Wafer bearing part structure of semiconductor cavity assembly

Abstract

The utility model discloses a wafer bearing part structure of a semiconductor cavity assembly, comprising a cavity body, the surface of which is provided with reinforcing ribs; one side of the adjusting assembly is fixedly connected with one side of the inner wall of the cavity body, and the adjusting assembly is used for adjusting the position of the wafer; and the bottom of the adsorption assembly is fixedly connected with the top of the cavity body. The utility model relates to the technical field of wafer bearing. According to the wafer bearing part structure of the semiconductor cavity assembly, by means of the arrangement of the adjusting assembly, through the rotating motor and the height telescopic rod, a wafer can be freely lifted to be close to the draught fan, the surface position of the wafer is changed through rotation, dust in the cavity body is conveniently and comprehensively sucked, and the round bottom plate serves as a bearing plate; the bearing plate can be stably supported, and the surface of the bearing plate can be kept stable during high-speed rotation through the dovetail plate and the dovetail ring.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer bearing, in particular to a wafer bearing part structure of a semiconductor cavity component. Background Art

[0002] Wafer refers to the silicon chip used in the manufacture of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer. The patent with announcement number CN216120259U discloses a base assembly and semiconductor process equipment, which relates to the field of semiconductor equipment. A base assembly is used in the reaction chamber of semiconductor process equipment, including a base body, the base body is used to carry wafers; a support member, the support member is connected to the side of the base body away from the bearing surface; a light-transmitting member, the light-transmitting member is arranged around the rotation axis of the base body, including a first end and a second end arranged opposite to each other, and a light-transmitting part connecting the first end and the second end, at least part of the light-transmitting part is arranged opposite to the side of the base body away from the bearing surface, and the first end is connected to the support member; a support shaft, the support shaft is connected to the second end. A semiconductor process equipment includes the above-mentioned base assembly. This patent can solve the problem that the three-pronged structure in the graphite base blocks the temperature measurement point and affects the temperature accuracy in the chamber.

[0003] As shown in the above technology, during the ordinary wafer production process, some dust may be generated after the surface of the wafer slice is cut and formed and remain in the semiconductor chamber. If it stays for a long time, it will adhere to the inner wall of the semiconductor chamber and the surface of the wafer, which will be inconvenient to clean later and affect the overall subsequent production accuracy of the wafer. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a wafer supporting structure for a semiconductor chamber assembly, which solves the problem that some dust may be generated on the surface of the wafer slice after being cut and formed and remain in the semiconductor chamber. The dust may adhere to the inner wall of the semiconductor chamber and the surface of the wafer after long-term retention, making it inconvenient to clean later and affecting the subsequent production accuracy of the entire wafer.

[0005] To achieve the above objectives, the utility model is implemented through the following technical solutions: A wafer bearing structure of a semiconductor cavity assembly, comprising:

[0006] A cavity body, wherein reinforcing ribs are arranged on the surface of the cavity body;

[0007] An adjusting component, one side of which is fixedly connected to one side of the inner wall of the cavity body, and the adjusting component is used to adjust the position of the wafer;

[0008] The adsorption component has a bottom that is fixedly connected to the top of the cavity body, and is used to remove dust inside the cavity body.

[0009] Preferably, the adjusting component includes a support plate fixedly connected to one side of the inner wall of the cavity body. A round bottom plate is fixedly connected to the top of the support plate. One side of the inner wall of the cavity body is fixedly connected to a fixing plate, and a telescopic rod is fixedly connected to the top of the fixing plate.

[0010] Preferably, the top end of the telescopic rod is fixedly connected to an adapter plate. One side of the adapter plate is fixedly connected to a dovetail plate. A dovetail ring is movably sleeved on the surface of the dovetail plate, and a bearing plate is fixedly connected to the inner wall of the dovetail ring.

[0011] Preferably, a height telescopic rod is fixedly connected to the middle of the bottom of the inner wall of the cavity body. The top end of the height telescopic rod is fixedly connected to a rotating motor, and the top end of the output shaft of the rotating motor is fixedly connected to the bottom of the bearing plate.

[0012] Preferably, the adsorption component includes a blower fixedly connected to the top of the cavity body. A filter plate is fixedly connected to one side of the blower.

[0013] Preferably, two material guiding pipes are communicated with one side of the filter plate. One end of the material guiding pipe penetrates through the cavity body and extends to the inside of the cavity body.

[0014] Beneficial effects

[0015] The present utility model provides a wafer bearing part structure of a semiconductor cavity component. Compared with the prior art, the following beneficial effects are achieved:

[0016] (1) In the wafer bearing part structure of the semiconductor cavity component, by using the adjusting component, through the rotating motor and the height telescopic rod, the wafer can be freely lifted to be close to the blower, and rotated to change the position of the wafer surface, which is convenient for comprehensively sucking the dust inside the cavity body. The round bottom plate serves as the bearing plate, which can stably support the bearing plate. Through the dovetail plate and the dovetail ring, the bearing plate can maintain surface stability during high-speed rotation.

[0017] (2) In the wafer bearing part structure of the semiconductor cavity component, by using the adsorption component, the device can adsorb and filter the dust through the filter plate, avoiding direct contact between the dirty air and the blower, and enabling the internal mechanism of the blower to maintain a long-term stable working state. Description of the drawings

[0018] Figure 1 is a three-dimensional schematic diagram of the present utility model;

[0019] Figure 2 is a three-dimensional sectional view of the present utility model;

[0020] Figure 3 is the present utility model Figure 2 a partial enlarged view of part A in;

[0021] Figure 4 This is a schematic diagram of the adsorption component structure of the present utility model.

[0022] In the figure: 1, cavity body; 2, adjustment component; 21, support plate; 22, round bottom plate; 23, fixing plate; 24, telescopic rod; 25, connecting plate; 26, dovetail plate; 27, dovetail ring; 28, bearing plate; 29, height telescopic rod; 210, rotating motor; 3, adsorption component; 31, fan; 32, filter plate; 33, material guiding pipe. Specific embodiments

[0023] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0024] Please refer to Figures 1-4 , the present utility model provides two technical solutions:

[0025] Embodiment 1, a wafer carrying part structure of a semiconductor cavity component, comprising:

[0026] Cavity body 1, with reinforcing ribs arranged on the surface of cavity body 1;

[0027] Adjustment component 2, one side of adjustment component 2 is fixedly connected to one side of the inner wall of cavity body 1, and adjustment component 2 is used to adjust the position of the wafer;

[0028] Adsorption component 3, the bottom of adsorption component 3 is fixedly connected to the top of cavity body 1, and adsorption component 3 is used to remove dust inside cavity body 1. With the arrangement of adjustment component 2, through rotating motor 210 and height telescopic rod 29, the wafer can be freely raised to be close to fan 31, and rotated to change the position of the wafer surface, facilitating the comprehensive absorption of dust inside cavity body 1. Round bottom plate 22 serves as a bearing plate, which can stably support bearing plate 28, and through dovetail plate 26 and dovetail ring 27, bearing plate 28 can maintain surface stability during high-speed rotation.

[0029] Embodiment 2, the main difference from Embodiment 1 lies in: a wafer carrier structure of a semiconductor cavity component. The adjustment component 2 includes a support plate 21 fixedly connected to one side of the inner wall of the cavity body 1. The top of the support plate 21 is fixedly connected with a round bottom plate 22. One side of the inner wall of the cavity body 1 is fixedly connected with a fixing plate 23. The top of the fixing plate 23 is fixedly connected with a telescopic rod 24. The top of the telescopic rod 24 is fixedly connected with an adapter plate 25. One side of the adapter plate 25 is fixedly connected with a dovetail plate 26. A dovetail ring 27 is movably sleeved on the surface of the dovetail plate 26. The inner wall of the dovetail ring 27 is fixedly connected with a bearing plate 28. In the middle of the bottom of the inner wall of the cavity body 1, a height telescopic rod 29 is fixedly connected. The top of the height telescopic rod 29 is fixedly connected with a rotation motor 210. The rotation motor 210 is a stepper motor. The top of the output shaft of the rotation motor 210 is fixedly connected with the bottom of the bearing plate 28. The adsorption component 3 includes a blower 31 fixedly connected to the top of the cavity body 1. One side of the blower 31 is fixedly connected with a filter plate 32. Two material guiding pipes 33 are communicated with one side of the filter plate 32. One end of the material guiding pipe 33 penetrates through the cavity body 1 and extends into the cavity body 1. By setting the adsorption component 3, the device can adsorb and filter dust through the filter plate 32, avoiding direct contact between dirty air and the blower 31, and enabling the internal mechanism of the blower 31 to maintain a long-term stable working state.

[0030] At the same time, the content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

[0031] During operation, after the wafer production is completed, it is placed on the top of the bearing plate 28. The blower 31 is turned on, and the dusty air in the cavity body 1 is extracted through the material guiding pipe 33. The dust is filtered by the filter plate 32. The height telescopic rod 29 is raised so that the wafer on the top of the bearing plate 28 is close to the bottom end of the material guiding pipe 33. The rotation motor 210 is turned on, and the bearing plate 28 drives the wafer to change its position, facilitating the operation of the material guiding pipe 33. While the height telescopic rod 29 is rising, the telescopic rod 24 rises synchronously. After the bearing plate 28 rotates, it drives the dovetail ring 27 to rotate, and relative sliding occurs between the surface of the dovetail plate 26 and the inner wall of the dovetail ring 27. After the dust extraction is completed, subsequent operations are performed on the wafer. When the device is completely operated, the device is restored.

[0032] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device.

[0033] Although embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A wafer supporting structure of a semiconductor chamber assembly, characterized in that: include: A cavity body (1), wherein reinforcing ribs are arranged on the surface of the cavity body (1); An adjustment component (2), one side of the adjustment component (2) being fixedly connected to one side of the inner wall of the cavity body (1), and the adjustment component (2) being used to adjust the position of the wafer; An adsorption component (3), the bottom of the adsorption component (3) being fixedly connected to the top of the cavity body (1), and the adsorption component (3) being used to remove dust inside the cavity body (1); The adjustment assembly (2) comprises a support plate (21) fixedly connected to one side of the inner wall of the cavity body (1); the top of the support plate (21) is fixedly connected to a round bottom plate (22); one side of the inner wall of the cavity body (1) is fixedly connected to a fixing plate (23); the top of the fixing plate (23) is fixedly connected to a telescopic rod (24); the top of the telescopic rod (24) is fixedly connected to a connecting plate (25); one side of the connecting plate (25) is fixedly connected to a dovetail plate (26); a dovetail ring (27) is movably sleeved on the surface of the dovetail plate (26); the inner wall of the dovetail ring (27) is fixedly connected to a bearing plate (28); a height telescopic rod (29) is fixedly connected to the middle of the bottom of the inner wall of the cavity body (1); the top of the height telescopic rod (29) is fixedly connected to a rotating motor (210); the top of the output shaft of the rotating motor (210) is fixedly connected to the bottom of the bearing plate (28).

2. The wafer supporting structure of a semiconductor chamber assembly according to claim 1, characterized in that: The adsorption assembly (3) comprises a fan (31) fixedly connected to the top of the cavity body (1); a filter plate (32) is fixedly connected to one side of the fan (31); two feed pipes (33) are connected to one side of the filter plate (32); one end of the feed pipe (33) passes through the cavity body (1) and extends to the interior of the cavity body (1).

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