Underwater pressure-resistant electronic cabin
By installing radiators with shape adaptation in the cavity of the underwater pressure-resistant electronic cabin, the problem of insufficient heat dissipation area in the prior art is solved, and the heat dissipation performance of the electronic cabin is significantly improved, and it is suitable for high-power equipment.
Patent Information
- Application Number
- CN202421004713.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-09
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-05-09
AI Technical Summary
The existing underwater pressure-resistant electronic chambers have poor heat dissipation performance. Due to the limitation of diameter, the heat dissipation area of the circular heat dissipation fin is insufficient, which affects the heat dissipation effect of the electronic chambers.
An underwater pressure-resistant electronic cabin is designed, and a heat dissipation member along the length direction is provided in the cavity of the electronic cabin assembly, and the shape of the heat dissipation member facing away from the circuit board is adapted to the shape of the cavity side wall to increase the heat conduction area.
It effectively solves the problem of limited heat dissipation area of circular radiator, increases the length of electronic compartment and heat dissipation, improves the heat dissipation performance of underwater pressure-resistant electronic compartment, and is suitable for high-power underwater pressure-resistant electronic compartment.
Smart Images

Figure CN222996733U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of underwater equipment, in particular to an underwater pressure-resistant electronic cabin. Background Art
[0002] The underwater pressure-resistant electronic cabin is used for underwater work, and the PCBA (printed circuit board) is installed inside the electronic cabin; the pressure-resistant electronic cabin is sealed as a whole, the outside of the electronic cabin is lake water or sea water, and the internal space is completely sealed, so the PCBA inside the pressure-resistant electronic cabin only relies on heat transfer and conduction; usually, low-power underwater electronic equipment contacts the heat dissipation chip or electronic components coated with thermal silicone grease through a metal heat sink, and conducts the heat through the air inside the electronic cabin to the cylinder, and the cylinder conducts the heat to the water for heat dissipation; or rely on the upper and lower end covers of the electronic cabin, install circular heat sinks, and the circular heat sinks contact the chips or electronic components coated with thermal silicone grease for conduction heat dissipation.
[0003] It can be known from the heat conduction calculation formula that, under the premise of a certain medium temperature difference and medium thermal conductivity, the heat dissipation performance of the heat sink is related to the size of the area perpendicular to the heat transfer direction. The larger the area, the better the heat dissipation effect, and vice versa. Due to the limitation of the diameter of the pressure-resistant electronic cabin, heat conduction relies on the upper and lower end covers of the electronic cabin, which seriously affects the heat dissipation performance of the underwater pressure-resistant electronic cabin. Utility Model Content
[0004] The utility model provides an underwater pressure-resistant electronic cabin, which is used to solve the problem of poor heat dissipation performance of the underwater pressure-resistant electronic cabin in the prior art.
[0005] The utility model provides an underwater pressure-resistant electronic cabin, comprising:
[0006] An electronic compartment assembly having a cavity therein;
[0007] A heat sink is arranged in the cavity along the length direction of the electronic compartment assembly, a circuit board is arranged on one side of the heat sink, a side of the heat sink facing away from the circuit board is fitted with the side wall of the cavity, and the shape of the side of the heat sink facing away from the circuit board is adapted to the shape of the side wall of the cavity to increase the heat conduction area between the heat sink and the electronic compartment assembly.
[0008] According to an underwater pressure-resistant electronic cabin provided by an embodiment of the utility model, the electronic cabin assembly includes:
[0009] An electronic cabin body, wherein the cavity is located inside the electronic cabin body, and at least one end of the electronic cabin body is provided with an opening communicating with the cavity;
[0010] At least one end cover is disposed at the corresponding opening to seal the opening.
[0011] An underwater pressure-resistant electronic cabin provided according to an embodiment of the present utility model, the main body of the electronic cabin is cylindrical, and one side of the heat dissipation member facing away from the circuit board has a first arc surface, and the radian of the first arc surface is the same as the radian of the side wall of the cavity.
[0012] An underwater pressure-resistant electronic cabin provided according to an embodiment of the present utility model, the pressure-resistant electronic cabin further includes:
[0013] A support assembly, connected to the heat dissipation member and the side wall of the cavity, the support assembly is used to fix the heat dissipation member in the cavity.
[0014] An underwater pressure-resistant electronic cabin provided according to an embodiment of the present utility model, the support assembly includes:
[0015] At least one adjusting mechanism, arranged in the cavity and located on one side of the heat dissipation member; the adjusting mechanism is connected to the heat dissipation member;
[0016] At least one heat dissipation support, arranged in the cavity and located on one side of the heat dissipation member; the heat dissipation support is connected to the adjusting mechanism and abuts against the side wall of the cavity; the adjusting mechanism is used to adjust the distance between the heat dissipation support and the heat dissipation member.
[0017] An underwater pressure-resistant electronic cabin provided according to an embodiment of the present utility model, one side of the heat dissipation support facing away from the heat dissipation member has a second arc surface, and the radian of the second arc surface is the same as the radian of the side wall of the cavity.
[0018] An underwater pressure-resistant electronic cabin provided according to an embodiment of the present utility model, the adjusting mechanism includes:
[0019] At least one screw rod, both the heat dissipation member and the heat dissipation support are provided with connection holes, one end of the screw rod is inserted into the connection hole of the heat dissipation member, the other end of the screw rod is inserted into the connection hole of the heat dissipation support, and two nuts threadedly engaged with the screw rod are arranged on the screw rod, one nut abuts against one side of the heat dissipation member, and the other nut abuts against the side of the heat dissipation support facing the heat dissipation member.
[0020] An underwater pressure-resistant electronic cabin provided according to an embodiment of the present utility model, at least one of the first arc surface and the second arc surface is provided with a first limiting portion, and the side wall of the cavity is provided with a second limiting portion, and the first limiting portion and the second limiting portion are in limiting cooperation.
[0021] An underwater pressure-resistant electronic cabin provided according to an embodiment of the present utility model, the first limiting portion includes a convex rib, and the second limiting portion includes a limiting groove; alternatively, the first limiting portion includes a limiting groove, and the second limiting portion includes a convex rib, and the convex rib is embedded in the limiting groove.
[0022] An underwater pressure-resistant electronic cabin provided by an embodiment of the present invention, heat dissipation silicone grease is provided between the heat dissipation member and the circuit board and between the heat dissipation member and the side wall of the cavity.
[0023] The underwater pressure-resistant electronic cabin provided by the embodiment of the present invention arranges the heat dissipation member in the cavity along the length direction of the electronic cabin assembly, and makes the shape of the side of the heat dissipation member facing away from the circuit board match the shape of the side wall of the cavity, so as to increase the heat conduction area between the heat dissipation member and the electronic cabin assembly. It effectively solves the problem of limited heat dissipation area of the circular heat sink, and at the same time can increase the length of the electronic cabin and the heat sink, improve the heat dissipation performance of the underwater pressure-resistant electronic cabin, and solve the heat dissipation problem of the high-power underwater pressure-resistant electronic cabin. Description of the Drawings
[0024] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0025] Figure 1 is an exploded structural schematic diagram of the underwater pressure-resistant electronic cabin provided by the embodiment of the present invention;
[0026] Figure 2 is a side sectional structural schematic diagram of the underwater pressure-resistant electronic cabin provided by the embodiment of the present invention;
[0027] Figure 3 is a schematic diagram of the connection relationship between the heat dissipation member, the circuit board and the support assembly provided by the embodiment of the present invention.
[0028] Reference Signs:
[0029] 10. Electronic cabin assembly; 11. Electronic cabin main body; 12. End cover; 13. Limit groove; 20. Heat dissipation member; 21. Circuit board; 22. Heat dissipation silicone grease; 23. First arc surface; 30. Support assembly; 31. Adjusting mechanism; 32. Heat dissipation support; 120. Connection part; 121. Watertight head; 122. Watertight head protection ring; 311. Screw; 312. Nut; 321. Second arc surface; 322. Convex rib. Detailed Embodiments
[0030] The following further describes in detail the embodiments of the present invention in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.
[0031] In the description of the embodiments of the present utility model, it should be noted that the orientation or positional relationships indicated by the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the embodiments of the present utility model and for simplification, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the embodiments of the present utility model. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.
[0032] In the description of the embodiments of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.
[0033] In the embodiments of the present utility model, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.
[0034] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the embodiments of the present utility model. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.
[0035] The following will be combined with Figures 1 - 3 Describe the specific structure of the underwater pressure-resistant electronic cabin of the embodiments of the present utility model.
[0036] Figure 1 Illustrates the schematic explosion structure diagram of the underwater pressure-resistant electronic cabin provided by the embodiment of the present invention, Figure 2 Illustrates the schematic side-sectional structure diagram of the underwater pressure-resistant electronic cabin provided by the embodiment of the present invention, Figure 3 Illustrates the schematic connection relationship diagram of the heat dissipation component, circuit board and support component provided by the embodiment of the present invention. As Figures 1 to 3 shown, the underwater pressure-resistant electronic cabin includes an electronic cabin component 10 and a heat dissipation component 20. The electronic cabin component 10 has a cavity inside. The heat dissipation component 20 is arranged in the cavity along the length direction of the electronic cabin component 10. A circuit board 21 is arranged on one side of the heat dissipation component 20. The side of the heat dissipation component 20 facing away from the circuit board 21 is attached to the side wall of the cavity. The shape of the side of the heat dissipation component 20 facing away from the circuit board 21 is adapted to the shape of the side wall of the cavity to increase the heat conduction area between the heat dissipation component 20 and the electronic cabin component 10.
[0037] For the underwater pressure-resistant electronic cabin provided by the embodiment of the present invention, by arranging the heat dissipation component 20 in the cavity along the length direction of the electronic cabin component 10 and making the shape of the side of the heat dissipation component 20 facing away from the circuit board 21 adapted to the shape of the side wall of the cavity, the heat conduction area between the heat dissipation component 20 and the electronic cabin component 10 is increased. Effectively solves the problem of limited heat dissipation area of the circular heat sink, and at the same time can increase the length of the electronic cabin and the heat sink, improves the heat dissipation performance of the underwater pressure-resistant electronic cabin, and solves the heat dissipation problem of the high-power underwater pressure-resistant electronic cabin.
[0038] In an embodiment of the present invention, as Figures 1 to 2 shown, the electronic cabin component 10 includes an electronic cabin main body 11 and at least one end cover 12. The electronic cabin main body 11 is in a tubular structure. The outer diameters at both ends of the electronic cabin main body 11 are the same. The cavity is located inside the electronic cabin main body 11. The central axis of the cavity and the central axis of the electronic cabin main body 11 are the same straight line. At least one end of the electronic cabin main body 11 is provided with an opening communicating with the cavity, and the opening is used for installing the end cover 12. The end cover 12 is arranged at the corresponding opening and seals the opening. The end cover 12 and the electronic cabin main body 11 cooperate to enclose a sealed space, providing a sealed installation space for the heat dissipation component 20.
[0039] In a specific embodiment of the present invention, as Figures 1 to 2 shown, openings are provided at both ends of the electronic cabin main body 11, and each opening is provided with an end cover 12. The opening is a circular opening, and the end cover 12 is a circular cover body adapted to the opening. The end cover 12 is detachably connected to the electronic cabin main body 11.
[0040] Specifically, one side of the end cap 12 close to the electronic cabin main body 11 has a connecting portion 120. The connecting portion 120 is cylindrical. The connecting portion 120 is embedded in the opening. Screw holes are provided at the edge of the opening. The end cap 12 is fixed to the opening by screws in the screw holes. The number of screws can be two, three, four or more. Preferably, four screw holes are provided at the edge of the opening, and the four screw holes are arranged symmetrically in pairs.
[0041] Furthermore, in order to improve the sealing performance, an annular groove is provided on the outer peripheral surface of the connecting portion 120, and a sealing ring is provided in the annular groove. The sealing ring is in contact with the inner wall of the opening to achieve the sealing fit between the connecting portion 120 and the opening.
[0042] In a specific embodiment of the present invention, as Figures 1 to 2 shown, the end cap 12 is provided with a watertight head 121. The watertight head 121 is electrically connected to the circuit board 21 through a wire.
[0043] Specifically, the end cap 12 is provided with a mounting hole. The inner wall of the mounting hole is provided with threads. The watertight head 121 is arranged in the mounting hole and is in threaded fit with the inner wall of the mounting hole. Preferably, a sealing ring is sleeved on the outer peripheral surface of the watertight head 121. The sealing ring is used for the sealing fit between the watertight head 121 and the inner wall of the mounting hole. The material of the sealing ring is rubber or silica gel.
[0044] A watertight head protection ring 122 is provided on the side of the end cap 12 away from the electronic cabin main body 11. The outer diameter of the watertight head protection ring 122 is smaller than the outer diameter of the connecting portion 120. The watertight head protection ring 122 surrounds the outer periphery of the watertight head 121. The height of the watertight head protection ring 122 is greater than the height of the watertight head 121, so that external objects cannot come into contact with the watertight head 121 to protect the watertight head 121. Specifically, the height of the watertight head 121 is one-third of the height of the watertight head protection ring 122. Of course, the height of the watertight head 121 can also be one-half, one-fourth or other proportional relationships of the height of the watertight head protection ring 122.
[0045] It should be noted here that the height of the watertight head 121 refers to the dimension of the watertight head 121 protruding from the outer surface of the end cap 12. As Figure 2 shown, the height of the left watertight head 121 refers to the dimension of the left watertight head 121 protruding relative to the left side of the end cap 12, which is the height of the left watertight head 121. Similarly, the height of the right watertight head 121 refers to the dimension of the right watertight head 121 protruding relative to the right side of the end cap 12, which is the height of the right watertight head 121.
[0046] The watertight head protection ring 122 is connected to the end cap 12 through fasteners. Specifically, the fasteners are hexagon socket head cap screws, and the material of the hexagon socket head cap screws is preferably stainless steel. The end cap 12 is provided with a plurality of blind holes, and the inner wall of the blind holes is provided with threads. The hexagon socket head cap screws are threadedly connected to the blind holes. Of course, the fasteners can also be rivets, flat head screws or other types of fasteners.
[0047] Furthermore, a hollowed-out part is arranged on the outer peripheral surface of the watertight head protection ring 122. The hollowed-out part can serve as a handle, which is convenient for the operator to lift the underwater pressure-resistant electronic cabin.
[0048] In an embodiment of the present utility model, as Figure 1 and Figure 3 shown, the electronic cabin body 11 is cylindrical. The side of the heat dissipation member 20 facing away from the circuit board 21 has a first arc surface 23. The heat dissipation member 20 extends along the length direction of the electronic cabin body 11, and the radian of the first arc surface 23 is the same as the radian of the side wall of the cavity. Compared with the existing technology of using a circular heat sink to contact the end cap 12 for heat conduction, in the present utility model, by making the side of the heat dissipation member 20 facing away from the circuit board 21 fit with the side wall of the cavity and making the radian of the first arc surface 23 the same as the radian of the side wall of the cavity, the heat conduction area between the heat dissipation member 20 and the electronic cabin body 11 is increased several times, effectively solving the problem of limited heat dissipation area of the circular heat sink. At the same time, since the heat dissipation member 20 is arranged in the cavity along the length direction of the electronic cabin assembly 10, a longer heat dissipation member 20 can be installed.
[0049] In an embodiment of the present utility model, the heat dissipation member 20 is made of a material with a high thermal conductivity coefficient. The specific material of the heat dissipation member 20 is aluminum alloy, copper or other metal materials. The side of the heat dissipation member 20 facing the circuit board 21 is a plane to provide an installation space for the installation of the circuit board 21.
[0050] In a preferred embodiment of the present utility model, the connection between the plane and the first arc surface 23 forms the side edge of the heat dissipation member 20. An extension part (not shown) is arranged on the side edge of the heat dissipation member 20. The extension part extends along the first arc surface 23. The extension part is in an arc-shaped sheet structure. The extension part fits with the side wall of the cavity, and the extension part is integrally formed with the heat dissipation member 20. By arranging the extension part on the side edge of the heat dissipation member 20, the heat dissipation area between the heat dissipation member 20 and the electronic cabin body 11 is effectively increased, further enhancing the heat dissipation performance of the underwater pressure-resistant electronic cabin and solving the heat dissipation problem of the high-power underwater pressure-resistant electronic cabin.
[0051] In a preferred embodiment of the present utility model, the end face of the heat dissipation member 20 is a plane, and at least one end of the heat dissipation member 20 is attached to the side of the end cover 12 facing the cavity, further increasing the heat dissipation area of the heat dissipation member 20. This enables the heat of the heat dissipation member 20 to be conducted not only to the outside of the electronic cabin main body 11 through the side wall of the cavity, but also to the outside of the electronic cabin main body 11 through the end cover 12.
[0052] In an embodiment of the present utility model, the pressure-resistant electronic cabin further includes a support assembly 30. The support assembly 30 is connected to the heat dissipation member 20 and the side wall of the cavity. The support assembly 30 is used to fix the heat dissipation member 20 in the cavity. The support assembly 30 fixes the heat dissipation member 20 by applying pressure to the heat dissipation member 20 in the radial direction of the electronic cabin main body 11. At the same time, setting the support assembly 30 can also make the heat dissipation member 20 fit tightly with the side wall of the cavity, improving the heat dissipation performance of the heat dissipation member 20.
[0053] In an embodiment of the present utility model, as Figures 1 to 3 shown, the support assembly 30 includes at least one adjustment mechanism 31 and at least one heat dissipation support 32. The adjustment mechanism 31 is arranged in the cavity and is located on one side of the heat dissipation member 20; the adjustment mechanism 31 is connected to the heat dissipation member 20. The heat dissipation support 32 is arranged in the cavity and is located on one side of the heat dissipation member 20; the heat dissipation support 32 is used to abut against the side wall of the cavity to provide a supporting force for the heat dissipation member 20; at the same time, the heat dissipation support 32 also plays a role in assisting heat dissipation. The more the number of the heat dissipation supports 32, the better the heat dissipation performance of the underwater pressure-resistant electronic cabin. However, if the number of the heat dissipation supports 32 is too large, it will occupy the internal space of the electronic cabin main body 11. Therefore, the number of the heat dissipation supports 32 is determined according to actual needs. In this embodiment, two heat dissipation supports 32 are provided. Of course, the number of the heat dissipation supports 32 is not limited to two, and may also be one, three or more. The number of the adjustment mechanisms 31 is the same as the number of the heat dissipation supports 32, and the specific number of the adjustment mechanisms 31 is determined according to the number of the heat dissipation supports 32.
[0054] The heat dissipation support 32 is connected to the adjustment mechanism 31 in a one-to-one correspondence, and the heat dissipation support 32 also abuts against the side wall of the cavity. The adjustment mechanism 31 is used to adjust the distance between the heat dissipation support 32 and the heat dissipation member 20. Due to the size limitation of the opening, it is necessary to reduce the distance between the heat dissipation support 32 and the heat dissipation member 20 during the installation process to facilitate placing the heat dissipation member 20 into the cavity. After the heat dissipation member 20 is installed in place, the distance between the heat dissipation support 32 and the heat dissipation member 20 is increased by the adjustment mechanism 31, so that both the heat dissipation support 32 and the heat dissipation member 20 abut against the side wall of the cavity, thereby realizing the fixation of the heat dissipation member 20 and preventing the heat dissipation member 20 from moving during use and causing damage to the circuit board 21.
[0055] In an embodiment of the present utility model, asFigures 1 to 3 As shown in the figure, the heat dissipation support 32 has a block structure. The heat dissipation support 32 is made of a material with a high thermal conductivity coefficient. The specific material of the heat dissipation support 32 is aluminum alloy, copper or other metal materials. Part of the heat conducted out by the heat dissipation component 20 can be conducted to the side wall of the cavity through the heat dissipation support 32, and then conducted to the outside of the electronic cabin body 11 through the side wall of the cavity. One side of the heat dissipation support 32 facing away from the heat dissipation component 20 has a second arc surface 321, and the radian of the second arc surface 321 is the same as that of the side wall of the cavity. By making the radian of the second arc surface 321 the same as that of the side wall of the cavity, it can ensure that the second arc surface 321 fits closely with the side wall of the cavity, which not only increases the heat dissipation area of the heat dissipation support 32 and further enhances the heat dissipation performance of the underwater pressure-resistant electronic cabin, but also increases the force-bearing area between the heat dissipation support 32 and the side wall of the cavity, improving the stability of the heat dissipation component 20.
[0056] In an embodiment of the present invention, the adjusting mechanism 31 includes at least one screw 311. The outer peripheral surface of the screw 311 is provided with threads, and the threads extend to both ends of the screw 311. The outer diameters of both ends of the screw 311 are equal. Both the heat dissipation component 20 and the heat dissipation support 32 are provided with connection holes, and the positions of the connection holes on the heat dissipation support 32 correspond to the positions of the connection holes on the heat dissipation component 20 one by one.
[0057] One end of the screw 311 is inserted into the connection hole of the heat dissipation component 20, and the other end of the screw 311 is inserted into the connection hole of the heat dissipation support 32. Two nuts 312 that are threadedly engaged with the screw 311 are provided on the screw 311. By rotating the nuts 312, the depth of the screw 311 inserted into the connection hole can be changed, thereby changing the distance between the heat dissipation support 32 and the heat dissipation component 20. When the first arc surface 23 and the second arc surface 321 both fit with the side wall of the cavity, one nut 312 abuts against one side of the heat dissipation component 20, and the other nut 312 abuts against the side of the heat dissipation support 32 facing the heat dissipation component 20. By respectively limiting the heat dissipation support 32 and the heat dissipation component 20 with the two nuts 312, the heat dissipation support 32 and the heat dissipation component 20 can both fit with the side wall of the cavity, thereby realizing the fixation of the heat dissipation component 20.
[0058] In a specific embodiment of the present invention, as Figure 2 shown, the support assembly 30 includes two adjusting mechanisms 31. The two adjusting mechanisms 31 are arranged at intervals along the length direction of the electronic cabin body 11. One adjusting mechanism 31 is located at the left end of the heat dissipation component 20, and one adjusting mechanism 31 is located at the right end of the heat dissipation component 20. Each adjusting mechanism 31 includes two screws 311. The two screws 311 in the same group are arranged at intervals along the width direction of the heat dissipation component 20, and the length direction of the screw 311 is perpendicular to the plane on one side of the heat dissipation component 20.
[0059] Two connection holes are provided at both ends of the heat dissipation member 20. The two connection holes at the same end are arranged at intervals along the width direction of the heat dissipation member 20. The connection holes can be through holes or blind holes. One connection hole is provided at each end of the heat dissipation support 32. The connection holes of the heat dissipation support 32 and the connection holes of the heat dissipation member 20 are both through holes.
[0060] The two left-side screws 311 are parallel to each other. One end of each of the two left-side screws 311 is inserted into the two connection holes at the left end of the heat dissipation member 20 in a one-to-one correspondence, and the other end of each of the two left-side screws 311 is inserted into the two connection holes of the left-side heat dissipation support 32 in a one-to-one correspondence. The two right-side screws 311 are parallel to each other. One end of each of the two right-side screws 311 is inserted into the two connection holes at the right end of the heat dissipation member 20 in a one-to-one correspondence, and the other end of each of the two right-side screws 311 is inserted into the two connection holes of the right-side heat dissipation support 32 in a one-to-one correspondence.
[0061] It should be noted here that the specific structural form of the adjusting mechanism 31 is not limited to the above structure. A nut 312 can also be provided on the screw 311. By adjusting the nut 312, the nut 312 is abutted against the side of the heat dissipation support 32 facing the heat dissipation member 20, and the above functions can also be realized. Of course, in another embodiment, the adjusting mechanism 31 includes a compression spring. One end of the compression spring is connected to one side of the heat dissipation member 20, and the other end of the compression spring is connected to the side of the heat dissipation support 32 facing the heat dissipation member 20. During installation, by applying pressure to the heat dissipation support 32, the heat dissipation support 32 approaches the heat dissipation member 20, and the compression spring is compressed, so that the distance between the heat dissipation support 32 and the heat dissipation member 20 is reduced, ensuring that the heat dissipation member 20 can enter the cavity through the opening of the electronic cabin main body 11. After the heat dissipation support 32 enters the cavity, the heat dissipation support 32 is released. Under the elastic force of the compression spring, the second arc surface 321 fits tightly with the inner wall of the cavity, thereby fixing the heat dissipation member 20 in the cavity.
[0062] In a specific embodiment of the present utility model, as Figures 1 to 3 shown, at least one of the first arc surface 23 and the second arc surface 321 is provided with a first limiting portion. The first limit can be provided only on the first arc surface 23, or only on the second arc surface 321, or the first limiting portion can be provided on both the first arc surface 23 and the second arc surface 321. When the support assembly 30 includes two heat dissipation supports 32, the first limit can be provided only on one of the second arc surfaces 321, or on both of the second arc surfaces 321.
[0063] The side wall of the cavity is provided with a second limiting portion. The first limiting portion and the second limiting portion are in limiting cooperation. By making the first limiting portion and the second limiting portion in limiting cooperation, the heat dissipation member 20 can be prevented from moving in the cavity, and the stability of the heat dissipation member 20 is improved.
[0064] In a specific embodiment of the present utility model, as Figure 2 shown, one of the two heat dissipation supports 32 is provided with a first limiting portion. Specifically, the second arc surface 321 of the heat dissipation support 32 located on the left side is provided with the first limiting portion. The first limiting portion includes a convex rib 322, and the convex rib 322 extends along the length direction of the second arc surface 321. The second limiting portion includes a limiting groove 13, and the limiting groove 13 is located at a position close to the opening. The position of the limiting groove 13 corresponds to the position of the convex rib 322. The limiting groove 13 is an annular groove body. By adopting the annular groove body, even if the heat dissipation member 20 and the heat dissipation support 32 rotate around the central axis of the electronic cabin main body 11, the convex rib 322 can still be caught in the limiting groove 13 for limiting, which simplifies the installation method of the heat dissipation member 20. Of course, the limiting groove 13 can also be an arc-shaped groove body, and the length of the arc-shaped groove body is greater than the length of the convex rib 322.
[0065] In another specific embodiment of the present utility model, the first limiting portion includes a limiting groove 13, and the limiting groove 13 extends along the length direction of the second arc surface 321. The second limiting portion includes a convex rib 322, and the position of the convex rib 322 corresponds to the position of the limiting groove 13. The convex rib 322 can be an annular convex rib 322 or an arc-shaped convex rib 322, and the convex rib 322 is embedded in the limiting groove 13.
[0066] It should be noted here that the specific structural form of the first limiting portion is not limited to the convex rib 322, and can also be a limiting block or a combination of a limiting block and a spring.
[0067] In a specific embodiment of the present utility model, the circuit board 21 is fixed to one side of the heat dissipation member 20 by screws, and a gap is formed between the heat dissipation member 20 and the circuit board 21. A heat dissipation silicone grease 22 is provided between the heat dissipation member 20 and the circuit board 21. By using the heat dissipation silicone grease 22 to fill the gap, the contact area between the heat dissipation member 20 and the circuit board 21 is increased, and the fitting gap caused by the machining tolerance is filled. Similarly, a heat dissipation silicone grease 22 is provided between the heat dissipation member 20 and the side wall of the cavity, and the heat dissipation silicone grease 22 between the heat dissipation member 20 and the side wall of the cavity can also play the same role as described above.
[0068] The present utility model also provides an underwater device, and the underwater device includes the underwater pressure-resistant electronic cabin described in any one of the above embodiments.
[0069] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. An underwater pressure-resistant electronic cabin, characterized in that: include: An electronic cabin assembly (10) having a cavity therein; A heat sink (20) is arranged in the cavity along the length direction of the electronic compartment assembly (10); a circuit board (21) is arranged on one side of the heat sink (20); a side of the heat sink (20) facing away from the circuit board (21) is in contact with a side wall of the cavity; and the shape of the side of the heat sink (20) facing away from the circuit board (21) is adapted to the shape of the side wall of the cavity, so as to increase a heat conduction area between the heat sink (20) and the electronic compartment assembly (10); The pressure-resistant electronic cabin also includes: a support assembly (30) connected to the heat sink (20) and a side wall of the cavity, the support assembly (30) being used to fix the heat sink (20) in the cavity; The support assembly (30) comprises: At least one adjustment mechanism (31) is arranged in the cavity and located on one side of the heat sink (20); the adjustment mechanism (31) is connected to the heat sink (20); At least one heat dissipation support (32) is arranged in the cavity and located on one side of the heat dissipation element (20); the heat dissipation support (32) is connected to the adjustment mechanism (31) and abuts against the side wall of the cavity; the adjustment mechanism (31) is used to adjust the distance between the heat dissipation support (32) and the heat dissipation element (20).
2. The underwater pressure-resistant electronic cabin according to claim 1, characterized in that: The electronic compartment assembly (10) comprises: An electronic cabin body (11), the cavity being located inside the electronic cabin body (11), and at least one end of the electronic cabin body (11) being provided with an opening communicating with the cavity; At least one end cover (12) is arranged at the corresponding opening and seals the opening.
3. The underwater pressure-resistant electronic cabin according to claim 2, characterized in that: The electronic cabin body (11) is cylindrical, and the heat sink (20) has a first curved surface (23) on a side facing away from the circuit board (21), and the curvature of the first curved surface (23) is the same as the curvature of the cavity side wall.
4. The underwater pressure-resistant electronic cabin according to claim 3, characterized in that: The heat dissipation support (32) has a second curved surface (321) on a side facing away from the heat dissipation element (20), and the curvature of the second curved surface (321) is the same as the curvature of the cavity side wall.
5. The underwater pressure-resistant electronic cabin according to claim 4, characterized in that: The regulating mechanism (31) comprises: At least one screw rod (311), the heat sink (20) and the heat sink support (32) are both provided with connection holes, one end of the screw rod (311) is inserted into the connection hole of the heat sink (20), and the other end of the screw rod (311) is inserted into the connection hole of the heat sink support (32), and the screw rod (311) is provided with two nuts (312) threadably matched with the screw rod (311), one of the nuts (312) abuts against one side of the heat sink (20), and the other of the nuts (312) abuts against a side of the heat sink support (32) facing the heat sink (20).
6. The underwater pressure-resistant electronic cabin according to claim 5, characterized in that: At least one of the first curved surface (23) and the second curved surface (321) is provided with a first limiting portion, the side wall of the cavity is provided with a second limiting portion, and the first limiting portion and the second limiting portion are matched in a limiting manner.
7. The underwater pressure-resistant electronic cabin according to claim 6, characterized in that: The first limiting portion comprises a convex ridge (322), and the second limiting portion comprises a limiting groove (13); or, the first limiting portion comprises a limiting groove (13), and the second limiting portion comprises a convex ridge (322), and the convex ridge (322) is embedded in the limiting groove (13).
8. The underwater pressure-resistant electronic cabin according to claim 1, 2, 3, 4, 5, 6 or 7, characterized in that: Heat dissipation silicone grease (22) is provided between the heat dissipation element (20) and the circuit board (21), and between the heat dissipation element (20) and the side wall of the cavity.