Square heat pipe welding radiator for radiating heat of chip

Abstract

The utility model relates to the technical field of radiators, in particular to a square heat pipe welding radiator for chip heat dissipation, which comprises a heat dissipation module and a heat conduction module, the heat dissipation module comprises heat dissipation fins and a heat dissipation copper pipe penetrating through the heat dissipation fins, and the heat conduction module comprises a heat conduction piece formed at one end of the heat dissipation copper pipe. A heat conduction groove used for installing the heat conduction piece is formed in the heat dissipation module, the heat conduction piece comprises a plurality of heat conduction copper pipes, the cross section of each heat conduction copper pipe is rectangular, and every two adjacent heat conduction copper pipes are in surface contact; every two adjacent heat conduction copper pipes are in surface contact; the heat conduction copper pipes of the heat conduction piece are in contact through formed planes, so that the heat conduction copper pipes form a whole, heat between every two adjacent heat conduction copper pipes can be transferred, heat cannot be gathered at one position, the heat can be evenly dispersed to the heat conduction copper pipes, and the heat conduction efficiency is improved. And then the heat is transmitted to the heat dissipation fins through the heat dissipation copper pipes to be discharged outwards, so that the heat dissipation performance is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a square heat pipe welded radiator for chip heat dissipation. Background Art

[0002] With the rapid development of power electronics technology, there are more and more high-power, large-size, and high heat flux density electronic components, with increasing heat generation power consumption, and the heat dissipation problem has become one of the important factors restricting its further development. The CPU chips of high-performance computers can be regarded as typical representatives of high heat flux density heat-generating devices. A large server usually has dozens or even hundreds of multi-core CPU chips. Behind the powerful performance, there is accompanied by higher heat generation and heat flux density.

[0003] The traditional heat pipe radiator is composed of a heat pipe and a radiator. The radiator includes a base and several fins. The heat pipe is fixedly arranged with the base through welding. Before welding, micro-treatment preparations need to be done first. For example, the parts of the heat pipe and the base of the fins to be welded need to be polished and smoothed with a file and sandpaper. Then, solder paste is applied to the parts to be welded, and the heat pipe and the base of the fins are welded with a heat gun or a soldering iron. In a hot environment, the solder paste will slowly melt, and the solder in the solder paste makes the heat pipe and the base of the fins stick together.

[0004] Among them, the utility model with the application number CN202321894455.3 discloses a radiator, including a copper pipe and a first fin. The copper pipe has an evaporation section and a condensation section. The cross-section of the evaporation section is rectangular. A plurality of convex strips are arranged around the outer wall of the condensation section, and the convex strips extend along the axis direction of the condensation section; the plurality of first fins are arranged at intervals, and the first fin is provided with a fixing hole, and the shape of the fixing hole is adapted to the condensation section. The first fin is fixed on the condensation section by sleeving the condensation section through the fixing hole. In the utility model, a plurality of convex strips are arranged around the outer wall of the condensation section, and the area of contact between the evaporation section and air is increased through the convex strips to improve the heat dissipation efficiency; in addition, the first fin is provided with a fixing hole, and the shape of the fixing hole is adapted to the condensation section. The first fin can be relatively fixed on the copper pipe by sleeving the condensation section through the fixing hole, simplifying the assembly operation and improving the production efficiency.

[0005] In the above solution, in order to increase the heat dissipation effect, a plurality of heat dissipation copper pipes are arranged to contact the chips of the device, and most of the heat dissipation copper pipes are round pipes. Since the contact between round pipes is line contact, the contact area between adjacent heat dissipation copper pipes is small, resulting in poor heat conduction effect. Summary of the Utility Model

[0006] The purpose of the present utility model is to provide a square heat pipe welded radiator for chip heat dissipation in view of the deficiencies of the prior art.

[0007] To achieve the above object, the technical solution of the present utility model is as follows:

[0008] A square heat pipe welded radiator for chip heat dissipation includes a heat dissipation module and a heat conduction module. The heat dissipation module includes heat dissipation fins and heat dissipation copper tubes passing through a plurality of heat dissipation fins. The heat conduction module includes a heat conduction member formed at one end of the heat dissipation copper tube. The heat dissipation module is formed with a heat conduction groove for installing the heat conduction member. The heat conduction member includes a plurality of heat conduction copper tubes. The cross-sectional shape of the heat conduction copper tube is rectangular, and two adjacent heat conduction copper tubes are in surface contact. One side of the heat conduction copper tube is the first side, and a protruding fitting block is formed on the first side. One side of the heat conduction copper tube is the second side, and the second side is arranged opposite to the first side, and a fitting groove matching with the fitting block on the first side is formed on the second side.

[0009] Further: A first heat dissipation flat plate is formed at the top of the heat conduction groove. The first heat dissipation flat plate is vertically connected to the heat dissipation fins and integrally formed with the heat dissipation fins. A second heat dissipation flat plate is formed at the bottom of the heat dissipation module. The second heat dissipation flat plate is vertically connected to the heat dissipation fins and integrally formed with the heat dissipation fins. A heat conduction surface flush with the second heat dissipation flat plate is formed at the bottom of the heat conduction member.

[0010] Further: The number of the heat conduction copper tubes is the same as that of the heat dissipation copper tubes, and one end of the heat conduction copper tube is integrally formed with one end of the heat dissipation copper tube.

[0011] Further: The number of the heat dissipation fins is multiple, and two adjacent heat dissipation fins are arranged at intervals. The heat dissipation fins are formed with heat dissipation holes for the heat dissipation copper tubes to pass through.

[0012] Further: A heat conduction sleeve in surface contact with the heat dissipation copper tube is coaxially formed in the heat dissipation hole.

[0013] Further: An installation groove is also formed at the bottom of the heat dissipation module. A heat spreader is installed in the installation groove, and the top surface of the heat spreader is respectively in contact with the heat conduction surface and the second heat dissipation flat plate.

[0014] Further: The heat conduction groove is formed in the installation groove.

[0015] Further: A heat conduction plate in contact with the heat conduction surface and the second heat dissipation flat plate is formed on the top surface of the heat spreader. The heat conduction plate is formed with a plurality of embedding plates embedded into the gaps between the heat dissipation fins.

[0016] Further: A heat dissipation member is arranged beside the heat dissipation module. The heat dissipation member includes a fin module and copper pipe parts passing through the fin module. One end of a part of the heat conduction copper tubes is integrally formed with the heat dissipation copper tubes of the heat dissipation module, and one end of the other part of the heat conduction copper tubes is integrally formed with the copper pipe parts of the heat dissipation member.

[0017] Further: A connection structure is provided between the heat dissipation module and the heat dissipation member.

[0018] The beneficial effects of the present utility model are as follows: The adjacent two heat conduction copper tubes are in surface contact; the heat conduction copper tubes of the heat conduction member are in plane contact through the formed surfaces, so that a plurality of heat conduction copper tubes form a whole. The heat between the adjacent two heat conduction copper tubes can be transferred, and the heat will not accumulate at one place, and can be more evenly dispersed to a plurality of heat conduction copper tubes, and then transferred to the heat dissipation fins through the heat dissipation copper tubes to discharge the heat outward, further improving the heat dissipation performance. Description of the Drawings

[0019] Figure 1 It is a schematic structural diagram of a welded radiator.

[0020] Figure 2 It is an exploded structural diagram of a welded radiator.

[0021] Figure 3 It is a schematic structural diagram when the copper tube is separated from the heat dissipation module.

[0022] Figure 4 It is a schematic structural diagram of the heat conduction member.

[0023] The reference numerals include:

[0024] 1 - Heat dissipation module,

[0025] 11 - Heat dissipation fins, 12 - Heat dissipation copper tube, 13 - Heat dissipation hole, 14 - Heat conduction sleeve, 15 - Heat dissipation member,

[0026] 16 - Fin module, 17 - Copper pipe fitting, 18 - Connection bar, 19 - Installation groove,

[0027] 2 - Heat conduction member,

[0028] 21 - Heat conduction copper tube, 22 - Fitting block, 23 - Fitting groove, 24 - Heat conduction groove, 25 - First heat dissipation flat plate, 26 - Second heat dissipation flat plate, 27 - Heat equalizing plate, 28 - Heat conduction plate, 29 - Embedded plate. Detailed Embodiment

[0029] The present utility model will be described in detail below with reference to the drawings.

[0030] As Figures 1-4As shown in the figure, a square heat pipe welded radiator for chip heat dissipation includes a heat dissipation module 1 and a heat conduction module. The heat dissipation module 1 includes heat dissipation fins 11 and heat dissipation copper pipes 12 passing through a plurality of heat dissipation fins 11. The heat conduction module includes a heat conduction member 2 formed at one end of the heat dissipation copper pipe 12. The heat dissipation module 1 is formed with a heat conduction groove 24 for installing the heat conduction member 2. The heat conduction member 2 includes a plurality of heat conduction copper pipes 21. The cross-sectional shape of the heat conduction copper pipe 21 is rectangular, and adjacent two heat conduction copper pipes 21 are in surface contact; the heat conduction copper pipes 21 of the heat conduction member 2 are in contact through the formed plane, so that a plurality of heat conduction copper pipes 21 form a whole. The heat between adjacent two heat conduction copper pipes 21 can be transferred, and the heat will not accumulate at one place, and can be more evenly dispersed to a plurality of heat conduction copper pipes 21, and then transferred to the heat dissipation fins 11 through the heat dissipation copper pipes 12 to discharge the heat outward, further improving the heat dissipation performance.

[0031] Preferably, the cross-sectional shape of the heat conduction copper pipe 21 is square.

[0032] Specifically, one side of the heat conduction copper pipe 21 is the first side, and a protruding fitting block 22 is formed on the first side. One side of the heat conduction copper pipe 21 is the second side, and the second side is arranged opposite to the first side, and a fitting groove 23 matching the fitting block 22 on the first side is formed on the second side; when adjacent two heat conduction copper pipes 21 are connected, the first side of the heat conduction copper pipe 21 is matched with the fitting groove 23 on the second side of another heat conduction copper pipe 21 through the protruding fitting block 22, so as to realize the fitting connection of adjacent two heat conduction copper pipes 21. It can prevent a plurality of heat conduction copper pipes 21 from shifting after fitting, thereby further ensuring the overall stability of the heat conduction member 2 and further improving the heat conduction stability when surface contact occurs.

[0033] Furthermore, a heat dissipation member 15 is arranged beside the heat dissipation module 1. The heat dissipation member 15 includes a fin module 16 and a copper pipe member 17 passing through the fin module 16. One end of a part of the heat conduction copper pipes 21 is integrally formed and connected with the heat dissipation copper pipe 12 of the heat dissipation module 1, and one end of another part of the heat conduction copper pipes 21 is integrally formed and connected with the copper pipe member 17 of the heat dissipation member 15; through the integral forming connection of the copper pipe member 17 and the heat conduction copper pipes 21, the connection between the heat dissipation module 1 and the heat dissipation member 15 is realized, and the heat of a part of the heat conduction copper pipes 21 can be dissipated through the fin module of the heat dissipation member 15, realizing multi-directional heat dissipation.

[0034] Furthermore, a connection structure is arranged between the heat dissipation module 1 and the heat dissipation member 15. The connection structure includes a connection bar 18 connected between the heat dissipation module 1 and the heat dissipation member 15. The connection bar 18 is formed with a top connection hole, and the tops of the heat dissipation fins 11 and the fin module 16 are respectively formed with bottom connection holes coaxially aligned with the top connection hole. The connection bar 18 is connected through the top connection hole and the bottom connection hole to realize the connection between the heat dissipation module 1 and the heat dissipation member 15.

[0035] The number of the heat-conducting copper tubes 21 is the same as that of the heat-dissipating copper tubes 12. One end of the heat-conducting copper tube 21 is integrally formed and connected with one end of the heat-dissipating copper tube 12. The heat of the heat-conducting copper tube 21 in contact with the device is transferred to the corresponding heat-dissipating fins 11 and fin modules 16 through the heat-dissipating copper tube 12 and the copper fitting 17, realizing multi-fin heat dissipation and further improving the heat dissipation effect.

[0036] The number of the heat-dissipating fins 11 is multiple. Two adjacent heat-dissipating fins 11 are arranged at intervals. The heat-dissipating fin 11 is formed with a heat-dissipating hole 13 for the heat-dissipating copper tube 12 to pass through, and a heat-conducting sleeve 14 in surface contact with the heat-dissipating copper tube 12 is coaxially formed in the heat-dissipating hole 13. When the heat-dissipating copper tube 12 is inserted into the heat-dissipating hole 13 of the heat-dissipating fin 11, it will be in surface contact with the heat-conducting sleeve 14 of the heat-dissipating hole 13, increasing the contact area between the heat-dissipating copper tube 12 and the heat-dissipating fin 11 and further improving the heat conduction performance.

[0037] A first heat-dissipating flat plate 25 is formed on the top of the heat-conducting groove 24. The first heat-dissipating flat plate 25 is vertically connected with the heat-dissipating fin 11 and integrally formed with the heat-dissipating fin 11; the top surfaces of the multiple heat-conducting copper tubes 21 are respectively in contact connection with the first heat-dissipating flat plate 25 on the top of the heat-conducting groove 24, and a part of the heat of the heat-conducting member 2 can be transferred to the heat-dissipating fin 11 through the first heat-dissipating flat plate 25. A second heat-dissipating flat plate 26 is formed on the bottom of the heat-dissipating module 1. The second heat-dissipating flat plate 26 is vertically connected with the heat-dissipating fin 11 and integrally formed with the heat-dissipating fin 11. A heat-conducting surface flush with the second heat-dissipating flat plate 26 is formed on the bottom of the heat-conducting member 2. After the heat-conducting member 2 is installed in the heat-conducting groove 24, the heat-conducting surface at the bottom of the heat-conducting member 2 is exactly flush with the second heat-dissipating flat plate 26, making a large area of the bottom surface of the heat-dissipating module 1 in a flat state.

[0038] An installation groove is also formed on the bottom of the heat-dissipating module 1, and the heat-conducting groove 24 is formed in the installation groove. A heat pipe 27 is installed in the installation groove, and the top surface of the heat pipe 27 is respectively in fit with the heat-conducting surface and the flat plate. The top of the heat pipe 27 is in fit with the second heat-dissipating flat plate 26 and the heat-conducting surface at the bottom of the heat-conducting member 2, enabling the heat pipe 27 to be in planar contact with the heat-dissipating module 1 and the heat-conducting member 2 and further increasing the heat conduction performance.

[0039] Specifically, a heat-conducting plate 28 in fit with the heat-conducting surface and the second heat-dissipating flat plate 26 is formed on the top surface of the heat pipe 27. The heat-conducting plate 28 is formed with multiple embedding plates 29 embedded in the gaps between the heat-dissipating fins 11. The heat pipe 27 can be connected with the heat-dissipating fins 11 of the heat-dissipating module 1 through the embedding plates 29, improving the installation stability of the heat pipe 27.

[0040] In summary, it can be seen that the present utility model has the above-mentioned excellent characteristics, enabling it to enhance the efficiency that has never been achieved in the prior art during use and having practicality, thus becoming a product with extremely high practical value.

[0041] The above content is only a preferred embodiment of the present utility model. For those of ordinary skill in the art, according to the idea of the present utility model, there will be changes in the specific implementation manner and application scope. The content of this specification should not be construed as a limitation to the present utility model.

Claims

1. A square heat pipe welding radiator for chip heat dissipation, comprising a heat dissipation module and a heat conduction module, wherein the heat dissipation module comprises heat dissipation fins and a heat dissipation copper tube penetrating through a plurality of heat dissipation fins, characterized in that: The heat conduction module includes a heat conduction member formed at one end of the heat dissipation copper tube, the heat dissipation module is formed with a heat conduction groove for installing the heat conduction member, the heat conduction member includes a plurality of heat conduction copper tubes, the cross-section of the heat conduction copper tubes is rectangular, and two adjacent heat conduction copper tubes are in surface contact; One of the side surfaces of the heat-conducting copper tube is a first side surface, on which a raised engaging block is formed; one of the side surfaces of the heat-conducting copper tube is a second side surface, which is arranged opposite to the first side surface, and on which an engaging groove is formed that cooperates with the engaging block on the first side surface.

2. A square heat pipe welding radiator for chip heat dissipation according to claim 1, characterized in that: A first heat dissipation flush plate is formed on the top of the heat conduction groove, and the first heat dissipation flush plate is vertically connected to the heat dissipation fins and is integrally connected to the heat dissipation fins; a second heat dissipation flush plate is formed on the bottom of the heat dissipation module, and the second heat dissipation flush plate is vertically connected to the heat dissipation fins and is integrally connected to the heat dissipation fins; a heat conduction surface flush with the second heat dissipation flush plate is formed at the bottom of the heat conductor.

3. A square heat pipe welding radiator for chip heat dissipation according to claim 1, characterized in that: The number of the heat-conducting copper tubes and the heat-dissipating copper tubes is the same, and one end of the heat-conducting copper tube is integrally connected with one end of the heat-dissipating copper tube.

4. A square heat pipe welding radiator for chip heat dissipation according to claim 3, characterized in that: There are multiple heat dissipation fins, and two adjacent heat dissipation fins are arranged at intervals. The heat dissipation fins are formed with heat dissipation holes for the heat dissipation copper tubes to pass through.

5. A square heat pipe welding radiator for chip heat dissipation according to claim 4, characterized in that: The heat dissipation hole is coaxially formed with a heat-conducting sleeve that contacts the heat dissipation copper tube surface.

6. A square heat pipe welding radiator for chip heat dissipation according to claim 5, characterized in that: The bottom of the heat dissipation module is also formed with an installation groove, and a heat spreader is installed in the installation groove, and the top surface of the heat spreader is respectively in contact with the heat conduction surface and the second heat dissipation flush plate.

7. A square heat pipe welding radiator for chip heat dissipation according to claim 6, characterized in that: The heat conduction groove is formed in the mounting groove.

8. A square heat pipe welding radiator for chip heat dissipation according to claim 7, characterized in that: The top surface of the heat spreader is formed with a heat conducting plate which is in contact with the heat conducting surface and the second heat dissipation leveling plate, and the heat conducting plate is formed with a plurality of embedded plates which are embedded in the gaps between the heat dissipation fins.

9. A square heat pipe welding radiator for chip heat dissipation according to claim 1, characterized in that: A heat sink is arranged beside the heat dissipation module, and the heat sink includes a fin module and a copper pipe fitting inserted through the fin module. One end of a portion of the heat-conducting copper pipe is integrally connected to the heat-conducting copper pipe of the heat dissipation module, and one end of another portion of the heat-conducting copper pipe is integrally connected to the copper pipe fitting of the heat sink.

10. A square heat pipe welding radiator for chip heat dissipation according to claim 9, characterized in that: A connection structure is provided between the heat dissipation module and the heat dissipation element.

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