High-computing-power server heat dissipation device

Abstract

The utility model discloses a high-computing-power server heat dissipation device, relates to the technical field of high-computing-power server equipment, and aims to solve the problems that when an existing server heat dissipation device is used, high-temperature air exhausted by the heat dissipation device can be absorbed by an adjacent heat dissipation device, so that the high-temperature air is recycled, and the service life of the server is prolonged. In order to solve the problem that the heat dissipation effect of a server is seriously influenced in the prior art, the utility model provides the following scheme that the server comprises a cabinet and a plurality of heat dissipation unit modules, the plurality of server unit modules are arranged in the cabinet, and the server unit modules are matched with the heat dissipation unit modules. The server unit module and the heat dissipation unit module which are convenient to install are arranged, so that cooling air can be kept in the same direction when passing through the server unit module, repeated use of high-temperature air is avoided, the heat dissipation effect is better, and the heat dissipation efficiency is improved by arranging the heat dissipation unit module which is convenient to disassemble, assemble and maintain. And therefore, overhaul and maintenance can be conveniently carried out.

Description

Technical Field

[0001] The utility model relates to the technical field of high computing power server equipment, and in particular to a heat dissipation device for a high computing power server. Background Art

[0002] A server is a high-performance computer device specially designed to provide computing, storage, network and other services. It is usually used to store and process large amounts of data, host websites, applications, provide network services, etc. Common servers include web servers, database servers, file servers, mail servers, high-computing servers, etc. Among them, high-computing servers are servers specially designed to handle large-scale computing tasks, and are usually used for applications and workloads that require a lot of computing resources, such as artificial intelligence, big data analysis, scientific computing, etc. These servers are usually equipped with powerful processors (CPU), large-capacity memory (RAM), high-performance graphics processors (GPU) and fast storage devices to provide high-performance computing capabilities.

[0003] After searching, a Chinese patent with authorization announcement number CN218768001U discloses a cabinet-type computing server, including a cabinet frame, a power module and a service unit module. The cabinet frame is provided with a first plug-in port and a second plug-in port, the first plug-in port is plugged with a power module and a service unit module, the second plug-in port is plugged with an air cooler, and the side wall of the cabinet frame is embedded with a line interface module, an indicator light module and a spare interface module; by structurally designing the entire cabinet frame, thereby providing an installation basis for different working modules, an air cooler is supplemented, and the cooling efficiency of the entire device is further improved, and the air cooling device of the original service unit module is supplemented, so that the chips and electronic components in the service unit module are at a relatively suitable working temperature, and the setting of the first plug-in port and the second plug-in port can ensure that the disassembly process of the entire device is relatively convenient, which is convenient for subsequent maintenance.

[0004] However, there are still some shortcomings in the above technology. When the existing server cooling device is in use, the high-temperature air discharged by the cooling device will be absorbed by the adjacent cooling device, resulting in the high-temperature air being recycled, which seriously affects the cooling effect of the server. For this reason, we propose a high-computing power server cooling device to solve this problem. Utility Model Content

[0005] The utility model is a high computing power server cooling device proposed to solve the problem that when the existing server cooling device is in use, the high-temperature air discharged by the cooling device will be absorbed by the adjacent cooling device, thereby causing the high-temperature air to be recycled and seriously affecting the cooling effect of the server.

[0006] To achieve the above object, the utility model adopts the following technical solutions:

[0007] A heat dissipation device for a high computing power server, comprising: a cabinet and a plurality of heat dissipation unit modules. A plurality of server unit modules are arranged in the cabinet, and the server unit modules are adapted to the heat dissipation unit modules. The server unit module includes a server main body, and a plurality of interfaces are arranged on the server main body. Two groups of guide plates are fixedly arranged at the bottom of the server main body. The heat dissipation unit module includes a plurality of groups of frames and a plurality of fans. Two limiting grooves are symmetrically formed in the fan, and a plurality of groups of limiting strips are fixedly arranged on the inner wall of the frame. The limiting grooves are adapted to the limiting strips. A plurality of fixing buckles are rotatably arranged on the front and rear sides of the frame. A return spring is fixedly sleeved on the outer side of the fixing buckle, and one end of the return spring is fixedly connected to the frame. A plurality of dust-proof nets are movably arranged on one side of the frame. The fan and the dust-proof net are respectively abutted against the corresponding fixing buckles. A group of fixing blocks are symmetrically arranged at the bottom of the frame, and the fixing blocks are adapted to the sliding grooves.

[0008] Preferably, the cabinet includes a plurality of support rods, and a plurality of partition plates are fixedly arranged on the support rods. The distances between the partition plates are the same. Fixing plates are fixedly arranged at one ends of the support rods located at the uppermost and lowermost positions respectively. A group of sliding grooves are symmetrically formed at the top of the partition plate, and the guide plates are adapted to the sliding grooves.

[0009] Preferably, an elastic cushion plate is fixedly arranged on the front side of the sliding groove, and a buffer baffle is fixedly arranged on the rear side of the sliding groove.

[0010] In the utility model, for the heat dissipation device of the high computing power server, by pushing a heat dissipation unit module along the sliding groove to the rear end position of the partition plate, through the interaction between the buffer baffle and the fixing block, the heat dissipation unit module can be fixed. Further, a server unit module is pushed along the sliding groove to the middle position of the partition plate; then, a heat dissipation unit module is pushed along the sliding groove to the front end position of the partition plate, and the heat dissipation unit module is fixed through the action of the elastic cushion plate; at this time, on one partition plate, a heat dissipation unit module is installed in front of and behind the server unit module located in the middle position of the partition plate, and the installation directions of the two heat dissipation unit modules are opposite, so that the air inlet and air outlet directions can be the same. When all the server unit modules and heat dissipation unit modules are installed, by starting the fan, the server unit modules can be cooled.

[0011] In the present utility model, for the described high-computing-power server heat dissipation device, when maintenance of the heat dissipation unit module is required, by rotating the fixing buckle, the fan and the dust-proof net can be removed. After maintenance, they are placed back in their original positions, and the reset spring will automatically drive the fixing buckle to reset, thereby being able to fix the fan and the dust-proof net;

[0012] By providing a server unit module and a heat dissipation unit module that can be conveniently installed, the present utility model enables the cooling air to maintain the same direction when passing through the server unit module, thereby avoiding the reuse of high-temperature air and achieving a better heat dissipation effect. By providing a heat dissipation unit module that can be conveniently disassembled, assembled, and maintained, maintenance and repair can be facilitated. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a three-dimensional structural schematic diagram of a high-computing-power server heat dissipation device proposed by the present utility model;

[0014] Figure 2 is a structural schematic diagram of the partition part of a high-computing-power server heat dissipation device proposed by the present utility model;

[0015] Figure 3 is a structural schematic diagram of the server unit module part of a high-computing-power server heat dissipation device proposed by the present utility model;

[0016] Figure 4 is a structural schematic diagram of the heat dissipation unit module part of a high-computing-power server heat dissipation device proposed by the present utility model;

[0017] Figure 5 is a structural schematic diagram of the dust-proof net part of a high-computing-power server heat dissipation device proposed by the present utility model;

[0018] Figure 6 is a structural schematic diagram of the heat dissipation unit module part of a high-computing-power server heat dissipation device proposed by the present utility model.

[0019] In the figure: 1, cabinet; 2, server unit module; 3, heat dissipation unit module; 101, support rod; 102, partition; 103, chute; 104, elastic cushion plate; 105, buffer baffle; 201, server main body; 202, interface; 203, guide plate; 301, frame; 302, fan; 303, limit groove; 304, limit strip; 305, fixing buckle; 306, reset spring; 307, dust-proof net; 308, fixing block. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments.

[0021] Referring to Figures 1-6 , an embodiment provided by this solution: a heat dissipation device for a high-computing power server, including: a cabinet 1 and multiple heat dissipation unit modules 3. A plurality of server unit modules 2 are arranged in the cabinet 1, and the server unit modules 2 are adapted to the heat dissipation unit modules 3.

[0022] In this embodiment, the cabinet 1 includes a plurality of support rods 101. A plurality of partition plates 102 are fixedly arranged on the support rods 101. The distances between the partition plates 102 are the same. Fixed plates are fixedly arranged at one ends of the support rods 101 located at the uppermost and lowermost positions respectively, which can facilitate the installation of the server unit modules 2 and the heat dissipation unit modules 3.

[0023] In this embodiment, a set of sliding grooves 103 are symmetrically opened on the top of the partition plate 102. An elastic cushion plate 104 is fixedly arranged on the front side of the sliding groove 103, and a buffer baffle 105 is fixedly arranged on the rear side of the sliding groove 103, which can facilitate the limitation of the server unit modules 2 and the heat dissipation unit modules 3.

[0024] In this embodiment, the server unit module 2 includes a server main body 201. A plurality of interfaces 202 are arranged on the server main body 201. Two groups of guide plates 203 are fixedly arranged at the bottom of the server main body 201. The guide plates 203 are adapted to the sliding grooves 103, which can facilitate the positioning of the server unit module 2 and facilitate installation.

[0025] In this embodiment, the heat dissipation unit module 3 includes multiple groups of frames 301 and a plurality of fans 302. Two limiting grooves 303 are symmetrically opened on the fans 302. A plurality of limiting strips 304 are fixedly arranged on the inner wall of the frame 301. The limiting grooves 303 are adapted to the limiting strips 304, which can facilitate the positioning of the fans 302 and facilitate installation.

[0026] In this embodiment, a plurality of fixed buckles 305 are rotatably arranged on the front and rear sides of the frame 301. A return spring 306 is fixedly sleeved on the outer side of the fixed buckle 305. One end of the return spring 306 is fixedly connected to the frame 301, which can facilitate the automatic reset of the fixed buckle 305 and is convenient to use.

[0027] In this embodiment, a plurality of dust-proof nets 307 are movably arranged on one side of the frame 301. The fan 302 and the dust-proof nets 307 are respectively abutted against the corresponding fixing buckles 305. A set of fixing blocks 308 are symmetrically arranged on the bottom of the frame 301. The fixing blocks 308 are adapted to the sliding grooves 103, which can facilitate providing a dust-proof effect for the server unit module 2 and the heat dissipation unit module 3.

[0028] In this embodiment, during use, on a single partition 102, first, a heat dissipation unit module 3 is pushed along the sliding groove 103 to the rear end position of the partition 102. Through the interaction between the buffer baffle 105 and the fixing block 308, the heat dissipation unit module 3 can be fixed. Further, a server unit module 2 is pushed along the sliding groove 103 to the middle position of the partition 102. Then, another heat dissipation unit module 3 is pushed along the sliding groove 103 to the front end position of the partition 102, and through the action of the elastic cushion plate 104, the heat dissipation unit module 3 is fixed. At this time, on one partition 102, a heat dissipation unit module 3 is installed in front of and behind the server unit module 2 at the middle position of the partition 102, and the installation directions of the two heat dissipation unit modules 3 are opposite, so that the air inlet and exhaust directions can be the same. When all the server unit modules 2 and heat dissipation unit modules 3 are installed, by starting the fan 302, the server unit module 2 can be cooled. When maintenance of the heat dissipation unit module 3 is required, by rotating the fixing buckle 305, the fan 302 and the dust-proof nets 307 can be removed. After maintenance, they are put back in place, and the reset spring 306 will automatically drive the fixing buckle 305 to reset, thereby being able to fix the fan 302 and the dust-proof nets 307.

[0029] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0030] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality of" means two or more, unless otherwise specifically defined.

[0031] The preferred embodiments of the present utility model disclosed above are only used to help illustrate the present utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the present utility model to the specific embodiments described. Obviously, according to the content of this specification, many modifications and variations can be made. These embodiments are selected and specifically described in this specification in order to better explain the principle and practical application of the present utility model, so that those skilled in the art can well understand and utilize the present utility model. The present utility model is only limited by the claims and their full scope and equivalents.

Claims

1. A heat dissipation device for a high computing power server, characterized in that: include: A cabinet (1) and a plurality of heat dissipation unit modules (3), wherein the cabinet (1) is provided with a plurality of server unit modules (2), the server unit modules (2) being compatible with the heat dissipation unit modules (3), the server unit modules (2) comprising a server body (201), the server body (201) being provided with a plurality of interfaces (202), two groups of guide plates (203) being fixedly provided on the bottom of the server body (201), the heat dissipation unit modules (3) comprising a plurality of frames (301) and a plurality of fans (302), two limit slots (303) being symmetrically provided on the fans (302), and a plurality of limit strips (304) being fixedly provided on the inner wall of the frame (301). The limiting groove (303) is matched with the limiting strip (304), and a plurality of fixing buckles (305) are rotatably arranged on both the front and rear sides of the frame (301). A reset spring (306) is fixedly sleeved on the outer side of the fixing buckle (305), and one end of the reset spring (306) is fixedly connected to the frame (301). A plurality of dustproof nets (307) are movably arranged on one side of the frame (301), and the fan (302) and the dustproof nets (307) are respectively abutted against the corresponding fixing buckles (305). A group of fixing blocks (308) are symmetrically arranged on the bottom of the frame (301), and the fixing blocks (308) are matched with the slide groove (103).

2. A high computing power server heat dissipation device according to claim 1, characterized in that: The cabinet (1) comprises a plurality of support rods (101), a plurality of partitions (102) are fixedly arranged on the support rods (101), the partitions (102) are spaced at the same distance from each other, a fixing plate is fixedly arranged on one end of the support rods (101) located at the top and the bottom respectively, a group of slide grooves (103) are symmetrically opened on the top of the partitions (102), and the guide plates (203) are adapted to the slide grooves (103).

3. A high computing power server heat dissipation device according to claim 2, characterized in that: An elastic pad (104) is fixedly arranged on the front side of the slide groove (103), and a buffer baffle (105) is fixedly arranged on the rear side of the slide groove (103).

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