Application circuit board of high-frequency transformer
By adopting high-frequency transformer and large-volume discrete components spacing arrangement, and vertical and horizontal spacing arrangement of small-volume discrete components on the circuit board of high-frequency transformer application, and combining the integrated design of resonant inductor and transformer and copper foil heat dissipation structure, the electromagnetic interference and heat dissipation problems are solved, and the working stability and production efficiency of the circuit board are improved.
Patent Information
- Application Number
- CN202422025691.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-20
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-08-20
AI Technical Summary
The existing circuit boards for high-frequency transformer application fail to effectively consider magnetic field electromagnetic interference and component heat dissipation problems, resulting in unstable work, increasing production costs and reducing production efficiency.
High-frequency transformers and large-volume discrete components are arranged spaced between the top surface of the circuit board, and the space on the bottom surface of the circuit board is used to arrange vertically and horizontally between the small-volume discrete components. A high-frequency transformer design that integrates resonant inductor and transformer is designed, and a copper foil heat dissipation structure is set at the pins of the semiconductor chip.
The electromagnetic interference of high-frequency transformers on components is reduced through interval arrangement, the heat dissipation efficiency is improved, the plug-ins or patches are facilitated, and the yield and production efficiency are improved.
Smart Images
Figure CN222996748U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to an application circuit board of a high-frequency transformer. Background Art
[0002] At present in the market, the application circuit boards of high-frequency transformers all adopt conventional layouts, only meeting the electrical connection of each component according to the circuit diagram, without reasonably planning the layout of the circuit board, which leads to two problems: one is that the electromagnetic interference of the magnetic field of the high-frequency transformer on the components nearby is not considered, resulting in unstable operation of the circuit board; the other is that the components are arranged densely, and there is not enough space around the components and the high-frequency transformer for heat dissipation, nor enough space for mechanized plug-in or chip mounting during the production of the circuit board, resulting in repeated pushing and folding of adjacent components during the mechanized plug-in or chip mounting process, easily damaging the installed components, greatly increasing the production cost and reducing the production efficiency. Summary of the Utility Model
[0003] Aiming at the above defects, the purpose of the utility model is to provide an application circuit board of a high-frequency transformer, which solves the problems of electromagnetic interference of the high-frequency transformer and low yield and production efficiency of mechanized plug-in or chip mounting.
[0004] To achieve the above object, the utility model adopts the following technical solutions:
[0005] An application circuit board of a high-frequency transformer, comprising a circuit board, a high-frequency transformer, a plurality of large-volume discrete components and a plurality of small-volume discrete components; the high-frequency transformer and the large-volume discrete components are arranged on the top surface of the circuit board, and the small-volume discrete components are arranged on the bottom surface of the circuit board;
[0006] The high-frequency transformer and the plurality of large-volume discrete components are arranged at vertical and horizontal intervals, and the plurality of small-volume discrete components are arranged at vertical and horizontal intervals.
[0007] Further, the high-frequency transformer adopts a high-frequency transformer integrating a resonant inductor and a transformer.
[0008] Further, the plurality of large-volume discrete components are arranged far away from the high-frequency transformer, and at least one-third of the circumferential side of the high-frequency transformer is not adjacent to the large-volume discrete components.
[0009] Further, the large-volume discrete components are vertical components.
[0010] Further, the small-volume discrete components are horizontal components.
[0011] Further, the horizontal component includes a horizontal element and a semiconductor chip; the semiconductor chips are arranged in a staggered manner, and at least one side of the semiconductor chip is arranged away from the horizontal element.
[0012] Further, the pins of the semiconductor chip are provided with a heat dissipation structure.
[0013] Further, the heat dissipation structure spreads from the pins of the semiconductor chip to the blank area on the bottom surface of the circuit board.
[0014] Further, the heat dissipation structure is a copper foil.
[0015] Further, the horizontal element is a chip integrated with multiple elements.
[0016] The technical solution provided by the present utility model may include the following beneficial effects: Usually, after the circuit board is installed in the housing, the space on the top surface is relatively large, and the space on the bottom surface is relatively small. Therefore, the high-frequency transformer with a larger volume and large-volume discrete components are arranged on the top surface of the circuit board, and the small-volume discrete components with a smaller volume and a larger number are arranged on the bottom surface of the circuit board, so as to reserve enough space on the top surface of the circuit board for the vertical and horizontal spacing arrangement between the high-frequency transformer and multiple large-volume discrete components, and reserve enough space on the bottom surface of the circuit board for the vertical and horizontal spacing arrangement between multiple small-volume discrete components, thereby realizing the heat dissipation of the high-frequency transformer and each component by using the spacing, and facilitating mechanized plug-in or chip mounting, ensuring the yield rate of the applied circuit board while improving the production efficiency; More importantly, separating the high-frequency transformer from the large-volume discrete components is beneficial to reducing the electromagnetic interference of the high-frequency transformer on the large-volume discrete components, and at the same time, the circuit board can be used to separate the high-frequency transformer from the small-volume discrete components, with a better electromagnetic interference isolation effect, improving the working stability of the large number of small-volume discrete components, especially when the small-volume discrete components contain integrated circuits. Description of the Drawings
[0017] Figure 1 is a schematic top view of an application circuit board of a high-frequency transformer according to one embodiment of the present utility model.
[0018] Figure 2 is as Figure 1 shown a schematic bottom view of an application circuit board of a high-frequency transformer.
[0019] Wherein: circuit board 1, high-frequency transformer 2, large-volume discrete component 3, small-volume discrete component 4, horizontal element 41, semiconductor chip 42, heat dissipation structure 421. Detailed Embodiment
[0020] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation of the present utility model.
[0021] In the description of the embodiments of the present utility model, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the embodiments of the present utility model, the meaning of "a plurality" is two or more unless otherwise specifically defined.
[0022] In the description of the embodiments of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.
[0023] The following is combined with Figures 1 to 2 to describe an application circuit board of a high-frequency transformer according to an embodiment of the present utility model.
[0024] An application circuit board of a high-frequency transformer includes a circuit board 1, a high-frequency transformer 2, a plurality of large-volume discrete components 3 and a plurality of small-volume discrete components 4; the high-frequency transformer 2 and the large-volume discrete components 3 are arranged on the top surface of the circuit board 1, and the small-volume discrete components 4 are arranged on the bottom surface of the circuit board 1;
[0025] The high-frequency transformer 2 and the plurality of large-volume discrete components 3 are arranged at vertical and horizontal intervals, and the plurality of small-volume discrete components 4 are arranged at vertical and horizontal intervals.
[0026] In a preferred embodiment of an application circuit board of a high-frequency transformer proposed by the present utility model, as Figures 1 to 2As shown, after the circuit board 1 is usually installed in the housing, there is a relatively large space on the top surface and a relatively small space on the bottom surface. Therefore, the high-frequency transformer 2 with a larger volume and the large-volume discrete components 3 are arranged on the top surface of the circuit board 1, and the small-volume discrete components 4 with a smaller volume and a larger quantity are arranged on the bottom surface of the circuit board 1, so as to reserve enough space on the top surface of the circuit board 1 for the vertical and horizontal spacing arrangement between the high-frequency transformer 2 and the multiple large-volume discrete components 3, and reserve enough space on the bottom surface of the circuit board 1 for the vertical and horizontal spacing arrangement between the multiple small-volume discrete components 4, thereby realizing the heat dissipation of the high-frequency transformer 2 and each component by means of the spacing, and facilitating mechanized plug-in or chip mounting, ensuring the yield rate of the applied circuit board while improving the production efficiency; more importantly, the separation of the high-frequency transformer 2 and the large-volume discrete components 3 is beneficial to reducing the electromagnetic interference of the high-frequency transformer 2 on the large-volume discrete components 3, and at the same time, the circuit board 1 can be used to separate the high-frequency transformer 2 and the small-volume discrete components 4, with a better electromagnetic interference isolation effect, improving the working stability of the relatively large number of small-volume discrete components 4, especially when the small-volume discrete components 4 contain integrated circuits.
[0027] It should be noted that the volume sizes of the large-volume discrete components 3 and the small-volume discrete components 4 are obtained by comparing the two. For example, all the discrete components to be used on the circuit board are sorted by volume, and then the volume dividing line is determined according to the actual situation. The discrete components sorted before the volume dividing line are the large-volume discrete components 3, and the discrete components sorted after the volume dividing line are the small-volume discrete components 4; it can also be classified according to the specifications of each component. For example, for capacitors, those usually above 1000 μF are large capacitors, that is, large-volume discrete components 3; the classification of the large-volume discrete components 3 and the small-volume discrete components 4 is not limited here, and the same principle applies.
[0028] Furthermore, the high-frequency transformer 2 adopts a high-frequency transformer integrating a resonant inductor and a transformer.
[0029] In this embodiment, the LLC scheme adopts a scheme of integrating a resonant inductor and a transformer. Compared with the scheme of using discrete components for the resonant inductor and the transformer commonly used in the market, the cost is lower and the space occupied on the top surface of the circuit board 1 is less, which is beneficial to increasing the spacing between the high-frequency transformer 2 and the large-volume discrete components 3. Moreover, the high-frequency transformer integrating a resonant inductor and a transformer can control the inductance of the resonant inductor through the magnetic core, improving the working performance of the applied circuit board. The high-frequency transformer integrating a resonant inductor and a transformer can be, for example, a kind of high-efficiency transformer with the Chinese patent number: CN114551052A.
[0030] Furthermore, the multiple large-volume discrete components 3 are arranged far away from the high-frequency transformer 2, and at least one-third of the circumferential side of the high-frequency transformer 2 is not adjacent to the large-volume discrete components 3.
[0031] In this embodiment, to increase the spacing between the large-sized discrete components 3 and the high-frequency transformer 2, multiple large-sized discrete components 3 are arranged away from the high-frequency transformer 2, and at least one-third of the circumferential side of the high-frequency transformer 2 is ensured not to be adjacent to the large-sized discrete components 3, ensuring sufficient heat dissipation space on the circumferential side of the high-frequency transformer 2 and reducing electromagnetic interference to the large-sized discrete components 3. The implementation method can be that the large-sized discrete components 3 are not adjacent to the high-frequency transformer 2, or a small number of large-sized discrete components 3 are adjacent to the high-frequency transformer 2.
[0032] Furthermore, the large-sized discrete components 3 are vertical components.
[0033] In this embodiment, the large-sized discrete components 3 are preferably vertical components because among daily electronic components, vertical components are usually large-sized components (such as large capacitors above 1000 μF, large resistors above 1 MΩ) or functional devices with relatively large volumes (such as terminal blocks). These components usually have relatively large volumes and are arranged vertically, and only the top surface of the circuit board 1 has sufficient longitudinal space to accommodate them.
[0034] Furthermore, the small-sized discrete components 4 are horizontal components.
[0035] In this embodiment, in contrast to the above-mentioned large-sized discrete components 3, the small-sized discrete components 4 are usually horizontal components, such as chip capacitors, chip resistors, small resistors below 1000 μF, chips, etc. They have relatively small volumes and can be accommodated in the limited longitudinal space on the bottom surface of the circuit board 1 while maintaining the spacing between them.
[0036] Furthermore, the horizontal components include horizontal elements 41 and semiconductor chips 42; the semiconductor chips 42 are arranged in a staggered manner, and at least one side of the semiconductor chips 42 is arranged away from the horizontal elements 41.
[0037] In this embodiment, the horizontal components can be further divided into horizontal elements 41 and semiconductor chips 42. Among them, the horizontal elements 41 can be generally summarized as components such as chip resistors and capacitors with their own unique properties and functions, and the semiconductor chips 42 can be generally summarized as chips with integrated circuits; therefore, the semiconductor chips 42 are arranged in a staggered manner, and at least one side of the semiconductor chips 42 is arranged away from the horizontal elements 41 to facilitate heat dissipation of the semiconductor chips 42.
[0038] Furthermore, the pins of the semiconductor chips 42 are provided with heat dissipation structures 421.
[0039] In this embodiment, the integrated circuits of the semiconductor chips 42 are quickly cooled by providing heat dissipation structures 421 on the pins of the semiconductor chips 42.
[0040] Further, the heat dissipation structure 421 spreads from the pins of the semiconductor chip 42 to the blank area on the bottom surface of the circuit board 1.
[0041] In this embodiment, since there is a relatively large amount of space around the semiconductor chip 42, the heat dissipation structure 421 spreads from the pins of the semiconductor chip 42 to the blank area on the bottom surface of the circuit board 1, expanding the contact area between the heat dissipation structure 421 and the air and improving the heat dissipation efficiency.
[0042] Further, the heat dissipation structure 421 is a copper foil.
[0043] In this embodiment, the heat dissipation structure 421 is a copper foil, and tin can be attached to the copper foil starting from the pins of the semiconductor chip 42 for heat conduction.
[0044] Further, the horizontal component 41 is a chip integrated with multiple components.
[0045] In this embodiment, in addition to being a surface-mount component, the horizontal component 41 can also be an integrated component, that is, a chip integrated with multiple components, such as a transistor array chip, which internally integrates multiple transistors, and one or more of the transistors can be selected according to the need by electrically connecting the corresponding pins; the occupied area on the bottom surface of the circuit board 1 can be greatly reduced, and the interval between the small-size discrete components 4 is larger.
[0046] Other configurations and operations of an application circuit board of a high-frequency transformer according to an embodiment of the present invention are known to those of ordinary skill in the art and will not be described in detail here.
[0047] In the description of this specification, the descriptions referring to the terms "embodiment", "example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.
[0048] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the claims and their equivalents.
Claims
1. A circuit board for high-frequency transformer, characterized in that: Including a circuit board, a high-frequency transformer, a plurality of large-volume discrete components and a plurality of small-volume discrete components; The high-frequency transformer and the large-volume discrete components are arranged on the top surface of the circuit board, and the small-volume discrete components are arranged on the bottom surface of the circuit board; The high-frequency transformer and the plurality of large-volume discrete components are arranged with intervals in the vertical and horizontal directions, and the plurality of small-volume discrete components are arranged with intervals in the vertical and horizontal directions.
2. The application circuit board of a high-frequency transformer according to claim 1, characterized in that: The high-frequency transformer is a high-frequency transformer that integrates a resonant inductor and a transformer.
3. The application circuit board of a high-frequency transformer according to claim 1, characterized in that: The plurality of large-volume discrete components are arranged away from the high-frequency transformer, and at least one-third of the circumference of the high-frequency transformer is not adjacent to the large-volume discrete components.
4. The application circuit board of a high-frequency transformer according to claim 1, characterized in that: The large-volume discrete components are vertical components.
5. The application circuit board of a high-frequency transformer according to claim 1, characterized in that: The small-volume discrete components are horizontal components.
6. The application circuit board of a high-frequency transformer according to claim 5, characterized in that: The horizontal components include horizontal elements and semiconductor chips; the semiconductor chips are arranged in a staggered manner, and at least one side of the semiconductor chip is arranged away from the horizontal element.
7. The application circuit board of a high-frequency transformer according to claim 6, characterized in that: The pins of the semiconductor chip are provided with a heat dissipation structure.
8. The application circuit board of a high-frequency transformer according to claim 7, characterized in that: The heat dissipation structure spreads from the pins of the semiconductor chip to the blank area on the bottom surface of the circuit board.
9. The application circuit board of a high-frequency transformer according to claim 7, characterized in that: The heat dissipation structure is copper foil.
10. The application circuit board of a high-frequency transformer according to claim 6, characterized in that: The horizontal component is a chip integrating multiple components.