Laser printing suction cup and laser printing platform

Abstract

The utility model discloses a laser printing sucker and a laser printing platform, and relates to the technical field of laser printing equipment. The laser printing suction cup comprises a suction cup body, the suction cup body comprises a bearing part and a mounting part connected with the bearing part, the mounting part is used for being fixedly connected with a working platform of a laser printing platform, and the bearing part is used for bearing a wafer; wherein the bearing part is divided into an outer edge placing part and a central hollow part from the outer edge to the center, the edge part of the wafer is placed on the outer edge placing part, and the middle part of the wafer is lapped on the central hollow part. The laser printing suction cup and the laser printing platform can solve the problem that in the prior art, in the process that a suction cup is adopted for bearing a wafer to conduct laser printing, the surface of the wafer is burnt at high temperature, and therefore the warping phenomenon occurs, and the qualified rate of products is increased.

Description

Technical Field

[0001] The utility model relates to the technical field of laser printing equipment, and more specifically, to a laser printing suction cup and a laser printing platform. Background Art

[0002] With the rapid development of the semiconductor industry, in the wafer processing technology, a process method of processing wafers through laser printing technology has been introduced. Currently, in the laser processing of wafers, a suction cup is usually used to carry the wafer to support it.

[0003] Since the laser printing technology requires high-temperature burning, it is easy to cause the wafer to warp due to high-temperature burning on the surface after laser printing, making it difficult to meet the requirements of wafer processing and seriously affecting the qualification rate of the obtained wafer products. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a laser printing suction cup and a laser printing platform, which can solve the problem of warping of the wafer due to high-temperature burning on the surface during the laser printing process using a suction cup to carry the wafer in the prior art, thereby improving the qualification rate of products.

[0005] The embodiments of the utility model are implemented as follows:

[0006] In the first aspect of the embodiments of the utility model, a laser printing suction cup is provided, including a suction cup body. The suction cup body includes a bearing part and an installation part connected to the bearing part. The installation part is used for fixedly connecting with the working platform of the laser printing platform, and the bearing part is used for carrying the wafer. Among them, the bearing part is divided into an outer edge placement part and a central hollow part along the outer edge towards the center. The edge of the wafer is placed on the outer edge placement part, and the middle part of the wafer is placed on the central hollow part. This laser printing suction cup can solve the problem of warping of the wafer due to high-temperature burning on the surface during the laser printing process using a suction cup to carry the wafer in the prior art, thereby improving the qualification rate of products.

[0007] Optionally, air channels communicating with each other are arranged in the installation part and the outer edge placement part. Air holes are arranged on the surface of the outer edge placement part. The air channels are communicated with the air holes. The air channels and the air holes cooperate together to provide vacuum adsorption for the wafer placed on the outer edge placement part.

[0008] Optionally, an installation groove is arranged at the bottom of the installation part. The installation groove is communicated with the air channel. The installation groove is used for limiting and accommodating the vacuum pipeline emission device of the laser printing platform.

[0009] Optionally, the installation groove is a stepped groove, and the shape of the stepped groove is adapted to the shape of the vacuum pipeline emission device.

[0010] Optionally, the midline of the air duct and the midline of the air hole are perpendicular to each other.

[0011] Optionally, a support angle is provided on the side wall of the outer edge placement portion, and the support angle protrudes from the side close to the outer edge placement portion toward the side close to the central hollow portion.

[0012] Optionally, an installation angle is provided on the side wall of the installation portion, and the installation angle gradually expands from the side close to the outer edge placement portion toward the side away from the outer edge placement portion.

[0013] Optionally, the number of the installation angles is an even number, and every two installation angles are symmetrically arranged on the opposite sides of one installation portion.

[0014] Optionally, the suction cup body is an integrally formed structure.

[0015] In the second aspect of the embodiments of the present invention, a laser printing platform is provided, including a working platform and at least one laser printing suction cup as described above disposed on the working platform. The laser printing suction cup can solve the problem that the wafer warps due to high-temperature burning on its surface during the laser printing process in the prior art, thereby improving the product qualification rate.

[0016] The beneficial effects of the embodiments of the present invention include:

[0017] The laser printing suction cup includes a suction cup body. The suction cup body includes a bearing portion and an installation portion connected to the bearing portion. The installation portion is used for fixedly connecting with the working platform of the laser printing platform, so as to be fixedly connected with the working platform of the laser printing platform through the installation portion, thereby fixedly installing the suction cup body on the working platform. The bearing portion is used for bearing the wafer to support the wafer, so as to facilitate laser printing on the wafer. Among them, the bearing portion is divided into an outer edge placement portion and a central hollow portion along the outer edge toward the center. The edge of the wafer is placed on the outer edge placement portion, and the middle portion of the wafer is placed on the central hollow portion, so as to support the wafer through the outer edge placement portion and dissipate heat from the wafer through the central hollow portion, thereby avoiding the phenomenon that the surface temperature of the wafer is too high and warps during the laser printing process. Description of the Drawings

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other relevant drawings can also be obtained based on these drawings.

[0019] Figure 1 One of the schematic structural diagrams of the laser printing suction cup provided by the embodiment of the present invention;

[0020] Figure 2 Another schematic structural diagram of the laser printing suction cup provided by the embodiment of the present invention;

[0021] Figure 3 Another schematic structural diagram of the laser printing suction cup provided by the embodiment of the present invention;

[0022] Figure 4 For Figure 3 Partial enlarged view of

[0023] Reference numerals: 100 - laser printing suction cup; 10 - suction cup body; 11 - bearing part; 111 - outer edge placement part; 1111 - air holes; 1112 - support angles; 112 - central hollow part; 12 - installation part; 121 - installation groove; 122 - installation angles; 13 - air duct. Detailed implementation manners

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Generally, the components of the embodiments of the present invention described and shown in the accompanying drawings here can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the present invention to be protected, but only represents the selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0026] It should be noted that: similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0027] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present utility model is customarily placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and cannot be understood as indicating or implying relative importance.

[0028] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging vertically, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0029] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the connection inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0030] Please refer to Figures 1 to 4 , the embodiment of the present application provides a laser printing suction cup 100, which includes a suction cup body 10. The suction cup body 10 includes a bearing portion 11 and an installation portion 12 connected to the bearing portion 11. The installation portion 12 is used for fixedly connecting with the working platform of the laser printing platform, and the bearing portion 11 is used for bearing a wafer; wherein, an outer edge placement portion 111 and a central hollow portion 112 are divided along the outer edge towards the center on the bearing portion 11. The edge of the wafer is placed on the outer edge placement portion 111, and the middle part of the wafer is placed on the central hollow portion 112. The laser printing suction cup 100 can solve the problem that the wafer warps due to high-temperature burning on its surface during the laser printing process using a suction cup in the prior art, thereby improving the product qualification rate.

[0031] It should be noted that as Figure 1 and Figure 2As shown, the suction cup body 10 includes a bearing part 11 and a mounting part 12. Among them, the bearing part 11 and the mounting part 12 are fixedly connected to be fixedly connected to the working platform of the laser printing platform through the mounting part 12, so as to fixedly install the suction cup body 10 on the working platform. At the same time, the wafer is carried by the bearing part 11 to support the wafer, so as to facilitate laser printing on the wafer. On this basis, the bearing part 11 is divided into an outer edge placement part 111 and a central hollow part 112 along the outer edge towards the center. The edge of the wafer is placed on the outer edge placement part 111, and the middle part of the wafer is placed on the central hollow part 112, so as to support the wafer through the outer edge placement part 111 and dissipate heat from the wafer through the central hollow part 112, thereby avoiding warping of the wafer surface due to excessive temperature during laser printing.

[0032] The above-mentioned division of the bearing part 11 into the outer edge placement part 111 and the central hollow part 112 along the outer edge towards the center is a division made artificially to distinguish the outer edge placement part 111 and the central hollow part 112, and does not refer to the existence of a physical structure between the outer edge placement part 111 and the central hollow part 112 to make the two independent of each other. Regarding the area ratio of the outer edge placement part 111 and the central hollow part 112 on the bearing part 11, those skilled in the art should be able to make reasonable selection and design according to the actual situation, and no specific limitation is made here. As long as the wafer can be stably and reliably placed on the suction cup body 10 through the outer edge placement part 111, the area ratio of the central hollow part 112 can be as large as possible to improve the heat dissipation effect of the central hollow part 112 on the wafer.

[0033] Exemplarily, as Figure 1 and Figure 2 shown, in this embodiment, the cross-sectional shape of the bearing part 11 is rectangular, and the number of the mounting parts 12 is four. The four mounting parts 12 correspond to the four sides of the bearing part 11 one by one and are respectively arranged on the four sides of the bearing part 11; of course, in other embodiments, the cross-sectional shape of the bearing part 11 can also be diamond-shaped, circular or oval, etc., and the number of the mounting parts 12 can also be two, three or five, etc. A plurality of mounting parts 12 are evenly distributed along the outer periphery of the bearing part 11. Those skilled in the art should be able to make reasonable selection and design according to the actual situation, and no specific limitation is made here.

[0034] On this basis, as Figure 1 and Figure 2As shown, in this embodiment, the cross-sectional shape of the central hollow portion 112 may be the same as that of the bearing portion 11. For example, the cross-sectional shape of the central hollow portion 112 is also rectangular. At this time, the cross-sectional shape of the outer-edge placement portion 111 is an annular rectangle with a rectangular hollow area inside. Of course, in other embodiments, the cross-sectional shape of the central hollow portion 112 may also be different from that of the bearing portion 11. For example, the cross-sectional shape of the central hollow portion 112 is circular. At this time, the cross-sectional shape of the outer-edge placement portion 111 is an irregular shape with a circular hollow area inside. Those skilled in the art should be able to make reasonable selections and designs according to the actual situation, and no specific limitations are made here.

[0035] Regarding the way of fixedly connecting the bearing portion 11 and the mounting portion 12, it can be common fixed connection methods such as welding, clamping, and bonding. Preferably, in the actual production and manufacturing process, the bearing portion 11 and the mounting portion 12 can be made by an integral molding process (that is, the suction cup body 10 is an integral molding structure) to improve the stability and reliability of the connection between the bearing portion 11 and the mounting portion 12, thereby improving the integrity and consistency of the suction cup body 10. Exemplarily, the materials of the bearing portion 11 and the mounting portion 12 can be any one of zirconia ceramics, silicon nitride ceramics, alumina ceramics, yttrium oxide, titanium oxide, silicon carbide, and aluminum nitride ceramics.

[0036] As Figure 3 and Figure 4 As shown, in this embodiment, an air passage 13 that communicates with each other is provided in the mounting portion 12 and the outer-edge placement portion 111. Air holes 1111 are provided on the surface of the outer-edge placement portion 111. The air passage 13 communicates with the air holes 1111. The air passage 13 and the air holes 1111 cooperate together to provide vacuum adsorption for the wafer placed on the outer-edge placement portion 111, so as to stably and reliably adsorb and fix the wafer on the outer-edge placement portion 111 under the action of vacuum adsorption, thereby avoiding the phenomenon that the printed pattern is shifted due to the vibration of the working platform during the laser printing process.

[0037] Specifically, as Figures 2 to 4 As shown, in this embodiment, a mounting groove 121 is provided at the bottom of the mounting portion 12. The mounting groove 121 communicates with the air passage 13. The mounting groove 121 is used to limit and accommodate the vacuum pipeline emission device of the laser printing platform, so that after the vacuum pipeline emission device is limited and accommodated in the mounting groove 121, the vacuum pipeline of the vacuum pipeline emission device can be connected to the air passage 13 to provide a vacuum adsorption effect on the air passage 13 and the air holes 1111.

[0038] Among them, as Figures 2 to 4As shown, the installation groove 121 is a stepped groove, and the shape of the stepped groove is adapted to the shape of the vacuum pipeline emission device to ensure that the vacuum pipeline emission device can be limited and placed in the installation groove 121 without shaking relative to the installation groove 121, thereby ensuring the continuous and reliable vacuum adsorption effect.

[0039] Optionally, as Figure 3 and Figure 4 shown, the center line of the air passage 13 and the center line of the air hole 1111 are perpendicular to each other, so that the air flow can smoothly flow between the air passage 13 and the air hole 1111, and the bottom surface of the wafer can be reliably adsorbed and fixed through the air hole 1111. Exemplarily, the number of the air passages 13 and the air holes 1111 can both be multiple, and are respectively arranged on one side where the above-mentioned multiple installation parts 12 are located to uniformly improve the vacuum adsorption effect on the wafer.

[0040] As Figures 1 to 4 shown, in this embodiment, a support angle 1112 is provided on the side wall of the outer edge placement part 111. The support angle 1112 protrudes from the side close to the outer edge placement part 111 towards the side close to the central hollow part 112, so as to increase the contact area between the outer edge placement part 111 and the wafer through the support angle 1112, thereby improving the reliability of the outer edge placement part 111 in carrying the wafer, and further avoiding the phenomenon that the middle part of the wafer sinks due to the lack of reliable support of the over-large central hollow part 112. Exemplarily, the cross-sectional shape of the support angle 1112 is a sector, and two adjacent support angles 1112 are arranged at intervals to ensure that the central hollow part 112 located between two adjacent support angles 1112 can still dissipate heat from the wafer.

[0041] As Figures 1 to 4 shown, in this embodiment, an installation angle 122 is provided on the side wall of the installation part 12 to increase the contact area between the installation part 12 and the working platform through the installation angle 122, thereby improving the stability and reliability of the connection between the installation angle 122 and the working platform, and further avoiding the phenomenon that the printed pattern is offset due to the vibration of the working platform during the laser printing process. On this basis, the installation angle 122 gradually expands from the side close to the outer edge placement part 111 towards the side away from the outer edge placement part 111, which can effectively increase the contact area between the side of the installation part 12 close to the working platform (i.e., the side away from the outer edge placement part 111) and the working platform, thereby effectively reducing the vibration conducted from the working platform to the installation part 12.

[0042] Optionally, as Figures 1 to 4 shown, the number of the installation angles 122 is an even number, and every two installation angles 122 are symmetrically arranged on the opposite sides of an installation part 12 to further increase the contact area between the installation part 12 and the working platform and improve the force uniformity on the opposite sides of the installation part 12. Exemplarily, the cross-sectional shape of the installation angle 122 is a triangle.

[0043] The embodiment of the present application further provides a laser printing platform, including a working platform and at least one laser printing suction cup 100 as described above disposed on the working platform. Since the structure and beneficial effects of the laser printing suction cup 100 have been described in detail in the foregoing embodiments, they will not be elaborated herein again.

[0044] The foregoing is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. For those skilled in the art, the present utility model may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

[0045] In addition, it should be noted that, in the various specific technical features described in the above specific embodiments, without conflict, they can be combined in any appropriate manner. To avoid unnecessary repetition, the present utility model will not separately describe various possible combination manners.

Claims

1. A laser printing suction cup, characterized in that: It includes a suction cup body, which includes a bearing part and a mounting part connected to the bearing part, the mounting part is used to be fixedly connected to the working platform of the laser printing platform, and the bearing part is used to bear the wafer; wherein, the bearing part is divided into an outer edge placement part and a central hollow part along the outer edge to the center, the edge of the wafer is placed on the outer edge placement part, and the middle part of the wafer is placed on the central hollow part.

2. The laser printing suction cup according to claim 1, characterized in that: The mounting portion and the outer edge placement portion are provided with interconnected air passages, the outer edge placement portion is provided with air holes on its surface, the air passages are connected with the air holes, and the air passages and the air holes cooperate to provide vacuum adsorption for the wafer placed on the outer edge placement portion.

3. The laser printing suction cup according to claim 2, characterized in that: The bottom of the mounting portion is provided with a mounting groove, the mounting groove is communicated with the air passage, and the mounting groove is used for limiting the position of the vacuum pipeline emitting device of the laser printing platform.

4. The laser printing suction cup according to claim 3, characterized in that: The mounting groove is a stepped groove, and the shape of the stepped groove is adapted to the shape of the vacuum pipeline launching device.

5. The laser printing suction cup according to any one of claims 2 to 4, characterized in that: The midline of the airway and the midline of the stoma are perpendicular to each other.

6. The laser printing suction cup according to claim 1, characterized in that: A support angle is arranged on the side wall of the outer edge placement portion, and the support angle protrudes from a side close to the outer edge placement portion toward a side close to the central hollow portion.

7. The laser printing suction cup according to claim 1, characterized in that: A mounting angle is arranged on the side wall of the mounting portion, and the mounting angle gradually expands from a side close to the outer edge placement portion toward a side away from the outer edge placement portion.

8. The laser printing suction cup according to claim 7, characterized in that: The number of the installation angles is an even number, and every two of the installation angles are symmetrically arranged on two opposite sides of one of the installation portions.

9. The laser printing suction cup according to claim 1, characterized in that: The suction cup body is an integrally formed structure.

10. A laser printing platform, characterized in that: The invention comprises a working platform and at least one laser printing suction cup as claimed in any one of claims 1 to 9 arranged on the working platform.

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