Laminating device of multi-layer printed circuit board

Abstract

The utility model discloses a laminating device for a multilayer printed circuit board, which belongs to the technical field of circuit board laminating, and comprises a workbench, a through positioning groove is arranged on the surface of the workbench, a jacking assembly is arranged below the surface of the workbench, and the output end of the jacking assembly is connected with a jacking plate corresponding to the positioning groove. A lower pressing head corresponding to the positioning groove is arranged above the workbench and installed at the output end of the pressing machine. The positioning groove is formed in the workbench, the jacking plate is arranged in the positioning groove, a circuit board to be pressed is placed in the positioning groove to be positioned, it is guaranteed that multiple layers of circuit boards are aligned, then the jacking assembly drives the jacking plate to ascend, the positioned multiple layers of circuit boards are jacked to the position above the workbench top, and then the circuit boards are pressed to be pressed. And the pressing machine drives the lower pressing head to carry out pressing, so that rapid positioning of the multilayer circuit board is realized.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit board pressing, and particularly relates to a pressing device for multi-layer printed circuit boards. Background Technique

[0002] A printed circuit board is a provider of electrical connections for electronic components; its design is mainly layout design; the main advantages of using a circuit board are to greatly reduce wiring and assembly errors, and improve the automation level and production labor rate; according to the number of layers of the circuit board, it can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards. For the production of multi-layer circuit boards, a pressing device is required.

[0003] During pressing, it is necessary to ensure that multiple circuit boards to be pressed are neatly stacked. If the circuit boards are pressed without being aligned, the circuit boards will be scrapped. Most of the existing pressing devices for multi-layer printed circuit boards achieve the alignment of the circuit boards by the fitting contact between the push plate and the two side surfaces of the circuit board, which has the problems of complex structure and complex alignment process. Content of the Utility Model

[0004] To solve the problems raised in the above background technique. The utility model provides a pressing device for multi-layer printed circuit boards, which has the characteristics of being able to quickly align and position multiple circuit boards to be fitted.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A pressing device for multi-layer printed circuit boards, including a workbench, a through positioning groove is provided on the tabletop of the workbench, a jacking component is provided below the tabletop of the workbench, a jacking plate corresponding to the positioning groove is connected to the output end of the jacking component, and a pressing head corresponding to the positioning groove is provided above the workbench, and the pressing head is installed on the output end of the press.

[0006] In order to be connected to the output end of the press, further, the pressing head includes a pressing block, and a connecting head is connected above the pressing block.

[0007] In order to guide the circuit board and facilitate the quick placement of the circuit board into the positioning groove, further, a guiding inclined surface is provided at the upper end of the positioning groove.

[0008] In order to facilitate the placement of the circuit board and at the same time be used to quickly discharge the air between two circuit boards, further, symmetric notch grooves are provided on both sides of the positioning groove.

[0009] In order to drive the lifting of the jacking plate, further, the jacking component includes a cushion block, a hydraulic cylinder is installed above the cushion block, and the output end of the hydraulic cylinder is connected to the jacking plate.

[0010] In order to act above the circuit board when the jacking plate drives the circuit board to be pressed to rise and avoid the situation of position deviation of the circuit board. Further, a positioning press block is provided below the pressing block, and guide rods are respectively connected to the four corners of the positioning press block, and the guide rods are connected to the positioning press block through linear bearings.

[0011] In order to limit the positioning press block and prevent it from slipping off. Further, a limit block is connected to the upper end of the guide rod.

[0012] In order to store the positioning press block and make the positioning press block and the pressing block act on the circuit board together for pressing during the pressing operation. Further, a storage groove corresponding to the positioning press block is provided on the bottom surface of the pressing block, and the depth of the storage groove is equal to the thickness of the positioning press block.

[0013] In order to quickly discharge air when the positioning press block fits with the circuit board and avoid the circuit board from shifting under the action of air flow. Further, dense through holes are provided on the positioning press block.

[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0015] 1. A positioning groove is provided on the workbench of the present utility model, and a jacking plate is provided inside the positioning groove. The circuit board to be pressed is placed in the positioning groove for positioning, ensuring the alignment between multiple layers of circuit boards. Then, the jacking assembly drives the jacking plate to rise to lift the positioned multiple layers of circuit boards above the workbench surface, and the pressing machine drives the pressing head to perform pressing, realizing the rapid positioning of multiple layers of circuit boards.

[0016] 2. A guiding inclined surface is provided at the upper end of the positioning groove of the present utility model to guide the circuit board, facilitating the rapid placement of the circuit board into the positioning groove.

[0017] 3. Symmetric notch grooves are provided on both sides of the positioning groove of the present utility model, facilitating the placement of the circuit board and also being used for quickly discharging the air between two circuit boards.

[0018] 4. A positioning press block is provided below the pressing block of the present utility model, and guide rods are respectively connected to the four corners of the positioning press block. When the jacking plate drives the circuit board to be pressed to rise, the positioning press block acts above the circuit board to avoid the situation of position deviation of the circuit board.

[0019] 5. Dense through holes are provided on the positioning press block of the present utility model, enabling the rapid discharge of air when the positioning press block fits with the circuit board and avoiding the circuit board from shifting under the action of air flow. Description of the Drawings

[0020] The accompanying drawings are used to provide a further understanding of the present utility model and form a part of the specification. Together with the embodiments of the present utility model, they are used to explain the present utility model and do not constitute a limitation to the present utility model. In the drawings:

[0021] Figure 1 is a schematic structural diagram of the present utility model;

[0022] Figure 2 is a schematic structural diagram of the workbench of the present utility model;

[0023] Figure 3 is a schematic structural diagram of the lower pressing head of the present utility model;

[0024] Figure 4 is a schematic structural diagram of the connection between the lifting assembly and the lifting plate of the present utility model;

[0025] In the figure: 1, workbench; 2, positioning groove; 21, notch groove; 22, guiding inclined surface; 3, lower pressing head; 31, lower pressing block; 32, connecting head; 33, limiting block; 34, guide rod; 35, positioning pressing block; 36, through hole; 4, lifting plate; 5, cushion block; 6, hydraulic cylinder. Specific embodiments

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0027] Embodiment 1

[0028] Please refer to Figures 1-4 , the present utility model provides the following technical solutions: A lamination device for multi-layer printed circuit boards, including a workbench 1, a through positioning groove 2 is provided on the tabletop of the workbench 1, the inner dimensions of the positioning groove 2 are the same as the outer dimensions of the circuit board to be laminated, a lifting assembly is provided below the tabletop of the workbench 1, a lifting plate 4 corresponding to the positioning groove 2 is connected to the output end of the lifting assembly, and a lower pressing head 3 corresponding to the positioning groove 2 is provided above the workbench 1, and the lower pressing head 3 is installed on the output end of the press.

[0029] By adopting the above technical solution, a positioning groove 2 is provided on the workbench 1, and a jacking plate 4 is arranged inside the positioning groove 2. The circuit board to be pressed is placed in the positioning groove 2 for positioning, ensuring the alignment between the multi-layer circuit boards. Then, the jacking assembly drives the jacking plate 4 to rise, jacking the positioned multi-layer circuit boards above the surface of the workbench 1, and the press drives the downward pressure head 3 to perform pressing, realizing the rapid positioning of the multi-layer circuit boards.

[0030] Specifically, the downward pressure head 3 includes a downward pressure block 31, and a connecting head 32 is connected above the downward pressure block 31.

[0031] By adopting the above technical solution, the connecting head 32 is used to connect with the output end of the press.

[0032] Specifically, a guiding inclined surface 22 is provided at the upper end of the positioning groove 2.

[0033] By adopting the above technical solution, it guides the circuit board, facilitating the rapid placement of the circuit board into the positioning groove 2.

[0034] Specifically, symmetric notch grooves 21 are provided on both sides of the positioning groove 2.

[0035] By adopting the above technical solution, it is convenient to place the circuit board, and at the same time, it can also be used to quickly discharge the air between two circuit boards.

[0036] Specifically, the jacking assembly includes a cushion block 5, a hydraulic cylinder 6 is installed above the cushion block 5, and the output end of the hydraulic cylinder 6 is connected to the jacking plate 4.

[0037] By adopting the above technical solution, the hydraulic cylinder 6 drives the jacking plate 4 to lift and lower.

[0038] Embodiment 2

[0039] The difference between this embodiment and Embodiment 1 is that: Specifically, a positioning pressure block 35 is provided below the downward pressure block 31. Guide rods 34 are respectively connected to the four corners of the positioning pressure block 35. The guide rods 34 are connected to the positioning pressure block 35 through linear bearings. When the jacking assembly jacks up, the press first drives the downward pressure block 31 to descend to a set position. At this time, the positioning pressure block 35 presses on the upper part of the circuit board to be pressed under the action of gravity. Then, the jacking assembly drives the jacking plate 4 to rise to the set position, and then the press continues to drive the downward pressure block 31 to descend for the pressing action.

[0040] By adopting the above technical solution, when the jacking plate 4 drives the circuit board to be pressed to rise, the positioning pressure block 35 acts on the upper part of the circuit board, avoiding the situation of the circuit board shifting in position.

[0041] Specifically, a limit block 33 is connected to the upper end of the guide rod 34.

[0042] By adopting the above technical solution, the positioning pressing block 35 is limited to prevent the positioning pressing block 35 from slipping.

[0043] Specifically, a receiving groove corresponding to the positioning pressing block 35 is provided on the bottom surface of the lower pressing block 31 , and the depth of the receiving groove is equal to the thickness of the positioning pressing block 35 .

[0044] By adopting the above technical solution, the positioning pressing block 35 is accommodated, and during the pressing action, the positioning pressing block 35 and the lower pressing block 31 act together on the circuit board for pressing.

[0045] Example 3

[0046] The present embodiment is different from the first embodiment in that: specifically, the positioning pressing block 35 is provided with dense through holes 36 .

[0047] By adopting the above technical solution, the air can be quickly evacuated when the positioning pressing block 35 is attached to the circuit board, thereby preventing the circuit board from shifting due to the action of the airflow.

[0048] In summary, the present invention provides a positioning groove 2 on the workbench 1, and a lifting plate 4 is provided inside the positioning groove 2. The circuit board to be pressed is placed in the positioning groove 2 for positioning, ensuring the alignment between the multi-layer circuit boards. Then, the lifting plate 4 is driven to rise by the lifting assembly to lift the multi-layer circuit board that has been positioned to the top of the workbench 1, and the pressing head 3 is driven by the press to press, thereby realizing the rapid positioning of the multi-layer circuit board. The upper end of the positioning groove 2 of the present invention is provided with a guiding inclined surface 22 to guide the circuit board, so as to facilitate the rapid placement of the circuit board into the positioning groove 2. The two side edges of the positioning groove 2 of the present invention A symmetrical notch groove 21 is provided on the top, which is convenient for placing the circuit board and can also be used to quickly exhaust the air between the two circuit boards; a positioning block 35 is provided below the lower pressing block 31 of the utility model, and the four corners of the positioning block 35 are respectively connected to guide rods 34. When the lifting plate 4 drives the circuit board to be pressed to rise, the positioning block 35 acts on the top of the circuit board to avoid the circuit board from being shifted; the positioning block 35 of the utility model is provided with dense through holes 36, so that the air can be quickly exhausted when the positioning block 35 is fitted with the circuit board to avoid the displacement of the circuit board under the action of airflow.

[0049] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A lamination device for a multi-layer printed circuit board, characterized in that: It includes a workbench, a positioning groove is provided on the workbench surface, a jacking assembly is provided below the workbench surface, a jacking plate corresponding to the positioning groove is connected to the output end of the jacking assembly, a lower pressure head corresponding to the positioning groove is provided above the workbench, and the lower pressure head is installed on the output end of the press.

2. A lamination device for a multi-layer printed circuit board according to claim 1, characterized in that: The pressing head comprises a pressing block, and a connecting head is connected above the pressing block.

3. The lamination device for a multi-layer printed circuit board according to claim 1, characterized in that: The upper end of the positioning groove is provided with a guiding inclined surface.

4. The lamination device for a multi-layer printed circuit board according to claim 1, characterized in that: Symmetrical notch grooves are arranged on both sides of the positioning groove.

5. The lamination device for a multi-layer printed circuit board according to claim 1, characterized in that: The jacking assembly comprises a cushion block, a hydraulic cylinder is installed above the cushion block, and an output end of the hydraulic cylinder is connected to the jacking plate.

6. A lamination device for a multi-layer printed circuit board according to claim 2, characterized in that: A positioning pressing block is provided below the lower pressing block, and guide rods are respectively connected to the four corners of the positioning pressing block, and the guide rods and the positioning pressing block are connected through linear bearings.

7. A lamination device for a multi-layer printed circuit board according to claim 6, characterized in that: The upper end of the guide rod is connected with a limiting block.

8. The lamination device for a multi-layer printed circuit board according to claim 6, characterized in that: A receiving groove corresponding to the positioning pressing block is provided on the bottom surface of the lower pressing block, and the depth of the receiving groove is equal to the thickness of the positioning pressing block.

9. The lamination device for a multi-layer printed circuit board according to claim 6, characterized in that: The positioning pressing block is provided with dense through holes.

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