Voltage conversion circuit and adapter plate

Abstract

The utility model discloses a voltage conversion circuit and an adapter plate, and the voltage conversion circuit comprises a voltage receiving module which is connected with a target programmer and receives an input voltage from the target programmer; the voltage conversion module is connected with the voltage receiving module, the voltage conversion module is used for converting the input voltage into a first voltage or a second voltage, and the first voltage is different from the second voltage; the switch module is connected with the voltage conversion module, the switch module comprises a first switch port, a second switch port and a communication port, the first switch port is connected with the first conversion sub-module, and the second switch port is connected with the second conversion sub-module; and the voltage output module is connected with the communication port and the target main control chip, and the voltage output module is used for outputting the first voltage or the second voltage to the target main control chip according to the conduction states of the first switch port, the second switch port and the communication port. According to the circuit provided by the utility model, the flexible selection of the output voltage of the burner is realized, and the damage to the main control chip is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic circuits, in particular to a voltage conversion circuit and an adapter board. Background Art

[0002] There are various types of programmers that perform data transmission through the Serial Peripheral Interface (SPI) protocol, such as the Basic Input Output System (BIOS) programmer. The BIOS programmer can be used to read, write, and program an Integrated Circuit (IC) chip (such as a Central Processing Unit (CPU) main control chip, hereinafter referred to as the main control chip).

[0003] In related technologies, a programmer is usually connected in series to the main control chip so that the voltage of the programmer matches that of the main control chip. As the central processing unit main control chip is continuously upgraded and updated, the central processing unit main control chip can use a voltage of 1.8V or 3.3V, while the output voltage of the BIOS programmer (hereinafter referred to as the programmer) can only be 3.3V. Thus, a programmer with an output voltage of 3.3V can only be used in cooperation with a main control chip with a rated voltage of 3.3V. And if this programmer is used in cooperation with a main control chip with a rated voltage of 1.8V, it will cause the output voltage to exceed the specification of the main control chip, thereby affecting the normal use of the main control chip. In order to be able to flexibly select the output voltage of the programmer and avoid damaging the main control chip, a system and product capable of voltage conversion need to be designed. Summary of the Utility Model

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. For this purpose, the utility model provides a voltage conversion circuit and an adapter board, which can flexibly select the output voltage of the programmer and avoid damaging the main control chip.

[0005] According to the voltage conversion circuit of the first aspect embodiment of the utility model, the voltage conversion circuit includes:

[0006] A voltage receiving module, connected to a target programmer and configured to receive an input voltage from the target programmer;

[0007] A voltage conversion module, connected to the voltage receiving module. The voltage conversion module includes a first conversion sub-module and a second conversion sub-module. The first conversion sub-module is configured to convert the input voltage into a first voltage, and the second conversion sub-module is configured to convert the input voltage into a second voltage, and the first voltage and the second voltage are different;

[0008] A switch module connected to the voltage conversion module, the switch module comprising a first switch port, a second switch port and a communication port, the first switch port being connected to the first conversion submodule, and the second switch port being connected to the second conversion submodule;

[0009] A voltage output module is connected to the communication port and the target main control chip, and is used to output the first voltage or the second voltage to the target main control chip according to the conduction state of the first switch port, the second switch port and the communication port.

[0010] The voltage conversion circuit according to the embodiment of the utility model has at least the following beneficial effects: the voltage receiving module is connected to the target burner, receives the input voltage from the target burner, and the voltage conversion module performs voltage conversion on the input voltage to obtain a first voltage and a second voltage. The switch module selects a voltage that matches the target main control chip according to the rated voltage of the target main control chip, and outputs the selected voltage to the target main control chip through the voltage output module. Among them, the output voltage includes the power supply voltage provided for the target main control chip and the SPI signal voltage for data transmission through the SPI protocol. The voltage conversion system realizes flexible selection of the output voltage of the burner through the voltage receiving module, the voltage conversion module, the switch module, and the voltage output module, thereby avoiding damage to the main control chip. The voltage conversion circuit provided by the utility model enables the burner to adapt to main control chips with different voltage specifications, thereby improving the applicability of the burner.

[0011] According to some embodiments of the present utility model, the voltage output module includes:

[0012] The bus signal output submodule is connected to the first conversion submodule and the switch module respectively; the power supply output submodule is connected to the target main control chip and the switch module respectively.

[0013] According to some embodiments of the present utility model, the bus signal output submodule includes a first working power port and a second working power port, and the first conversion submodule includes a first voltage output port;

[0014] The first working power port is connected to the first voltage output port, and the first voltage is used as the first working power supply of the bus signal output submodule;

[0015] The second working power supply port is connected to the communication port. When the first switch port is connected to the communication port, the first voltage is used as the second working power supply of the bus signal output submodule. When the second switch port is connected to the communication port, the second voltage is used as the second working power supply of the bus signal output submodule.

[0016] According to some embodiments of the present utility model, the bus signal output sub-module is further respectively connected to the target main control chip and the voltage receiving module;

[0017] Wherein, the bus signal output sub-module includes: an eleventh pin, a twelfth pin, a thirteenth pin, and a fourteenth pin, and the target main control chip includes: a fifth pin, a sixth pin, a seventh pin, and an eighth pin;

[0018] Wherein, the eleventh pin of the bus signal output sub-module is connected to the eighth pin of the target main control chip, the twelfth pin of the bus signal output sub-module is connected to the seventh pin of the target main control chip, the thirteenth pin of the bus signal output sub-module is connected to the sixth pin of the target main control chip, and the eleventh pin of the bus signal output sub-module is connected to the fifth pin of the target main control chip;

[0019] The bus signal output sub-module further includes: a third pin, a fourth pin, a fifth pin, and a sixth pin, and the voltage receiving module includes: a first pin, a third pin, a sixth pin, and an eighth pin;

[0020] Wherein, the third pin of the bus signal output sub-module is connected to the first pin of the voltage receiving module, the fourth pin of the bus signal output sub-module is connected to the third pin of the voltage receiving module, the fifth pin of the bus signal output sub-module is connected to the sixth pin of the voltage receiving module, and the sixth pin of the bus signal output sub-module is connected to the eighth pin of the voltage receiving module.

[0021] According to some embodiments of the present utility model, the power supply output sub-module includes:

[0022] A seventeenth resistor, one end of the seventeenth resistor is connected to the power supply voltage input terminal, and the other end of the seventeenth resistor is connected to the power supply voltage output terminal;

[0023] The anode of an eighth crystal diode, the anode of the eighth crystal diode is connected to the communication port of the switch module, and the cathode of the eighth crystal diode is connected to the first pin of the target main control chip of the switch module.

[0024] According to some embodiments of the present utility model, the voltage conversion circuit further includes: a thirteenth resistor, a fifteenth resistor, a nineteenth resistor, and a twenty-first resistor, and the bus signal output sub-module further includes: a first direction control pin, a second direction control pin, a third direction control pin, and a fourth direction control pin;

[0025] One end of the thirteenth resistor is connected to the first voltage output port, and the other end is connected to the first direction control pin to make the input level of the first direction control pin a high level;

[0026] One end of the fifteenth resistor is grounded, and the other end is connected to the second direction control pin to make the input level of the second direction control pin a low level;

[0027] One end of the nineteenth resistor is connected to the first voltage output port, and the other end is connected to the third direction control pin to make the input level of the third direction control pin a high level;

[0028] One end of the twenty-first resistor is connected to the first voltage output port, and the other end is connected to the fourth direction control pin to make the input level of the fourth direction control pin a high level.

[0029] According to some embodiments of the present invention, when the input level of the first direction control pin is a high level, the data transmission direction is from the third pin of the bus signal output sub-module to the fourteenth pin of the bus signal output sub-module;

[0030] When the input level of the second direction control pin is a low level, the data transmission direction is from the fourth pin of the bus signal output sub-module to the thirteenth pin of the bus signal output sub-module;

[0031] When the input level of the third direction control pin is a high level, the data transmission direction is from the fifth pin of the bus signal output sub-module to the twelfth pin of the bus signal output sub-module;

[0032] When the input level of the fourth direction control pin is a high level, the data transmission direction is from the sixth pin of the bus signal output sub-module to the eleventh pin of the bus signal output sub-module.

[0033] According to some embodiments of the present invention, the voltage conversion circuit further includes a third field effect transistor and a ninth resistor, and the second conversion sub-module includes a second voltage output port;

[0034] One end of the ninth resistor is connected to the second voltage output port, and the other end is connected to the gate of the third field effect transistor to make the source and drain of the third field effect transistor conduct;

[0035] The drain of the third field-effect transistor is connected to the enable port of the bus signal output sub-module, and the source of the third field-effect transistor is grounded. When the source and drain of the third field-effect transistor are conducting, the enable port of the bus signal output sub-module is grounded, so that the enable port of the bus signal output sub-module is in a low level state.

[0036] According to some embodiments of the present invention, the second conversion sub-module includes a second resistor, a fourth voltage-dividing resistor, a sixth voltage-dividing resistor, a second filter capacitor, and a fourth capacitor;

[0037] Wherein, one end of the second resistor is connected to the voltage receiving module, and the other end is connected to the third pin of the second conversion sub-module. One end of the fourth voltage-dividing resistor is connected to the fifth pin of the second conversion sub-module, and the other end is connected to the sixth voltage-dividing resistor. One end of the sixth voltage-dividing resistor is grounded, and the other end is connected to the fourth pin of the second conversion sub-module and the fourth capacitor. One end of the second filter capacitor is grounded, and the other end is connected to the fifth pin of the second conversion sub-module. One end of the fourth capacitor is grounded, and the other end is connected to the voltage receiving module.

[0038] The present invention also provides an adapter board having the above voltage conversion circuit.

[0039] The adapter board according to the embodiments of the present invention has at least the following beneficial effects: This adapter board includes the above voltage conversion circuit. The target programmer is connected to the adapter board, and the adapter board is connected to the target main control chip. The adapter board converts the output voltage of the target programmer and then selects a voltage that matches the voltage specification of the target main control chip for output, realizing flexible selection of the output voltage of the programmer and avoiding damage to the main control chip.

[0040] The additional aspects and advantages of the present invention will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The present invention will be further described below in conjunction with the drawings and embodiments, wherein:

[0042] Figure 1 is a module diagram of the voltage conversion circuit provided by the embodiments of the present invention;

[0043] Figure 2 is another module diagram of the voltage conversion circuit provided by the embodiments of the present invention;

[0044] Figure 3 is a circuit diagram of the voltage receiving module provided by the embodiments of the present invention;

[0045] Figure 4 Circuit diagram of the first conversion sub-module provided by the embodiment of the present utility model;

[0046] Figure 5 Circuit diagram of the second conversion sub-module provided by the embodiment of the present utility model;

[0047] Figure 6 Circuit diagram of the bus signal output sub-module provided by the embodiment of the present utility model;

[0048] Figure 7 Circuit diagram of the power supply output sub-module provided by the embodiment of the present utility model;

[0049] Figure 8 Circuit diagram of the switch module provided by the embodiment of the present utility model;

[0050] Figure 9 Module connection diagram of the adapter board provided by the embodiment of the present utility model. Detailed implementation manners

[0051] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation to the present utility model.

[0052] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0053] In the description of the present utility model, the meaning of several is more than one, the meaning of multiple is more than two, and understandings such as greater than, less than, exceeding, etc. do not include the present number, and understandings such as above, below, within, etc. include the present number. If there is a description of first and second, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0054] In the description of the present utility model, unless otherwise clearly defined, words such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present utility model in combination with the specific content of the technical solution.

[0055] In the description of the present utility model, the descriptions with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0056] The receiving target and the simulated shooting target reporting system provided by the embodiments of the present application will be specifically described through the following embodiments. First, the receiving target in the embodiments of the present application will be described.

[0057] Please refer to Figure 1 , the voltage conversion circuit provided by the embodiments of the present application includes: a voltage receiving module 100, a voltage conversion module 200, a switch module 300, and a voltage output module 400. The voltage receiving module 100 is connected to a target programmer (not shown in the figure) and is used to receive the input voltage from the target programmer. The voltage conversion module 200 is respectively connected to the switch module 300 and the voltage receiving module 100, and is used to convert the input voltage of the target programmer into a first voltage and a second voltage; wherein, the input voltage of the target programmer is 3.3V, and the first voltage and the second voltage obtained by the voltage conversion module 200 are different. The first voltage is 3.3V, and the second voltage is 1.8V. The switch module 300 is connected to the voltage output module 400. The switch module 300 is used to select the first voltage or the second voltage for output according to the voltage specification of the target main control chip (not shown in the figure), and output it to the target main control chip through the voltage output module 400. The voltage output module 400 is used to be connected to the target main control chip and output the selected power supply voltage and SPI signal voltage to the target main control chip.

[0058] It can be understood that the target programmer can be any programmer that uses SPI signals for data transmission and communicates with the target main control chip. It should be noted that SPI is a high-speed, full-duplex synchronous communication bus, and the general voltage conversion module cannot meet the voltage conversion requirements for transmission through this protocol. The output voltage of the programmer is 3.3V, and the target main control chip can be of different types and different brands, and no restrictions are imposed here. The voltage specification of the target main control chip can be the traditional 3.3V or the low voltage 1.8V. The present utility model takes the BIOS programmer as an example to specifically describe the voltage conversion circuit of the present utility model.

[0059] The voltage receiving module 100 is connected to the target programmer to receive the input voltage from the target programmer. The voltage conversion module 200 converts the input voltage to obtain a first voltage and a second voltage. The switching module 300 selects a matching voltage according to the rated voltage of the target main control chip and outputs the selected voltage to the target main control chip through the voltage output module 400. Among them, the output voltage includes the power supply voltage provided for the target main control chip and the SPI signal voltage for data transmission through the SPI protocol. The voltage conversion system realizes the flexible selection of the output voltage of the programmer through the voltage receiving module 100, the voltage conversion module 200, the switching module 300, and the voltage output module 400, avoiding damage to the main control chip.

[0060] Please refer to Figure 2 , in some embodiments, the voltage conversion module 200 includes a first conversion sub-module 210 and a second conversion sub-module 220, and the voltage output module 400 includes a bus signal output sub-module 410 and a power supply output sub-module 420. The voltage receiving module 200 is respectively connected to the first conversion sub-module 210 and the second conversion sub-module 220 to receive the input voltage from the target programmer. The input voltage of the target programmer is voltage-converted by the first conversion sub-module 210 to obtain a first voltage (3.3V), and is voltage-converted by the second conversion sub-module to obtain a second voltage (1.8V). The first conversion sub-module 210 and the second conversion sub-module 220 are respectively connected to the switching module 300, and the switching module 300 selects the first voltage or the second voltage for output according to the voltage specification of the target main control chip. The voltage output module 400 includes a bus signal output sub-module 410 and a power supply output sub-module 420. The switching module 300 is respectively connected to the bus signal output sub-module 410 and the power supply output sub-module 420. The bus signal output sub-module 410 is used to determine the SPI signal voltage output to the target main control chip according to the voltage selected by the switching module 300, and the power supply output sub-module 420 is used to determine the power supply voltage output to the target main control chip according to the voltage selected by the switching module 300.

[0061] Please refer to Figure 3, in some embodiments, the voltage receiving module 100 is a pin connector J1. The pin connector J1 is a Header-2.54mm, and the spacing between each row of pins is 2.54mm. The chip J1 is inserted into the card slot of a BIOS burner (hereinafter referred to as the burner) to achieve the connection between the burner and the pin connector J1. The pin connector J1 includes pin 1, pin 2, pin 3, pin 4, pin 5, pin 6, pin 7, and pin 8. Among them, pin 1 is connected to the bus signal output sub-module 410 through the interface SPI_CS, pin 2 is respectively connected to the first conversion sub-module 210 and the second conversion sub-module 220 through the interface SPI_VCC, pin 3 is connected to the bus signal output sub-module 410 through the interface SPI_MIOS, pin 4 is connected to the interface SPI_HOLD. The interface SPI_HOLD is effective when grounded. When effective, it is used to pause communication and is not used when connected to the power supply. Pin 5 is connected to the interface SPI_WP. The interface SPI_WP is effective when grounded. When effective, it is used to prohibit writing data and is not used when connected to the power supply. Pin 6 is connected to the bus signal output sub-module 410 through the interface SPI_CLK, pin 7 is grounded, and pin 8 is connected to the bus signal output sub-module 410 through the interface SPI_MOSI. It should be noted that in actual use, pins 4 and 5 of J1 are suspended, that is, the interfaces SPI_WP and SPI_HOLD are invalid, so as to ensure normal communication between the burner and the main control chip and normal data writing during burning.

[0062] Please refer to Figure 4 , in some embodiments, the first conversion sub-module 210 includes a chip U1, a resistor R1, a resistor R3, a resistor R5, a capacitor C1, and a capacitor C5. The VIN pin of the chip U1 is connected to the pin connector J1 through the interface SPI_VCC. The GDN pin of the chip U1 is grounded. One end of the resistor R1 is connected to the EN pin of the chip U1, and the other end is connected to one end of the capacitor C5. One end of the capacitor C5 is connected to the SPI_VCC pin of the pin connector J1, and the other end is grounded. The VOUT pin of the chip U1 is used to output a voltage of +V3.3A. One end of the resistor R3 is connected to the VOUT pin of the chip U1, and the other end of the resistor R3 is connected to the resistor R5. One end of the resistor R5 is connected to the FB pin of the chip U1, and the other end is grounded. One end of the capacitor C1 is grounded, and the other end is connected to the VOUT pin of the chip U1.

[0063] Among them, the resistor R3, the resistor R5, and the capacitor C1 form a voltage stabilizing circuit. The resistor R3 and the resistor R5 are voltage dividing resistors to ensure the linear and stable output of the +V3.3A voltage. The capacitor C1 is a filtering capacitor for decoupling to make the output of the +V3.3A voltage more stable.

[0064] It should be noted that the signal of chip U1 is ETA5050V0S2F, the resistance value of resistor R1 is 10 kΩ, the resistance value of resistor R3 is 62 kΩ, and the resistance value of resistor R5 is 20 kΩ. The capacitance values of capacitor C1 and capacitor C5 are both 10 uf.

[0065] Please refer to Figure 5 , in some embodiments, the second conversion sub-module 220 includes chip U2, resistor R2, resistor R4, resistor R6, capacitor C2, and capacitor C4. The VIN pin of chip U2 is connected to the pin connector J1 through the interface SPI_VCC, the GDN pin of chip U2 is grounded, one end of resistor R2 is connected to the EN pin of chip U2, and the other end is connected to one end of capacitor C4. One end of capacitor C4 is connected to the SPI_VCC pin of the pin connector J1, and the other end is grounded. The VOUT pin of chip U2 is used to output a voltage of +V1.8A. One end of resistor R4 is connected to the VOUT pin of chip U2, and the other end of resistor R6 is connected to resistor R4. One end of resistor R6 is connected to the FB pin of chip U2, and the other end is grounded. One end of capacitor C2 is grounded, and the other end is connected to the VOUT pin of chip U2.

[0066] Among them, resistor R4, resistor R6, and capacitor C2 form a voltage stabilization circuit. Resistor R4 and resistor R6 are voltage-dividing resistors to ensure the linear and stable output of the +V1.8A voltage. Capacitor C2 is a filtering capacitor for decoupling to make the output of the +V1.8A voltage more stable.

[0067] It should be noted that the signal of chip U2 is ETA5050V0S2F, the resistance value of resistor R2 is 10 kΩ, the resistance value of resistor R4 is 24.9 kΩ, and the resistance value of resistor R6 is 20 kΩ. The capacitance values of capacitor C2 and capacitor C4 are both 10 uf.

[0068] Please refer to Figure 6 , in some embodiments, the bus signal output sub-module 410 is chip U5. Chip U5 includes DIR1 pin, DIR2 pin, A1 pin, A2 pin, A3 pin, A4 pin, DIR3 pin, DIR4 pin, VCCA pin, VCCB pin, B1 pin, B2 pin, B3 pin, B4 pin, GND pin, and OE# pin. Among them, the DIR1 pin, DIR2 pin, DIR3 pin, and DIR4 pin are used to control the data transmission direction. The VCCA pin and VCCB pin are two working power supply pins. The VCCA pin is connected to the first working power supply to provide the working power for chip U5 to work and determine the voltage at the A end. The VCCB pin is connected to the second working power supply and determines the voltage at the B end.

[0069] Specifically, the DIR1 pin is connected to one end of the resistor R13, and the other end of the resistor R13 is connected to the interface +V3.3A of the chip U1, so that the DIR1 pin is in a high-level state, and the data transmission direction is from pin A1 to B1, that is, the data transmission direction is from the interface SPI_CS to the interface SPI_CS_R; the DIR2 pin is connected to one end of the resistor R15, and the other end of the resistor R15 is grounded, so that the DIR2 pin is in a low-level state, and the data transmission direction is from pin A2 to B2, that is, the data transmission direction is from the interface SPI_MISO to the interface SPI_MISO_R; the DIR3 pin is connected to one end of the resistor R19, and the other end of the resistor R19 is connected to the interface +V3.3A of the chip U1, so that the DIR3 pin is in a high-level state, and the data transmission direction is from pin A3 to B3, that is, the data transmission direction is from the interface SPI_CLK to the interface SPI_CLK_R; the DIR4 pin is connected to one end of the resistor R21, and the other end of the resistor R21 is connected to the interface +V3.3A of the chip U1, so that the DIR4 pin is in a high-level state, and the data transmission direction is from pin A4 to B4, that is, the data transmission direction is from the interface SPI_MOSI to the interface SPI_MOSI_R.

[0070] Further, the VCCA pin of the chip U5 is connected to the interface +V3.3A of the chip U1 and one end of the capacitor C7 to provide a 3.3V working power supply for the chip U5, and the other end of the capacitor C7 is grounded; the VCCB pin of the chip U5 is used to connect to the switch module 300 and one end of the capacitor C6, and the other end of the capacitor C6 is grounded.

[0071] The B1 pin of chip U5 is connected to the target master chip through the interface SPI_CS_R, the B2 pin of chip U5 is connected to the target master chip through the interface SPI_MISO_R, the B3 pin is connected to the target master chip through the interface SPI_CLK_R, and the B4 pin is connected to the target master chip through the interface SPI_MOSI_R. The GND pin of chip U5 is grounded, and the enable pin OE# of chip U5 is connected to the interface SPI_OE, and through the interface SPI_OE, it is connected to the drain (D pole) of the third field-effect transistor Q3. The source (S pole) of the third field-effect transistor Q3 is grounded, and the gate (G pole) of the third field-effect transistor Q3 is connected to one end of the resistor R9. The other end of the resistor R9 is connected to the chip U2 through the interface +V1.8A. Among them, a body diode is connected between the drain and the source of the third field-effect transistor Q3. The direction of the body diode is from the source to the drain, and it has functions such as reverse voltage protection. The second voltage 1.8V output by the chip U2 for voltage conversion is connected to the resistor R9 through the interface +V1.8A. The current flows through the resistor R9 to the gate of the third field-effect transistor Q3, making the gate access a high voltage, and the drain and source of the third field-effect transistor Q3 conduct, and the interface SPI_OE conducts to ground, that is, the OE# pin of chip U5 is grounded. The interface SPI_OE controls the chip U5 to turn on, and the chip U5 turns on when the interface SPI_OE is grounded.

[0072] It should be noted that the model of chip U5 is SN74AVC4T774, the resistance value of resistor R13 is 10kΩ, the resistance value of resistor R15 is 10kΩ, and the resistance values of resistor R9, resistor R19, and resistor R21 are all 10kΩ. The capacitance values of capacitor C6 and capacitor C7 are both 0.1uf, and the third field-effect transistor is an N-type field-effect transistor.

[0073] Please refer to Figure 7, in some embodiments, the power supply output sub-module 420 includes a flexible printed circuit board FPC1, a resistor R7, and a diode D8. Pin 1 of the flexible printed circuit board FPC1 is connected to the output terminal of the diode D8 through the interface SPI_VCC_CON, pins 2 and 4 are suspended, pin 5 is connected to pin B1 of the chip U5 through the interface SPI_CS_R, pin 6 is connected to pin B2 of the chip U5 through the interface SPI_MISO_R, pin 7 is connected to pin B3 of the chip U5 through the interface SPI_CLK_R, pin 8 is connected to pin B4 of the chip U5 through the interface SPI_MOSI_R, pin 10 is connected to the SPI_WP_R interface, and pin 12 is connected to the interface SPI_HOLD_R. Pins 10 and 12 are suspended during actual use to ensure normal communication between the programmer and the main control chip and normal data writing during programming. Pins 11, 13, and 14 are grounded, and test points TP1, TP2, and TP3 can be placed at pins 3, 4, and 9 respectively.

[0074] The input terminal of the diode D8 is connected to the switch module 300 through the interface VCC_SEL, and the output terminal of the diode D8 is connected to the flexible printed circuit board FPC1 through the interface SPI_VCC_CON and then to the target main control chip through the flexible printed circuit board FPC1. The diode D8 conducts unidirectionally to provide voltage to the target main control chip. It should be noted that the model of the flexible printed circuit board FPC1 is ZX-0.5FPC-2H-QFX12F.

[0075] Please refer to Figure 8 , in some embodiments, the switch module 300 includes a jump cap H3. It should be noted that the model of the jump cap is Header5P. The switch module 300 includes pins 1, 2, 3, 4, and 5. Among them, pin 1 of the switch module 300 is connected to the interface EXTERNAL_5A. During actual use, the interface EXTERNAL_5A does not need to access an external power supply, and pin 1 is suspended. Pin 2 of the switch module 300 is grounded, pin 3 is connected to the VOUT pin of the chip U2 through the interface +V1.8A, pin 4 is connected to the VCCB pin of the chip U5 through the interface VCC_SEL, and pin 5 is connected to the VOUT pin of the chip U1 through the interface +V3.3A. The conduction state of the switch module 300 is controlled by unplugging and plugging the jump cap. By shorting pin 3 and pin 4 of the jump cap switch H3, pins 3 and 4 are made conductive, and a 1.8V voltage is output to the VCCB pin of the bus signal output sub-module through the interface VCC_SEL; by shorting pin 5 and pin 4 of the jump cap switch H3, pins 4 and 5 are made conductive, and a 3.3V voltage is output to the VCCA pin of the bus signal output sub-module through the interface VCC_SEL.

[0076] Please refer to Figure 9, in some embodiments, the target programmer needs to output a voltage of 3.3V and send a Serial Peripheral Interface (SPI) signal to the target main control chip to communicate with the target main control chip. The target programmer and the target main control chip are connected through an adapter board, and the aforementioned voltage conversion circuit is included in the adapter board. The voltage conversion module 200 in the voltage conversion circuit converts the 3.3V voltage output by the target programmer into 3.3V voltage or 1.8V voltage. The specific conversion process has been introduced in the previous steps and will not be elaborated here. Further, according to the voltage specification of the target main control chip, the converted 1.8V voltage or 3.3V voltage is selectively output. On the one hand, the power supply voltage is output to the target main control chip and the Basic Input Output System Flash (BIOS Flash), and the data programmed by the programmer is stored in the Basic Input Output System Flash. On the other hand, the switch module controls the voltage of the SPI signal output by the bus signal output sub-module 410 by selecting the output voltage and transmits the SPI signal to the target main control chip and the Basic Input Output System Flash. Throughout the process, the adapter board serves as an intermediary between the target programmer and the target main control chip, capable of converting and flexibly selecting the output voltage of the target programmer, so as to match the voltage specification of the target main control chip and avoid damaging the main control chip.

[0077] In addition, an embodiment of the present invention also discloses an adapter board, which includes the above-mentioned voltage conversion circuit.

[0078] The adapter board of the embodiment of the present invention includes the above voltage conversion circuit, which can connect the target programmer and the target main control chip through the adapter board, and convert and flexibly select the output voltage of the target programmer through the voltage conversion circuit, so as to match the voltage specification of the target main control chip, avoid damaging the main control chip, and ultimately improve the applicability of the programmer.

[0079] The above has described the embodiments of the present invention in detail with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made without departing from the spirit of the present invention within the knowledge scope of those of ordinary skill in the art. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. A voltage conversion circuit, characterized in that: The voltage conversion circuit comprises: A voltage receiving module, connected to a target programmer and used for receiving an input voltage from the target programmer; a voltage conversion module, connected to the voltage receiving module, the voltage conversion module comprising a first conversion submodule and a second conversion submodule, the first conversion submodule being used to convert the input voltage into a first voltage, the second conversion submodule being used to convert the input voltage into a second voltage, the first voltage and the second voltage being different; A switch module connected to the voltage conversion module, the switch module comprising a first switch port, a second switch port and a communication port, the first switch port being connected to the first conversion submodule, and the second switch port being connected to the second conversion submodule; A voltage output module is connected to the communication port and the target main control chip, and is used to output the first voltage or the second voltage to the target main control chip according to the conduction state of the first switch port, the second switch port and the communication port.

2. The voltage conversion circuit according to claim 1, characterized in that: The voltage output module comprises: A bus signal output submodule, connected to the first conversion submodule and the switch module respectively; The power supply output submodule is connected to the target main control chip and the switch module respectively.

3. The voltage conversion circuit according to claim 2, characterized in that: The bus signal output submodule includes a first working power port and a second working power port, and the first conversion submodule includes a first voltage output port; The first working power port is connected to the first voltage output port, and the first voltage is used as the first working power supply of the bus signal output submodule; The second working power supply port is connected to the communication port. When the first switch port is connected to the communication port, the first voltage is used as the second working power supply of the bus signal output submodule. When the second switch port is connected to the communication port, the second voltage is used as the second working power supply of the bus signal output submodule.

4. The voltage conversion circuit according to claim 2, characterized in that: The bus signal output submodule is also connected to the target main control chip and the voltage receiving module respectively; Wherein, the bus signal output submodule includes: the eleventh pin, the twelfth pin, the thirteenth pin, and the fourteenth pin, and the target main control chip includes: the fifth pin, the sixth pin, the seventh pin, and the eighth pin; Among them, the eleventh pin of the bus signal output submodule is connected to the eighth pin of the target main control chip, the twelfth pin of the bus signal output submodule is connected to the seventh pin of the target main control chip, the thirteenth pin of the bus signal output submodule is connected to the sixth pin of the target main control chip, and the eleventh pin of the bus signal output submodule is connected to the fifth pin of the target main control chip; The bus signal output submodule further includes: a third pin, a fourth pin, a fifth pin, and a sixth pin; the voltage receiving module includes: a first pin, a third pin, a sixth pin, and an eighth pin; Among them, the third pin of the bus signal output submodule is connected to the first pin of the voltage receiving module, the fourth pin of the bus signal output submodule is connected to the third pin of the voltage receiving module, the fifth pin of the bus signal output submodule is connected to the sixth pin of the voltage receiving module, and the sixth pin of the bus signal output submodule is connected to the eighth pin of the voltage receiving module.

5. The voltage conversion circuit according to claim 2, characterized in that: The power supply output submodule comprises: a seventeenth resistor, one end of the seventeenth resistor being connected to the power supply voltage input end, and the other end of the seventeenth resistor being connected to the power supply voltage output end; The anode of an eighth crystal diode is connected to the communication port of the switch module, and the cathode of the eighth crystal diode is connected to the first pin of the target main control chip of the switch module.

6. The voltage conversion circuit according to claim 2, characterized in that: The voltage conversion circuit further includes: a thirteenth resistor, a fifteenth resistor, a nineteenth resistor, and a twenty-first resistor, and the bus signal output submodule further includes: a first direction control pin, a second direction control pin, a third direction control pin, and a fourth direction control pin; Wherein, one end of the thirteenth resistor is connected to the first voltage output port, and the other end is connected to the first direction control pin, so that the input level of the first direction control pin is a high level; One end of the fifteenth resistor is grounded, and the other end is connected to the second direction control pin, so that the input level of the second direction control pin is a low level; One end of the nineteenth resistor is connected to the first voltage output port, and the other end is connected to the third direction control pin, so that the input level of the third direction control pin is a high level; One end of the twenty-first resistor is connected to the first voltage output port, and the other end is connected to the fourth direction control pin, so that the input level of the fourth direction control pin is a high level.

7. The voltage conversion circuit according to claim 6, characterized in that: When the input level of the first direction control pin is high, the data transmission direction is from the third pin of the bus signal output submodule to the fourteenth pin of the bus signal output submodule; When the input level of the second direction control pin is low, the data transmission direction is from the fourth pin of the bus signal output submodule to the thirteenth pin of the bus signal output submodule; When the input level of the third direction control pin is high, the data transmission direction is from the fifth pin of the bus signal output submodule to the twelfth pin of the bus signal output submodule; When the input level of the fourth direction control pin is high, the data transmission direction is from the sixth pin of the bus signal output submodule to the eleventh pin of the bus signal output submodule.

8. The voltage conversion circuit according to claim 2, characterized in that: The voltage conversion circuit further includes a third field effect transistor and a ninth resistor, and the second conversion submodule includes a second voltage output port; One end of the ninth resistor is connected to the second voltage output port, and the other end is connected to the gate of the third field effect transistor, so that the source and drain of the third field effect transistor are turned on; The drain of the third field effect transistor is connected to the enable port of the bus signal output submodule, and the source of the third field effect transistor is grounded. When the source and drain of the third field effect transistor are turned on, the enable port of the bus signal output submodule is grounded, so that the enable port of the bus signal output submodule is in a low level state.

9. The voltage conversion circuit according to claim 1, characterized in that: The second conversion submodule includes a second resistor, a fourth voltage-dividing resistor, a sixth voltage-dividing resistor, a second filter capacitor, and a fourth capacitor; Among them, one end of the second resistor is connected to the voltage receiving module, and the other end is connected to the third pin of the second conversion submodule; one end of the fourth voltage-dividing resistor is connected to the fifth pin of the second conversion submodule, and the other end is connected to the sixth voltage-dividing resistor; one end of the sixth voltage-dividing resistor is grounded, and the other end is connected to the fourth pin of the second conversion submodule and the fourth capacitor; one end of the second filter capacitor is grounded, and the other end is connected to the fifth pin of the second conversion submodule; one end of the fourth capacitor is grounded, and the other end is connected to the voltage receiving module.

10. An adapter plate, characterized in that: The adapter board includes the voltage conversion circuit according to any one of claims 1 to 9.

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