FPC (Flexible Printed Circuit) with reinforcing plate attached to whole plate strip
By using the entire PI reinforcement plate on the FPC instead of the single-particle PI reinforcement plate, and by designing large FPC plates and FPC monomers, the problem of low adhesion efficiency of PI reinforcement plates in the existing technology is solved, achieving higher adhesion yield and lower production costs.
Patent Information
- Application Number
- CN202421631784.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-10
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-07-10
AI Technical Summary
In the prior art, the 50um thickness PI reinforcement plate used on the FPC is softer, resulting in low production efficiency and yield during the single-particle adhesion process of the robot.
The entire PI reinforcement plate is used to replace the single-particle PI reinforcement plate. Through the design of setting up several FPC monomers and the entire PI reinforcement plate on the large FPC plate, the entire PI reinforcement plate is fixed on the opposite side of the gold fingers of each FPC monomer, and is attached and fixed with the FPC monomer by using a solid glue layer.
It improves the adhesion yield and adhesion efficiency of PI reinforcement boards, reduces production costs, and thus enhances the market competitiveness of the products.
Smart Images
Figure CN222996739U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of circuit boards, in particular to an FPC with a whole-board strip-attached reinforcement board. Background Art
[0002] With the improvement of living standards, intelligent wearable devices such as bracelets and watches are becoming more and more common. The functions of smart watches are also becoming more comprehensive, integrating a series of functions such as touch control, display, and NFC payment. Each functional module needs to be connected to the main board of the watch through a corresponding connector for communication. The ZIF connector is widely used in such products due to its advantage in combined thickness. On the back of the FPC gold finger insertion end connected to the ZIF connector, since the FPC is relatively soft, a PI reinforcement board usually needs to be attached. Due to the stacking thickness limitation, a PI reinforcement board with a thickness of 50um is usually selected. However, when the manipulator attaches the PI reinforcement board to the FPC one by one, since the PI reinforcement board with a thickness of 50um is relatively soft, the production efficiency and yield are low. Content of the Utility Model
[0003] The purpose of the utility model is to overcome the deficiencies in the prior art and provide an FPC with a whole-board strip-attached reinforcement board.
[0004] The purpose of the utility model is realized by the following technical solutions:
[0005] An FPC with a whole-board strip-attached reinforcement board, comprising: a large FPC board, a plurality of FPC monomers, and a PI reinforcement board; a plurality of FPC monomers are arranged on the large FPC board, a gold finger is arranged at one end of each FPC monomer, the gold fingers of each FPC monomer are arranged on the same surface of the large FPC board, the PI reinforcement board is in a strip shape, and the whole strip of the PI reinforcement board is fixed on the opposite surface of the gold fingers of each FPC monomer.
[0006] In one embodiment, the number of the FPC monomers is 28.
[0007] In one embodiment, each of the FPC monomers is evenly divided into 4 groups, the number of FPC monomers in each group is 7, the number of the PI reinforcement boards is 2, and the gold fingers of every two groups of FPC monomers are arranged opposite to each other.
[0008] In one embodiment, the gold fingers of every two groups of FPC monomers are arranged in a staggered manner.
[0009] In one embodiment, the FPC monomers in each group are arranged at equal intervals.
[0010] In one embodiment, the gold fingers of the FPC monomers in each group are arranged in alignment.
[0011] In one embodiment, a solid glue layer is provided on the joint surface of the PI reinforcing plate and the FPC monomer, and the PI reinforcing plate is attached and fixed to the FPC monomer through the solid glue layer.
[0012] In one embodiment, the sum of the thicknesses of the PI reinforcing plate and the solid glue layer is 0.05 mm.
[0013] In one embodiment, the large FPC board is respectively provided with limiting holes at its four peripheral edges.
[0014] In one embodiment, the size of the large FPC board is 120 mm * 130 mm.
[0015] Compared with the prior art, the utility model has at least the following advantages:
[0016] A flexible printed circuit (FPC) with a whole-board strip-attached reinforcing plate of the utility model is provided with a large FPC board, a plurality of FPC monomers and a PI reinforcing plate. A plurality of FPC monomers are arranged on the large FPC board. Gold fingers are arranged at one end of each FPC monomer, and the gold fingers are arranged on the same surface of the FPC monomer. The gold fingers of each FPC monomer are arranged on the same surface of the large FPC board. The whole PI reinforcing plate is fixed on the opposite surface of the gold fingers of each FPC monomer. The utility model uses the whole PI reinforcing plate to replace the single-piece PI reinforcing sheet attached to the gold fingers in the prior art, thereby improving the attachment yield and attachment efficiency of the PI reinforcing plate, reducing the production cost, and thus improving the market competitiveness of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required to be used in the embodiments will be briefly introduced below.
[0018] Figure 1 It is a schematic structural diagram of an FPC board with a single-piece attached PI reinforcing sheet in the prior art.
[0019] Reference numerals:
[0020] The FPC board 100 with a single-piece attached PI reinforcing sheet, the PI reinforcing sheet 101.
[0021] Figure 2 It is a schematic structural diagram of an FPC with a whole-board strip-attached reinforcing plate in an embodiment of the utility model;
[0022] Figure 3 It is a schematic structural diagram of an FPC monomer in an embodiment of the utility model.
[0023] Reference numerals:
[0024] An FPC200 with a full - sheet strip - attached reinforcement plate, a large FPC board 10, a limiting hole 11, an FPC monomer 20, a component soldering area 30, a PI reinforcement plate 40, and a non - adhesive handle 50. Detailed implementation mode
[0025] For the convenience of understanding the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings.
[0026] The present application proposes an FPC200 with a full - sheet strip - attached reinforcement plate, including: a large FPC board 10, a plurality of FPC monomers 20, and a PI reinforcement plate 40. The PI reinforcement plate 40 has a relatively hard hardness. A plurality of FPC monomers 20 are arranged on the large FPC board 10, and each FPC monomer 20 can be installed in various electronic products. A gold finger is arranged at one end of each FPC monomer 20, and the gold finger is inserted into a connector and then electrically connected to the connector. The gold fingers are arranged on the same surface of the FPC monomer 20, and the gold fingers of each FPC monomer 20 are arranged on the same surface of the large FPC board 10. The PI reinforcement plate 40 is fixed as a whole on the opposite surface of the gold fingers of each FPC monomer 20. The PI reinforcement plate is in a strip shape. The present utility model uses the whole PI reinforcement plate 40 to replace the single - grain PI reinforcement sheet attached to the gold finger in the prior art, thereby improving the attachment yield and attachment efficiency of the PI reinforcement plate 40, reducing production costs, and thus enhancing the market competitiveness of the product.
[0027] It should be noted that a component soldering area 30 is arranged on each FPC monomer 20, and a rigid sheet is also arranged on the back of the component soldering area 30 for reinforcement.
[0028] In one embodiment, a solid glue layer is arranged on the joint surface of the PI reinforcement plate 40 and the FPC monomer 20. Both sides of the solid glue layer have adhesiveness. One side is bonded to the PI reinforcement plate 40, and the other side is bonded to the FPC. Therefore, the PI reinforcement plate 40 is attached and fixed to the FPC monomer 20 through the solid glue layer, preventing the PI reinforcement plate 40 from falling off from the back of the gold finger of the FPC and ensuring the working reliability of the FPC.
[0029] Furthermore, the sum of the thicknesses of the PI reinforcement plate 40 and the solid glue layer is 0.05 mm, so that the stacked thickness of the gold finger, the PI reinforcement plate 40, and the solid glue layer can meet the requirements of the ZIF connector.
[0030] It should be noted that after the whole PI reinforcement plate 40 is attached, the PI reinforcement plate 40 between the FPC monomers 20 needs to be grooved and hollowed out to facilitate the SMT sub - plate into independent FPC monomers 20.
[0031] In one embodiment, the number of FPC monomers 20 arranged on a large FPC board 10 is 28.
[0032] Further, the 28 FPC monomers 20 are evenly divided into 4 groups, with 7 FPC monomers 20 in each group and 2 PI reinforcing plates 40. The gold fingers of every two groups of FPC monomers 20 are arranged oppositely. Therefore, there are two groups of oppositely arranged gold fingers, and the 2 PI reinforcing plates 40 are respectively attached to the oppositely arranged gold fingers, reducing the number of attachment strips of the PI reinforcing plates 40 and further improving the attachment efficiency.
[0033] In another embodiment, the gold fingers of every two groups of FPC monomers 20 are arranged in a staggered manner, shortening the interval between the two groups of FPC monomers 20, improving the material utilization rate of the large FPC board 10, and at the same time reducing the waste of the PI reinforcing plate 40 material. The area of the PI reinforcing plate 40 can be made smaller.
[0034] Further, the FPC monomers 20 in each group are arranged at equal intervals. The equally spaced FPC monomers 20 make the positions of the gold fingers fixed, facilitating the subsequent punching and hollowing of the PI reinforcing plate 40 by automated or semi-automated equipment and improving the punching accuracy.
[0035] Still further, the gold fingers of the FPC monomers 20 in each group are aligned, making the area and position where the PI reinforcing plate 40 is attached to each FPC monomer 20 consistent, improving the attachment accuracy and attachment yield rate of the PI reinforcing plate 40, thereby reducing the subsequent cutting process. Moreover, a non-adhesive handle 50 is provided on each FPC monomer 20, and the non-adhesive handle 50 is used for clamping by a fixture or a manipulator, facilitating the staff to take out the FPC monomer 20 from the large FPC board 10 and assemble the FPC monomer 20 into the equipment, and avoiding damaging the devices in the FPC monomer 20.
[0036] In one embodiment, the large FPC board 10 is respectively provided with limiting holes 11 at its four peripheral edges. When the PI reinforcing plate 40 is punched and hollowed by automated or semi-automated equipment, the large FPC board 10 is fixed to the equipment through the limiting holes 11, preventing the large FPC board 10 from shifting during the operation of the equipment and causing punching failure and scrapping of the large FPC board 10.
[0037] In addition, the size of the large FPC board 10 is 120mm * 130mm.
[0038] The above-described embodiments only represent several implementation manners of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the utility model patent shall be subject to the appended claims.
Claims
1. An FPC with a full-page strip-pasted reinforcement board, characterized in that: include: Large FPC board, several FPC monomers and PI reinforcement board; A plurality of FPC monomers are arranged on the large FPC board, and a gold finger is arranged on one end of each of the FPC monomers. The gold fingers of each of the FPC monomers are arranged on the same surface of the large FPC board. The PI reinforcement board is in a strip shape, and the entire PI reinforcement board is fixed on the opposite surface of the gold fingers of each of the FPC monomers.
2. The FPC with a reinforcing plate pasted on the entire page according to claim 1, characterized in that: The number of the FPC monomers is 28.
3. The FPC with reinforcing plate pasted on the whole sheet according to claim 2, characterized in that: The FPC monomers are divided into 4 groups on average, each group has 7 FPC monomers, the PI reinforcing plates have 2 pieces, and the gold fingers of every two groups of FPC monomers are arranged opposite to each other.
4. The FPC with reinforcing plate pasted on the whole sheet according to claim 3, characterized in that: The gold fingers of every two groups of FPC monomers are staggered.
5. The FPC with reinforcing plate pasted on the whole sheet according to claim 3, characterized in that: The FPC monomers in each group are arranged at equal intervals.
6. The FPC with reinforcing plate pasted on the whole sheet according to claim 3, characterized in that: The gold fingers of each group of FPC monomers are aligned.
7. The FPC with reinforcing plate pasted on the whole sheet according to claim 1, characterized in that: The PI reinforcing plate is provided with a solid adhesive layer on the bonding surface with the FPC monomer, and the PI reinforcing plate is attached and fixed to the FPC monomer through the solid adhesive layer.
8. The FPC with reinforcing plate pasted on the whole sheet according to claim 7, characterized in that: The sum of the thicknesses of the PI reinforcing plate and the solid adhesive layer is 0.05 mm.
9. The FPC with reinforcing plate pasted on the whole sheet according to claim 1, characterized in that: The large FPC board is provided with limiting holes at the edges of the four sides thereof.
10. The FPC with reinforcing plate pasted on the whole sheet according to claim 1, characterized in that: The size of the large FPC board is 120mm*130mm.