Platform for wafer measurement

Abstract

The utility model provides a platform for wafer measurement, and belongs to the technical field of wafer measurement. The platform for wafer measurement comprises a platform mechanism and a measurement mechanism, the platform mechanism comprises a platform block, a threaded rod, a moving block and a ball, the platform block is provided with a groove and a communicating groove, the measurement mechanism comprises a fixed rod, an adjusting sliding rod and a thickness gauge, and the thickness gauge can be adjusted by arranging the platform block, the threaded rod, the moving block and the ball and forming the groove and the communicating groove. Through the position-adjustable moving blocks and the balls, the whole body can be supported and moved, and the moving blocks and the balls can be withdrawn for stable supporting after moving, so that the convenience is greatly improved, the position can be conveniently transferred and adjusted, the wafer can be clamped and lifted between the grooves for position adjustment or taking away, the abrasion of the back surface of the wafer is reduced, and the service life of the wafer is prolonged. And through the arrangement of a fixed rod, an adjusting sliding rod and a thickness gauge, the thickness of the wafer can be measured.

Description

Technical Field

[0001] This application relates to the field of wafer measurement, and more particularly, to a platform for wafer measurement. Background Art

[0002] During the production process of LED wafers, it is often necessary to measure the thickness uniformity of the wafers. Currently, the traditional detection method is as follows: First, attach the wafer to the upper surface of a circular ceramic disk; then place the other side of the ceramic disk on a measurement platform, and use a thickness measurement mechanism to measure the maximum thickness and the minimum thickness of the wafer, and judge whether the thickness of the wafer is uniform by calculating the difference.

[0003] Some existing platforms for wafer measurement currently are a whole-board platform and a bracket measurement structure. The wafer is placed on the platform. However, for measuring or removing the wafer at different positions, it is necessary to first horizontally move the wafer and then rotate or remove it, which easily causes wear and damage to the wafer. Moreover, placing the whole platform on the desktop is not convenient for moving and adjusting the position or removing and transferring, and it is not convenient to take. Summary of the Utility Model

[0004] To make up for the above deficiencies, this application provides a platform for wafer measurement, aiming to improve the problems proposed in the above background art.

[0005] An embodiment of this application provides a platform for wafer measurement, which includes a platform mechanism and a measurement mechanism.

[0006] The platform mechanism includes a platform block, a threaded rod, a moving block, and a ball. The platform block is provided with a groove and a communication groove. The threaded rod is rotatably arranged in the communication groove. The moving block is slidably arranged in the communication groove, and the moving block is threadedly connected to the threaded rod. The ball is movably arranged at the bottom of the moving block.

[0007] The measurement mechanism includes a fixed rod, an adjusting slide rod, and a thickness gauge. The fixed rod is arranged on the top of the platform block. One end of the adjusting slide rod is sleeved on the surface of the fixed rod. The thickness gauge is arranged at the end of the adjusting slide rod.

[0008] In a specific implementation, a rotary knob is fixedly connected to the top of the threaded rod. The threaded rod is fixedly sleeved with a limit ring, and the limit ring is rotatably arranged in the communication groove.

[0009] In the above implementation process, by setting the limit ring to limit the axial movement of the threaded rod, the threaded rod rotates and maintains its position unchanged. The rotary knob facilitates the user to twist the rotary knob to drive the threaded rod to rotate.

[0010] In a specific implementation, the moving block is rectangular, and the communication groove is adapted to the moving block.

[0011] In the above implementation process, a rectangular moving block is provided to limit the thread transmission rotation of the moving block, thereby guiding the moving block to move linearly.

[0012] In a specific embodiment, the moving block is provided with a limiting edge, and the limiting edge is in contact with the inner wall of the connecting groove.

[0013] In the above implementation process, the limit edge is set to limit the downward movement distance of the moving block, thereby preventing the moving block from moving out of the connecting groove.

[0014] In a specific implementation manner, the moving block is provided with a thread groove, and the threaded rod is threadedly connected to the thread groove.

[0015] In the above implementation process, by providing a thread groove, the threaded rod and the thread groove are threadedly connected, so that when the threaded rod is rotated, the moving block is driven to move through the thread transmission principle.

[0016] In a specific embodiment, the adjustment slide rod includes a clamp and a tightening knob, one end of the clamp is slidably mounted on the surface of the fixed rod, the tightening knob is rotationally connected to one side of the clamp, and the tightening knob is threadedly connected to the other side of the clamp.

[0017] In the above implementation process, by setting a splint and a tightening knob, the end of the forked splint is sleeved on the fixing rod, the tightening knob and one splint are rotatably fixedly connected, and the tightening knob and the other splint are threadedly connected, so that when the tightening knob is rotated, the two splints of the forked splint are clamped on the fixing rod.

[0018] In a specific embodiment, a socket is provided at one end of the clamping plate, and the bottom end of the thickness gauge passes through the socket.

[0019] In a specific embodiment, the fixing rod and the platform block are perpendicular to each other, and the bottom end of the fixing rod is threadedly connected to the platform block.

[0020] In the above implementation process, the threaded connection installation fixing rod is convenient for removal from the platform block.

[0021] Beneficial effects: The present application provides a platform for wafer measurement, which supports the movement of the whole through the arrangement of platform blocks, threaded rods, moving blocks and ball bearings, and the provision of grooves and connecting grooves. The movable blocks and ball bearings can be adjusted in position, and the movable blocks and ball bearings can be retracted after the movement for stable support, thereby greatly improving the convenience and facilitating the transfer and adjustment of the position. By setting the grooves, the wafer can be directly clamped and lifted to adjust the position or take it away, thereby reducing the wear on the back of the wafer and ensuring the yield rate. By setting the fixed rod, the adjusting slide rod and the thickness gauge, the wafer thickness can be measured. Brief Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0023] Figure 1 It is a schematic diagram of the platform structure for wafer measurement provided by the embodiment of the present application;

[0024] Figure 2 It is a schematic diagram of the platform block structure provided by the embodiment of the present application;

[0025] Figure 3 It is a schematic diagram of the communication groove structure provided by the embodiment of the present application;

[0026] Figure 4 It is a schematic diagram of the measurement mechanism structure provided by the embodiment of the present application.

[0027] In the figure: 100 - platform mechanism; 110 - platform block; 111 - groove; 112 - communication groove; 120 - threaded rod; 121 - rotation knob; 122 - limit ring; 140 - moving block; 141 - limit edge; 142 - thread groove; 160 - ball; 200 - measurement mechanism; 210 - fixed rod; 220 - adjustment slide rod; 221 - clamping plate; 222 - tightening knob; 223 - socket; 230 - thickness gauge. Detailed Embodiments

[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0029] Please refer to Figures 1-4 , the present application provides a platform for wafer measurement, which includes a platform mechanism 100 and a measurement mechanism 200.

[0030] Please refer to Figure 1 , 2 and 3, the platform mechanism 100 includes a platform block 110, a threaded rod 120, a moving block 140 and a ball 160. The platform block 110 is provided with a groove 111 and a communication groove 112. The threaded rod 120 is rotatably arranged in the communication groove 112. The moving block 140 is slidably arranged in the communication groove 112, and the moving block 140 is threadedly connected to the threaded rod 120. The ball 160 is movably arranged at the bottom of the moving block 140.

[0031] Among them, a rotating knob 121 is fixedly connected to the top of the threaded rod 120, and a limiting ring 122 is fixedly sleeved on the threaded rod 120. The limiting ring 122 is rotatably set in the connecting groove 112. The limiting ring 122 is used to limit the axial movement of the threaded rod 120, so that the threaded rod 120 can rotate and keep its position unchanged. The rotating knob 121 is convenient for the user to twist the rotating knob 121 to drive the threaded rod 120 to rotate.

[0032] Specifically, the moving block 140 is rectangular, and the communicating groove 112 and the moving block 140 are matched. By setting the rectangular moving block 140, the threaded transmission rotation of the moving block 140 is limited, and the moving block 140 is guided to move linearly.

[0033] It should be noted that the moving block 140 is provided with a limiting edge 141 , and the limiting edge 141 is in contact with the inner wall of the connecting groove 112 . By providing the limiting edge 141 , the downward movement distance of the moving block 140 is limited to prevent the moving block 140 from moving out of the connecting groove 112 .

[0034] In a specific implementation scheme, the moving block 140 is provided with a thread groove 142, and the threaded rod 120 and the thread groove 142 are threadedly connected. By providing the thread groove 142 and the threaded rod 120 and the thread groove 142 are threadedly connected, the moving block 140 is driven to move by the thread transmission principle when the threaded rod 120 is rotated.

[0035] See also Figure 1 , 2 4, the measuring mechanism 200 includes a fixed rod 210, an adjusting slide rod 220 and a thickness gauge 230, the fixed rod 210 is arranged on the top of the platform block 110, one end of the adjusting slide rod 220 is sleeved on the surface of the fixed rod 210, and the thickness gauge 230 is arranged at the end of the adjusting slide rod 220.

[0036] Among them, the adjusting slide rod 220 includes a splint 221 and a tightening knob 222, one end of the splint 221 is slidably mounted on the surface of the fixing rod 210, the tightening knob 222 and one side of the splint 221 are rotationally connected, and the tightening knob 222 and the other side of the splint 221 are threadedly connected. By setting the splint 221 and the tightening knob 222, the end of the forked splint 221 is sleeved on the fixing rod 210, the tightening knob 222 and one petal of the splint 221 are rotationally fixedly connected, and the tightening knob 222 and the other petal of the splint 221 are threadedly connected, so that when the tightening knob 222 is rotated, the two petals of the forked splint 221 are clamped on the fixing rod 210.

[0037] In a specific implementation scheme, a socket 223 is opened at one end of the clamp 221, and the bottom end of the thickness gauge 230 passes through the socket 223. The fixing rod 210 and the platform block 110 are perpendicular to each other, and the bottom end of the fixing rod 210 is threadedly connected to the platform block 110. The fixing rod 210 is threadedly installed to facilitate removal from the platform block 110.

[0038] The working principle of the platform for wafer measurement: When in use, place the wafer on the platform block 110 and measure the thickness through the thickness gauge 230. When it is necessary to adjust the position or remove the wafer, the fixture can be directly inserted into the groove 111 to clamp and lift the wafer, thus avoiding the friction and wear between the horizontally moving wafer and the platform, ensuring the yield rate. Further, when it is necessary to adjust the position of the platform block 110, turn the rotary knob 121 to drive the threaded rod 120 to rotate. The threaded rod 120 drives the moving block 140 to move through the principle of screw drive. The rectangular moving block 140 moves along the communication groove 112 to the bottom under the limiting action of the limiting edge 141. The moving block 140 drives the ball 160 to move and contact the tabletop to support the whole, and then the platform block 110 can be pushed to move for position adjustment, ensuring accurate adjustment and facilitating long-distance transfer. After moving in place, reverse-rotate the rotary knob 121, then the moving block 140 drives the ball 160 to retract into the communication groove 112. The ball 160 no longer contacts the tabletop, but the bottom surface of the platform block 110 contacts the tabletop for support, ensuring stability.

[0039] It should be noted that the specific model and specification of the thickness gauge 230 need to be selected according to the actual specifications of the device, etc. The specific selection calculation method adopts the existing technology in this field, so it will not be elaborated in detail.

[0040] The power supply and its principle of the thickness gauge 230 are clear to those skilled in the art, and will not be elaborated in detail here.

[0041] For those skilled in the art, it is obvious that this application is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of this application. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of this application is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in this application. Any reference signs in the claims should not be regarded as limiting the claims involved.

Claims

1. A platform for wafer measurement, characterized in that: include A platform mechanism (100), the platform mechanism (100) comprising a platform block (110), a threaded rod (120), a moving block (140) and a ball (160), the platform block (110) being provided with a groove (111) and a connecting groove (112), the threaded rod (120) being rotatably disposed in the connecting groove (112), the moving block (140) being slidably disposed in the connecting groove (112), the moving block (140) being provided with a threaded groove (142), the threaded rod (120) and the threaded groove (142) being threadedly connected, and the ball (160) being movably disposed at the bottom of the moving block (140); A measuring mechanism (200), the measuring mechanism (200) comprising a fixed rod (210), an adjusting slide rod (220) and a thickness gauge (230), the fixed rod (210) being arranged on the top of the platform block (110), one end of the adjusting slide rod (220) being sleeved on the surface of the fixed rod (210), and the thickness gauge (230) being arranged on the end of the adjusting slide rod (220).

2. The wafer measurement platform according to claim 1, characterized in that: A rotating knob (121) is fixedly connected to the top of the threaded rod (120), and a limiting ring (122) is fixedly sleeved on the threaded rod (120), and the limiting ring (122) is rotatably disposed in the connecting groove (112).

3. The wafer measurement platform according to claim 1, characterized in that: The moving block (140) is rectangular, and the communicating groove (112) and the moving block (140) are adapted to each other.

4. The wafer measurement platform according to claim 1, characterized in that: The moving block (140) is provided with a limiting edge (141), and the limiting edge (141) is in contact with the inner wall of the connecting groove (112).

5. The wafer measurement platform according to claim 1, characterized in that: The adjusting slide rod (220) comprises a clamping plate (221) and a tightening knob (222), one end of the clamping plate (221) is slidably sleeved on the surface of the fixing rod (210), the tightening knob (222) and one side of the clamping plate (221) are rotationally connected, and the other side of the tightening knob (222) and the clamping plate (221) are threadedly connected.

6. The wafer measurement platform according to claim 5, characterized in that: A socket (223) is provided at one end of the clamping plate (221), and the bottom end of the thickness gauge (230) passes through the socket (223).

7. The wafer measurement platform according to claim 1, characterized in that: The fixing rod (210) and the platform block (110) are perpendicular to each other, and the bottom end of the fixing rod (210) is threadedly connected to the platform block (110).

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