Clamping mechanism of wafer cleaning machine

Abstract

The utility model discloses a wafer cleaning machine clamping mechanism which comprises a transmission assembly, a driving part is arranged in the transmission assembly, a connecting shaft penetrating to the outside of the transmission assembly is installed at the output end of the driving part, and the driving part drives the connecting shaft to rotate. The mounting sleeve and the fixing sleeve are arranged on the connecting shaft in a sleeving mode and synchronously rotate along with the connecting shaft, the bottom of the mounting sleeve is further connected with a connecting rod, the bottom end of the connecting rod is connected with clamping plates, in the clamping process of wafer cleaning, the connecting shaft drives the mounting sleeve to rotate, the mounting sleeve drives the connecting rod and the clamping plates to synchronously rotate, and the wafer is clamped between the two clamping plates; therefore, the clamping work is completed; a buffer assembly is further arranged at the joint of the connecting rod and the clamping plate. The buffer assembly is composed of a detection piece and an elastic piece. Through the designed buffer assembly, on the basis of ensuring stable clamping of the wafer, the phenomenon of clamping damage to the wafer caused by too large force is avoided, and meanwhile, the buffer assembly is simple in structure and convenient to process and produce.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer cleaning machines, and particularly relates to a clamping mechanism of a wafer cleaning machine. Background Technique

[0002] In the processing of wafers, chemical mechanical polishing treatment needs to be carried out on the wafers, and the wafers after polishing treatment need to be cleaned. In the cleaning process of wafers, it is often necessary to fix the wafers and then carry out cleaning. At this time, a clamping mechanism is required to achieve fixed limit.

[0003] Currently, in the clamping of wafers, there is no buffer structure between the clamping plate and the wafer, and only the material of the clamping plate itself can be used to achieve flexible clamping. However, in actual use, once the clamping force is too large, it is easy to damage the wafer, so there is room for improvement. Content of the Utility Model

[0004] The purpose of the utility model is to provide a clamping mechanism of a wafer cleaning machine to solve the problem that the existing clamping mechanism does not have a buffer protection function during clamping in the above-mentioned background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A clamping mechanism of a wafer cleaning machine includes a transmission component, in which a driving part is arranged. A connecting shaft penetrating to the outside of the transmission component is installed on the output end of the driving part, and the connecting shaft is driven to rotate by the driving part; a mounting sleeve is fixedly sleeved on the connecting shaft and rotates synchronously with the connecting shaft. A connecting rod is also connected to the bottom of the mounting sleeve, and the bottom end of the connecting rod is connected to a clamping plate. During the clamping of wafer cleaning, the mounting sleeve is driven to rotate by the connecting shaft, and the mounting sleeve drives the connecting rod and the clamping plate to rotate synchronously, so that the wafer is clamped between the two clamping plates to complete the clamping work; a buffer component is also arranged at the connection between the connecting rod and the clamping plate. The buffer component is composed of a detection part and an elastic part. The detection part and the elastic part are respectively arranged on both sides of the swinging direction of the connecting rod. The elastic part is always in contact with or against the connecting rod, so that the swinging force of the connecting rod can be received by the elastic part and transmitted to the clamping plate, so as to achieve the purpose of clamping the wafer.

[0006] Preferably, moving grooves for the connecting rod to penetrate are symmetrically opened at the top of the clamping plate. The detection part is a pressure sensor with one end extending into the moving groove, and the elastic part is a spring. The spring and the pressure sensor are respectively at both ends of the moving groove, and the connecting rod is between the spring and the pressure sensor. When the connecting rod swings, it will squeeze the spring, and the spring drives the clamping plate to clamp the wafer. The spring will produce a rebound force to press the connecting rod against the pressure sensor, and the clamping force is detected by the pressure sensor. At the same time, during further clamping, buffer clamping can be realized through the deformation of the spring.

[0007] Preferably, screw holes are machined on the outer side of the top of the clamping plate. The outside of the pressure sensor is threaded and screwed into the screw holes to be fixedly connected with the clamping plate. The spring is fixed in the moving groove by spot welding to ensure stable installation.

[0008] Preferably, at least two nuts are sleeved on the connecting rod, and the two nuts are respectively located at the upper and lower end faces of the top of the clamping plate, so as to realize the limit of the connecting rod and the clamping plate and avoid the phenomenon that the connecting rod and the clamping plate are separated.

[0009] Preferably, a plurality of rubber strips are adhered to the inner side surface of the clamping plate, and the rubber strips are in flexible clamping contact with the wafer to further reduce the risk of damage to the wafer.

[0010] Preferably, a reinforcing member is further provided on the connecting rod. The reinforcing member is a collar sleeved on the connecting rod and a reinforcing rod for fixing the collar in a staggered manner. The strength between the two connecting rods can be improved through the reinforcing member to ensure the stability of clamping.

[0011] Preferably, the driving member is a servo motor, and the connecting shaft is installed on the output end of the servo motor.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0013] Through the designed buffer assembly, on the basis of ensuring stable clamping of the wafer, the phenomenon of clamping damage to the wafer caused by excessive force is avoided. At the same time, the buffer assembly has a simple structure, is convenient for processing and production, has high practicability, and improves the deficiencies existing in the use of the existing structure. Description of the Drawings

[0014] Figure 1 is a schematic structural diagram of the present utility model;

[0015] Figure 2 is a schematic structural diagram of the clamping plate of the present utility model;

[0016] Figure 3 is the present utility model Figure 2 an enlarged schematic diagram of area A in;

[0017] Figure 4 is a schematic structural diagram of the reinforcing member of the present utility model.

[0018] In the figure:

[0019] 100, transmission assembly; 101, connecting shaft;

[0020] 200, mounting sleeve; 201, collar; 202, connecting rod; 203, reinforcing rod; 204, clamping plate; 205, rubber strip; 206, moving groove; 207, spring; 208, pressure sensor. Specific embodiments

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0022] Please refer to Figures 1 to 4 , the present utility model provides a technical solution: a clamping mechanism for a wafer cleaning machine, including

[0023] A transmission component 100, which is provided with a driving member therein. A connecting shaft 101 penetrating to the outside of the transmission component 100 is installed on the output end of the driving member, and the connecting shaft 101 is driven to rotate by the driving member;

[0024] An installation sleeve 200 is fixedly sleeved on the connecting shaft 101 and rotates synchronously with the connecting shaft 101. A connecting rod 202 is further connected to the bottom of the installation sleeve 200, and a clamping plate 204 is connected to the bottom end of the connecting rod 202. During the clamping of the wafer cleaning, the connecting shaft 101 drives the installation sleeve 200 to rotate, and the installation sleeve 200 drives the connecting rod 202 and the clamping plate 204 to rotate synchronously, so that the wafer is clamped between the two clamping plates 204 to complete the clamping work;

[0025] A buffer component is further provided at the connection between the connecting rod 202 and the clamping plate 204. The buffer component is composed of a detection member and an elastic member, where

[0026] The detection member and the elastic member are respectively arranged on both sides of the swinging direction of the connecting rod 202. The elastic member is always in contact with or against the connecting rod 202, so that the swinging force of the connecting rod 202 can be received by the elastic member and transmitted to the clamping plate 204 to achieve the purpose of clamping the wafer.

[0027] In this embodiment, preferably, moving grooves 206 for the connecting rod 202 to penetrate are symmetrically opened at the top of the clamping plate 204. The detection member is a pressure sensor 208 with one end extending into the moving groove 206, and the elastic member is a spring 207. The spring 207 and the pressure sensor 208 are respectively at both ends of the moving groove 206, and the connecting rod 202 is between the spring 207 and the pressure sensor 208. When the connecting rod 202 swings, it will squeeze the spring 207, and the spring 207 drives the clamping plate 204 to clamp the wafer. The spring 207 will rebound and press the connecting rod 202 against the pressure sensor 208 to detect the clamping force through the pressure sensor 208. At the same time, during further clamping, buffer clamping can be realized through the deformation of the spring 207.

[0028] In this embodiment, preferably, screw holes are machined on the outer side of the top of the clamping plate 204. The outside of the pressure sensor 208 is threaded and screwed into the screw holes to be fixedly connected to the clamping plate 204. The spring 207 is fixed in the moving groove 206 by spot welding to ensure a stable installation.

[0029] In this embodiment, preferably, at least two nuts are sleeved on the connecting rod 202, and the two nuts are respectively located at the upper and lower end faces of the top of the clamping plate 204, so as to realize the limitation of the connecting rod 202 and the clamping plate 204 and avoid the disengagement of the connecting rod 202 and the clamping plate 204.

[0030] In this embodiment, preferably, a plurality of rubber strips 205 are adhered to the inner side surface of the clamping plate 204. The rubber strips 205 are in flexible clamping contact with the wafer to further reduce the risk of damage to the wafer.

[0031] In this embodiment, preferably, a reinforcing member is further provided on the connecting rod 202. The reinforcing member is a collar 201 sleeved on the connecting rod 202 and a reinforcing rod 203 for fixing the collar 201 in a staggered manner. The strength between the two connecting rods 202 can be improved through the reinforcing member to ensure the stability of clamping.

[0032] In this embodiment, preferably, the driving member is a servo motor, and the connecting shaft 101 is installed on the output end of the servo motor.

[0033] Although the embodiments of the present invention have been shown and described (see the above detailed description), for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer cleaning machine clamping mechanism, comprising: A transmission assembly (100) is provided with a driving member, and a connecting shaft (101) penetrating to the outside of the transmission assembly (100) is installed on the output end of the driving member; The mounting sleeve (200) is a fixed sleeve disposed on the connecting shaft (101) and rotates synchronously with the connecting shaft (101). The bottom of the mounting sleeve (200) is also connected to a connecting rod (202), and the bottom end of the connecting rod (202) is connected to a clamping plate (204); Features: A buffer component is also provided at the connection between the connecting rod (202) and the clamping plate (204), and the buffer component is composed of a detection component and an elastic component, wherein The detection member and the elastic member are respectively arranged at two sides of the swinging direction of the connecting rod (202), and the elastic member is always in contact with or against the connecting rod (202).

2. The wafer cleaning machine clamping mechanism according to claim 1, characterized in that: The top of the clamping plate (204) is symmetrically provided with a movable groove (206) for the connecting rod (202) to pass through, the detecting member is a pressure sensor (208) with one end extending into the movable groove (206), and the elastic member is a spring (207), the spring (207) and the pressure sensor (208) are respectively located at the two ends of the movable groove (206), and the connecting rod (202) is located between the spring (207) and the pressure sensor (208).

3. The wafer cleaning machine clamping mechanism according to claim 2, characterized in that: The top outer side of the clamping plate (204) is provided with a screw hole, the outer side of the pressure sensor (208) is threaded and screwed into the screw hole to be fixedly connected to the clamping plate (204); the spring (207) is fixed in the movable groove (206) by spot welding.

4. The wafer cleaning machine clamping mechanism according to claim 2, characterized in that: At least two nuts are sleeved on the connecting rod (202), and the two nuts are respectively located at the upper and lower end surfaces of the top of the clamping plate (204).

5. The wafer cleaning machine clamping mechanism according to claim 1, characterized in that: A plurality of rubber strips (205) are bonded to the inner side surface of the clamping plate (204).

6. The wafer cleaning machine clamping mechanism according to claim 2, characterized in that: The connecting rod (202) is also provided with a reinforcing member, which is a collar (201) sleeved on the connecting rod (202) and a reinforcing rod (203) that fixes the collar (201) in a staggered manner.

7. The wafer cleaning machine clamping mechanism according to claim 1, characterized in that: The driving member is a servo motor, and the connecting shaft (101) is mounted on the output end of the servo motor.

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