097] During the wafer processing, the electrostatic chuck fixes and stabilizes the wafer chuck based on electrostatic force. The electrostatic chuck is mainly used in high-precision semiconductor manufacturing processes, such as lithography, etching, deposition, etc.

[0098] The electrostatic chuck includes: an insulating substrate and an electrode layer. Among them, the electrode layer can be a single-pole design or a bipolar design. When the electrode layer adopts a single-pole design, the electrostatic attraction force is generated by relying on the potential difference between the electrostatic chuck and the wafer chuck; when the electrode layer adopts a bipolar design, a more uniform electric field distribution can be provided, thereby providing a more uniform adsorption force.

[0099] Although the embodiments of the present utility model are disclosed as above, the present utility model is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the scope defined by the claims.

Claims

1. A wafer chuck, characterized in that: include: Wafer carrier, used to place wafers; A clamping portion, fixedly disposed on the wafer carrier; A clamping block, corresponding to the clamping portion, wherein the clamping block has a clamping position on the wafer carrier, and when the clamping block is in the clamping position, the clamping block and the clamping portion cooperate to clamp the wafer; The wafer chuck further comprises: a fixing member fixedly connected to the wafer carrier, the clamping block being slidably disposed on the fixing member, and the clamping position being located on a sliding path of the clamping block; The wafer carrier has a placement area for placing wafers; the fixing component is located in the placement area, and when the wafer is located in the placement area, the fixing component is covered by the wafer.

2. The wafer chuck according to claim 1, characterized in that: The clamping block is slidably arranged on the wafer carrier, and the clamping position is located on the sliding path of the clamping block.

3. The wafer chuck according to claim 2, characterized in that: The wafer chuck also includes: The slide groove is located in the clamping block or the wafer carrier, and the clamping block and the wafer carrier are slidably matched through the slide groove.

4. The wafer chuck according to claim 2, characterized in that: The wafer chuck also includes: An elastic member, one end of which is connected to the wafer carrier, and the other end of which is connected to the clamping block.

5. The wafer chuck according to claim 1, characterized in that: The wafer chuck also includes: The slide groove is located in the clamping block or the fixing member, and the clamping block and the fixing member are slidably matched through the slide groove.

6. The wafer chuck according to claim 1, characterized in that: The wafer chuck also includes: An elastic member, one end of which is connected to the fixing member, and the other end of which is connected to the clamping block.

7. The wafer chuck according to claim 1, characterized in that: The clamping portion includes a limiting component, and the limiting component has an arc surface for abutting against the wafer.

8. The wafer chuck according to claim 1, characterized in that: The wafer carrier has a placement area for placing wafers; The clamping portion includes a plurality of limiting components which are distributed at intervals along the circumference of the placement area.

9. The wafer chuck according to claim 8, characterized in that: The limiting component has a first clamping surface facing the placement area, and the first clamping surface is an arc-shaped curved surface.

10. The wafer chuck according to claim 1, characterized in that: The clamping block has a second clamping surface facing the center of the wafer carrier, and the second clamping surface is an arc-shaped curved surface.

11. The wafer chuck according to claim 1, characterized in that: The wafer carrier is provided with a convex ring, and the clamping portion is provided on the convex ring.

12. The wafer chuck according to claim 1, characterized in that: The clamping portion has a first clamping surface facing the center of the wafer carrier, the first clamping surface is set at an acute angle or a right angle to the surface of the wafer carrier, or the first clamping surface is provided with a clamping groove, and the clamping groove is used to embed the edge of the wafer.

13. The wafer chuck according to claim 1, characterized in that: The clamping block has a second clamping surface facing the center of the wafer carrier, the second clamping surface is set at an acute angle or a right angle to the surface of the wafer carrier, or the second clamping surface is provided with a clamping groove, and the clamping groove is used to embed the edge of the wafer.

14. The wafer chuck according to claim 1, characterized in that: The wafer carrier has a placement area for placing wafers; The wafer chuck further comprises: a raised positioning portion, located at the edge of the placement area, for circumferential positioning of the wafer, the positioning portion comprising a positioning surface facing the placement area; or the positioning portion comprises one or more raised points.

15. The wafer chuck according to claim 1, characterized in that: The wafer carrier is provided with a notch for positioning the wafer carrier.

16. The wafer chuck according to claim 1, characterized in that: The wafer carrier is provided with a through hole.

17. The wafer chuck according to claim 1, characterized in that: The material of the clamping block includes one or more of graphite, silicon, ceramic, plastic and quartz.

18. The wafer chuck according to claim 1, characterized in that: The material of the wafer carrier includes one or more of graphite, silicon, ceramic, plastic and quartz.

19. A semiconductor device, characterized in that: include: Electrostatic chuck; The wafer chuck according to any one of claims 1 to 18, arranged on the electrostatic chuck.

Images