Flux-cored brazing filler metal heating device

Abstract

The utility model provides a flux-cored brazing filler metal heating device, and relates to the technical field of brazing filler metal. Specifically, the flux-cored brazing filler metal heating device comprises a flux-cored brazing filler metal fixing unit, and a first heating unit, a second heating unit and a third heating unit which are sequentially arranged from bottom to top; wherein the flux-cored brazing filler metal fixing unit comprises a fixing assembly and a glass tube, and the third heating unit comprises a heat strengthening sleeve and a strong heat source; the strong heat source is arranged outside the heat strengthening sleeve, and the heat strengthening sleeve is arranged outside the glass tube. According to the utility model, the three vertically arranged heating units are adopted to carry out gradient heating on the flux-cored brazing filler metal, and the flux-cored brazing filler metal in the brazing heating process is divided into different melting areas according to the reaction progress of a brazing filler metal skin and a powder core melt interface; therefore, the interface reaction of the outer skin and the powder inner core of the flux-cored brazing filler metal is represented, the effect of the in-situ reaction process and the structure evolution behavior in the flux-cored brazing filler metal is revealed, and the method has important practical significance.

Description

Technical Field

[0001] The utility model relates to the technical field of solders, and particularly to a heating device for a flux-cored solder. Background Art

[0002] A flux-cored solder is a solder product made by wrapping a flux core (or other functional powders) with an alloy solder outer skin; compared with the discrete use of solders and fluxes, the flux-cored solder can keep the dosage relationship between the flux and the solder constant, greatly simplify the soldering process flow and operation difficulty, eliminate the need for additional flux addition, promote the automation development of soldering, accelerate the implementation efficiency of conventional soldering applications, and at the same time achieve advantages such as beautiful welded joints, good seam filling performance, low welding leakage rate, and clean environmental protection.

[0003] Therefore, the popularization and application of flux-cored solders have great prospects; but it also means that when replacing the combination of conventional solders and fluxes with flux-cored solders, the corresponding soldering process will change to a certain extent; for example, it is necessary to explore the soldering temperature suitable for flux-cored solders to achieve a good interfacial reaction between the coating and the core, and correspondingly obtain a completely melted and mutually fused solder metal phase, and how the formed solder metal phase further reacts with the metal to be welded, etc. In addition, the exploration of the interfacial reaction between the coating and the core can also accelerate the development of flux-cored solder varieties, and has extremely strong practical significance for the selection and proportioning of the components of the coating and the core.

[0004] However, the existing heating equipment is difficult to be applicable to the research on the interfacial mechanism of flux-cored solders. Currently, when conducting such research, usually a heat source, usually an induction coil, is set outside a certain test section of the flux-cored solder, and the test section of the flux-cored solder is heated, and samples are taken and tested in the middle, end, and preheating section outside the test section, and characteristic results at different temperatures are obtained through means such as SEM, EDS, and XRD, and then the interfacial reaction is speculated. However, the thermal conductivity of flux-cored solders is usually very good, it is difficult to form a stable melting section or partially melted section, and it is difficult to determine the specific interfacial reaction behavior of flux-cored solders through one or several tests. In addition, when the temperature is higher than the melting point of the flux-cored solder, the test section of some flux-cored solders may collapse, so it is impossible to obtain the length information of regions with different interfacial reactions such as the melting section or partially melted section.

[0005] In view of this, the present utility model is specifically proposed. Content of the Utility Model

[0006] The purpose of the present utility model is to provide a heating device for flux-cored solder, which is used to realize the research and test of the interfacial reaction of the flux-cored solder, and is used to assist in the design and development of the flux-cored solder and the exploration of its usage conditions, so as to make up for the technical gap of this type of heating equipment. The present utility model quickly heats the flux-cored solder by adopting three vertically arranged heating units, and forms a temperature gradient field outside the flux-cored solder. According to whether the interface between the solder sheath and the powder core melt undergoes complete reaction, partial reaction or no reaction, the flux-cored solder in the brazing heating process is divided into a melting zone, a partial melting zone and an unmelted zone, so as to realize the characterization of the interfacial reaction between the sheath and the powder core of the flux-cored solder, and reveal the in-situ reaction process and microstructure evolution behavior in the flux-cored solder.

[0007] In order to achieve the above object of the present utility model, the following technical solutions are specifically adopted:

[0008] A heating device for flux-cored solder includes a flux-cored solder fixing unit, and a first heating unit, a second heating unit and a third heating unit arranged in sequence from bottom to top; wherein, the flux-cored solder fixing unit includes a fixing component and a glass tube, and the third heating unit includes a heat-strengthening sleeve and a strong heat source; the strong heat source is outside the heat-strengthening sleeve, and the heat-strengthening sleeve is outside the glass tube.

[0009] Preferably, the glass tube is movably connected to the fixing component; the fixing component is a groove structure, and the bottom of the glass tube is in the groove structure.

[0010] Preferably, the glass tube is arranged in a vertical direction, and the first heating unit, the second heating unit and the third heating unit are all arranged outside the glass tube.

[0011] Preferably, the heating device for flux-cored solder further includes: a sliding track, and the sliding track is arranged in a vertical direction; the first heating unit, the second heating unit and the third heating unit are connected to the sliding track from bottom to top.

[0012] Preferably, the heating device for flux-cored solder further includes one or more of a first positioning unit, a second positioning unit and a third positioning unit; the first positioning unit is connected to the first heating unit, the second positioning unit is connected to the second heating unit, and the third positioning unit is connected to the third heating unit.

[0013] Preferably, the first heating unit includes a weak heat source, and the second heating unit includes a medium heat source; the weak heat source, the medium heat source and the strong heat source respectively include one or more of an induction heating component, a resistance heating component, a laser heating component, a graphite heating component or a molybdenum heating component.

[0014] More preferably, the weak heat source, the medium heat source and the strong heat source are independently provided with induction heating components; the induction heating components include induction coils, power supplies and temperature control systems.

[0015] Preferably, the inner diameter of the glass tube ranges from 0.6 mm to 5.2 mm; the inner diameter of the heat-strengthening sleeve ranges from 5.8 mm to 10.4 mm.

[0016] Preferably, the height of the glass tube ranges from 20 mm to 150 mm; the height of the heat-strengthening sleeve ranges from 5 mm to 50 mm.

[0017] Preferably, the material of the heat-strengthening sleeve includes graphite or silicon carbide.

[0018] Compared with the prior art, the beneficial effects of the present utility model are as follows: Based on conventional means, it is very difficult to obtain stable and complete melting when a single heat source is used to heat the cored solder alone, and the melted solder will flow and collapse, resulting in obvious migration and instability of the "complete melting zone" and "partial melting zone" of the cored solder, and the height of the partial melting zone is small and cannot be adjusted. In contrast, the present utility model designs to use the glass tube with a size slightly larger than the diameter of the cored solder and sleeved outside the cored solder, so that the complete melting zone and the partial melting zone can be stable without flowing and collapsing; at the same time, further design to use the heat-strengthening sleeve outside the glass tube, the diameter of which is larger than that of the glass tube, so that the cored solder in the upper part is more likely to generate a complete melting zone. In addition, the present utility model also uses three heating units with different heat positions to achieve the stability of the complete melting zone and the partial melting zone, and expand and control the height of the partial melting zone. Description of the Drawings

[0019] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0020] Figure 1 It is a schematic diagram of a cored solder heating device provided by the present utility model.

[0021] Reference Signs:

[0022] 1 - Cored Solder Fixing Unit;

[0023] 11 - Fixing Component;

[0024] 12 - Glass Tube;

[0025] 2 - First heating unit;

[0026] 3 - Second heating unit;

[0027] 4 - Third heating unit;

[0028] 41 - Heat - strengthened sleeve;

[0029] 42 - Strong heat source;

[0030] 01 - Powder core of the flux - cored solder;

[0031] 02 - Outer skin of the flux - cored solder. Detailed implementation manners

[0032] The technical solutions of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings and specific implementation manners. However, those skilled in the art will understand that the following described embodiments are some embodiments of the present utility model, rather than all embodiments, and are only used to illustrate the present utility model and should not be construed as limiting the scope of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model. For those conditions not specified in the embodiments, they are carried out according to conventional conditions or conditions recommended by the manufacturer. Those reagents or instruments not specified by the manufacturer can be obtained as conventional products through commercial purchase.

[0033] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation of the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0034] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0035] The present utility model is achieved through the following technical solutions: A flux-cored solder heating device includes a flux-cored solder fixing unit 1, and a first heating unit 2, a second heating unit 3, and a third heating unit 4 arranged in sequence from bottom to top; wherein, the flux-cored solder fixing unit 1 includes a fixing component 11 and a glass tube 12, and the third heating unit 4 includes a heat-strengthening sleeve 41 and a strong heat source 42; the strong heat source 42 is outside the heat-strengthening sleeve 41, and the heat-strengthening sleeve 41 is outside the glass tube 12. As Figure 1 shown, a schematic diagram of a feasible flux-cored solder heating device of the present utility model is provided. Exemplarily, at the center of Figure 1 , a flux-cored solder for implementing the present utility model is provided, including a powder core 01 of the flux-cored solder and an outer skin 02 of the flux-cored solder.

[0036] As a preferred embodiment, the glass tube 12 is movably connected to the fixing component 11.

[0037] As a preferred embodiment, the glass tube 12 is arranged in a vertical direction, and the first heating unit 2, the second heating unit 3, and the third heating unit 4 are all arranged outside the glass tube 12.

[0038] As a preferred embodiment, the fixing component 11 includes, but is not limited to, a clamping fixing piece, a base fixing piece, a magnetic fixing piece, etc.; the material of the fixing component 11 is not limited, and in a more preferred case, high melting point materials such as ceramics, refractory metals or alloys, and cemented carbides are selected.

[0039] As a more preferred embodiment, the fixing component 11 is a base fixing piece, that is, a cylindrical groove structure. By inserting the flux-cored solder and the glass tube 12 into the groove structure for fixing, the flux-cored solder is prevented from skewing or being in a non-vertical state; the inner diameter of the groove of the groove structure is slightly larger than the glass tube 12.

[0040] As a preferred embodiment, the flux-cored solder heating device is further provided with a second flux-cored solder fixing unit, and the second flux-cored solder fixing unit is arranged above the third heating unit 4; that is, through the cooperation of the flux-cored solder fixing unit and the second flux-cored solder fixing unit, the fixing is jointly achieved at the upper and lower ends of the flux-cored solder; regarding the type or material of the second flux-cored solder fixing unit, it is consistent with the selection range of the implementation manner of the flux-cored solder fixing unit, but there may be different specific selections from it.

[0041] As a more preferred embodiment, the second cored solder fixing unit is a base-type fixing member, that is, another cylindrical groove structure, and the inner diameter of the groove of the groove structure is slightly larger than the maximum diameter of the glass tube 12, or the inner diameter of the groove of the groove structure is slightly larger than the diameter of the cored solder; or, the second cored solder fixing unit is a clamping assembly to achieve clamping and fixing of the top of the cored solder or the glass tube 12.

[0042] As a preferred embodiment, the cored solder heating device is further provided with a sliding track, and the sliding track is arranged in the vertical direction; the first heating unit 2, the second heating unit 3 and the third heating unit 4 are arranged on the sliding track from bottom to top, and the height adjustment of the three in the vertical direction is realized based on the inherent function of the sliding track.

[0043] As a preferred embodiment, the cored solder heating device is further provided with one or more of a first positioning unit, a second positioning unit and a third positioning unit, and the first positioning unit is connected to the first heating unit 2, the second positioning unit is connected to the second heating unit 3, and the third positioning unit is connected to the third heating unit 4, and the height or position of the heating unit is adjusted respectively through each positioning unit.

[0044] It can be understood that the first positioning unit, the second positioning unit and the third positioning unit are not implemented simultaneously with the sliding track, and any one of them can be selected. In addition, the sliding track, the first positioning unit, the second positioning unit and the third positioning unit are all made of high-temperature resistant insulating materials, including but not limited to ceramics, mica, rubber or other polymer composite materials, etc. Through the sliding track or the positioning unit, the free movement of the heating unit in the vertical direction can be realized. Except for the purpose of exploring the reaction mechanism, a single cored solder can be experimented multiple times to improve the utilization rate of experimental samples.

[0045] As a more preferred embodiment, one or more of the first positioning unit, the second positioning unit and the third positioning unit adopt a positioning bracket assembly; in some alternative embodiments, the horizontal projections of the first positioning unit, the second positioning unit and the third positioning unit are mutually at an angle of 120 degrees.

[0046] As a preferred embodiment, the first heating unit 2 is provided with a weak heat source, and the second heating unit 3 is provided with a medium heat source; thus, different regions of the flux-cored solder are heated by the weak heat source, the medium heat source and the strong heat source 42 respectively. In actual operation, different temperature gradients are obtained by setting different heat source temperatures, so as to stabilize and adjust the region sizes of the completely melted zone and the partially melted zone of the flux-cored solder, and then effectively obtain the interfacial reaction situation and specification parameters of the flux-cored solder.

[0047] Specifically, the first heating unit 2 is mainly used to obtain the upper limit of the temperature of the unfused zone of the solder corresponding to the unreacted heating interface, prevent the temperature of the partially melted zone from rapidly conducting to the low-temperature zone at the bottom, and stabilize the temperature gradient and the height of the partially melted zone. The second heating unit 3 is mainly used to adjust the size of the temperature gradient, expand the height of the partially melted zone, and stabilize the completely melted zone and the partially melted zone. The third heating unit 4 is mainly used to form and obtain a complete melted zone. In addition, it should be emphasized that the "partially melted zone" in the present invention refers to a region where there is a certain melting phenomenon, but the interfacial reaction is not complete, and the "completely melted zone" or "melted zone" refers to a region where the interfacial reaction is complete and the core and coating components of the solder are evenly fused.

[0048] As a more preferred embodiment, the weak heat source, the medium heat source and the strong heat source 42 include but are not limited to induction heating components, resistance heating components, laser heating components, graphite heating components, molybdenum heating components, etc. It should be noted that the same selection range of three heat sources is given here, but it does not mean that the three heat sources must have the same selection; that is, the three heat sources can adopt a certain heating component at the same time, or can adopt different heating components.

[0049] As a further preferred embodiment, the weak heat source, the medium heat source and the strong heat source 42 all adopt induction heating components; it should be clear to those skilled in the art that the induction heating components are essential elements for implementing induction heating, including but not limited to inductors (commonly such as induction coils), power supplies, temperature control systems or optional cooling systems, etc. The present invention does not make any restrictions on the specific selection of the induction heating components.

[0050] As a preferred embodiment, the heat strengthening sleeve 41 and the strong heat source 42 are at the same horizontal height, that is, the outside of the glass tube 12 is the heat strengthening sleeve 41, and the same height outside the heat strengthening sleeve 41 is the strong heat source 42.

[0051] As a preferred embodiment, the inner diameter of the glass tube 12 is slightly larger than the diameter of the flux-cored solder; in some more preferred embodiments, the difference between the inner diameter of the glass tube 12 and the diameter of the flux-cored solder is ≤0.2 mm.

[0052] It is clear in the art that the diameter distribution range of the cored solder is 0.4 mm to 5 mm; therefore, as a more preferred embodiment, the inner diameter distribution range of the glass tube 12 is 0.6 mm to 5.2 mm.

[0053] As a preferred embodiment, the outer diameter range of the glass tube 12 is 5.6 mm to 10.2 mm. By using the glass tube 12, the molten solder is prevented from flowing or collapsing, and at the same time, it can also play a certain role in fixing the cored solder.

[0054] As a preferred embodiment, the inner diameter of the heat-strengthened sleeve 41 is slightly larger than the outer diameter of the glass tube 12; in some more preferred embodiments, the difference between the inner diameter of the heat-strengthened sleeve 41 and the outer diameter of the glass tube 12 is ≤ 0.2 mm.

[0055] As a more preferred embodiment, the inner diameter distribution range of the heat-strengthened sleeve 41 is 5.8 mm to 10.4 mm. By using the heat-strengthened sleeve 41, the heating effect is enhanced, so that the temperature rise effect of the solder in the heating part is greater than the heat conduction effect to the low temperature.

[0056] As a preferred embodiment, the height range of the glass tube 12 is 20 mm to 150 mm, and the height range of the heat-strengthened sleeve 41 is 5 mm to 50 mm.

[0057] As a preferred embodiment, the material of the heat-strengthened sleeve 41 includes graphite or silicon carbide.

[0058] Although the present invention has been illustrated and described with specific embodiments, it should be realized that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; those of ordinary skill in the art should understand that: without departing from the spirit and scope of the present invention, the technical solutions recorded in the foregoing embodiments can be modified, or some or all of the technical features can be equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention; therefore, this means that all such replacements and modifications that belong to the scope of the present invention are included in the appended claims.

Claims

1. A flux cored solder heating device, characterized in that: The heating device comprises a flux core solder fixing unit, and a first heating unit, a second heating unit and a third heating unit which are sequentially arranged from bottom to top; Wherein, the flux core solder fixing unit comprises a fixing assembly and a glass tube, and the third heating unit comprises a heat strengthening sleeve and a strong heat source; The strong heat source is outside the heat strengthening sleeve, and the heat strengthening sleeve is outside the glass tube.

2. The flux core solder heating device according to claim 1, characterized in that: The glass tube is movably connected to the fixing assembly; The fixing component is a groove structure, and the bottom of the glass tube is in the groove structure.

3. The flux cored solder heating device according to claim 1, characterized in that: The glass tube is arranged in a vertical direction, and the first heating unit, the second heating unit and the third heating unit are all arranged on the outside of the glass tube.

4. The flux cored solder heating device according to claim 1, characterized in that: The flux core solder heating device further comprises: a sliding track, and the sliding track is arranged in a vertical direction; The first heating unit, the second heating unit and the third heating unit are connected to the sliding track from bottom to top.

5. The flux cored solder heating device according to claim 1, characterized in that: The flux core solder heating device further comprises: one or more of a first positioning unit, a second positioning unit and a third positioning unit; The first positioning unit is connected to the first heating unit, the second positioning unit is connected to the second heating unit, and the third positioning unit is connected to the third heating unit.

6. The flux cored solder heating device according to claim 1, characterized in that: The first heating unit includes a weak heat source, and the second heating unit includes a medium heat source; The weak heat source, the medium heat source and the strong heat source respectively include one or more of an induction heating component, a resistance heating component, a laser heating component, a graphite heating component or a molybdenum heating component.

7. The flux core solder heating device according to claim 6, characterized in that: The weak heat source, the medium heat source and the strong heat source are independently provided with induction heating components; The induction heating assembly includes an induction coil, a power supply and a temperature control system.

8. The flux-cored solder heating device according to claim 1, characterized in that: The inner diameter of the glass tube is 0.6 mm to 5.2 mm; The inner diameter of the heat-enhanced sleeve is 5.8 mm to 10.4 mm.

9. The flux-cored solder heating device according to claim 1, characterized in that: The height of the glass tube ranges from 20 mm to 150 mm; The height of the heat-enhanced sleeve ranges from 5 mm to 50 mm.

10. The flux cored solder heating device according to claim 1, characterized in that: The material of the heat-enhanced sleeve includes graphite or silicon carbon.

Images