Heat dissipation structure of IGBT (Insulated Gate Bipolar Translator) module

Abstract

The utility model discloses an IGBT module heat radiation structure comprising a device body, the upper end of the device body is detachably connected with a heat radiation assembly, the device body comprises a copper substrate, the upper end of the copper substrate is fixedly connected with a ceramic substrate, the upper end of the ceramic substrate is fixedly connected with a plurality of templates, and the two sides of the upper ends of the plurality of templates are fixedly connected with bonding wires. According to the utility model, the device body is matched with the heat dissipation assembly, so that the heat dissipation effect and the heat dissipation efficiency of the IGBT module can be obviously improved, the service life of the IGBT module can be prolonged, the cost loss can be reduced, the IGBT module can be conveniently disassembled, and the replacement of IGBT module parts can be facilitated.

Description

Technical Field

[0001] The utility model relates to the field of heat dissipation structures, in particular to an IGBT module heat dissipation structure. Background Art

[0002] The IGBT module is a composite fully-controlled voltage-driven power semiconductor device composed of BJT (bipolar junction transistor) and MOS (insulated gate field effect transistor). Since the IGBT module will generate heat inside when in use, if it is not dissipated, it will cause damage to the IGBT module, thereby causing cost loss. Therefore, an IGBT module with a heat dissipation structure is required. Among them, the "a ceramic-based heat dissipation structure of an IGBT module" disclosed in the application number "CN202221257875.6" is also an increasingly mature technology. It "is able to conduct heat to the ceramic base body by setting an opening component and a heat-conducting component, so that the ceramic base body has a better heat dissipation effect, and the heat dissipation fins are used to dissipate the heat. The IGBT module is a heat dissipation module that is used to dissipate heat from the ceramic base body, and the opening of the box cover can accelerate the gas flow, thereby achieving a better heat dissipation effect. However, the IGBT module still has the following defects during use: the IGBT module can indeed dissipate heat from the ceramic base body through the heat-conducting components provided, but the heat dissipation effect achieved by the heat-conducting components alone is not significant enough, thereby affecting the heat conduction efficiency. Therefore, it is necessary to provide a heat dissipation structure that can significantly improve the heat conduction effect. In addition, since the IGBT module is an integral structure, it is not convenient to install and disassemble it. Therefore, it is necessary to provide a heat dissipation structure that is convenient for disassembly and replacement of components. Utility Model Content

[0003] The purpose of the utility model is to provide an IGBT module heat dissipation structure to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an IGBT module heat dissipation structure, comprising a device body, the upper end of which is detachably connected to a heat dissipation component;

[0005] The device body includes a copper substrate, the upper end of which is fixedly connected to a ceramic substrate, the upper end of which is fixedly connected to a plurality of templates, both sides of the upper ends of the plurality of templates are fixedly connected to bonding wires, the upper end of one of the templates is fixedly connected to a thermistor, the heat dissipation component includes a shell, the upper end of which is provided with a plurality of heat dissipation grooves, the inner wall of which is fixedly installed with a circulation pipe, and the lower surface of the shell is fixedly connected to two blocks at both ends.

[0006] As a preferred embodiment of the present utility model, a plurality of limiting blocks are fixedly connected to both sides of the upper surface of the copper substrate, and a plurality of first limiting grooves are formed on both sides of the upper end of the ceramic substrate. A plurality of the limiting blocks are movably inserted into the first limiting grooves.

[0007] As a preferred embodiment of the present utility model, a plurality of second limiting grooves are formed on both sides of the upper end of the housing. A plurality of the limiting blocks penetrate through the first limiting grooves and are movably inserted into the second limiting grooves.

[0008] As a preferred embodiment of the present utility model, a limiting hole is formed at one end of the housing. One end of the circulation pipe is fixedly connected to a liquid inlet pipe. The liquid inlet pipe is fixedly inserted into the limiting hole, and a valve is rotatably connected to the side surface of the liquid inlet pipe.

[0009] As a preferred embodiment of the present utility model, the structures of the copper substrate, the ceramic substrate and the housing are matched.

[0010] As a preferred embodiment of the present utility model, the circulation pipe is made of stainless steel, and the coverage area of the circulation pipe fits with a plurality of templates.

[0011] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0012] 1. The present utility model can significantly improve the heat dissipation efficiency of the heat dissipation structure by means of the device body and the heat dissipation component. When in use, the ceramic substrate and the copper substrate are used to conduct the current generated by the template and the bonding wires on its upper end, so that part of the current is led out of the IGBT module body. At the same time, the condensate is conveyed into the circulation pipe and the valve is turned to seal the circulation pipe, so that the condensate can circulate in the circulation pipe, and thus the effect of secondary heat dissipation can be achieved. At the same time, the heat dissipation effect of the heat dissipation component can be enhanced by cooperating with the heat dissipation grooves. Compared with the heat dissipation effect achieved only by the heat conduction component in the prior art "a ceramic-based heat dissipation structure of an IGBT module", the present utility model can significantly improve the heat dissipation effect of the IGBT module through the above operations, and thus can improve the heat dissipation efficiency, extend the service life of the IGBT module, and reduce the cost loss.

[0013] 2. The utility model also facilitates the disassembly and assembly of the IGBT module through the cooperation of the device body and the heat dissipation component, thereby providing convenience for the replacement of the IGBT module components. During installation, simply snap the limit block into the first limit slot and the second limit slot, and then snap the clamping block into the clamping slot to complete the installation of the copper substrate, ceramic substrate and the housing. Conversely, removing the limit block from the first limit slot and the second limit slot and removing the clamping block from the clamping slot can complete the disassembly work. Compared with the overall heat dissipation structure of the "ceramic-based heat dissipation structure of an IGBT module" in the prior art, the utility model can facilitate the disassembly and assembly of the IGBT module through the mutual cooperation of the above structures, thereby providing convenience for the replacement of the IGBT module components. Description of the Drawings

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 It is an exploded view of the structure of the device body of the utility model;

[0016] Figure 3 It is an exploded view of the structure of the heat dissipation component of the utility model.

[0017] In the figure: 1. Device body; 11. Copper substrate; 12. Ceramic substrate; 13. Template; 14. Bonding wire; 15. Clamping slot; 16. Thermistor; 111. Limit block; 112. First limit slot; 2. Heat dissipation component; 21. Housing; 22. Heat dissipation slot; 23. Circulation pipe; 24. Clamping block; 211. Second limit slot; 221. Limit hole; 222. Liquid inlet pipe; 223. Valve. Detailed Embodiment

[0018] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0019] Please refer to Figures 1 - 3 , the present utility model provides a technical solution: a heat dissipation structure for an IGBT module, including a device body 1, and a heat dissipation component 2 is detachably connected to the upper end of the device body 1;

[0020] The device body 1 includes a copper substrate 11. A ceramic substrate 12 is fixedly connected to the upper end of the copper substrate 11. A plurality of templates 13 are fixedly connected to the upper end of the ceramic substrate 12. Bonding wires 14 are fixedly connected to both sides of the upper ends of the plurality of templates 13. A thermistor 16 is fixedly connected to the upper end of one of the templates 13. The heat dissipation component 2 includes a housing 21. A plurality of heat dissipation grooves 22 are opened in the upper end of the housing 21. A circulation pipe 23 is fixedly installed on the inner wall of the housing 21. Two clamping blocks 24 are fixedly connected to both ends of the lower surface of the housing 21.

[0021] Specifically, by the cooperation of the device body 1 and the heat dissipation component 2, not only can the heat dissipation effect of the IGBT module be significantly improved, the heat dissipation efficiency be increased, the service life of the IGBT module be prolonged, and the cost loss be reduced, but also it is convenient to disassemble the IGBT module, and thus it is convenient to replace the components of the IGBT module. When in use, the ceramic substrate 12 can play an insulating role, cooperate with the thermistor 16 to monitor the internal temperature of the IGBT module. At the same time, the copper substrate 11 can conduct the internal heat of the IGBT module out. Then, the condensate is conveyed into the circulation pipe 23. The circulation structure of the circulation pipe 23 enables the condensate to circulate in the circulation pipe 23. Cooperating with the heat dissipation grooves 22 can conduct secondary heat dissipation, and thus the heat dissipation efficiency of the IGBT module can be significantly improved. At the same time, the limiting block 111 is clamped in the first limiting groove 112 and the second limiting groove 211, and then the clamping block 24 is clamped in the clamping groove 15 to install and fix the copper substrate 11, the ceramic substrate 12 and the housing 21.

[0022] In this embodiment: A plurality of limiting blocks 111 are fixedly connected to both sides of the upper surface of the copper substrate 11. A plurality of first limiting grooves 112 are opened on both sides of the upper end of the ceramic substrate 12. The plurality of limiting blocks 111 are all movably inserted into the first limiting grooves 112.

[0023] Specifically, by clamping the plurality of limiting blocks 111 in the first limiting grooves 112, the copper substrate 11 and the ceramic substrate 12 can be installed and fixed.

[0024] In this embodiment: A plurality of second limiting grooves 211 are opened on both sides of the upper end of the housing 21. The plurality of limiting blocks 111 penetrate through the first limiting grooves 112 and are movably inserted into the second limiting grooves 211.

[0025] Specifically, by clamping the limiting block 111 in the first limiting groove 112 and the second limiting groove 211, the copper substrate 11, the ceramic substrate 12 and the housing 21 can be installed and fixed. At the same time, by taking out the limiting block 111, the IGBT module can be disassembled.

[0026] In this embodiment: A limiting hole 221 is formed at one end of the housing 21. One end of the circulation pipe 23 is fixedly connected to a liquid inlet pipe 222. The liquid inlet pipe 222 is fixedly inserted into the interior of the limiting hole 221. A valve 223 is rotatably connected to the side surface of the liquid inlet pipe 222.

[0027] Specifically, by inserting the liquid inlet pipe 222 at one end of the circulation pipe 23 into the limiting hole 221, the circulation pipe 23 can be installed inside the housing 21. By turning the valve 223, the opening and closing of the circulation pipe 23 can be controlled, so that the interior of the circulation pipe 23 can be in a sealed state, facilitating the circulation of the condensate inside the circulation pipe 23.

[0028] In this embodiment: The structures of the copper substrate 11, the ceramic substrate 12 and the housing 21 match.

[0029] Specifically, since the structures of the copper substrate 11, the ceramic substrate 12 and the housing 21 match, the limiting block 111 can be accurately inserted into the first limiting groove 112 and the second limiting groove 211, so that the housing 21 can wrap and protect the template 13, the bonding wire 14 and the thermistor 16 above it.

[0030] In this embodiment: The circulation pipe 23 is made of stainless steel, and the coverage area of the circulation pipe 23 matches that of several templates 13.

[0031] Specifically, the stainless steel circulation pipe 23 can avoid rusting under the action of the condensate, thus extending the service life of the circulation pipe 23. Since the coverage area of the circulation pipe 23 matches that of several templates 13, the condensate inside the circulation pipe 23 can uniformly dissipate heat from the IGBT module, thereby improving the heat dissipation efficiency of the heat dissipation structure.

[0032] Working principle: When in use, during the installation of this utility model, first, the limiting block 111 is snapped into the first limiting groove 112 and the second limiting groove 211. Then, the clamping block 24 is snapped into the clamping groove 15, so as to connect the copper substrate 11, the ceramic substrate 12 and the housing 21. The insulation of the copper substrate 11 can initially play a heat dissipation effect. At the same time, in cooperation with the copper substrate 11, the heat generated by the transmission of current in the bonding wire 14 of the IGBT module can be discharged. Meanwhile, the condensate is conveyed into the circulation pipe 23 through the liquid inlet pipe 222, and the circulation pipe 23 is sealed by screwing the valve 223. Then, the condensate circulating in the circulation pipe 23 can play a secondary heat dissipation effect, and in cooperation with the heat dissipation groove 22, the heat dissipation effect of the heat dissipation component 2 can be enhanced. Subsequently, when disassembling, just take out the limiting block 111 from the first limiting groove 112 and the second limiting groove 211, and take out the clamping block 24 from the clamping groove 15 to disassemble the IGBT module. Through the mutual cooperation of the above structures, not only can the heat dissipation efficiency of the IGBT module be significantly improved, the service life of the IGBT module be extended, and the cost loss be reduced, but also the disassembly and assembly of the IGBT module components are facilitated, and thus it is convenient to replace the IGBT module.

[0033] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or sequence between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0034] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. An IGBT module heat dissipation structure, comprising a device body (1), characterized in that: The upper end of the device body (1) is detachably connected to a heat dissipation component (2); The device body (1) comprises a copper substrate (11), the upper end of the copper substrate (11) is fixedly connected to a ceramic substrate (12), the upper end of the ceramic substrate (12) is fixedly connected to a plurality of templates (13), both sides of the upper ends of the plurality of templates (13) are fixedly connected to bonding wires (14), the upper end of one of the templates (13) is fixedly connected to a thermistor (16), the heat dissipation component (2) comprises a shell (21), the upper end of the shell (21) is provided with a plurality of heat dissipation grooves (22), the inner wall of the shell (21) is fixedly mounted with a circulation pipe (23), and the lower surface of the shell (21) is fixedly connected to two blocks (24) at both ends.

2. The IGBT module heat dissipation structure according to claim 1, characterized in that: A plurality of limit blocks (111) are fixedly connected to both sides of the upper surface of the copper substrate (11), a plurality of first limit grooves (112) are provided on both sides of the upper end of the ceramic substrate (12), and the plurality of limit blocks (111) are movably inserted into the first limit grooves (112).

3. The IGBT module heat dissipation structure according to claim 2, characterized in that: A plurality of second limiting grooves (211) are provided on both sides of the upper end of the shell (21), and a plurality of limiting blocks (111) penetrate the first limiting grooves (112) and are movably inserted into the interior of the second limiting grooves (211).

4. The IGBT module heat dissipation structure according to claim 1, characterized in that: A limiting hole (221) is provided at one end of the shell (21), a liquid inlet pipe (222) is fixedly connected to one end of the circulation pipe (23), the liquid inlet pipe (222) is fixedly inserted into the limiting hole (221), and a valve (223) is rotatably connected to the side surface of the liquid inlet pipe (222).

5. The IGBT module heat dissipation structure according to claim 1, characterized in that: The structures of the copper substrate (11), the ceramic substrate (12) and the housing (21) match each other.

6. The IGBT module heat dissipation structure according to claim 1, characterized in that: The circulation pipe (23) is made of stainless steel, and the coverage area of ​​the circulation pipe (23) matches that of a plurality of templates (13).

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