Microwave power amplification module structure with heat dissipation function

Abstract

The utility model relates to the technical field of module heat dissipation, and provides a microwave power amplification module structure with a heat dissipation function, which comprises a first carrier and a second carrier, the first carrier consists of a panel and a plurality of vertical rods arranged on the panel, the side surfaces of at least three vertical rods are positioned on the same surface and form a contact surface, and the second carrier is positioned on the panel. The second carrier is attached to at least one contact surface, and a soft heat dissipation material layer is arranged at the attaching position; the heat dissipation effect of a single module structure is improved, the structure is simple, and integration and miniaturization of the module structure are facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of module heat dissipation, and particularly to a microwave power amplification module structure with heat dissipation. Background Technique

[0002] Active radars are widely used in military target detection, civil aviation control, maritime surveillance, astronomical observation and other fields. The core component is a microwave power amplifier, which is composed of microwave power amplification modules. With the miniaturization development of the microwave power amplification module structure, the factors of its components affected by temperature directly restrict the development of the module structure. For example, high-power microwave power amplification modules have high power consumption and high requirements for heat dissipation efficiency. Otherwise, signal interruption will be caused, affecting the reliability of microwave communication. In this regard, in the existing module structure, generally, an additional heat dissipation structure is specially installed or the heat is conducted to a centralized heat dissipation place for heat dissipation treatment. This way of separately setting the heat dissipation structure will cause certain losses as the number of module structures increases. If the heat of several module structures is conducted to the end for unified heat dissipation, it depends very much on the performance of the heat conduction material. At present, the effect of this heat dissipation method is poor. Content of the Utility Model

[0003] The purpose of the utility model is to provide a microwave power amplification module structure with heat dissipation to solve the above problems, improve the heat dissipation effect of a single module structure and have a simple structure, which is conducive to the integration and miniaturization of the module structure.

[0004] An embodiment of the utility model is realized by the following technical scheme: A microwave power amplification module structure with heat dissipation includes a first carrier and a second carrier. The first carrier is composed of a panel and several vertical rods arranged on the panel. The sides of at least 3 vertical rods are located on the same surface and form a contact surface. The second carrier is attached to at least one contact surface, and a soft heat dissipation material layer is provided at the attachment part.

[0005] Further, several vertical rods are arranged in a rectangle.

[0006] Further, the thickness of the soft heat dissipation material layer is less than the width of the vertical rod.

[0007] Further, the soft heat dissipation material layer includes heat dissipation silica gel and heat dissipation silicone grease.

[0008] Further, the number of contact surfaces is even and symmetrically arranged.

[0009] Further, an arc-shaped groove is provided at the top of the side of the vertical rod forming the contact surface close to the second carrier; the height of the second carrier is less than the distance between the arc-shaped groove and the panel.

[0010] Furthermore, a heat dissipation cover plate is provided on the top layer of the second carrier, and a heat conductive material layer is provided between the heat dissipation cover plate and the second carrier.

[0011] The utility model has at least the following advantages and beneficial effects: By providing a number of vertical rods as the peripheral support members of the second carrier, the heat dissipation material layer is extruded into the gaps between the vertical rods by the extrusion between the second carrier and the heat dissipation material layer, which increases the external heat dissipation area of the heat dissipation material layer. At the same time, as a heat dissipation structure, the vertical rods have a large contact area with the air, further improving the heat dissipation efficiency. In addition, the structure of the utility model is simple, and it can be further integrated and miniaturized, so that it can be applied to the design and application of high-power sub-modules, improving the efficiency of active radars. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0013] Figure 1 An exploded structure schematic diagram of a microwave power amplification module structure with heat dissipation provided for Embodiment 1;

[0014] Figure 2 A partial side view cross-sectional structure schematic diagram of a microwave power amplification module structure with heat dissipation provided for Embodiment 1;

[0015] Figure 3 A partial top view cross-sectional structure schematic diagram of a microwave power amplification module structure with heat dissipation provided for Embodiment 1;

[0016] Figure 4 A partial side view cross-sectional structure schematic diagram of a microwave power amplification module structure with heat dissipation provided for Embodiment 5;

[0017] Figure 5 A partial side view cross-sectional structure schematic diagram of a microwave power amplification module structure with heat dissipation provided for Embodiment 6;

[0018] Reference numerals: 1 - first carrier, 2 - second carrier, 3 - vertical rod, 4 - panel, 5 - contact surface, 6 - soft heat dissipation material layer, 7 - arc-shaped groove. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Components of the embodiments of the present utility model described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed present utility model, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.

[0021] Embodiment 1

[0022] As Figure 1 shown, in this embodiment, a microwave power amplification module structure with heat dissipation is mainly disclosed, including a first carrier 1 and a second carrier 2. The first carrier 1 is composed of a panel 4 and several vertical rods 3 arranged on the panel 4. In this embodiment, the second carrier 2 is a cuboid, so the several vertical rods 3 are arranged in a rectangle; at this time, four contact surfaces 5 are formed on the sides of all the vertical rods 3, and the four contact surfaces 5 and the panel 4 form a groove. The distance between the second carrier 2 and the four contact surfaces 5 is equal and they are in a fitting arrangement. Further, heat dissipation silica gel is provided at the fitting place. When the second carrier 2 is placed in the groove, the heat dissipation silica gel will be squeezed into the gaps between the vertical rods 3. Since the thickness of the heat dissipation silica gel is less than the width of the vertical rods 3, as Figure 2 shown in Figure 3, the heat dissipation silica gel squeezed into the gaps between the vertical rods 3 will not completely fill the gaps between the vertical rods 3, so that the vertical rods 3 protrude outward relative to the heat dissipation silica gel to form a heat dissipation grid, accelerating the heat dissipation of the heat dissipation silica gel, thereby improving the heat dissipation efficiency of the second carrier 2; in addition, since the contact surface 5 between the heat dissipation silica gel and the vertical rods 3 is larger than the contact surface 5 formed by the vertical rods 3, the heat transfer efficiency of the heat dissipation silica gel to the vertical rods 3 is also increased, thereby also increasing the heat conduction of the heat dissipation silica gel to the second carrier 2.

[0023] Embodiment 2

[0024] In this embodiment, a microwave power amplification module structure with heat dissipation is mainly disclosed. Its main structure is exactly the same as that of the first embodiment. The difference is that in this embodiment, a general radio frequency combination unit is also provided, which includes a traveling wave tube, a solid-state amplifier, and an integrated power supply; the radio frequency input end is connected to the solid-state amplifier, the solid-state amplifier is connected to the traveling wave tube, the traveling wave tube is connected to the radio frequency output end, and the integrated power supply is used for power supply. The entire radio frequency combination unit is mainly arranged on the second carrier 2, and the mounting holes for the radio frequency input end and the output end are provided on the first carrier 1; it should be noted that in this embodiment, only a combined structure of a microwave power amplification structure is given. As the technology develops, the radio frequency combination unit becomes functionalized, integrated, and miniaturized; more units will be arranged on the second carrier 2. Without changing the structures of the first carrier 1 and the second carrier 2, they all fall within the protection scope of this patent.

[0025] In this embodiment, a module structure with good heat dissipation is formed by the first carrier 1 and the second carrier 2, so that the module structure can adapt to the design applications of integration, miniaturization, and high power.

[0026] Embodiment Three

[0027] In this embodiment, a microwave power amplification module structure with heat dissipation is mainly disclosed. It includes a first carrier 1 and a second carrier 2. The first carrier 1 is composed of a panel 4 and several vertical rods 3 arranged on the panel 4. In this embodiment, the second carrier 2 is a cuboid, and several vertical rods 3 are arranged in two rows to form two contact surfaces 5. The distance between the second carrier 2 and the two contact surfaces 5 is equal and they are fitted. Further, heat dissipation silica gel is provided at the fitting place. When the second carrier 2 is placed between the two contact surfaces 5 and on the panel 4, the heat dissipation silica gel will be squeezed into the gaps between the vertical rods 3. Since the thickness of the heat dissipation silica gel is less than the width of the vertical rods 3, the heat dissipation silica gel squeezed into the gaps between the vertical rods 3 will not completely fill the gaps between the vertical rods 3. Thus, the vertical rods 3 protrude outward relative to the heat dissipation silica gel to form a heat dissipation grille, accelerating the heat dissipation of the heat dissipation silica gel, thereby improving the heat dissipation efficiency of the second carrier 2; in addition, since the contact surface 5 between the heat dissipation silica gel and the vertical rods 3 is larger than the contact surface 5 formed by the vertical rods 3, the heat transfer efficiency of the heat dissipation silica gel to the vertical rods 3 is also increased, thereby increasing the heat conduction of the heat dissipation silica gel to the second carrier 2.

[0028] Further, in other embodiments of this embodiment, a heat dissipation cover plate is also provided on the top layer of the second carrier 2. The heat dissipation cover plate and the second carrier 2 use heat dissipation silica gel as a heat conduction material layer for heat dissipation. The heat dissipation cover plate is made of a metal plate, and the heat dissipation silica gel is adhered between the metal plate and the second carrier 2.

[0029] Embodiment Four

[0030] In this embodiment, a microwave power amplification module structure with heat dissipation is mainly disclosed, which includes a first carrier 1 and a second carrier 2. The first carrier 1 is composed of a panel 4 and several vertical rods 3 arranged on the panel 4. In this embodiment, the second carrier 2 is a cylinder. The several vertical rods 3 are arranged in a circular pattern and form a circular contact surface 5. The distance between the second carrier 2 and the circular contact surface 5 is equal and they are arranged in a fitting manner. Further, heat dissipation silica gel is provided at the fitting position. When the second carrier 2 is placed on the circular contact surface 5 and the panel 4, the heat dissipation silica gel will be squeezed into the gaps between the vertical rods 3. Since the thickness of the heat dissipation silica gel is less than the width of the vertical rods 3, the heat dissipation silica gel squeezed into the gaps between the vertical rods 3 will not completely fill the gaps between the vertical rods 3. Thus, the vertical rods 3 protrude outward relative to the heat dissipation silica gel to form a heat dissipation grille, accelerating the heat dissipation of the heat dissipation silica gel, thereby improving the heat dissipation efficiency of the second carrier 2. Additionally, since the contact surface 5 between the heat dissipation silica gel and the vertical rods 3 is larger than the contact surface 5 formed by the vertical rods 3, the heat transfer efficiency of the heat dissipation silica gel to the vertical rods 3 is also increased, thereby increasing the heat conduction of the heat dissipation silica gel to the second carrier 2.

[0031] Embodiment Five

[0032] As Figure 4 shown, in this embodiment, a microwave power amplification module structure with heat dissipation is mainly disclosed. Its main structure is completely the same as that of Embodiment One. The difference is that the vertical rod 3 is a trapezoidal structure with a smaller top and a larger bottom, so the formed contact surface 5 is an inclined surface, further increasing the contact area between the second carrier 2 and the first carrier 1 and improving the heat dissipation efficiency.

[0033] Embodiment Six

[0034] As Figure 5 shown, in this embodiment, a module structure with heat dissipation is mainly disclosed. Its main structure is completely the same as that of Embodiment One. The difference is that an arc-shaped groove 7 is provided at the top of the side of the vertical rod 3 forming the contact surface 5 close to the second carrier 2; the height of the second carrier 2 is less than the distance between the arc-shaped groove 7 and the panel 4; during the extrusion process of the second carrier 2 and the vertical rod 3 on the soft heat dissipation material layer 6, the soft heat dissipation material layer 6 will be squeezed to the arc-shaped groove 7. This is related to the fluidity of the soft heat dissipation material layer 6 and the distribution density of the vertical rods 3. When the soft heat dissipation material layer 6 continues to move at the arc-shaped groove 7, it will be distributed on the top layer of the second carrier 2, thereby having a certain fixing effect on the second carrier 2. In today's highly integrated and miniaturized situation, this fixing effect can meet the usage requirements of certain working conditions without the need for additional fixing components. Preferably, in this embodiment, the distance between the fitting surface of the second carrier 2 and the contact surface 5 increases from bottom to top, thereby leaving a certain space for the soft heat dissipation material layer 6 to flow, facilitating its flow to the arc-shaped groove 7.

[0035] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, various modifications and variations can be made to the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A microwave power amplification module structure with heat dissipation, comprising a first carrier (1) and a second carrier (2), characterized in that: The first carrier (1) is composed of a panel (4) and a plurality of vertical rods (3) arranged on the panel (4); the side surfaces of at least three of the vertical rods (3) are located on the same plane and form a contact surface (5); the second carrier (2) and at least one of the contact surfaces (5) are arranged in close contact with each other, and a soft heat dissipation material layer (6) is provided at the contacting position.

2. The microwave power amplifier module structure with heat dissipation according to claim 1, characterized in that: The plurality of vertical rods (3) are arranged in a rectangular shape.

3. The microwave power amplifier module structure with heat dissipation as claimed in claim 2, characterized in that: The thickness of the soft heat dissipation material layer (6) is smaller than the width of the vertical rod (3).

4. The microwave power amplifier module structure with heat dissipation as claimed in claim 3, characterized in that: The soft heat dissipation material layer (6) comprises heat dissipation silica gel and heat dissipation silicone grease.

5. The microwave power amplifier module structure with heat dissipation as claimed in claim 4, characterized in that: The contact surfaces (5) are of even number and are symmetrically arranged.

6. The microwave power amplifier module structure with heat dissipation as claimed in claim 5, characterized in that: An arc-shaped groove (7) is provided at the top of the vertical rod (3) forming the contact surface (5) on the side close to the second carrier (2); the height of the second carrier (2) is smaller than the distance between the arc-shaped groove (7) and the panel (4).

7. The microwave power amplifier module structure with heat dissipation according to claim 6, characterized in that: The top layer of the second carrier (2) is also provided with a heat dissipation cover plate, and a heat conductive material layer is provided between the heat dissipation cover plate and the second carrier (2).

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