Double-layer shutter structure of wafer cleaning device and wafer cleaning device

Abstract

The utility model relates to a double-layer shutter structure of a wafer cleaning device and the wafer cleaning device. According to the double-layer shutter structure of the wafer cleaning device, the door body is of a double-layer structure, the inner layer is corrosion-resistant, the outer layer is a protective cover, and it is ensured that the door body is not corroded by cleaning liquid or gas overflowing from the wafer cleaning device after being used for a long time. The connecting rod is arranged to connect the door body and the sliding block, so that the driving piece, the sliding rail, the guide rail, the sliding block and the door body are isolated, cleaning liquid or gas is prevented from corroding easily-corroded parts, and the service life of the whole structure is prolonged. The wafer cleaning device applies the double-layer shutter structure of the wafer cleaning device.

Description

Technical Field

[0001] This application belongs to the technical field of wafer production equipment, and particularly relates to a double shutter structure for a wafer cleaning device and a wafer cleaning device. Background Art

[0002] In the semiconductor manufacturing process, wet etching equipment is used to precisely remove specific materials on the surface of a wafer. Corrosive cleaning liquids are usually required, and the corrosive cleaning liquids may splash out. At the same time, the corrosive components in the cleaning liquid may also escape. Therefore, anti-corrosion treatment needs to be carried out on the door structure. In particular, for mechanisms such as motors and slide rails that are easily corroded and have limited anti-corrosion means, a protection structure needs to be set up for protection. Summary of the Utility Model

[0003] The technical problem to be solved by this utility model is: to solve the deficiencies in the prior art, and thus provide a double shutter structure for a wafer cleaning device and a wafer cleaning device that are corrosion-resistant and have a long service life.

[0004] The technical solution adopted by this utility model to solve its technical problems is:

[0005] A double shutter structure for a wafer cleaning device includes:

[0006] A door body, which is a double-layer structure, including an outer protective plate and an inner door panel with an anti-corrosion coating on its surface located inside;

[0007] A mounting plate is located on one side of the door body. A driving member, a slide rail, a guide rail, and a slider are provided on the mounting plate; the slider is arranged on the slide rail and the guide rail, and the driving member can drive the slider to move on the slide rail and the guide rail;

[0008] The slider is connected to the door body through a connecting rod.

[0009] Preferably, in the double shutter structure for a wafer cleaning device of this utility model, the connecting rod is arranged between the guide rail and the slider.

[0010] Preferably, in the double shutter structure for a wafer cleaning device of this utility model, the driving member is a servo motor.

[0011] Preferably, in the double shutter structure for a wafer cleaning device of this utility model, a positioning block is further provided on the mounting plate, and the connecting rod passes through the positioning block so that the connecting rod can move horizontally under the restriction of the positioning block.

[0012] Preferably, in the double shutter structure for a wafer cleaning device of this utility model, a rubber layer is further provided between the outer protective plate and the inner door panel.

[0013] Preferably, for the double-layer shutter structure of the wafer cleaning device of the present utility model, the surface of the connecting rod is coated with an anti-corrosion coating.

[0014] The present utility model also provides a wafer cleaning device, which includes a wafer cleaning device main body and a closed installation box body located on one side of the wafer cleaning device main body;

[0015] The door body is arranged at the opening of the wafer cleaning device main body, the mounting plate is arranged inside the installation box body, and the connecting rod passes through the partition between the wafer cleaning device main body and the installation box body to connect the slider and the door body.

[0016] Preferably, for the wafer cleaning device of the present utility model, the outer protective plate is further provided with protrusions, which are used to trigger the first sensor and the second sensor arranged on the outer frame of the wafer cleaning device main body, and the first sensor and the second sensor respectively correspond to the closing position and the opening position of the door body.

[0017] Preferably, for the wafer cleaning device of the present utility model, the installation box body is provided with a ventilation hole for connecting with an air pipe, and the air pipe introduces gas into the installation box body to keep the inside of the installation box body at a positive pressure.

[0018] The beneficial effects of the present utility model are:

[0019] For the double-layer shutter structure of the wafer cleaning device of the present utility model, the door body is of a double-layer structure, with the inner layer being corrosion-resistant and the outer layer being a protective cover, ensuring that the door body is not corroded by the cleaning liquid or gas overflowing from the wafer cleaning device during long-term use. By arranging a connecting rod to connect the door body and the slider, the driving member, the slide rail, the guide rail, the slider and the door body are isolated from each other, preventing the cleaning liquid or gas from corroding these easily corroded components and improving the overall service life of the structure. Description of the Drawings

[0020] The technical solutions of the present application will be further described below with reference to the drawings and embodiments.

[0021] Figure 1 It is the front view of the inner side of the double-layer shutter structure of the wafer cleaning device according to the embodiment of the present application;

[0022] Figure 2 It is the three-dimensional view of the inner side of the double-layer shutter structure of the wafer cleaning device according to the embodiment of the present application;

[0023] Figure 3 It is the three-dimensional view of the outer side of the double-layer shutter structure of the wafer cleaning device according to the embodiment of the present application;

[0024] Figure 4 It is the front view of the wafer cleaning device with the double-layer shutter structure of the wafer cleaning device according to the embodiment of the present application;

[0025] The reference numerals in the drawings are:

[0026] 1 Door body;

[0027] 2 Mounting plate;

[0028] 3 Driving member;

[0029] 11 Inner door panel;

[0030] 12 Outer protective plate;

[0031] 13 Protrusion;

[0032] 21 Guide rail;

[0033] 22 Slide rail;

[0034] 23 Slide block;

[0035] 24 Positioning block;

[0036] 25 Connecting rod;

[0037] 41 First sensor;

[0038] 42 Second sensor;

[0039] 91 Main body of wafer cleaning device;

[0040] 92 Installation box. Detailed implementation manners

[0041] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0042] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the protection scope of the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0043] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0044] The technical solution of the present application will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0045] Embodiment

[0046] This embodiment provides a double shutter structure for a wafer cleaning device, as Figure 1 shown, including:

[0047] The door body 1 is a double-layer structure, including an outer protective plate 12 and an inner door plate 11 with an anti-corrosion coating on the inner surface.

[0048] The mounting plate 2 is located on one side of the door body 1. A driving member 3, a slide rail 22, a guide rail 21, and a slider 23 are provided on the mounting plate 2; the slider 23 is arranged on the slide rail 22 and the guide rail 21, and the driving member 3 can drive the slider 23 to move on the slide rail 22 and the guide rail 21.

[0049] The slider 23 is connected to the door body 1 through a connecting rod 25.

[0050] In the double shutter structure of the wafer cleaning device of this embodiment, the door body 1 is a double-layer structure, with a corrosion-resistant inner layer and a protective cover on the outer layer, ensuring that the door body 1 is not corroded by the cleaning liquid or gas overflowing from the wafer cleaning device during long-term use. By setting the connecting rod 25 to connect the door body 1 and the slider 23, the driving member 3, the slide rail 22, the guide rail 21, the slider 23 and the door body 1 are isolated from each other, preventing the cleaning liquid or gas from corroding these easily corroded components and improving the overall service life of the structure.

[0051] Furthermore, the connecting rod 25 is arranged between the guide rail 21 and the slider 23 so that the force received by the connecting rod 25 is relatively balanced.

[0052] Furthermore, the driving member 3 is a servo motor.

[0053] Furthermore, a positioning block 24 is also provided on the mounting plate 2, and the connecting rod 25 passes through the positioning block 24 so that the connecting rod 25 can move horizontally under the limitation of the positioning block 24.

[0054] Further, a rubber layer (sandwiched between two plates) is also provided between the outer protective plate 12 and the inner door panel 11 to play a role in buffering and shock absorption.

[0055] Further, the anti-corrosion coating is a PTFE coating (polytetrafluoroethylene coating). The surface of the connecting rod 25 is also coated with an anti-corrosion coating.

[0056] This embodiment also provides a wafer cleaning device, as Figure 4 shown, including a wafer cleaning device main body 91 and an enclosed installation box body 92 located on one side of the wafer cleaning device main body 91;

[0057] The door body 1 is arranged at the opening of the wafer cleaning device main body 91, the mounting plate 2 is arranged in the installation box body 92, and the connecting rod 25 passes through the partition between the wafer cleaning device main body 91 and the installation box body 92 to connect the slider 23 and the door body 1.

[0058] The mounting plate 2 and components such as the driving member 3, the slide rail 22, the guide rail 21, and the slider 23 on the mounting plate 2 are placed in the enclosed installation box body 92, which plays an isolation role to prevent the driving member 3, the slide rail 22, the guide rail 21, and the slider 23 from being corroded and improves the service life.

[0059] The outer protective plate 12 is further provided with a protrusion 13, and the protrusion 13 is used to trigger the first sensor 41 and the second sensor 42 provided on the outer frame of the wafer cleaning device main body 91, and the first sensor 41 and the second sensor 42 respectively correspond to the closing position and the opening position of the door body 1.

[0060] Both the first sensor 41 and the second sensor 42 are photoelectric sensors.

[0061] The mounting plate 2 is further provided with a temperature sensor for sensing the temperature inside the installation box body 92 to prevent the temperature inside the installation box body 92.

[0062] The installation box body 92 is provided with a ventilation hole for connecting with an air pipe, and the air pipe introduces gas into the installation box body 92 to keep the pressure inside the installation box body 92 positive, so that the gas will not enter the installation box body 92 through the through hole where the connecting rod 25 passes through.

[0063] Inspired by the above ideal embodiments according to the present application, through the above description, relevant staff can completely make various changes and modifications without departing from the technical idea of this application. The technical scope of this application is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A double-layer shutter structure for a wafer cleaning device, characterized in that: include: The door body (1) is a double-layer structure, comprising an outer protective plate (12) and an inner door plate (11) located on the inner side and coated with an anti-corrosion coating; A mounting plate (2) is located on one side of the door body (1); a driving member (3), a slide rail (22), a guide rail (21), and a slider (23) are arranged on the mounting plate (2); the slider (23) is arranged on the slide rail (22) and the guide rail (21); the driving member (3) is capable of driving the slider (23) to move on the slide rail (22) and the guide rail (21); The sliding block (23) is connected to the door body (1) via a connecting rod (25).

2. The double-layer shutter structure of the wafer cleaning device according to claim 1, characterized in that: The connecting rod (25) is arranged between the guide rail (21) and the sliding block (23).

3. The double-layer shutter structure of the wafer cleaning device according to claim 1, characterized in that: The driving component (3) is a servo motor.

4. The double-layer shutter structure of the wafer cleaning device according to claim 1, characterized in that: A positioning block (24) is also provided on the mounting plate (2), and the connecting rod (25) passes through the positioning block (24), so that the connecting rod (25) can move in a horizontal direction under the restriction of the positioning block (24).

5. The double-layer shutter structure of the wafer cleaning device according to claim 1, characterized in that: A rubber layer is also provided between the outer protection plate (12) and the inner door plate (11).

6. The double-layer shutter structure of the wafer cleaning device according to claim 1, characterized in that: The surface of the connecting rod (25) is coated with an anti-corrosion coating.

7. A wafer cleaning device having a double-layer shutter structure of a wafer cleaning device according to any one of claims 1 to 6, characterized in that: It comprises a wafer cleaning device body (91) and a sealed installation box (92) located on one side of the wafer cleaning device body (91); The door body (1) is arranged at an opening of a wafer cleaning device body (91), the mounting plate (2) is arranged in a mounting box (92), and a connecting rod (25) passes through a partition between the wafer cleaning device body (91) and the mounting box (92) to connect the slider (23) to the door body (1).

8. The wafer cleaning device according to claim 7, characterized in that: The outer protective plate (12) is also provided with a protrusion (13), and the protrusion (13) is used to trigger a first sensor (41) and a second sensor (42) provided on the outer frame of the wafer cleaning device body (91), the first sensor (41) and the second sensor (42) respectively corresponding to the closed position and the open position of the door body (1).

9. The wafer cleaning device according to claim 7, characterized in that: The installation box (92) is provided with a vent hole for connecting to an air pipe, and the air pipe allows gas to be introduced into the installation box (92) so that a positive pressure is maintained in the installation box (92).

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