Wafer mounting machine

Abstract

The utility model provides a wafer mounting machine. The wafer mounting machine comprises a chuck; clamping parts are arranged at the tops of the ejector pins, conductive fibers are arranged in the clamping parts, the output end of the chuck drives the ejector pins to rotate, and the clamping parts of the ejector pins are used for fixing a wafer; the output end of the power source is connected with the input end of the chuck; and the control panel is electrically connected to the conductive fibers, and the control panel detects on-off signals of the conductive fibers so as to detect the abrasion loss of the clamping part. According to the utility model, the chip breaking risk of the machine table can be reduced, the damage to parts and parts of the machine table is reduced, the operation time of the machine table is prolonged, and the risk caused by the abrasion of the ejector pin to the product yield is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and particularly to a wafer mounting machine. Background Art

[0002] In semiconductor processing technologies such as etching, deposition, and lithography, it is necessary to stably and accurately fix a wafer on a mounting machine to ensure efficient chip production. On existing wafer mounting machines, multiple pins provide uniform support points, enabling the wafer to remain flat during processing and avoiding wafer bending or cracking due to uneven stress. The pins will wear during the process of clamping the wafer. It is impossible for only the staff to accurately judge the wear degree of the pins. The worn pins will bring risks such as wafer fragmentation, damage to machine parts, and an increase in the maintenance time of the mounting machine. Therefore, there is room for improvement. Summary of the Utility Model

[0003] The utility model provides a wafer mounting machine to solve the technical problems in the prior art that worn pins will cause wafer fragmentation, damage to machine parts, and an increase in the maintenance time of the mounting machine.

[0004] A wafer mounting machine provided by the utility model includes:

[0005] A chuck;

[0006] Multiple pins, each having a clamping portion at its top, and conductive fibers are provided inside the clamping portion. The output end of the chuck drives the multiple pins to rotate, and the clamping portions of the multiple pins are used to fix the wafer;

[0007] A power source, whose output end is connected to the input end of the chuck; and

[0008] A control board, which is electrically connected to the conductive fibers through electric connection wires, and the electric connection wires and the conductive fibers form a conductive closed loop.

[0009] In an embodiment of the utility model, electric connection wires are provided between the clamping portion of the pin and the control board, and the conductive fibers and the electric connection wires form a closed loop.

[0010] In an embodiment of the utility model, a gear is provided at the bottom of the pin, the gear is connected to the output end of the chuck, and the central axis of the gear is parallel to the central axis of the clamping portion.

[0011] In an embodiment of the utility model, the pin includes a pin body, the pin body is connected between the clamping portion and the gear, and the central axis of the gear coincides with the central axis of the pin body.

[0012] In one embodiment of the present utility model, the chuck includes a toothed ring, and the gear meshes with the toothed ring.

[0013] In one embodiment of the present utility model, the chuck includes a mounting body, the gear is rotatably arranged at the bottom of the mounting body, and the toothed ring is rotatably arranged at the bottom of the mounting body.

[0014] In one embodiment of the present utility model, a plurality of connecting rods are connected to the inner side of the toothed ring, and the connecting rods are connected to the mounting body through elastic members.

[0015] In one embodiment of the present utility model, a rotating ring is connected to one end of the plurality of connecting rods away from the toothed ring, and the rotating ring is rotatably connected to the bottom of the mounting body.

[0016] In one embodiment of the present utility model, the number of the ejector pins is at least three.

[0017] In one embodiment of the present utility model, the control board is electrically connected to the power source, and the control board controls the output of the power source.

[0018] Advantages of the present utility model: An installation machine table for wafers proposed by the present utility model can reduce the risk of wafer breakage of the machine table, reduce the damage of machine table parts and components, improve the running time of the machine table, and reduce the risk to the yield of process products caused by the wear of the ejector pins. Description of the Drawings

[0019] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 It is a connection schematic diagram of the installation machine table for wafers provided by an embodiment of the present utility model.

[0021] Figure 2 It is a front view between the chuck and the ejector pins provided by an embodiment of the present utility model.

[0022] Figure 3 It is a bottom view between the chuck and the ejector pins provided by an embodiment of the present utility model.

[0023] Explanation of the Reference Numerals in the Drawings

[0024] 10. Chuck; 110. Installation body; 120. Gear ring; 130. Rack; 140. Connecting rod; 150. Elastic member; 160. Rotating ring; 20. Thimble; 210. Gear; 220. Thimble body; 230. Clamping portion; 240. Conductive fiber; 30. Power source; 40. Control board; 50. Wafer. Detailed implementation manners

[0025] The following uses specific specific examples to illustrate the implementation manners of the present utility model. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. The present utility model can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present utility model. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0026] It should be noted that the drawings provided in the following embodiments only illustrate the basic concept of the present utility model in a schematic manner. Therefore, only the components related to the present utility model are shown in the drawings, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and ratio of each component in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0027] In the following description, a large number of details are explored to provide a more thorough explanation of the embodiments of the present utility model. However, it is obvious to those skilled in the art that the embodiments of the present utility model can be implemented without these specific details. In other embodiments, well-known structures and devices are shown in the form of block diagrams rather than in detail to avoid making the embodiments of the present utility model difficult to understand.

[0028] Please refer to Figures 1 to 3 , the present utility model proposes an installation machine for wafers, which can be applied in semiconductor processing technologies such as etching, deposition, and lithography. By stably and precisely fixing the wafer on the installation machine, the efficient production of chips can be ensured. The present utility model can reduce the risk of wafer breakage on the machine, reduce damage to machine parts and components, increase the running time of the machine, and reduce the risk to the yield of process products caused by thimble wear. The following is a detailed description through specific embodiments.

[0029] Please refer to Figure 1, the present utility model provides a wafer mounting machine, which may include a chuck 10, ejector pins 20, a power source 30, and a control board 40. The ejector pins 20 may penetrate through the top wall of the chuck 10, that is, the clamping portion 230 provided at the top of the ejector pins 20 is located on the top wall of the chuck 10, and the remaining components of the ejector pins 20 are located inside the chuck 10. The chuck 10 can drive the ejector pins 20 to rotate. The number of ejector pins 20 is multiple, and the number of ejector pins 20 is at least three. For example, the number of ejector pins 20 is six. The clamping portions 230 of more than three ejector pins 20 are used to clamp and fix the wafer 50. For example, first, the chuck 10 drives the multiple ejector pins 20 to rotate. Secondly, the wafer 50 is placed on the chuck 10. Then, the chuck 10 returns the multiple ejector pins 20 to the initial position to enable the clamping portions 230 on the multiple ejector pins 20 to clamp the wafer 50.

[0030] Please refer to Figure 1 , in an embodiment of the present utility model, conductive fibers 240 are provided inside the clamping portion 230 of the ejector pins 20. A rotating assembly may be provided inside the chuck 10, and the rotating assembly is used to drive the ejector pins 20 to rotate. The output end of the power source 30 is connected to the input end of the rotating assembly, that is, the power source 30 drives the rotating assembly to rotate. The control board 40 is electrically connected to the conductive fibers 240 through an electrical connection wire, and the electrical connection wire and the conductive fibers 240 may form a conductive closed loop. The control board 40 is used to detect the on-off signal of the conductive fibers 240 to detect the wear amount of the clamping portion 230. For example, when the control board 40 detects the conduction signal of the conductive fibers 240, that is, the conductive fibers 240 remain continuous, it indicates that the wear amount of the clamping portion 230 of the ejector pins 20 is negligible, and the ejector pins 20 can be kept in normal use without replacement. When the control board 40 detects the cut-off signal of the conductive fibers 240, that is, the conductive fibers 240 are broken, it indicates that the wear amount of the clamping portion 230 of the ejector pins 20 is relatively large, and the ejector pins 20 need to be replaced.

[0031] Please refer to Figure 1, in an embodiment of the present utility model, an electrical connection line is provided between the clamping portion 230 of the ejector pin 20 and the control board 40, and a closed loop is formed between the electrical connection line and the conductive fiber 240. For example, the conductive fiber 240 penetrates through the ejector pin 230, the conductive fiber 240 extends from the clamping portion 230 to the bottom of the ejector pin 20, and the conductive fiber 240 at the bottom of the ejector pin 20 is electrically connected to the control board 40 through the electrical connection line. The control board 40 detects the on-off signal of the closed loop. When detecting the conduction signal of the closed loop, that is, the conductive fiber 240 remains continuous, it indicates that the wear amount of the clamping portion 230 of the ejector pin 20 is negligible. When detecting the cut-off signal of the closed loop, that is, the conductive fiber 240 breaks, it indicates that the wear amount of the clamping portion 230 of the ejector pin 20 is relatively large. Through the improvement scheme in the present utility model, the problem that the ejector pin 20 will be worn during the process of clamping the wafer 50 and it is impossible for the staff to accurately judge the wear degree of the ejector pin 20 only by themselves is solved. That is, the improvement scheme of the present utility model enables the staff not to need to regularly replace the ejector pin 20 every month, nor to arrange the staff to regularly check the wear condition of the ejector pin 20, improves the intelligent level of the machine tool, reduces the quality inspection cost of the staff, and reduces the impact of the wear of the ejector pin 20 on the yield of the wafer 50 products.

[0032] Please refer to Figure 1 , in an embodiment of the present utility model, the ejector pin 20 includes a gear 210, an ejector pin body 220, and a clamping portion 230. The gear 210 is arranged at the bottom of the ejector pin 20. As mentioned above, the clamping portion 230 is arranged at the top of the ejector pin 20, and the ejector pin body 220 is connected between the gear 210 and the clamping portion 230. The central axis of the gear 230 coincides with the central axis of the ejector pin body 220. The central axis of the clamping portion 230 is parallel to the central axis of the ejector pin body 220, and the clamping portion 230 is arranged at one side position at the top of the ejector pin body 220.

[0033] Please refer to Figure 1 , in an embodiment of the present utility model, the control board 40 is electrically connected to the power source 30, and the control board 40 can control the output of the power source 30, that is, the control board 40 can control whether the power source 30 outputs externally and the magnitude of the external output of the power source 30. The power source 30 can be a driving motor. Of course, the power source 30 is not limited to the driving motor only. The power source 30 can also be performed manually, that is, the rotating component is driven manually. In the present utility model, the control board 40 controls the power source 30, which improves the intelligent level of the machine tool, reduces the quality inspection cost of the staff, and improves the operation time of the machine tool.

[0034] Please refer to Figure 2 and Figure 3, in an embodiment of the present utility model, the chuck 10 includes an installation main body 110, and the rotation assembly includes a gear ring 120, a rack 130, a connecting rod 140, an elastic member 150, and a rotating ring 160. The installation main body 110, the gear ring 120, and the rotating ring 160 can all be circular in shape. The gear 230 of the thimble 20 is rotatably arranged at the bottom of the installation main body 110, the gear ring 120 is rotatably arranged at the bottom of the installation main body 110, and the multiple gears 230 corresponding to the multiple thimbles 20 are meshed with the gear ring 120. The multiple thimbles 20 can be axially symmetrically arranged or centrally symmetrically arranged with respect to the center point of the gear ring 120. For example, a rack 130 is provided on the outer edge of the gear ring 120, and one rack 130 can cooperate with the gear 230 of one thimble 20. When the power source 30 drives the gear ring 120 to rotate, the rack 130 on the gear ring 120 can drive the multiple gears 230 to rotate, that is, the rotation of the multiple thimbles 20 is realized.

[0035] Please refer to Figure 1 , Figure 2 and Figure 3 , in an embodiment of the present utility model, when the thimble 20 is installed on the chuck 10, the connecting line of the center of the chuck 10, the center of the clamping portion 230, and the center of the thimble body 220 can be located on the radius of the chuck 10. Before the power source 30 drives the rotation assembly, the clamping portion 230 above the thimble body 220 is located on the side close to the center of the chuck 10. At this time, the connecting line of the center of the chuck 10, the center of the clamping portion 230, and the center of the thimble body 220 is located in the radial direction of the chuck 10. After the power source 30 drives the rotation assembly, the rotation assembly drives the rotating ring 160 to rotate, and the rotating ring 160 can drive the connecting rod 140 and the gear ring 120 to rotate. The gear ring 120 further drives the thimble 20 to rotate. The clamping portion 230 above the thimble body 220 is located on the side far from the center of the chuck 10. The wafer 50 can be placed between the multiple thimbles 20 above the chuck 10. At this time, the connecting line of the center of the chuck 10, the center of the thimble body 220, and the center of the clamping portion 230 is located in the radial direction of the chuck 10.

[0036] Please refer to Figure 2 and Figure 3, in an embodiment of the present utility model, a plurality of connecting rods 140 are connected to the inner side of the gear ring 120, and the plurality of connecting rods 140 can be connected to the mounting body 110 through elastic members 150. A rotating ring 160 is connected to one end of the plurality of connecting rods 140 away from the gear ring 120. The rotating ring 160 is rotatably connected to the bottom of the mounting body 110, and the rotating ring 160 can be connected to the power source 30. The elastic member 150 can be a spring or other elastic elements. After the power source 30 drives the rotating ring 160 and the connecting rods 140 to rotate, under the elastic action of the elastic member 150, the elastic member 150 deforms. When the power source 30 stops driving the rotating ring 160, since the elastic member 150 needs to release the stored energy, the elastic member 150 can drive the connecting rods 140 to rotate so that the connecting rods 140 and the gear ring 120 return to the initial state.

[0037] Please refer to Figure 2 and Figure 3 , in an embodiment of the present utility model, the process of mounting the wafer 50 on the chuck 10 is as follows. First, under the action of the power source 30, the rotating ring 160 rotates, and under the action of the plurality of connecting rods 140, the gear ring 120 rotates. The racks 130 on the outer edge of the gear ring 120 drive the plurality of gears 230 to rotate, that is, the plurality of ejector pins 20 rotate. The rotation angle of the ejector pins 20 can be 135°, and during the rotation, the ejector pins 20 can maintain a perpendicular relationship with the chuck 10. Second, after the plurality of ejector pins 20 rotate, the wafer 50 is placed on the chuck 10. Then, after the wafer 50 is placed on the chuck 10, when the power source 30 stops driving the rotating ring 160, the elastic member 150 returns to the initial state, the elastic member 150 drives the connecting rods 140 to rotate, and the connecting rods 140 drive the gear ring 120 to rotate. The racks 130 on the outer edge of the gear ring 120 drive the plurality of gears 230 to rotate, that is, the plurality of ejector pins 20 return to the initial position, and the clamping portions 230 on the plurality of ejector pins 20 clamp the wafer 50.

[0038] Please refer to Figure 1 , Figure 2 and Figure 3, in an embodiment of the present utility model, during the normal use of the wafer mounting machine, the control board 40 detects the on-off signal of the closed loop formed by the electrical connection line and the conductive fiber 240, and the receiving end of the control board 40 receives the on-off signal of the closed loop. After the control board 40 detects the conduction signal of the closed loop, the sending end of the control board 40 sends a signal to the power source 30, and the power source 30 drives the rotating ring 160 to rotate. Under the action of multiple connecting rods 140, the toothed ring 120 rotates. The rack 130 on the outer edge of the toothed ring 120 drives multiple gears 230 to rotate, that is, multiple ejector pins 20 rotate. After multiple ejector pins 20 rotate, the wafer 50 is placed on the chuck 10. After the wafer 50 is placed on the chuck 10, the sending end of the control board 40 sends a signal to the power source 30 again, so that the power source 30 stops driving the rotating ring 160. Since the energy stored in the elastic member 150 needs to be released, the elastic member 150 returns to its initial state, and the elastic member 150 drives the connecting rod 140 to rotate. The connecting rod 140 drives the toothed ring 120 to rotate. The rack 130 on the outer edge of the toothed ring 120 drives multiple gears 230 to rotate, that is, multiple ejector pins 20 return to their initial positions, and the clamping portions 230 on the multiple ejector pins 20 clamp the wafer 50.

[0039] Please refer to Figure 1 , Figure 2 and Figure 3 , in an embodiment of the present utility model, during the normal use of the wafer mounting machine, the control board 40 detects the on-off signal of the closed loop formed by the electrical connection line and the conductive fiber 240, and the receiving end of the control board 40 receives the on-off signal of the closed loop. After the control board 40 detects the cut-off signal of the closed loop, that is, when the clamping portion 230 on the ejector pin 20 is severely worn, the sending end of the control board 40 immediately sends a signal to the power source 30, so that the power source 30 stops driving the rotating assembly. When multiple ejector pins 20 above the chuck 10 clamp the wafer 50, or when multiple ejector pins 20 above the chuck 10 do not clamp the wafer 50, in the case where the power source 30 stops driving, the clamping portion 230 on the ejector pin 20 will be located on the side away from the center of the chuck 10. Then, the ejector pin 20 corresponding to the cut-off signal generated on the closed loop can be replaced to reduce the damage of the machine parts and components and improve the running time of the machine.

[0040] In summary, the present utility model provides a wafer mounting machine, which can reduce the risk of wafer breakage, reduce the damage of machine parts and components, improve the running time of the machine, and reduce the risk of affecting the yield of the process products due to the wear of the ejector pins.

[0041] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of methods and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagram may represent a module, a segment of a program, or a part of code that contains one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than that marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, and combinations of blocks in the block diagram and / or flowchart, may be implemented by a dedicated hardware-based system that performs the specified functions or operations, or may be implemented by a combination of dedicated hardware and computer instructions.

[0042] The above embodiments are only illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Any person familiar with this technology may modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. A wafer mounting machine, characterized in that: include: Chuck; A plurality of ejector pins, each having a clamping portion on its top, wherein a conductive fiber is arranged in the clamping portion, the chuck drives the plurality of ejector pins to rotate, and the clamping portions of the plurality of ejector pins are used to fix the wafer; a power source, the output end of which is connected to the input end of the chuck; and The control board is electrically connected to the conductive fiber through an electrical connection line, and the electrical connection line and the conductive fiber form a conductive closed loop.

2. The wafer mounting machine according to claim 1, characterized in that: The conductive fiber passes through the ejector pin, and the conductive fiber extends from the clamping portion to the bottom of the ejector pin. The conductive fiber at the bottom of the ejector pin is electrically connected to the control board through an electrical connection line.

3. The wafer mounting machine according to claim 1, characterized in that: A gear is provided at the bottom of the ejector pin, the gear is connected to the output end of the chuck, and the central axis of the gear is arranged parallel to the central axis of the clamping portion.

4. The wafer mounting machine according to claim 3, characterized in that: The ejector pin comprises an ejector pin body, the ejector pin body is connected between the clamping portion and the gear, and the gear and the ejector pin body are coaxially arranged.

5. The wafer mounting machine according to claim 3, characterized in that: The chuck includes a gear ring, and the gear meshes with the gear ring.

6. The wafer mounting machine according to claim 5, characterized in that: The chuck comprises a mounting body, the gear is rotatably arranged at the bottom of the mounting body, and the gear ring is rotatably arranged at the bottom of the mounting body.

7. The wafer mounting machine according to claim 6, characterized in that: A plurality of connecting rods are connected to the inner side of the gear ring, and the connecting rods are connected to the mounting body through elastic members.

8. The wafer mounting machine according to claim 7, characterized in that: One end of the plurality of connecting rods away from the gear ring is connected with a rotating ring, and the rotating ring is rotatably connected to the bottom of the installation body.

9. The wafer mounting machine according to claim 1, characterized in that: The number of the ejector pins is at least three.

10. The wafer mounting machine according to claim 1, characterized in that: The control board is electrically connected to the power source, and the control board controls the output of the power source.

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