Communication equipment

Abstract

The utility model relates to the technical field of communication, and discloses a communication device which comprises a circuit board, a radiator, a chip and a hydraulic buffer, the chip is installed on the circuit board, and the radiator is located on the side, away from the circuit board, of the chip; and one end of the hydraulic buffer is relatively fixed with the circuit board, and the other end of the hydraulic buffer is relatively fixed with the radiator. When the hydraulic buffer is impacted by the radiator, the hydraulic buffer absorbs impact energy by utilizing the flow resistance of hydraulic oil and the resistance of the viscosity of the hydraulic oil, converts the impact energy into heat energy and discharges the heat energy into the atmosphere, so that the impact energy can be absorbed very effectively under the condition of very stability and almost no rebound, and the service life of the hydraulic buffer is prolonged. The chip is prevented from being impacted and damaged by the radiator.

Description

Technical Field

[0001] The utility model relates to the technical field of communication, in particular to a communication device. Background Art

[0002] As the power consumption of high-power chips in communication equipment exceeds 1000w, lidless packaging has become one of the effective solutions to solve chip heat dissipation. The reason is that the bare chip (die) can reduce the thermal resistance of heat dissipation and can effectively solve the heat dissipation problem. However, the surface of the bare chip is a relatively brittle silicon material, and the bare chip is sensitive to the pressure of the heat sink. The heat sink is large in size and heavy in weight, and it is easy to cause damage to the bare chip due to excessive local pressure during installation. In addition, when the communication equipment falls or is transported, the radiator is also prone to transient impact force on the chip, crushing the bare chip. In the process of the above radiator squeezing the chip, the thermal conductive material (TIM) between the two is also easily compressed, resulting in stratification of the heat dissipation interface, affecting heat transfer.

[0003] In related technical solutions, in order to alleviate the impact force of the heat sink on the surface of the bare chip, foam is usually used as a buffer, but the rebound force of the foam fluctuates greatly and is unstable. Utility Model Content

[0004] The utility model discloses a communication device, which is used for providing buffering for a radiator in a relatively stable manner to avoid damaging a chip.

[0005] In order to achieve the above object, the utility model provides the following technical solutions:

[0006] A communication device comprises: a circuit board, a heat sink, a chip and a hydraulic buffer, wherein the chip is mounted on the circuit board, and the heat sink is located on a side of the chip away from the circuit board; one end of the hydraulic buffer is fixed relative to the circuit board, and the other end is fixed relative to the heat sink.

[0007] When the hydraulic buffer is impacted by the radiator, it uses the flow resistance of the hydraulic oil and the resistance of the hydraulic oil viscosity to absorb the impact energy and convert it into heat energy and discharge it into the atmosphere. Therefore, it can absorb the impact energy very effectively in a very stable and almost rebound-free state to prevent the chip from being damaged by the impact of the radiator.

[0008] Optionally, one end of the hydraulic buffer is fixedly connected to the radiator, and the other end is fixedly connected to the circuit board.

[0009] Optionally, the communication device further includes a first structural support plate located on the side of the circuit board away from the chip, and the circuit board is fixed to the first structural support plate; one end of the hydraulic buffer is fixedly connected to the radiator, and the other end is fixedly connected to the first structural support plate.

[0010] Optionally, the communication device further includes a second structural support plate located on the side of the radiator away from the chip; one end of the hydraulic buffer is fixedly connected to the radiator, and the other end is fixedly connected to the second structural support plate.

[0011] Optionally, the number of the hydraulic buffers is at least two, and at least two of the radiators are dispersed on different sides of the chip.

[0012] Optionally, the bottom surface of the radiator facing the chip is rectangular, and the hydraulic buffers are respectively arranged at two opposite corner portions of the radiator, or the hydraulic buffers are respectively arranged at four corner portions of the radiator; or a plurality of the hydraulic buffers are respectively arranged around the chip.

[0013] Optionally, the maximum stroke of the hydraulic buffer is less than or equal to 20 mm.

[0014] Optionally, the hydraulic buffer is in a pre-compressed state.

[0015] Optionally, the pre-compressed stroke of the hydraulic buffer accounts for 20% to 80% of the maximum stroke of the hydraulic buffer.

[0016] Optionally, the hydraulic buffer includes a hydraulic cylinder, a piston assembly and an elastic reset member. The piston assembly is slidably fitted in the hydraulic cylinder to enclose a pressure chamber with the hydraulic cylinder, and the pressure chamber is filled with hydraulic oil; the elastic reset member is used to provide an elastic reset force for the piston assembly away from the bottom of the hydraulic cylinder; wherein, the hydraulic cylinder forms one end of the hydraulic buffer, and the piston assembly forms the other end of the hydraulic buffer.

[0017] Optionally, the chip is a bare chip, and the radiator is in thermal contact with the bare chip through a thermal conductive medium material. Description of the Drawings

[0018] Figure 1 It is a partial structure three-dimensional view of the first embodiment of the communication device provided by the embodiment of the present application;

[0019] Figure 2 is Figure 1 an exploded view of the structure shown;

[0020] Figure 3The front view of the partial structure of the second embodiment of the communication device provided by the embodiment of the present application;

[0021] Figure 4 The front view of the partial structure of the third embodiment of the communication device provided by the embodiment of the present application;

[0022] Figure 5 Indicates Figure 1 The schematic structural diagram of the hydraulic buffer 60 in

[0023] Figure 6 Indicates Figure 1 The stress curves of the scheme shown and other buffer schemes. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0025] Combined with Figures 1 to 4 , the communication device provided by the embodiment of the present application may be devices such as routers and switches. The communication device may include: a circuit board 10, a radiator 40, a chip 30, and a hydraulic buffer 60. The chip 30 is installed on the circuit board 10, and the radiator 40 is located on the side of the chip 30 away from the circuit board 10; one end of the hydraulic buffer 60 is relatively fixed to the circuit board 10, and the other end is relatively fixed to the radiator 40.

[0026] The basic principle of the hydraulic buffer 60 can be referred to Figure 5 , the hydraulic buffer 60 includes a hydraulic cylinder (such as Figure 5 the inner tube 64 and the outer tube 66), a piston assembly, and an elastic reset member (such as Figure 5 the helical spring 65). The piston assembly is slidably fitted in the hydraulic cylinder to enclose a pressure chamber with the hydraulic cylinder, and the pressure chamber is filled with hydraulic oil; the elastic reset member is used to provide an elastic reset force for the piston assembly away from the bottom of the hydraulic cylinder. Among them, one end of the hydraulic cylinder forms one end of the hydraulic buffer 60, and the piston assembly forms the other end of the hydraulic buffer 60.

[0027] Specifically, the inner tube 64 is located within the space enclosed by the outer tube 66 and is coaxially arranged with the outer tube 66. A sandwich layer is formed between the inner tube 64 and the outer tube 66. The inner tube 64 is provided with oil discharge holes T1 and oil return holes T2 that connect the space inside the inner tube 64 and the above-mentioned sandwich layer. The piston assembly includes a piston rod 62, a piston 63, and a collision head 61. The piston 63 and the collision head 61 are respectively fixedly installed at both ends of the piston rod 62. The piston rod 62 drives the piston 63 to slide and fit within the inner tube 64. The space enclosed by the inner tube 64 is filled with hydraulic oil. It should be noted that Figure 5 The shown hydraulic buffer 60 is merely an example for facilitating the understanding of the principle of the hydraulic buffer 60. However, the concept of the hydraulic buffer 60 in the embodiments of the present application is not limited to the above form. Any component that utilizes the hydraulic principle to buffer the radiator 40 is acceptable.

[0028] When the collision head 61 is subjected to an impact force F, the impact force F is transmitted to the hydraulic oil inside the inner tube 64 through the collision head 61, the piston rod 62, and the piston 63. The hydraulic oil is pressed and discharged along the oil discharge hole T1. The hydraulic oil in the space (pressure chamber) enclosed by the inner tube 64 generates pressure, and the pressure of the hydraulic oil acts on the piston 63 to form a resistance force. Thus, a reaction force is generated on the radiator 40, and this reaction force acts to prevent and resist the radiator 40, slowing down the action of the radiator 40. Among them, the impact force F can come from the radiator 30, or from the circuit board 10 or other components that are relatively fixed to the circuit board 10.

[0029] If the impact energy is absorbed through the elastic deformation of rubber, after the impact force disappears, the elastic potential energy causes the rubber to gradually rebound. And after these energies are gradually absorbed by the rubber, it is easy to cause fatigue aging of the rubber, making the elastic deformation smaller and smaller, and the ability to absorb impact energy gradually decreases. The buffering principle of the foam is similar to that of rubber.

[0030] Similar to rubber, referring to Figure 6 curve A, the spring also uses deformation to resist impact. The impact energy is absorbed by the spring through elastic deformation and converted into elastic potential energy. After the impact force disappears, the elastic potential energy causes the spring to rebound. The spring is also prone to fatigue aging, resulting in a decrease in the ability to absorb impact energy. The buffering principle of the spring piece is similar to that of the spring.

[0031] Referring to Figure 6 curve B, the air compression component can resist the impact force like rubber and the spring. The compressed air is discharged into the atmosphere through the air holes, and there is no energy accumulation. However, when the rapidly compressed air is discharged through the overflow hole and cannot be balanced in time, fatigue will also occur.

[0032] In contrast to the above buffer materials, referring to Figure 6Curves C, D, or E. In the embodiments of the present application, the hydraulic buffer 60 utilizes the flow resistance of hydraulic oil and the resistance of the viscosity of hydraulic oil to absorb impact energy and convert it into heat energy to be discharged into the atmosphere. Therefore, it can very effectively absorb impact energy in a very stable and almost non-rebound situation, preventing the chip 30 from being damaged by the impact of the heat sink 40. As described above, a relatively small hydraulic buffer 60 can absorb a large amount of impact energy.

[0033] When not under impact or in a steady state after impact and reaching a new equilibrium, only the restoring force of the helical spring 65 acts (such as about 5 N), and its influence on the stress control at the thermal interface between the heat sink 40 and the chip 30 can be almost ignored.

[0034] And, by observing Figure 6 the stress curves of C, D, and E, it can be seen that dynamically, by selecting hydraulic buffers with different parameters and resistance curves, the impact absorption characteristics of the hydraulic buffer 60 can be changed to match the corresponding product application scenarios. By using a customized hydraulic buffer 60, the thermal contact reliability at the thermal interface between the heat sink 40 and the chip 30 can be improved and optimized, which is beneficial to achieving good heat transfer between the interfaces and stress control of the chip 30.

[0035] There can be various distribution methods for the hydraulic buffer 60, as long as one end of the hydraulic buffer 60 is relatively fixed to the circuit board 10 and the other end is relatively fixed to the heat sink 40, and it can provide hydraulic buffering force for the heat sink 40.

[0036] Refer to Figure 1 and Figure 2 , in a specific embodiment, one end of the hydraulic buffer 60 is fixedly connected to the heat sink 40, and the other end is fixedly connected to the circuit board 10. The "fixed connection" in the embodiments of the present application can be understood as direct connection or abutment, as long as the relative positions of the two are fixed. Specifically, the heat sink 40 may include a bottom plate 41 and heat dissipation fins 42. The bottom plate 41 may be a rectangular two-phase heat pipe, and the heat dissipation fins 42 are fixed to the surface of the bottom plate 41 facing away from the chip 30. Installation holes can be opened on the bottom plate 41, the piston rod 62 completely passes through the above installation holes, and abuts against the circuit board 10 through the impact head 61, or the piston rod 62 can be fixedly connected to the circuit board 10, and the outer tube 66 is fixedly connected to the installation hole by clamping. Specifically, the outer tube 66 can be connected to the installation hole of the bottom plate 41 through a mounting member. The outer tube 66 has an external thread, and the mounting member is connected to the external thread of the outer tube 66. The mounting member is fixed to the above installation hole by a reverse-tightening screw. Along the direction perpendicular to the circuit board 10, the hydraulic buffer 60 has a certain spatial reuse with the heat sink 40 and the chip 30, which can reduce the space occupied in this direction and is beneficial to realizing the thin and light of the communication device.

[0037] Refer toFigure 3 , in a specific embodiment, the communication device further includes a first structural support plate 20, the first structural support plate 20 is located on the side of the circuit board 10 away from the chip 30, and the circuit board 10 is fixed to the first structural support plate 20; one end of the hydraulic buffer 60 is fixedly connected to the radiator 40, and the other end is fixedly connected to the first structural support plate 20. The first structural support plate 20 may specifically be a metal housing of the communication device or other plates with sufficient structural support strength. Installation holes may be formed in the first structural support plate 20, through holes are formed in the circuit board 10, the piston rod 62 completely passes through the through holes in the circuit board 10, and abuts against the radiator 40 through the impact head 61. Alternatively, the piston rod 62 may be fixedly connected to the radiator 40, and the outer tube 66 is fixed at the installation hole of the first structural support plate 20 through an installation member. Most of the outer tube 66 is located on the side of the first structural support plate 20 away from the circuit board 10. By making full use of the space outside the first structural support plate 20, the extrusion of the space of the heat dissipation fins 42 is reduced, which is convenient for improving the heat dissipation efficiency.

[0038] The screw of the spring screw 50 may be threadedly connected to the first structural support plate 20. Among them, the screw passes through the bottom plate 41, and the spring on the screw elastically presses the bottom plate 41 against the chip 30. The number of the spring screws 50 may be 4 or multiple. These spring screws 50 are symmetrically arranged on both sides of the heat dissipation fins 42 to provide a balanced elastic force for the bottom plate 41.

[0039] Reference Figure 4 , in a specific embodiment, the communication device may further include a second structural support plate 70, the second structural support plate 70 is located on the side of the radiator 40 away from the chip 30; one end of the hydraulic buffer 60 is fixedly connected to the radiator 40, and the other end is fixedly connected to the second structural support plate 70. The second structural support plate 70 may also be a metal housing of the communication device or other plates with sufficient structural support strength. For example, the first structural support plate 20 and the second structural support plate 70 may be two opposite side plates in the housing of the communication device. Most of the outer tube 66 is located on the side of the second structural support plate 70 away from the circuit board 10. By making full use of the space outside the second structural support plate 70, the extrusion of the space of the heat dissipation fins 42 is reduced, which is convenient for improving the heat dissipation efficiency.

[0040] In a specific embodiment, the number of the hydraulic buffers 60 is at least two, and at least two radiators 40 are dispersed on different sides of the chip 30, so as to provide buffering for the radiators 40 from different sides of the chip 30, and avoid the radiator 40 tilting to one side, causing the chip 30 to be damaged by pressure.

[0041] In a specific embodiment, the bottom surface of the radiator 40 facing the chip 30 is rectangular. For example, the shape of the bottom plate 41 is rectangular. Hydraulic buffers 60 are respectively arranged at two opposite corner portions of the radiator 40 to provide balanced buffer support for the radiator 40 with a smaller number of hydraulic buffers 60. Or, hydraulic buffers 60 are respectively arranged at the four corner portions of the radiator 40 to facilitate providing more stable and parallel buffer support for the radiator 40. Or, a plurality of hydraulic buffers 60 are respectively arranged around the chip 30. These hydraulic buffers 60 are arranged adjacent to the chip 30 and around the chip 30, which is beneficial to providing more stable buffer protection for the chip 30.

[0042] In a specific embodiment, the maximum stroke of the hydraulic buffer 60 is less than or equal to 20 mm. For example, it can be 20 mm, 19 mm, 18 mm, 15 mm, 10 mm, 8 mm, 6 mm, 4 mm, etc. If the maximum stroke is too large, it will occupy too much space inside the communication device, resulting in the communication device being too large in size, which is not conducive to realizing thin and light design.

[0043] In a specific embodiment, the hydraulic buffer 60 is in a pre-compressed state, which is convenient for the hydraulic buffer 60 to achieve zero-spacing contact with the circuit board 10, the first structural support plate 20 or the second structural support plate 70, so as to Figure 1 and Figure 2 Taking the corresponding embodiment as an example, since the hydraulic buffer 60 is in a pre-compressed state during installation, the gap between the piston rod 62 and the circuit board 10 can be automatically compensated. At the same time, pre-compression can shorten the reaction time of the hydraulic buffer 60 and reduce the time for the resistance to reach the maximum value, so as to effectively protect the chip 30 from damage.

[0044] In a specific embodiment, the pre-compression stroke of the hydraulic buffer 60 accounts for 20% to 80% of the maximum stroke of the hydraulic buffer 60. For example, it can be 40%, 45%, 50%, 60%, etc. If the proportion of the pre-compression stroke is too large, the remaining stroke available for buffering of the hydraulic buffer 60 will be too short, which is not conducive to effectively protecting the chip 30. If the proportion of the pre-compression stroke is too small, the reaction of the hydraulic buffer 60 will be longer, which is not conducive to quickly protecting the chip 30 by rapid reaction.

[0045] In a specific embodiment, the chip 30 is a bare chip. The radiator 40 is in thermal contact with the bare chip through a heat-conducting medium material to achieve heat transfer. The bare chip is beneficial for heat dissipation. The surface of the bare chip is usually a brittle silicon material and is sensitive to the pressure of the radiator 40. The hydraulic buffer 60 can effectively absorb the impact energy under stable and almost non-rebound conditions to prevent the bare chip from being damaged by the impact of the radiator 40. Especially for high-power and large-size bare chips, the advantage is more obvious.

[0046] In addition, a stepped boss smaller than the surface of the bare chip may be provided on the bottom plate 41 to further avoid damaging the bare chip. Buffer materials such as rubber, foam, and springs may be provided between the bottom plate 41 and the circuit board 10 to further improve the buffering effect of the radiator 40. Limiting bosses may also be provided between the bottom plate 41 and the circuit board 10 in different side regions of the chip 30 to prevent the bottom plate 41 from tilting excessively and crushing the chip 30.

[0047] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these modifications and variations.

Claims

1. A communication device, characterized in that: include: A circuit board, a heat sink, a chip and a hydraulic buffer, wherein the chip is mounted on the circuit board, and the heat sink is located on a side of the chip away from the circuit board; One end of the hydraulic buffer is fixed relatively to the circuit board, and the other end is fixed relatively to the radiator.

2. The communication device according to claim 1, characterized in that One end of the hydraulic buffer is fixedly connected to the radiator, and the other end is fixedly connected to the circuit board.

3. The communication device according to claim 1, characterized in that The communication device further comprises a first structural support plate, the first structural support plate is located at a side of the circuit board away from the chip, and the circuit board is fixed to the first structural support plate; One end of the hydraulic buffer is fixedly connected to the radiator, and the other end is fixedly connected to the first structural support plate.

4. The communication device according to claim 1, characterized in that The communication device further comprises a second structural support plate, wherein the second structural support plate is located on a side of the heat sink facing away from the chip; One end of the hydraulic buffer is fixedly connected to the radiator, and the other end is fixedly connected to the second structural support plate.

5. The communication device according to any one of claims 1 to 4, characterized in that: The number of the hydraulic buffers is at least two, and at least two heat sinks are distributed on different sides of the chip.

6. The communication device according to claim 5, characterized in that The bottom surface of the heat sink facing the chip is rectangular, and the hydraulic buffers are respectively arranged at two opposite corners of the heat sink, or the hydraulic buffers are respectively arranged at four corners of the heat sink; or, A plurality of the hydraulic buffers are respectively arranged around the chip.

7. The communication device according to claim 5, characterized in that The maximum stroke of the hydraulic buffer is less than or equal to 20 mm.

8. The communication device according to claim 7, characterized in that The pre-compression stroke of the hydraulic buffer accounts for 20% to 80% of the maximum stroke of the hydraulic buffer.

9. The communication device according to claim 1, characterized in that The hydraulic buffer comprises a hydraulic cylinder, a piston assembly and an elastic return member, wherein the piston assembly is slidably fitted in the hydraulic cylinder to enclose a pressure chamber with the hydraulic cylinder, and the pressure chamber is filled with hydraulic oil; The elastic restoring member is used to provide the piston assembly with an elastic restoring force away from the bottom of the hydraulic cylinder; The hydraulic cylinder forms one end of the hydraulic buffer, and the piston assembly forms the other end of the hydraulic buffer.

10. The communication device according to claim 1, characterized in that The chip is a bare chip, and the heat sink is in thermal contact with the bare chip via a heat-conducting medium material.

Images