Liquid cooling cabinet and data center liquid cooling system
By adopting layered boards and diversion tubes in the data center liquid cooling cabinet, the uneven temperature distribution and deviation of heat dissipation effect caused by low cooling liquid density are solved, and a more uniform coolant distribution and more efficient server heat dissipation effect are achieved.
Patent Information
- Application Number
- CN202421577800.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-04
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-07-04
AI Technical Summary
In existing data center liquid-cooling cabinets, due to the low cooling density and floating characteristics, the temperature distribution of the coolant in the cabinet is uneven, especially for the heat dissipation effect of the main heating components of the server (such as processors, graphics cards, etc.), and the uneven distribution of the coolant leads to local overheating problems.
A liquid cooling cabinet is designed, using a layered plate to divide the housing cavity into a liquid separation cavity and a placement cavity, and the liquid separation cavity and the placement cavity are connected through several through holes. The coolant first diffuses in the liquid separation cavity and then enters the placement cavity through the through hole. At the same time, the flow guides the coolant to the main heating components to improve the heat dissipation effect.
Through this design, the pre-diffusion of the coolant in the liquid separation chamber ensures its uniform distribution at the bottom of the placement chamber, avoids the problem of reducing heat dissipation effect caused by the increase in the coolant temperature, significantly improves the heat dissipation effect of the server, and avoids local overheating.
Smart Images
Figure CN222996903U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of data centers, and particularly to a liquid-cooled cabinet and a data center liquid-cooling system. Background Art
[0002] In the existing data center liquid-cooling method, servers are usually immersed in a coolant, and the heat on the servers is taken away by the circulating coolant to achieve a cooling effect.
[0003] However, due to the characteristic that the density of the coolant after heat exchange is low and it floats upward, the coolant at the lower part of the liquid-cooled cabinet is colder than the coolant near the upper part. And the main heat-generating components of the server (such as processors, graphics cards, etc.) are usually near the upper-middle part of the server, which leads to a poor heat dissipation effect on the main heat-generating components of the server. Summary of the Invention
[0004] The purpose of this application is to provide a liquid-cooled cabinet and a data center liquid-cooling system, which can improve the heat dissipation effect on the server.
[0005] To achieve the above purpose, on the one hand, this application provides a liquid-cooled cabinet, which at least includes a cabinet body, a layered plate and at least one diversion pipe. Among them, the cabinet body is provided with a containing cavity; the layered plate is connected to the cabinet body, and the layered plate divides the containing cavity into a liquid separation cavity and a placement cavity. A number of through holes for communicating the liquid separation cavity and the placement cavity are opened on the layered plate; the diversion pipe is located in the placement cavity, one end of the diversion pipe is communicated with one of the through holes, the other end of the diversion pipe is higher than the layered plate, and the other end of the diversion pipe is used for opening towards the main heat-generating component, so that the coolant flowing out of one of the through holes is guided by the diversion pipe to flow to the periphery of the main heat-generating component.
[0006] To achieve the above purpose, on the other hand, this application also provides a data center liquid-cooling system, which at least includes a server and the above-mentioned liquid-cooled cabinet; the server is installed in the placement cavity, and the other end of the diversion pipe is opened towards the CPU or graphics card of the server.
[0007] It can be seen that in the technical solution provided by the present application, the liquid-cooled cabinet further includes at least one diversion pipe located in the placement cavity. One end of the diversion pipe is communicated with one of the through holes, and the other end of the diversion pipe is higher than the layered plate and is used for opening towards the main heat-generating component, so that the coolant flowing out from one of the through holes 2 is guided by the diversion pipe to flow to the periphery of the main heat-generating component. That is to say, in the present application, part of the coolant is directly guided to the main heat-generating component of the device to be cooled through the diversion pipe, thereby avoiding the problem that the heat dissipation effect of the main heat-dissipating component is reduced due to the gradual increase in temperature during the upward diffusion of the coolant, and improving the heat dissipation effect.
[0008] At the same time, the layered plate is connected to the cabinet body. The layered plate divides the accommodation cavity into a liquid separation cavity and a placement cavity, and a plurality of through holes for communicating the liquid separation cavity and the placement cavity are opened on the layered plate. When the coolant enters the cabinet body from the outside, the coolant first enters the liquid separation cavity and then enters the placement cavity through a plurality of through holes. In this way, compared with the way that the coolant directly enters the placement cavity, the coolant can be pre-diffused around in the liquid separation cavity, so as to be distributed as evenly as possible at the bottom of the placement cavity, and then flow into the placement cavity through a plurality of through holes, thereby ensuring that the coolant for cooling the device to be cooled in the cooling cabinet is more evenly distributed, avoiding the problem of local overheating, and improving the heat dissipation effect of the server. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0010] Figure 1 is a top view schematic diagram of a liquid-cooled cabinet in an embodiment provided by the present application;
[0011] Figure 2 is a half-sectional schematic diagram of a liquid-cooled cabinet in an embodiment provided by the present application;
[0012] Figure 3 is a structural schematic diagram of a diversion pipe in an embodiment provided by the present application;
[0013] Figure 4 is a structural schematic diagram of a liquid-cooled system for a data center in an embodiment provided by the present application;
[0014] Description of the reference numerals:
[0015] 100, cabinet; 110, accommodation cavity; 111, liquid separation cavity; 112, placement cavity; 1121, first storage cavity; 1122, liquid return cavity; 1123, second storage cavity; 120, liquid inlet; 121, first inlet; 122, second inlet; 130, liquid return port; 131, first return port; 132, second return port; 200, layered plate; 210, through hole; 300, diversion pipe; 310, connection seat; 320, flexible hose; 400, partition plate; 500, first liquid-liquid heat exchanger; 600, second liquid-liquid heat exchanger. Detailed implementation mode
[0016] To make the purpose, technical solution and advantages of the present application clearer, the following will further describe the embodiments of the present application in detail with reference to the accompanying drawings. Spatially relative terms used in the present application, such as "upper", "above", "lower", "below", "first end", "second end", "one end", "the other end", etc., are for the purpose of facilitating description to describe the relationship of one unit or feature relative to another unit or feature as shown in the accompanying drawings. Spatially relative terms may be intended to include different orientations of the device in use or operation other than the orientation shown in the figures. For example, if the device in the figure is flipped, the unit described as being "below" or "beneath" another unit or feature will be "above" another unit or feature. Therefore, the exemplary term "below" can encompass both the upper and lower orientations. The device can be oriented in other ways (rotated 90 degrees or other orientations), and the spatially related descriptive terms used herein can be interpreted accordingly.
[0017] In addition, the terms "installed", "set", "provided with", "connected", "slidably connected", "fixed", "socketed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there is an internal connection between two devices, components or parts. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0018] The existing liquid cooling refrigeration method in data centers usually immerses servers in the coolant, and the heat on the servers is taken away by the circulating coolant to achieve the refrigeration effect.
[0019] However, due to the characteristic that the density of the coolant after heat exchange is low and it floats upward, the coolant in the lower part of the liquid cooling cabinet is colder than the coolant near the upper part, and the main heat-generating components of the server (such as processors, graphics cards, etc.) are usually near the upper middle part of the server, which results in a poor heat dissipation effect for the main heat-generating components of the server.
[0020] In addition, the circulating cold water entering the liquid-cooled cabinet from the water inlet all flows directly towards the water outlet of the liquid-cooled cabinet, which results in the inability of the circulating cold water to effectively spread within the liquid-cooled cabinet, thereby causing uneven cooling of the servers within the liquid-cooled cabinet and there being a problem of local overheating.
[0021] In addition, during the R & D process, the inventors found that when only one-way water inlet circulation is used to cool the liquid-cooled cabinet, when a failure occurs in this water circulation, only shutdown for maintenance can be carried out, seriously affecting the normal use of the servers.
[0022] Therefore, how to improve the structure of the liquid-cooled cabinet and the liquid cooling system of the data center, and thus improve the heat dissipation effect on the servers, has become an urgent problem to be solved in this field.
[0023] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments of the present application are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the scope of protection of the present application.
[0024] The present application provides a liquid-cooled cabinet, in which components to be heat-dissipated are installed. Coolant circulates into the liquid-cooled cabinet, contacts the components to be heat-dissipated, and the coolant takes away the heat on the components to be heat-dissipated, thereby achieving the heat dissipation effect.
[0025] Specifically, please refer to Figures 1 to 2 As shown, in a feasible embodiment, the liquid-cooled cabinet at least includes a cabinet body 100 and a layered plate 200. Among them, the cabinet body 100 serves as the basic carrier of the entire liquid-cooled cabinet. The cabinet body 100 is used to accommodate and support the layered plate 200, and the cabinet body 100 is provided with a receiving cavity 110. The layered plate 200 is connected to the cabinet body 100. The layered plate 200 divides the receiving cavity 110 into a liquid distribution cavity 111 and a placement cavity 112. A plurality of through holes 210 for communicating the liquid distribution cavity 111 and the placement cavity 112 are provided on the layered plate 200. When the coolant enters the cabinet body 100 from the outside, the coolant first enters the liquid distribution cavity 111, and then enters the placement cavity 112 through the plurality of through holes 210. In this way, compared with the way that the coolant directly enters the placement cavity, the coolant can be pre-diffused around in the liquid distribution cavity 111, so as to be as evenly distributed as possible at the bottom of the placement cavity 112, and then flow into the placement cavity 112 through the plurality of through holes 210, thereby ensuring that the coolant for cooling the components to be heat-dissipated in the cabinet body 100 is more evenly distributed, avoiding the problem of local overheating, and improving the heat dissipation effect of the servers.
[0026] Please refer to Figures 1 to 3As shown, in an implementable embodiment, the liquid-cooled cabinet further includes at least one diversion pipe 300. The diversion pipe 300 is located in the placement cavity 112. One end of the diversion pipe 300 is communicated with one of the through holes 210. The other end of the diversion pipe 300 is higher than the layered plate 200, and the other end of the diversion pipe 300 is used to face the main heat-generating component, so that the coolant flowing out from one of the through holes 210 is guided by the diversion pipe 300 to flow to the periphery of the main heat-generating component. That is to say, in this application, part of the coolant is directly guided to the main heat-generating component of the device to be cooled through the diversion pipe 300, thereby avoiding the problem that the heat dissipation effect of the main heat-dissipating component is reduced due to the gradual increase in temperature during the upward diffusion of the coolant.
[0027] It should be noted that the device to be cooled may refer to a server, a power supply, etc. Taking a server as an example, the main heat-generating components may be a processor, a graphics card, etc.
[0028] In this embodiment, the number of the diversion pipes 300 should correspond to the number of the devices to be cooled in the placement cavity 112. The number of the diversion pipes 300 may be the same as the number of the devices to be cooled in the placement cavity 112, or the number of the diversion pipes 300 may be an integer multiple of the number of the devices to be cooled in the placement cavity 112, so that each device to be cooled is correspondingly arranged with a plurality of diversion pipes 300.
[0029] For example, when there are two main heat-generating components in the device to be cooled, at this time, the number of the diversion pipes 300 corresponding to the device to be cooled can be selected as two, and the two diversion pipes 300 are respectively used to divert the coolant to the two main heat-generating components.
[0030] Regarding the specific structure of the diversion pipe 300, as Figure 3 shown, in an implementable embodiment, the diversion pipe 300 includes a connection seat 310 and a flexible hose 320. One end of the flexible hose 320 is communicated with one of the through holes 210 through the connection seat 310. The flexible hose 320 is used to adjust the orientation of the flexible hose 320 by bending, so that the other end of the flexible hose 320 faces the main heat-generating component.
[0031] In practical applications, the connection seat 310 should be made of a rigid material, while the flexible hose 320 is made of a flexible material. The connection between the connection seat 310 and one of the through holes 210 can be realized by means of plugging, or the connection between the connection seat 310 and one of the through holes 210 can also be realized by means of threaded connection. This application does not make specific limitations on this.
[0032] In this embodiment, as Figure 4As shown, the cabinet body 100 generally also has a liquid inlet 120 and a liquid return port 130. The liquid inlet 120 is communicated with the liquid distribution cavity 111, and the liquid return port 130 is communicated with the placement cavity 112. Thus, the cooling liquid enters the liquid distribution cavity 111 from the liquid inlet 120, and the heat-carrying cooling liquid after heat exchange in the placement cavity 112 flows out from the liquid return port 130.
[0033] Furthermore, two partition plates 400 are connected inside the cabinet body 100. The two partition plates 400 divide the placement cavity 112 into a first storage cavity 1121, a liquid return cavity 1122, and a second storage cavity 1123. The liquid return cavity 1122 is located between the first storage cavity 1121 and the second storage cavity 1123, and the liquid return port 130 is communicated with the liquid return cavity 1122. The tops of the two partition plates 400 are lower than the tops of the first storage cavity 1121 and the second storage cavity 1123. The through holes 210 are located at the bottoms of the first storage cavity 1121 and the second storage cavity 1123, and the diversion pipes 300 are located in the first storage cavity 1121 and / or the second storage cavity 1123. In this way, the cooling liquid in the liquid distribution cavity 111 first enters the first storage cavity 1121 and the second storage cavity 1123 through a plurality of through holes 210, and then the cooling liquid exchanges heat in the first storage cavity 1121 and the second storage cavity 1123. The heat-carrying cooling liquid after heat exchange floats and then overflows into the liquid return cavity 1122, and then flows out through the liquid return port 130.
[0034] It should be noted that this embodiment precisely utilizes the principle that the density of the cooling liquid is low and it floats after heat exchange in the first storage cavity 1121 and the second storage cavity 1123, so that the heat-carrying cooling liquid after heat exchange flows out from above, and the cooling liquid that has not participated in heat exchange remains at the bottom, thereby fully utilizing the refrigeration effect of the cooling liquid. At the same time, the liquid return cavity 1122 is located between the first storage cavity 1121 and the second storage cavity 1123, and the liquid return cavity 1122 can provide the liquid return function for both storage cavities at the same time. Compared with the method of setting a liquid return cavity for each storage cavity separately, the solution of this application can further reduce the volume of the liquid-cooled computer cabinet and reduce the floor area.
[0035] In practical applications, a plurality of through holes 210 located at the bottom of the first storage cavity 1121 are arranged in a plurality of column groups. The plurality of column groups are linearly arrayed along the length direction of the first storage cavity 1121, and each column group includes at least two through holes 210 linearly arrayed along the width direction of the first storage cavity 1121. The first storage cavity 1121 and the second storage cavity 1123 are symmetrically arranged with respect to the liquid return cavity 1122. The inner wall of the liquid return cavity 1122 is coated or pasted with a heat insulation layer.
[0036] Based on the same inventive concept, the present application also provides a data center liquid cooling system, which at least includes a server and the above-mentioned liquid-cooled computer cabinet. The server is installed in the placement cavity 112, and the other end of the diversion pipe 300 opens towards the CPU or the graphics card of the server.
[0037] In this embodiment, there are two liquid inlets 120, namely a first inlet 121 and a second inlet 122, which are located at both ends of the liquid cooling cabinet; there are two liquid return ports 130, namely a first return port 131 and a second return port 132, and the first return port 131 and the second return port are located at both ends of the liquid cooling cabinet. The refrigeration system further includes a first liquid-liquid heat exchanger 500 and a second liquid-liquid heat exchanger 600. The first inlet 121 and the first return port 131 are connected in series with the inner flow path of the first liquid-liquid heat exchanger 500 to form a first internal circulation loop, and the second inlet 122 and the second return port 132 are connected in series with the inner flow path of the second liquid-liquid heat exchanger 600 to form a second internal circulation loop, and a circulation pump is connected in series to each of the first internal circulation loop and the second internal circulation loop.
[0038] It can be seen that in the technical solution provided by the present application, the liquid cooling cabinet further includes at least one diversion pipe, the diversion pipe is located in the placement cavity, one end of the diversion pipe is communicated with one of the through holes, the other end of the diversion pipe is higher than the layered plate, and the other end of the diversion pipe is used to open towards the main heat generating component, so that the coolant flowing out from one of the through holes 2 is guided by the diversion pipe to flow to the periphery of the main heat generating component. That is to say, in the present application, part of the coolant is directly guided to the main heat generating component of the device to be cooled through the diversion pipe, thereby avoiding the problem that the heat dissipation effect on the main heat dissipating component is reduced due to the gradual increase in temperature during the upward diffusion of the coolant, and improving the heat dissipation effect.
[0039] At the same time, the layered plate is connected to the cabinet body, and the layered plate divides the accommodating cavity into a liquid distribution cavity and a placement cavity, and a plurality of through holes for communicating the liquid distribution cavity and the placement cavity are opened on the layered plate. When the coolant enters the cabinet body from the outside, the coolant first enters the liquid distribution cavity, and then enters the placement cavity through a plurality of through holes. In this way, compared with the way that the coolant directly enters the placement cavity, the coolant can be pre-diffused in all directions in the liquid distribution cavity, so as to be evenly distributed at the bottom of the placement cavity as much as possible, and then flow into the placement cavity through a plurality of through holes, thereby ensuring that the coolant for cooling the device to be cooled in the cooling cabinet is more evenly distributed, avoiding the problem of local overheating, and improving the heat dissipation effect of the server.
[0040] Furthermore, by using the principle that the density of the coolant after heat exchange in the first storage cavity and the second storage cavity is low and floats upward, the heat-carrying coolant after heat exchange flows out from above, and the coolant that has not participated in the heat exchange remains at the bottom, so as to make full use of the refrigeration effect of the coolant. At the same time, the liquid return cavity is located between the first storage cavity and the second storage cavity, and the liquid return cavity can provide the liquid return function for both storage cavities at the same time. Compared with the way that a liquid return cavity is provided for each storage cavity respectively, the solution of the present application can further reduce the volume of the liquid cooling cabinet and reduce the floor area.
[0041] The foregoing are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included within the protection scope of the present application.
Claims
1. A liquid cooling cabinet, characterized in that: The liquid cooling cabinet at least comprises a cabinet body, a layered plate and at least one flow guide pipe, wherein the cabinet body is provided with a containing cavity; The layered plate is connected to the cabinet, the layered plate divides the accommodating cavity into a liquid separation cavity and a placement cavity, and the layered plate is provided with a plurality of through holes for connecting the liquid separation cavity and the placement cavity; The guide tube is located in the placement cavity, one end of the guide tube is connected to one of the through holes, the other end of the guide tube is higher than the layered plate, and the other end of the guide tube is used to open toward the main heat-generating component, so that the coolant flowing out of one of the through holes can be guided by the guide tube to flow to the periphery of the main heat-generating component.
2. The liquid cooling cabinet according to claim 1, characterized in that: The flow guide pipe comprises a connecting seat and a flexible hose; One end of the bendable hose is communicated with one of the through holes through the connecting seat, and the bendable hose is used to adjust the direction of the bendable hose by bending.
3. The liquid cooling cabinet according to claim 2, characterized in that: The connecting seat is threadedly connected to one of the through holes.
4. The liquid cooling cabinet according to claim 1 or 2, characterized in that: The cabinet also has a liquid inlet and a liquid return port; The liquid inlet is communicated with the liquid separation cavity, and the liquid return port is communicated with the placement cavity.
5. The liquid cooling cabinet according to claim 4, characterized in that: Two partition plates are connected to the cabinet; The two partition plates divide the storage chamber into a first storage chamber, a liquid return chamber, and a second storage chamber. The liquid return chamber is located between the first storage chamber and the second storage chamber, and the liquid return port is connected to the liquid return chamber. The tops of the two partition plates are lower than the tops of the first storage cavity and the second storage cavity, the through holes are located at the bottoms of the first storage cavity and the second storage cavity, and the flow guide tube is located in the first storage cavity and / or the second storage cavity.
6. The liquid cooling cabinet according to claim 5, characterized in that: The plurality of through holes located at the bottom of the first storage cavity are arranged into a plurality of hole groups; Several rows of hole groups are arranged in a linear array along the length direction of the first storage cavity, and each row of hole groups includes at least two through holes arranged in a linear array along the width direction of the first storage cavity.
7. The liquid cooling cabinet according to claim 6, characterized in that: The first storage chamber and the second storage chamber are symmetrically arranged with respect to the liquid return chamber.
8. The liquid cooling cabinet according to claim 5, characterized in that: The inner wall of the liquid return cavity is coated or adhered with a heat insulation layer.
9. A data center liquid cooling system, characterized in that: The data center liquid cooling system comprises at least a server and a liquid cooling cabinet according to any one of claims 4 to 8; The server is installed in the placement cavity, and the other end of the guide tube opens toward the CPU or graphics card of the server.
10. The data center liquid cooling system according to claim 9, characterized in that: The liquid inlet has two inlets, namely a first inlet and a second inlet, and the first inlet and the second inlet are located at two ends of the liquid cooling cabinet; The liquid return port has two, namely a first return port and a second return port, and the first return port and the second return port are located at two ends of the liquid cooling cabinet; The data center liquid cooling system also includes a first liquid-liquid heat exchanger and a second liquid-liquid heat exchanger, the first inlet and the first return port are connected in series with the inner flow channel of the first liquid-liquid heat exchanger to form a first internal circulation loop, the second inlet and the second return port are connected in series with the inner flow channel of the second liquid-liquid heat exchanger to form a second internal circulation loop, and the first internal circulation loop and the second internal circulation loop are respectively connected in series with circulation pumps.