Wafer back cleaning device

Abstract

The utility model discloses a wafer back cleaning device, which comprises a frame body, a first cleaning assembly and a second cleaning assembly, and is characterized in that the frame body comprises a supporting disc, a water spraying assembly for discharging water and a drying assembly for drying after cleaning; the first cleaning assembly comprises a first shaft body which rotatably penetrates through the supporting disc and a first cleaning part which is connected to the top of the first shaft body and is used for cleaning the wafer, and the first shaft body is rotatably sleeved with a first transmission part; the second cleaning assembly comprises a second shaft body which is rotatably connected to the first transmission part and a second cleaning part which is arranged at the top of the second shaft body and is used for cleaning the manipulator for transferring the wafer, the second shaft body movably penetrates through the supporting disc, the second cleaning part is started, and the water spraying assembly operates synchronously, so that the manipulator is cleaned. The first cleaning part is started, the water spraying assembly operates synchronously to clean the bottom of the wafer, the back face of the wafer can be cleaned, the mechanical arm can also be cleaned, and the quality of the wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer processing, and particularly relates to a wafer backside cleaning device. Background Art

[0002] In the manufacturing process of semiconductor integrated circuit devices, it is necessary to keep the surface of the semiconductor wafer clean at all times. Not only the front side of the wafer is required to be kept clean all the time, but also the back side of the wafer is required to be kept clean all the time to avoid cross-contamination during the transfer process of the wafer. Therefore, it is necessary to clean the front and back sides of the wafer. The traditional wafer cleaning method is mainly to clean with a chemical solution and then dry by high-temperature drying.

[0003] However, this method has some problems, such as incomplete cleaning, easy to leave residues, and affecting the quality of the wafer. The existing solutions mainly improve the quality of the wafer by increasing the number of cleaning and drying times. Although this method can improve the quality of the wafer, it will increase the production cost and reduce the production efficiency. In addition, the existing cleaning devices usually can only clean one side of the wafer and cannot clean the back side of the wafer, which will affect the quality of the wafer. The cleanliness of the manipulator used to transfer the wafer will also affect the quality of the wafer, but the existing cleaning devices do not have the ability to clean the manipulator used to transfer the wafer.

[0004] Therefore, how to provide a cleaning device that can clean both the back side of the wafer and the manipulator to improve the quality of the wafer is a technical problem that those skilled in the art need to solve currently. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a cleaning device that can clean both the back side of the wafer and the manipulator to improve the quality of the wafer.

[0006] To achieve the above purpose, the utility model provides a wafer backside cleaning device, including:

[0007] A frame body, including a support disk, a water spraying component for discharging water, and a drying component for drying after cleaning;

[0008] A first cleaning component, including a first shaft body rotatably penetrating through the support disk, and a first cleaning member connected to the top of the first shaft body for cleaning the wafer. A first transmission member is rotatably sleeved on the first shaft body;

[0009] A second cleaning component, including a second shaft body rotatably connected to the first transmission member, and a second cleaning member arranged at the top of the second shaft body for cleaning the manipulator for transferring the wafer. The second shaft body is movably penetrated through the support disk.

[0010] Preferably, one end of the first shaft body facing away from the first cleaning member is connected with a first power assembly, and the first power assembly includes:

[0011] A first power source, the output end of which has the same axis as the first shaft body;

[0012] A mounting block, connected to the output end of the first power source and the bottom of the first shaft body, so that the first shaft body rotates synchronously with the output end of the first power source.

[0013] Preferably, a first gear is provided at the bottom of the second shaft body. The first transmission member includes a first transmission part and a second transmission part which are coaxially arranged and connected. The first transmission part is provided with a second gear which has the same height as the first gear and meshes with each other. The second gear is used to drive the second shaft body and the second cleaning member to rotate around the axis of the second shaft body.

[0014] Preferably, the second transmission part is connected with a second power assembly, and the second power assembly includes:

[0015] A second power source, the output end of which is provided with a synchronous pulley;

[0016] A transmission belt, connected to the synchronous pulley and a transmission wheel arranged on the outer periphery of the second transmission part, so that the second power source drives the first transmission member to rotate around its own axis.

[0017] Preferably, there are two second cleaning assemblies, and the second shaft bodies of the two second cleaning assemblies are symmetrically arranged about the first shaft body. The second cleaning members both include:

[0018] A mounting plate, which is in a strip-shaped structure and is connected to the top of the second shaft body;

[0019] Brush bristles, arranged on the side of the mounting plate facing away from the second shaft body, and the brush bristles are arranged along the length direction of the mounting plate.

[0020] Preferably, the first cleaning member includes:

[0021] A mounting arm, connected to the top of the first shaft body, and a groove for the mounting plate to rotate is provided in the middle of the mounting arm;

[0022] A sponge, arranged at both ends of the mounting arm in the length direction.

[0023] Preferably, the frame body is further provided with a guide shaft located below the support disc. An annular groove is provided on the first shaft body. The first shaft body is connected with a lifting assembly, and the lifting assembly includes:

[0024] A cylinder, including a cylinder body and a piston rod which are connected, and the cylinder body is fixedly connected to the frame body;

[0025] The sliding plate is connected to one end of the cylinder body away from the piston rod. The sliding plate includes a first sliding part slidably mounted on the guide shaft, and a second sliding part rotatably mounted on the annular groove through a bearing. The cylinder can drive the sliding plate to move axially along the guide shaft to drive the first shaft body to move up and down.

[0026] Preferably, the water spray assembly includes a plurality of water spray nozzles connected to the water pipeline, the plurality of water spray nozzles are arranged along the circumference of the support plate, the water outlets of the water spray nozzles are inclined upward and lower than the first cleaning part and the second cleaning part, and the frame is also provided with a bucket cover for preventing water from splashing.

[0027] Preferably, the drying assembly comprises:

[0028] A gas pipeline is connected to an external gas source through a joint, and the gas pipeline is arranged circumferentially along the top of the water bucket cover;

[0029] A plurality of air jets are arranged on one side of the gas pipeline close to the water bucket cover and are arranged along the circumference of the water bucket cover.

[0030] Preferably, the second power source is a servo motor or a stepper motor.

[0031] Compared with the above-mentioned background technology, the wafer back side cleaning device provided by the utility model includes a frame, a first cleaning component and a second cleaning component, the frame includes a supporting plate, a water spray component for discharging water and a drying component for drying after cleaning; the first cleaning component includes a first shaft body rotatably passing through the supporting plate, and a first cleaning part connected to the top of the first shaft body for cleaning the wafer, and a first transmission part is rotatably mounted on the first shaft body; the second cleaning component includes a second shaft body rotatably connected to the first transmission part, and a second cleaning part is arranged on the top of the second shaft body for cleaning a robot for transferring the wafer, and the second shaft body is movably passed through the supporting plate.

[0032] Specifically, after the robot rotates to above the cleaning device, the second cleaning component arranged on the top of the second axis is started, and the water spray component for discharging water is operated synchronously to clean the robot. Then the robot moves to a preset position, adsorbs the wafer and transfers the wafer to above the cleaning device. The first cleaning component connected to the top of the first axis is started, and the water spray component for discharging water is operated synchronously to clean the bottom of the wafer. Then, the cleaned wafer is dried by the drying component to enter the subsequent workstation. By installing the first cleaning component and the second cleaning component on the same supporting plate, both the back of the wafer and the robot can be cleaned, thereby improving the cleaning efficiency and cleaning effect while improving the quality of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on the provided drawings.

[0034] Figure 1 Schematic structural diagram of the backside cleaning device for wafers provided by the embodiment of the present invention;

[0035] Figure 2 Cross-sectional structural view of the backside cleaning device for wafers provided by the embodiment of the present invention;

[0036] Figure 3 Top view of the backside cleaning device for wafers provided by the embodiment of the present invention.

[0037] Wherein:

[0038] 110 - support disk, 121 - water spray nozzle, 131 - gas pipeline, 132 - joint, 133 - gas jet nozzle, 140 - guide shaft, 150 - water bucket cover, 210 - first shaft body, 221 - mounting arm, 222 - sponge, 241 - first power source, 242 - mounting block, 251 - second power source, 252 - synchronous pulley, 310 - second shaft body, 321 - mounting plate, 322 - brush bristles, 330 - first gear, 410 - cylinder, 420 - sliding plate. Detailed implementation manners

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0040] To enable those skilled in the art of this technology to better understand the solution of the present invention, the present invention will be further described in detail below in conjunction with the drawings and specific implementation manners.

[0041] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "upper", "lower", "top", "bottom", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated positions or elements must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0042] The utility model aims to provide a cleaning device which can clean the back side of a wafer and clean a robot arm, so as to improve the quality of the wafer.

[0043] See also Figures 1 to 3 To achieve the above-mentioned purpose, the utility model provides a wafer back side cleaning device, including a frame, a first cleaning component and a second cleaning component.

[0044] The frame includes a support plate 110, a water spray assembly for discharging water, and a drying assembly for drying after cleaning. The support plate 110 is a disc-shaped structure. The water spray assembly can spray liquid to cooperate with the subsequent cleaning process of the first cleaning assembly and the second cleaning assembly. The liquid can be a chemical solution, etc. The drying assembly blows the cleaned wafers dry through air flow to dry them for subsequent processes.

[0045] The first cleaning assembly includes a first shaft 210 rotatably passing through the support plate 110, and a first cleaning member connected to the top of the first shaft 210 for cleaning the wafer. A first transmission member is rotatably mounted on the first shaft 210, and the first transmission member and the first shaft 210 can rotate relative to each other so that the two can be used for different transmission modules.

[0046] The second cleaning assembly includes a second shaft 310 rotatably connected to the first transmission member, and a second cleaning member disposed on the top of the second shaft 310 for cleaning the robot for transferring the wafer. The second shaft 310 is movably disposed on the support plate 110 .

[0047] After the robot rotates to the top of the cleaning device, the second cleaning component arranged on the top of the second shaft 310 is started and the water spray component for discharging water is synchronously operated to clean the robot. Then the robot moves to a preset position, adsorbs the wafer and transfers the wafer to the top of the cleaning device. The first cleaning component connected to the top of the first shaft 210 is started and the water spray component for discharging water is synchronously operated to clean the bottom of the wafer. Then the cleaned wafer is dried by the drying component to enter the subsequent workstation. By installing the first cleaning component and the second cleaning component on the same supporting plate 110, both the back of the wafer and the robot can be cleaned, thereby improving the cleaning efficiency and the cleaning effect while improving the quality of the wafer.

[0048] In this embodiment, the end of the first shaft 210 facing away from the first cleaning piece is connected to the first power assembly, and the first power assembly includes a first power source 241 and a mounting block 242. The output end of the first power source 241 is identical to the axis of the first shaft 210; the mounting block 242 is connected to the output end of the first power source 241 and the bottom of the first shaft 210, so that the first shaft 210 rotates synchronously with the output end of the first power source 241.

[0049] The frame is also provided with a guide shaft 140 located below the support plate 110, the guide shaft 140 extends vertically, and the axis of the guide shaft 140 is parallel to the axis of the first shaft body 210, the first shaft body 210 is provided with an annular groove, the first shaft body 210 is connected to a lifting assembly capable of driving its vertical movement, the lifting assembly includes a cylinder 410 and a sliding plate 420, the cylinder 410 includes a cylinder body and a piston rod connected, the cylinder body is fixedly connected to the frame; the sliding plate 420 is connected to one end of the cylinder body away from the piston rod, and the sliding plate 420 includes a sliding sleeve slidably arranged on the guide shaft 140. The cylinder 410 can drive the sliding plate 420 to move axially along the guide shaft 140, so as to drive the first shaft body 210 to move up and down. At the same time, through the setting of the sliding plate 420, the first power component can be moved relative to the frame, so that the vertical movement and rotational movement of the first shaft body 210 can be carried out simultaneously without interfering with each other. With such a setting, two power sources can be connected through the first shaft body 210 to realize two kinds of movements, which is beneficial to saving the occupied space of the device.

[0050] In this embodiment, there are two second cleaning components, and the two second shafts 310 of the two second cleaning components are symmetrically arranged about the first shaft 210. The second cleaning components include a mounting plate 321 and bristles 322. The mounting plate 321 is a long strip structure and is connected to the top of the second shaft 310; the bristles 322 are arranged on the side of the mounting plate 321 away from the second shaft 310, and the bristles 322 are arranged along the length direction of the mounting plate 321. The two mounting plates 321 do not interfere with each other during the rotation process of the second shaft 310.

[0051] Specifically, a first gear 330 is provided at the bottom of the second shaft body 310, and the first transmission member includes a first transmission part and a second transmission part which are coaxially arranged and connected. The first transmission part is provided with a second gear which is at the same height as the first gear 330 and meshes with each other. Through the meshing of a second gear with the two first gears 330, the second gear can simultaneously drive the second shaft body 310 to rotate around its own axis, so as to drive the second cleaning part above the second shaft body 310 to rotate accordingly. Considering the length and rotation process of the mounting plate 321, when the rotation trajectories of the two mounting plates 321 do not overlap, the initial positions of the two mounting plates 321 are not limited. When the rotation trajectories of the two mounting plates 321 partially overlap, the initial positions of the two mounting plates 321 should be at a certain angle to avoid collision between the two mounting plates 321 during rotation.

[0052] The first cleaning member includes a mounting arm 221 and a sponge 222. The mounting arm 221 is connected to the top of the first shaft body 210, and a groove for the rotation of the mounting plate 321 is provided in the middle of the mounting arm 221. When the second cleaning member operates, the groove in the middle of the mounting arm 221 is lower than the bottom of the second cleaning member, so that the second cleaning member can rotate above the groove, providing a larger rotation coverage area for the second cleaning member and improving the cleaning efficiency of the second cleaning member. The sponge 222 is arranged at both ends of the mounting arm 221 in the length direction. When the second cleaning member finishes cleaning, the projection of the second cleaning member on the horizontal plane should have no overlapping area with the projection of the first cleaning member on the horizontal plane, so that the first cleaning member moves upward under the drive of the cylinder 410, and the bottom of the first cleaning member should be higher than the top of the second cleaning member, providing a rotation space for the first cleaning member to rotate around the first shaft body 210 under the drive of the first power source 241, facilitating the cleaning process of the wafer and improving the cleaning efficiency of the wafer.

[0053] It should be noted that the first shaft body 210 can adopt a ball spline shaft, and the second shaft body 310 can adopt a flange shaft. The height difference between the tops of the first shaft body 210 and the second shaft body 310 can be adjusted through the cylinder 410 to meet the rotation space required for the first cleaning member connected to the first shaft body 210 and the second cleaning member connected to the second shaft body 310, which is beneficial to the efficient use of space. The sponge 222 is wetted by liquid to rotate and clean the wafer. Among them, the sponge 222 has a large size and can be applied to the cleaning of wafers of multiple sizes. The sponge 222 is detachably mounted on the mounting arm 221, so that the sponge 222 can be replaced regularly to ensure the cleaning effect of the wafer.

[0054] The second transmission part is connected with a second power assembly. The second power assembly includes a second power source 251 and a transmission belt. The second power source 251 can adopt a servo motor or a stepping motor, and a synchronous pulley 252 is provided at the output end of the second power source 251. The transmission belt is connected between the synchronous pulley 252 and a transmission wheel arranged on the outer periphery of the second transmission part, so that the second power source 251 drives the synchronous pulley 252 to rotate synchronously, and then drives the transmission wheel to drive the first transmission member to rotate around its own axis, so that the second shaft body 310 rotates to make the second cleaning member complete the function of the rotating cleaning manipulator.

[0055] In this embodiment, the water spraying assembly includes a plurality of spray nozzles 121 connected to the water pipeline. The plurality of spray nozzles 121 are arranged along the circumferential direction of the support disk 110. The water outlet of the spray nozzle 121 is inclined upward and lower than the first cleaning member and the second cleaning member, so as to spray the liquid onto the manipulator and the back of the wafer to assist the cleaning process of the first cleaning member and the second cleaning member. The frame body is also provided with a water bucket cover 150 for preventing water from splashing out, and at the same time, the water bucket cover 150 can avoid the interference of the external environment.

[0056] The drying assembly includes a gas pipeline 131 and a plurality of jet nozzles 133. The gas pipeline 131 is connected to an external gas source through a joint 132, and the gas pipeline 131 is arranged circumferentially along the top of the water bucket cover 150. The plurality of jet nozzles 133 are arranged on one side of the gas pipeline 131 close to the water bucket cover 150 and are arranged circumferentially along the water bucket cover 150 to blow-dry the washed wafers in multiple directions, thereby promoting the working efficiency of the drying process.

[0057] In summary, the present application designs a cleaning device that can clean both the back surface of the wafer and the manipulator. The size of the sponge 222 is designed to be sufficient to handle the cleaning of the back surfaces of wafers of multiple sizes. By designing different pulley transmission ratios and gear transmission ratios, the sponge 222 and the brush can rotate without interfering with each other. The specific steps are as follows: The manipulator rotates to the back surface cleaning device. The second power source 251 drives the synchronous pulley 252. After the synchronous pulley 252 rotates, it drives the second shaft body 310 and the brush to rotate through the first transmission member, and the water spray nozzle 121 is opened to clean the manipulator. The manipulator rotates to the chuck, the chuck releases, and the manipulator adsorbs the wafer. The manipulator transports the wafer to the back surface cleaning device, the cylinder 410 drives the second shaft body 310 to rise, and the first power source 241 drives the sponge 222 to rotate. The sponge 222 is wetted with liquid to rotate and clean the wafer. The rotation of the sponge 222 stops, and the cylinder 410 drives the second shaft body 310 to descend. The manipulator lifts the wafer above the annular jet nozzle 133, the jet nozzle 133 is opened to blow-dry the wafer, and then the manipulator transports the wafer to the next station.

[0058] It should be noted that in this specification, relational terms such as first and second are only used to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities.

[0059] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts among the various embodiments can be referred to each other.

[0060] Specific examples are used in this article to elaborate on the principles and implementation manners of the present invention. The descriptions of the above embodiments are only used to help understand the method and its core idea of the present invention. It should be pointed out that for those of ordinary skill in the art in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the protection scope of the present invention.

Claims

1. A wafer backside cleaning device, characterized in that: include: The frame comprises a support plate (110), a water spraying assembly for discharging water, and a drying assembly for drying after washing; A first cleaning component comprises a first shaft (210) rotatably passing through the support plate (110), and a first cleaning member connected to the top of the first shaft (210) for cleaning the wafer, wherein a first transmission member is rotatably sleeved on the first shaft (210); The second cleaning component comprises a second shaft (310) rotatably connected to the first transmission member, and a second cleaning member arranged on the top of the second shaft (310) for cleaning a robot that transfers the wafer, wherein the second shaft (310) is movably arranged to pass through the support plate (110).

2. The wafer backside cleaning device according to claim 1, characterized in that: The end of the first shaft (210) facing away from the first cleaning component is connected to a first power assembly, and the first power assembly comprises: A first power source (241), the output end of which is coaxial with the axis of the first shaft (210); The mounting block (242) is connected to the output end of the first power source (241) and the bottom of the first shaft (210), so that the first shaft (210) rotates synchronously with the output end of the first power source (241).

3. The wafer backside cleaning device according to claim 1, characterized in that: A first gear (330) is provided at the bottom of the second shaft (310); the first transmission member comprises a first transmission part and a second transmission part which are coaxially arranged and connected; the first transmission part is provided with a second gear which is at the same height as the first gear (330) and meshes with each other; the second gear is used to drive the second shaft (310) and the second cleaning member to rotate around the axis of the second shaft (310).

4. The wafer backside cleaning device according to claim 3, characterized in that: The second transmission part is connected to a second power assembly, and the second power assembly includes: A second power source (251), an output end of which is provided with a synchronous pulley (252); A transmission belt is connected to the synchronous pulley (252) and a transmission wheel arranged on the outer periphery of the second transmission part, so that the second power source (251) drives the first transmission member to rotate around its own axis.

5. The wafer backside cleaning device according to any one of claims 1 to 4, characterized in that: There are two second cleaning components, and the second shafts (310) of the two second cleaning components are symmetrically arranged about the first shaft (210), and the second cleaning parts each include: A mounting plate (321) which is a long strip structure and is connected to the top of the second shaft (310); The bristles (322) are arranged on a side of the mounting plate (321) away from the second shaft (310), and the bristles (322) are arranged along the length direction of the mounting plate (321).

6. The wafer backside cleaning device according to claim 5, characterized in that: The first cleaning part comprises: A mounting arm (221) connected to the top of the first shaft (210), and a groove is provided in the middle of the mounting arm (221) to provide the space required for the mounting plate (321) to rotate; The sponge (222) is arranged at two ends of the mounting arm (221) in the length direction.

7. The wafer backside cleaning device according to claim 1, characterized in that: The frame is further provided with a guide shaft (140) located below the support plate (110); an annular groove is provided on the first shaft body (210); the first shaft body (210) is connected to a lifting assembly, and the lifting assembly comprises: A cylinder (410) comprising a cylinder body and a piston rod connected to each other, wherein the cylinder body is fixedly connected to the frame body; A sliding plate (420) is connected to an end of the piston rod away from the cylinder body, and the sliding plate (420) includes a first sliding portion slidably mounted on the guide shaft (140), and a second sliding portion rotatably mounted on the annular groove via a bearing. The cylinder (410) can drive the sliding plate (420) to move axially along the guide shaft (140) to drive the first shaft body (210) to move up and down.

8. The wafer backside cleaning device according to claim 1, characterized in that: The water spray assembly comprises a plurality of water spray nozzles (121) connected to a water pipeline, the plurality of water spray nozzles (121) being arranged along the circumference of the support plate (110), the water outlets of the water spray nozzles (121) being inclined upward and lower than the first cleaning part and the second cleaning part, and the frame body is further provided with a water bucket cover (150) for preventing water from splashing out.

9. The wafer backside cleaning device according to claim 8, characterized in that: The drying component comprises: A gas pipeline (131) is connected to an external gas source via a joint (132), and the gas pipeline (131) is arranged circumferentially along the top of the water bucket cover (150); A plurality of air nozzles (133) are arranged on a side of the gas pipeline (131) close to the water bucket cover (150) and are arranged along the circumference of the water bucket cover (150).

10. The wafer backside cleaning device according to claim 4, characterized in that: The second power source (251) is a servo motor or a stepper motor.

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