Multiple cooling type high-pressure steam condenser

Abstract

The utility model discloses a multi-cooling type high-pressure steam condenser which comprises a condenser tube shell, a plurality of steam condensing tubes are fixed in the condenser tube shell, and a core cooling mechanism is arranged in the condenser tube shell. The input ends of the multiple steam condensation pipes are jointly communicated and fixed with a condensation input gathering pipe, and the output ends of the multiple steam condensation pipes are jointly communicated and fixed with a condensation output liquid discharging pipe. A plurality of cooling liquid input pipes and cooling liquid output pipes which are communicated with the interior of the condenser pipe shell are fixed on the outer side of the condenser pipe shell; the condenser has efficient heat exchange performance, heat in high-pressure steam can be rapidly and effectively transferred to a cooling medium, and rapid condensation of the steam is achieved; and the cooling water in the condenser tube shell is further cooled through the core cooling mechanism, so that the cooling water in the condenser tube shell is always kept at a low temperature, and the cooling performance of the cooling water is prevented from being reduced due to the fact that the temperature of the cooling water gradually rises after heat exchange.

Description

Technical Field

[0001] The utility model relates to the technical field of high-pressure steam condensation, in particular to a multi-cooling type high-pressure steam condenser. Background Technique

[0002] A high-pressure steam condenser is an important device in the industrial field. It is mainly used to cool high-pressure steam and condense it into a liquid. In terms of working principle, it exchanges heat with a cooling medium, usually water or air, to reduce the temperature of the steam, causing it to lose heat and change from a gaseous state to a liquid state. For example, in a power plant, it helps to improve the efficiency of the steam cycle, recover the heat and moisture in the steam, and reduce energy waste. In chemical production, it can process the generated high-pressure steam to achieve the separation and purification of substances.

[0003] In existing condensers, little further treatment is done to the cooling medium. The cooling medium gradually warms up during the heat exchange process, resulting in a gradual decrease in its cooling performance, which is not conducive to the stability of the condensation and liquefaction process and needs to be further improved and optimized. Content of the Utility Model

[0004] The purpose of the utility model is to provide a multi-cooling type high-pressure steam condenser, which can perform better cooling control on the condensation process.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] A multi-cooling type high-pressure steam condenser includes a condenser shell. Inside the condenser shell, multiple steam condensation tubes are fixed. A core cooling mechanism is provided inside the condenser shell;

[0007] The input ends of multiple steam condensation tubes are commonly connected and fixed with a condensation input collecting pipe, and the output ends of multiple steam condensation tubes are commonly connected and fixed with a condensation output drain pipe;

[0008] Outside the condenser shell, multiple coolant input tubes and coolant output tubes connected to its inside are fixed;

[0009] The core cooling mechanism includes multiple core cooling tubes fixed inside the condenser shell.

[0010] Preferably, multiple coolant guide plates are fixed on the inner side wall of the condenser shell, and the coolant guide plates extend along the axis direction parallel to the condenser shell.

[0011] Note: Multiple coolant guide plates are beneficial to maintaining the stability of the cooling water flow, making the heat exchange between the cooling water and multiple steam condensation tubes more stable.

[0012] Preferably, the core cooling pipe is arranged to extend in a zigzag shape inside the condenser shell. A core cooling input pipe communicating with the input end of the core cooling pipe is fixed on the side wall of the condenser shell, and a core cooling output pipe communicating with the output end of the core cooling pipe is fixed on the side wall of the condenser shell.

[0013] Explanation: The core cooling mechanism is used to further cool the cooling water inside the condenser shell, so that the cooling water inside the condenser shell always remains at a relatively low temperature, avoiding the gradual increase in temperature of the cooling water after heat exchange and the decline of its cooling performance.

[0014] Preferably, an indirect cooling mechanism is provided on the condenser shell. The indirect cooling mechanism includes an indirect cooling outer ring shell fixed on the outer side of the condenser shell, and an indirect cooling inner ring shell fixed on the inner side of the condenser shell;

[0015] An outer ring shell cooling input pipe and an outer ring shell cooling output pipe communicating with the inside thereof are fixed on the indirect cooling outer ring shell, and an inner ring shell cooling input pipe and an inner ring shell cooling output pipe communicating with the inside thereof are fixed on the indirect cooling inner ring shell;

[0016] An outer ring shell guide spiral plate is fixed inside the indirect cooling outer ring shell, and an inner ring shell guide spiral plate is fixed inside the indirect cooling inner ring shell.

[0017] Explanation: Under the action of multiple cooling means, the cooling water inside the condenser shell is nearly kept at a constant temperature close to the heat preservation temperature, which is beneficial to the stability of the condensation and liquefaction of high-pressure steam in each steam condensation pipe.

[0018] Preferably, a semiconductor cooling mechanism is provided inside the indirect cooling inner ring shell. The semiconductor cooling mechanism includes a plurality of cooling conduction fixing strips fixed on the inner side of the indirect cooling inner ring shell. A plurality of semiconductor refrigeration chips are fixed on the cooling conduction fixing strips. The cold ends of the semiconductor refrigeration chips are fixedly connected to the cooling conduction fixing strips, and heat dissipation fins are fixed on the hot ends of the semiconductor refrigeration chips;

[0019] A heat dissipation guide pipe coaxial with it is fixed on the inner side of the indirect cooling inner ring shell. A heat dissipation guide channel is formed between the outer side wall of the heat dissipation guide pipe and the inner side of the indirect cooling inner ring shell, and a plurality of heat dissipation driving fans are fixed at the end of the heat dissipation guide channel.

[0020] Explanation: The semiconductor cooling mechanism can quickly cool the cold air inside the indirect cooling inner ring shell to improve the overall cooling performance of the device, and at the same time improve the fault tolerance and stability of the device.

[0021] Compared with the prior art, the beneficial effects of the present utility model are reflected in the following aspects:

[0022] 1. The structure of the utility model is reasonably designed. This condenser has high heat exchange performance and can quickly and effectively transfer the heat in high-pressure steam to the cooling medium to achieve the rapid condensation of steam.

[0023] 2. In the technical solution of the utility model, the core cooling mechanism is used to further cool the cooling water in the condenser shell, so that the cooling water in the condenser shell always remains at a relatively low temperature, avoiding the gradual increase in temperature of the cooling water after heat exchange and the decline of its cooling performance.

[0024] 3. In the technical solution of the utility model, under the action of multiple cooling means, the cooling water in the condenser shell is almost kept at a constant temperature close to the heat preservation temperature, which is beneficial to the stability of the condensation and liquefaction of high-pressure steam in each steam condensation tube.

[0025] 4. In the technical solution of the utility model, the semiconductor cooling mechanism can quickly cool the cold air in the indirect cooling inner ring shell to improve the overall cooling performance of the device, and at the same time improve the fault tolerance and stability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is the front view of the utility model;

[0027] Figure 2 is Figure 1 the left view of

[0028] Figure 3 is the structural schematic diagram of the indirect cooling outer ring shell of the utility model;

[0029] Figure 4 is the structural schematic diagram of the indirect cooling inner ring shell of the utility model;

[0030] Figure 5 is the structural schematic diagram of the semiconductor refrigeration sheet of the utility model;

[0031] Figure 6 is the structural schematic diagram of the heat dissipation diversion channel of the utility model.

[0032] In the figure, 10 is the condenser shell, 101 is the coolant input pipe, 102 is the coolant output pipe, 103 is the coolant deflector, 12 is the steam condensation pipe, 131 is the condensation input manifold pipe, 132 is the condensation output drain pipe, 20 is the core cooling mechanism, 21 is the core cooling pipe, 221 is the core cooling input pipe, 222 is the core cooling output pipe, 30 is the indirect cooling mechanism, 31 is the indirect cooling outer shell, 311 is the outer shell cooling input pipe, 312 is the outer shell cooling output pipe, 313 is the outer shell deflector spiral plate, 32 is the indirect cooling inner shell, 321 is the inner shell cooling input pipe, 322 is the inner shell cooling output pipe, 323 is the inner shell deflector spiral plate, 40 is the semiconductor cooling mechanism, 41 is the cooling conduction fixing strip, 42 is the semiconductor refrigeration chip, 43 is the heat dissipation fin, 44 is the heat dissipation deflector pipe, 440 is the heat dissipation deflector channel, and 441 is the heat dissipation driving fan. Detailed implementation mode

[0033] The following Figures 1 - 6 will be used to describe the present utility model in detail. For the convenience of narration, the directions mentioned below are defined as follows: the up, down, left, right, front, and back directions mentioned below are the same as the up, down, left, right, front, and back directions of the projection relationship of each main view or structural schematic diagram itself.

[0034] Embodiment 1:

[0035] A multiple cooling type high-pressure steam condenser, as Figure 1 shown, includes a condenser shell 10. A plurality of steam condensation pipes 12 are fixedly arranged inside the condenser shell 10, and a core cooling mechanism 20 is arranged inside the condenser shell 10;

[0036] The input ends of the plurality of steam condensation pipes 12 are fixedly communicated and fixed with a condensation input manifold pipe 131, and the output ends of the plurality of steam condensation pipes 12 are fixedly communicated and fixed with a condensation output drain pipe 132;

[0037] A plurality of coolant input pipes 101 and coolant output pipes 102 that are communicated with the inside thereof are fixedly arranged outside the condenser shell 10;

[0038] The core cooling mechanism 20 includes a plurality of core cooling pipes 21 fixedly arranged inside the condenser shell 10.

[0039] As Figure 2 shown, a plurality of coolant deflectors 103 are fixedly arranged on the inner side wall of the condenser shell 10, and the coolant deflectors 103 extend along the axial direction of the condenser shell 10.

[0040] As Figure 2 shown, the core cooling pipes 21 are arranged in a zigzag bending and extending manner inside the condenser shell 10, as Figure 1As shown, a core cooling input pipe 221 communicating with the input end of the core cooling pipe 21 is fixed on the side wall of the condenser shell 10, and a core cooling output pipe 222 communicating with the output end of the core cooling pipe 21 is fixed on the side wall of the condenser shell 10.

[0041] Embodiment 2:

[0042] Based on Embodiment 1, as Figure 1 shown, an indirect cooling mechanism 30 is provided on the condenser shell 10. The indirect cooling mechanism 30 includes an indirect cooling outer ring shell 31 fixed on the outer side of the condenser shell 10, and an indirect cooling inner ring shell 32 fixed on the inner side of the condenser shell 10;

[0043] An outer ring shell cooling input pipe 311 and an outer ring shell cooling output pipe 312 communicating with the inside thereof are fixed on the indirect cooling outer ring shell 31, and an inner ring shell cooling input pipe 321 and an inner ring shell cooling output pipe 322 communicating with the inside thereof are fixed on the indirect cooling inner ring shell 32;

[0044] As Figure 3 shown, an outer ring shell guide spiral plate 313 is fixed inside the indirect cooling outer ring shell 31. The outer ring shell guide spiral plate 313 is spirally extended and arranged around the axis of the indirect cooling outer ring shell 31. As Figure 4 shown, an inner ring shell guide spiral plate 323 is fixed inside the indirect cooling inner ring shell 32. The inner ring shell guide spiral plate 323 is spirally extended and arranged around the axis of the indirect cooling inner ring shell 32.

[0045] Embodiment 3:

[0046] Based on Embodiment 2, as Figure 1 shown, a semiconductor cooling mechanism 40 is provided inside the indirect cooling inner ring shell 32. As Figure 5 shown, the semiconductor cooling mechanism 40 includes a plurality of cooling conduction fixing strips 41 fixed on the inner side of the indirect cooling inner ring shell 32. The cooling conduction fixing strips 41 are extended and arranged along the direction parallel to the axis of the indirect cooling inner ring shell 32. A plurality of semiconductor refrigeration chips 42 are fixed on the cooling conduction fixing strips 41. The cold ends of the semiconductor refrigeration chips 42 are fixedly connected with the cooling conduction fixing strips 41, and heat dissipation fins 43 are fixed on the hot ends of the semiconductor refrigeration chips 42;

[0047] As Figure 6 shown, a heat dissipation guide pipe 44 coaxial with it is fixed on the inner side of the indirect cooling inner ring shell 32. A heat dissipation guide channel 440 is formed between the outer side wall of the heat dissipation guide pipe 44 and the inner side of the indirect cooling inner ring shell 32, and a plurality of heat dissipation driving fans 441 are fixed at the end of the heat dissipation guide channel 440.

[0048] It should be noted that the semiconductor refrigeration sheet 42 and the heat dissipation driving fan 441 in the embodiments of the present application can both adopt the structures or products of the prior art, and those skilled in the art can select and use them according to needs, and no special limitations are made here.

[0049] In the actual application process of the present utility model, the high-pressure steam to be condensed and liquefied is transported to each steam condensation tube 12 through the condensation input collecting pipe 131. During the process of flowing through the steam condensation tube 12, the high-pressure steam is gradually cooled and liquefied, and finally the liquefied high-pressure steam is discharged from the condensation output drain pipe 132.

[0050] The cooling water is continuously transported into the condenser shell 10 through the coolant input pipe 101 by using a delivery pump. During the process of flowing through the condenser shell 10, the cooling water fully contacts with each steam condensation tube 12 for heat exchange, thereby cooling the high-pressure steam in the steam condensation tube 12. After the heat exchange is completed, the cooling water is discharged through the coolant output pipe 102.

[0051] The core cooling mechanism 20 is used to further cool down the cooling water in the condenser shell 10, so that the cooling water in the condenser shell 10 always maintains a relatively low temperature. Cold air at 5°C is continuously input into the core cooling tube 21 through the core cooling input pipe 221. The cold air exchanges heat with the cooling water in the condenser shell 10, thereby cooling down the cooling water in the condenser shell 10. After the heat exchange is completed, the cold air is discharged through the core cooling output pipe 222.

[0052] The indirect cooling mechanism 30 is used to assist in cooling down the cooling water in the condenser shell 10, so that the cooling water in the condenser shell 10 always maintains a relatively low temperature. Cold air at 5°C is continuously input into the indirect cooling outer shell 31 through the outer shell cooling input pipe 311. The cold air exchanges heat with the cooling water in the condenser shell 10, thereby cooling down the cooling water in the condenser shell 10. After the heat exchange is completed, the cold air is discharged through the outer shell cooling output pipe 312. Cold air is continuously input into the indirect cooling inner shell 32 through the inner shell cooling input pipe 321. The cold air exchanges heat with the cooling water in the condenser shell 10, thereby cooling down the cooling water in the condenser shell 10. After the heat exchange is completed, the cold air is discharged through the inner shell cooling output pipe 322.

[0053] Under the action of multiple cooling means, the cooling water in the condenser shell 10 is nearly kept at a constant temperature close to the heat preservation temperature, which is beneficial to the stability of the condensation and liquefaction of the high-pressure steam in each steam condensation tube 12.

[0054] The semiconductor cooling mechanism 40 can quickly cool down the cold air in the indirectly cooled inner ring shell 32 to improve the overall cooling performance of the device. At the same time, it also improves the fault tolerance and stability of the device. Multiple semiconductor refrigeration chips 42 are powered on. The cold ends of the semiconductor refrigeration chips 42 exchange heat with the cold air inside the indirectly cooled inner ring shell 32. The heat generated at the hot ends of the semiconductor refrigeration chips 42 is dissipated by the heat dissipation fins 43. Then, multiple heat dissipation driving fans 441 are used to input circulating air into the heat dissipation diversion channel 440 to take away the heat generated at the hot ends of the semiconductor refrigeration chips 42, that is, the heat exchange heat.

Claims

1. A multi-cooling high-pressure steam condenser, characterized in that: It comprises a condenser tube shell (10), a plurality of steam condensation tubes (12) are fixed inside the condenser tube shell (10), and a core cooling mechanism (20) is provided inside the condenser tube shell (10); The input ends of the plurality of steam condensing tubes (12) are connected and fixed with a condensation input collecting tube (131), and the output ends of the plurality of steam condensing tubes (12) are connected and fixed with a condensation output drain tube (132); A plurality of cooling liquid inlet pipes (101) and cooling liquid outlet pipes (102) connected to the interior of the condenser tube shell (10) are fixed on the outside of the condenser tube shell (10); The core cooling mechanism (20) comprises a plurality of core cooling tubes (21) fixed inside the condenser tube shell (10).

2. A multi-cooling high-pressure steam condenser according to claim 1, characterized in that: A plurality of cooling liquid guide plates (103) are fixed on the inner side wall of the condenser tube shell (10), and the cooling liquid guide plates (103) extend in a direction parallel to the axis of the condenser tube shell (10).

3. A multi-cooling high-pressure steam condenser according to claim 1, characterized in that: The core cooling tube (21) is arranged to bend and extend in a zigzag shape inside the condenser tube shell (10); a core cooling input tube (221) connected to the input end of the core cooling tube (21) is fixed on the side wall of the condenser tube shell (10); and a core cooling output tube (222) connected to the output end of the core cooling tube (21) is fixed on the side wall of the condenser tube shell (10).

4. A multi-cooling high-pressure steam condenser according to claim 1, characterized in that: An indirect cooling mechanism (30) is provided on the condenser tube shell (10), and the indirect cooling mechanism (30) comprises an indirect cooling outer ring shell (31) fixed on the outside of the condenser tube shell (10), and an indirect cooling inner ring shell (32) is fixed on the inside of the condenser tube shell (10); The indirect cooling outer ring shell (31) is fixed with an outer ring shell cooling input pipe (311) and an outer ring shell cooling output pipe (312) which are in communication with the interior thereof, and the indirect cooling inner ring shell (32) is fixed with an inner ring shell cooling input pipe (321) and an inner ring shell cooling output pipe (322) which are in communication with the interior thereof; An outer ring shell flow guide spiral plate (313) is fixed inside the indirectly cooled outer ring shell (31), and an inner ring shell flow guide spiral plate (323) is fixed inside the indirectly cooled inner ring shell (32).

5. A multi-cooling high-pressure steam condenser according to claim 4, characterized in that: A semiconductor cooling mechanism (40) is provided on the inner side of the indirect cooling inner ring shell (32), and the semiconductor cooling mechanism (40) comprises a plurality of cooling conduction fixing strips (41) fixed on the inner side of the indirect cooling inner ring shell (32), a plurality of semiconductor cooling sheets (42) are fixed on the cooling conduction fixing strips (41), the cold ends of the semiconductor cooling sheets (42) are fixedly connected to the cooling conduction fixing strips (41), and the hot ends of the semiconductor cooling sheets (42) are fixedly provided with heat dissipation fins (43); A heat dissipation guide tube (44) coaxial with the indirectly cooled inner ring shell (32) is fixed on the inner side thereof, a heat dissipation guide channel (440) is formed between the outer side wall of the heat dissipation guide tube (44) and the inner side of the indirectly cooled inner ring shell (32), and a plurality of heat dissipation drive fans (441) are fixed at the end of the heat dissipation guide channel (440).

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