Soldering-free SMD (Surface Mount Device) diode

Abstract

The utility model discloses a soldering-free surface-mounted diode, which relates to the field of diodes and comprises a diode main body arranged on the inner side of a connecting frame plate and two groups of connecting pins, a circuit board is arranged below the connecting frame plate, and two groups of connecting sleeve shells are fixedly connected to the upper surface of the circuit board. Moving plates are fixedly connected to the middle positions of the upper surfaces of the two sets of connecting pins, side sliding plates are fixedly connected to the positions, close to the two ends, of the upper surfaces of the two sets of connecting pins, the sections of the two sets of connecting pins are in an L shape, and the two sets of connecting pins are connected with the two sets of connecting sleeve shells correspondingly; the opposite sides of the two moving plates are fixedly connected with reset springs, and an inserting sliding rod is arranged at the bottom of one side of the connecting frame plate in a penetrating mode. The SMD diode has the advantages that soldering tin connection is not needed, the connection rate of the SMD diode and the circuit board is increased, the installation efficiency is high, the SMD diode has a convenient assembly function, and the SMD diode is convenient to disassemble and overhaul.

Description

Technical Field

[0001] The utility model relates to the field of diodes, in particular to a surface-mounted diode that does not require soldering. Background Art

[0002] A diode is a semiconductor device with two electrodes. It allows current to flow in one direction while blocking current flow in the other direction. A surface-mounted diode is an electronic component and a type of packaging form of a diode. It is a commonly used surface-mounted diode, also known as an SMD diode. They are directly mounted on the surface of a printed circuit board through surface mount technology without the need to pass through holes.

[0003] After retrieval, the patent number is CN219246686U, which discloses a surface-mounted diode. By soldering the internal connecting pins and the external connecting pins with solder paste to form the first pin, the stress generated during the lead cutting process of the first pin can be absorbed by the solder paste, thereby avoiding damage to the chip due to stress. However, when the existing surface-mounted diodes are in use, it is usually necessary to solder the pins of the surface-mounted diodes to the circuit board one by one using soldering, and the operation process is long and complex, and the installation efficiency is relatively low. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is to provide a surface-mounted diode that does not require soldering. When the existing surface-mounted diodes are in use, it is usually necessary to solder the pins of the surface-mounted diodes to the circuit board one by one using soldering, and the operation process is long and complex, and the installation efficiency is relatively low.

[0005] To solve the above technical problem, the technical solution of the utility model is that a surface-mounted diode that does not require soldering includes a diode body arranged inside a connection frame plate, and also includes two groups of connection pins. A circuit board is arranged below the connection frame plate. Two groups of connection sleeves are fixedly connected to the upper surface of the circuit board. Moving plates are fixedly connected to the middle positions of the upper surfaces of the two groups of connection pins, and side sliding plates are fixedly connected to the positions near both ends of the upper surfaces of the two groups of connection pins.

[0006] As a further solution of the utility model: The cross-sectional shapes of the two groups of connection pins are both L-shaped, and the two groups of connection pins are respectively connected to the two groups of connection sleeves.

[0007] As a further solution of the utility model: Reset springs are fixedly connected to the opposite sides of the two groups of moving plates. A plugging sliding rod penetrates through the bottom of one side of the connection frame plate. The two groups of reset springs are both sleeved on the outer side of the plugging sliding rod. Slide holes are respectively formed through one side of the two groups of moving plates, and the two groups of moving plates are respectively slidably connected to the plugging sliding rod through the slide holes.

[0008] As a further solution of the utility model: middle sliding openings are respectively formed through the lower surface of the connecting frame plate near the middle positions on both sides, and the two moving plates are respectively located inside the two middle sliding openings.

[0009] As a further solution of the utility model: side sliding openings are respectively formed through the lower surface of the connecting frame plate near the edge positions on both sides, the four side sliding plates are respectively located inside the two side sliding openings, and the two side sliding openings are symmetrically arranged with respect to the middle sliding opening.

[0010] As a further solution of the utility model: inserting guide rods are fixedly connected to the lower surface of the diode body near the edge positions, through holes are respectively formed through the inner bottom surface of the connecting frame plate near the corner positions, threaded rods are fixedly connected to the two side surfaces of the diode body near the edge positions on both sides, sliders are fixedly connected to the outer sides of the four threaded rods, and notch openings are respectively formed through the two side surfaces of the connecting frame plate near the top edge positions.

[0011] As a further solution of the utility model: the four inserting guide rods are respectively located inside the four through holes, connecting screw sleeves are arranged inside the four notch openings, the four connecting screw sleeves are respectively in threaded connection with the four threaded rods, and the four sliders are respectively located inside the four notch openings.

[0012] As a further solution of the utility model: a connecting nut is arranged at the bottom of one side of the connecting frame plate, and the inserting slide rod passes through the connecting frame plate and is in threaded connection with the connecting nut.

[0013] The utility model adopts the above technical solutions, compared with the prior art, has the following advantages: through the cooperation of the two side sliding plates and the two side sliding openings, the two connecting pins move relatively closer to each other on the lower side of the connecting frame plate, and then through the return spring in the middle sliding opening, the moving plate and the inserting slide rod, the two connecting pins return to the original position. At this time, the two connecting pins are respectively inserted into the two connecting socket shells, so that the diode body is electrically connected to the circuit board, without soldering connection, which speeds up the connection rate between the surface-mounted diode and the circuit board, and the installation efficiency is relatively high.

[0014] The diode body is placed inside the connecting frame plate through the cooperation of the four inserting guide rods and the four through holes. At this time, the four threaded rods and the four sliders are respectively located inside the four notch openings. Then, through the cooperation of the threaded rod and the connecting screw sleeve, the diode body is clamped with the connecting frame plate. Then, the inserting slide rod passes through the connecting frame plate and the two moving plates and is in threaded connection with the connecting nut, so that the two connecting pins are connected to the lower side of the connecting frame plate, which has a convenient assembling function and is also convenient for disassembling and overhauling the surface-mounted diode. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic structural diagram of a surface-mounted diode without soldering in an embodiment of the utility model;

[0016] Figure 2 This is a schematic diagram of the connection structure between the connecting frame plate and the circuit board in the embodiment of the present utility model;

[0017] Figure 3 This is a schematic diagram of the connection structure between the connecting frame plate and the diode body in the embodiment of the present utility model;

[0018] Figure 4 This is a front view of a solderless surface mount diode in the embodiment of the present utility model.

[0019] In the figure: 1. Diode body; 2. Connecting frame plate; 3. Connecting pin; 4. Circuit board; 5. Connecting sleeve; 6. Moving plate; 7. Intermediate sliding opening; 8. Insertion sliding rod; 9. Return spring; 10. Side sliding plate; 11. Side sliding opening; 12. Insertion guide rod; 13. Through hole; 14. Threaded rod; 15. Slide block; 16. Notch; 17. Connecting screw sleeve; 18. Connecting nut. Specific embodiments

[0020] The following further describes the specific embodiments of the present utility model with reference to the accompanying drawings. It should be noted here that the description of these embodiments is used to help understand the present utility model, but does not constitute a limitation to the present utility model. In addition, the technical features involved in the following various embodiments of the present utility model can be combined with each other as long as they do not conflict with each other.

[0021] Embodiment 1, please refer to Figures 1 - 4 , A solderless surface mount diode, including a diode body 1 arranged inside a connecting frame plate 2, and further including two groups of connecting pins 3. A circuit board 4 is arranged below the connecting frame plate 2. Two groups of connecting sleeves 5 are fixedly connected to the upper surface of the circuit board 4. The middle positions of the upper surfaces of the two groups of connecting pins 3 are fixedly connected with moving plates 6, and the side sliding plates 10 are fixedly connected to the upper surfaces of the two groups of connecting pins 3 near both ends.

[0022] The cross-sectional shapes of the two groups of connecting pins 3 are both L-shaped, and the two groups of connecting pins 3 are respectively connected to the two groups of connecting sleeves 5.

[0023] In this embodiment, the surface mount diode is connected to the circuit board 4 through the cooperation of the connecting pin 3 and the connecting sleeve 5.

[0024] On the opposite sides of the two groups of moving plates 6, return springs 9 are fixedly connected. A plugging slide rod 8 is disposed through the bottom of one side of the connecting frame plate 2. The two groups of return springs 9 are sleeved on the outer side of the plugging slide rod 8. Slide holes are respectively formed through one side of the two groups of moving plates 6, and the two groups of moving plates 6 are respectively slidably connected to the plugging slide rod 8 through the slide holes. Intermediate slide openings 7 are respectively formed through the lower surface of the connecting frame plate 2 near the middle positions on both sides, and the two groups of moving plates 6 are respectively located inside the two groups of intermediate slide openings 7.

[0025] In this embodiment, the two groups of connecting pins 3 are moved by the cooperation of the moving plate 6, the plugging slide rod 8 and the return spring 9.

[0026] Side slide openings 11 are respectively formed through the lower surface of the connecting frame plate 2 near the edge positions on both sides. The four groups of side slide plates 10 are respectively located inside the two groups of side slide openings 11, and the two groups of side slide openings 11 are symmetrically arranged with respect to the intermediate slide opening 7.

[0027] In this embodiment, the two groups of connecting pins 3 are stably moved by the cooperation of the two groups of side slide plates 10 and the two groups of side slide openings 11.

[0028] Specifically, the two groups of connecting pins 3 are relatively moved closer to each other on the lower side of the connecting frame plate 2 by the cooperation of the two groups of side slide plates 10 and the two groups of side slide openings 11. Then, the two groups of connecting pins 3 return to their original positions by the cooperation of the return spring 9 in the intermediate slide opening 7, the moving plate 6 and the plugging slide rod 8. At this time, the two groups of connecting pins 3 are respectively inserted into the two groups of connecting socket shells 5, so that the diode body 1 is electrically connected to the circuit board 4. There is no need for soldering connection, which speeds up the connection rate between the surface mount diode and the circuit board 4, and the installation efficiency is relatively high.

[0029] Embodiment 2, please refer to Figures 1 - 4 , a surface mount diode without soldering. Plugging guide rods 12 are fixedly connected to the lower surface of the diode body 1 near the edge positions. Through holes 13 are respectively formed through the inner bottom surface of the connecting frame plate 2 near the corner positions. Threaded rods 14 are fixedly connected to the two side surfaces of the diode body 1 near the edge positions on both sides. Sliding blocks 15 are fixedly connected to the outer sides of the four groups of threaded rods 14. Slot openings 16 are respectively formed through the two side surfaces of the connecting frame plate 2 near the top edge positions.

[0030] The four groups of plugging guide rods 12 are respectively located inside the four groups of through holes 13. Connecting screw sleeves 17 are arranged inside the four groups of slot openings 16, and the four groups of connecting screw sleeves 17 are respectively threadedly connected to the four groups of threaded rods 14. The four groups of sliding blocks 15 are respectively located inside the four groups of slot openings 16.

[0031] In this embodiment, the diode body 1 is clamped to the connecting frame plate 2 by the cooperation of the four groups of plugging guide rods 12, the four groups of through holes 13, the threaded rods 14 and the connecting screw sleeves 17.

[0032] A connecting nut 18 is provided at the bottom of one side of the connecting frame plate 2, and the inserting slide rod 8 passes through the connecting frame plate 2 and is threadedly connected to the connecting nut 18.

[0033] In this embodiment, the inserting slide rod 8 and the moving plate 6 cooperate with the connecting nut 18 so that the connecting pin 3 is connected to the connecting frame plate 2.

[0034] Specifically, the diode body 1 is arranged inside the connecting frame plate 2 through the cooperation of four groups of inserting guide rods 12 and four groups of through holes 13. At this time, the four groups of threaded rods 14 and the four groups of sliders 15 are respectively located inside the four groups of notches 16. Then, through the cooperation of the threaded rod 14 and the connecting sleeve 17, the diode body 1 is clamped with the connecting frame plate 2. Then, the inserting slide rod 8 passes through the connecting frame plate 2 and the two moving plates 6 and is threadedly connected to the connecting nut 18, so that the two connecting pins 3 are connected to the lower side of the connecting frame plate 2, which has a convenient assembling function and is also convenient for disassembling and overhauling the surface-mounted diode.

[0035] The above describes the embodiments of the present invention in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, without departing from the principle and spirit of the present invention, various changes, modifications, substitutions, and variations to these embodiments still fall within the protection scope of the present invention.

Claims

1. A solder-free chip diode, comprising a diode body (1) arranged inside a connecting frame plate (2), characterized in that: It also comprises two groups of connecting pins (3), a circuit board (4) is arranged below the connecting frame plate (2), two groups of connecting housings (5) are fixedly connected to the upper surface of the circuit board (4), a movable plate (6) is fixedly connected at the middle position of the upper surface of the two groups of connecting pins (3), and side sliding plates (10) are fixedly connected to the upper surfaces of the two groups of connecting pins (3) near both ends.

2. The solder-free chip diode according to claim 1, characterized in that: The cross-sectional shapes of the two groups of connecting pins (3) are both L-shaped, and the two groups of connecting pins (3) are respectively connected to the two groups of connecting casings (5).

3. The solder-free chip diode according to claim 1, characterized in that: The opposite sides of the two groups of movable plates (6) are fixedly connected with reset springs (9), the bottom of one side of the connecting frame plate (2) is penetrated with a plug-in slide rod (8), the two groups of reset springs (9) are sleeved on the outside of the plug-in slide rod (8), one side of the two groups of movable plates (6) is penetrated with a slide hole, and the two groups of movable plates (6) are respectively slidably connected with the plug-in slide rod (8) through the slide hole.

4. The solder-free chip diode according to claim 3, characterized in that: The lower surface of the connecting frame plate (2) is provided with middle sliding openings (7) near the middle positions of both sides, and the two groups of movable plates (6) are respectively located inside the two groups of middle sliding openings (7).

5. The solder-free chip diode according to claim 4, characterized in that: The lower surface of the connecting frame plate (2) is provided with side sliding openings (11) near the edges on both sides, and the four groups of side sliding plates (10) are respectively located inside the two groups of side sliding openings (11), and the two groups of side sliding openings (11) are symmetrically arranged with respect to the middle sliding opening (7).

6. The solder-free chip diode according to claim 1, characterized in that: The lower surface of the diode body (1) is fixedly connected to a plug-in guide rod (12) near the edge position, the inner bottom surface of the connecting frame plate (2) is penetrated by a through hole (13) near the corner position, the two side surfaces of the diode body (1) are fixedly connected to the edge positions on both sides, the outer sides of the four groups of threaded rods (14) are fixedly connected to sliders (15), and the two side surfaces of the connecting frame plate (2) are penetrated by a notch (16) near the top edge position.

7. The solder-free chip diode according to claim 6, characterized in that: The four groups of plug-in guide rods (12) are respectively located on the inner sides of the four groups of through holes (13); the inner sides of the four groups of notches (16) are all provided with connecting screw sleeves (17); the four groups of connecting screw sleeves (17) are respectively threadedly connected to the four groups of threaded rods (14); and the four groups of sliding blocks (15) are respectively located on the inner sides of the four groups of notches (16).

8. The solder-free chip diode according to claim 3, characterized in that: A connecting nut (18) is provided at the bottom of one side of the connecting frame plate (2), and the plug-in sliding rod (8) passes through the connecting frame plate (2) and is threadedly connected to the connecting nut (18).

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