Optical communication receiving device based on TO46 packaging

Abstract

The utility model discloses an optical communication receiving device based on TO46 packaging, which comprises a nickel-plated TO46 base, the top end of the nickel-plated TO46 base is respectively provided with a PCB (printed circuit board), a photoelectric chip and a trans-impedance amplifier, the PCB is used for electrically connecting the photoelectric chip and the trans-impedance amplifier with the nickel-plated TO46 base, the outer wall of the top of the nickel-plated TO46 base is sleeved with a cover body structure, and the cover body structure is arranged on the top of the nickel-plated TO46 base. The cover body structure is used for covering the top of the nickel-plated TO46 base, a plurality of pin mechanisms are arranged at the bottom of the nickel-plated TO46 base in a penetrating manner, and the plurality of pin mechanisms are used for electric connection. According to the utility model, the substrate is arranged by combining the nickel-plated TO46 base and the PCB, the nickel-plated TO46 base lead and the photoelectric chip are in transition connection through the PCB, and the stable circuit is additionally arranged between the nickel-plated TO46 base lead and the photoelectric chip in the PCB, so that signal capacitive reactance and inductive reactance can be adjusted to stabilize signal output; and meanwhile, the nickel-plated TO46 base is adopted, so that gold plating of the base can be reduced, and the manufacturing cost of the receiver is reduced.

Description

Technical Field

[0001] The utility model relates to the field of optoelectronic sensors, and particularly relates to an optical communication receiving device based on TO46 packaging. Background Art

[0002] Optical communication receiving devices are key components in optical communication systems, mainly responsible for receiving optical signals and converting them into electrical signals; among them, optical communication receiving devices based on TO46 packaging are widely used due to their compact structure and small size.

[0003] In existing such optical communication receiving devices, the optoelectronic chip inside is directly wire-bonded and led out through the TO46 base. At the same time, decoupling capacitors are added to adjust the signal output to ensure the stability of communication signal reception. In the existing such communication receiving devices, the part at the top of the lead of the TO46 base needs to be gold-plated, and 100% pure gold wires are required for welding during the gold-plating process. In this way, the manufacturing cost required for this device becomes higher. At the same time, since there is no corresponding circuit for stabilizing signals inside this device, decoupling capacitors need to be added to stabilize signal reception, and thus the signal reception stability of the receiver is not easy to control. Summary of the Utility Model

[0004] The purpose of the utility model is to provide an optical communication receiving device based on TO46 packaging to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the utility model provides the following technical solution: An optical communication receiving device based on TO46 packaging, including a nickel-plated TO46 base. A PCB board, an optoelectronic chip, and a transimpedance amplifier are respectively arranged at the top of the nickel-plated TO46 base. The PCB board is used for the electrical connection between the optoelectronic chip and the transimpedance amplifier and the nickel-plated TO46 base. A cover body structure is sleeved on the outer wall of the top of the nickel-plated TO46 base, and the cover body structure is used to cover the top of the nickel-plated TO46 base. A plurality of pin mechanisms are inserted through the bottom of the nickel-plated TO46 base, and the plurality of pin mechanisms are used for electrical connection.

[0006] Preferably, a plurality of connection plugs are arranged around the side of the top of the nickel-plated TO46 base, and the plurality of connection plugs are used to assist the docking of the cover body structure and the nickel-plated TO46 base.

[0007] Preferably, the cover body structure includes:

[0008] An optical metal tube cap, and a plurality of docking jacks are opened on the side of the bottom of the optical metal tube cap. The plurality of docking jacks are respectively slidably inserted and connected with the plurality of connection plugs;

[0009] The condenser cover is arranged in the middle of the top end of the optical metal tube cap. The condenser cover is a convex hemispherical structure and is used to condense light to the optoelectronic chip.

[0010] Preferably, a placement groove is formed in the middle of the top end of the PCB board. The optoelectronic chip is electrically connected to the top end of the nickel-plated TO46 base, and the optoelectronic chip penetrates through the placement groove. An electrical connection component for electrical connection is arranged between the optoelectronic chip and the transimpedance amplifier and the top end of the PCB board.

[0011] Preferably, the electrical connection component includes an electrical connection coil and a conductive sheet. The electrical connection coil is arranged on the top end of the PCB board and at the notch of the placement groove, and the conductive sheet is arranged on the top end of the PCB board and is electrically connected to the side of the electrical connection coil. The conductive sheet is electrically connected to the bottom end of the transimpedance amplifier.

[0012] Preferably, a plurality of through holes are formed in the side edges of the nickel-plated TO46 base and the top end of the PCB board in the vertical direction. All the through holes are used for inserting the pin mechanism, and an electrical connection structure for assisting the pin mechanism to conduct electricity with the PCB board is arranged at each of the through holes.

[0013] Preferably, the electrical connection structure includes solder pads. All the solder pads are arranged on the top end of the PCB board and are respectively located at the plurality of through holes. Electric connection tubes are arranged at the bottom ends of all the solder pads and inside the through holes. The top of the pin mechanism penetrates through the middle of the electric connection tube and through the top end of the PCB board. The bottom radius of the through hole formed in the nickel-plated TO46 base is twice the top radius.

[0014] Preferably, the pin mechanism includes:

[0015] A connecting pin, the top of the connecting pin is inserted and connected to the middle of the electric connection tube;

[0016] A connecting cap, the connecting cap is sleeved on the top of the connecting pin, and a guiding member for assisting the connecting pin to conduct electricity is arranged on the inner wall of the connecting cap;

[0017] A limiting sleeve, the limiting sleeve is sleeved on the top of the connecting pin, the limiting sleeve is inserted and connected to the bottom area of the through hole of the nickel-plated TO46 base, and a plurality of extrusion blocks are arranged on the outer wall of the limiting sleeve.

[0018] Preferably, the guiding member includes a connecting piece. The connecting piece is attached to the inner wall of the connecting cap. A fixing nail for fixing the two is inserted and connected between the connecting piece and the connecting cap. A bent clamping part is arranged at the top of the connecting piece, a connecting ring is arranged at the bottom of the connecting piece, and a first contact part and a second contact part for contact conduction are symmetrically arranged at the bottom of the connecting ring.

[0019] Technical effects and advantages of the present utility model:

[0020] The present utility model first adopts a method of combining a nickel-plated TO46 base with a PCB board for substrate setting. The nickel-plated TO46 base lead and the optoelectronic chip are connected through the PCB circuit board. By adding a stable circuit between the two connections within the PCB board, the signal capacitive reactance and inductive reactance can be adjusted to stabilize the signal output. At the same time, using a nickel-plated TO46 base can reduce the gold plating of the base and lower the manufacturing cost of the receiver. Description of the drawings

[0021] Figure 1 It is a schematic diagram of the overall structure of the optical communication receiving device of the present utility model.

[0022] Figure 2 It is a top view of the overall structure of the optical communication receiving device of the present utility model.

[0023] Figure 3 It is a bottom view of the overall structure of the optical communication receiving device of the present utility model.

[0024] Figure 4 It is a schematic diagram of the structure of the optical communication receiving device of the present utility model with the cover structure removed.

[0025] Figure 5 It is a side view of the structure of the optical communication receiving device of the present utility model with the cover structure removed.

[0026] Figure 6 It is a top view of the structure of the optical communication receiving device of the present utility model with the cover structure removed.

[0027] Figure 7 It is a cross-sectional view of the connection between the pin mechanism, the nickel-plated TO46 base and the PCB board of the present utility model.

[0028] Figure 8 It is a cross-sectional view of the structure at the connection cap of the present utility model.

[0029] Figure 9 It is a flow chart of the operation steps of the packaging method of the present utility model.

[0030] In the figure: 1. Nickel-plated TO46 base; 101. Connection plug; 2. Optical metal tube cap; 3. Condensing cover; 4. PCB board; 5. Optoelectronic chip; 6. Transimpedance amplifier; 7. Power connection coil; 8. Conductive sheet; 9. Solder pad; 901. Power connection tube; 10. Connection cap; 11. Connection pin; 12. Limiting sleeve; 1201. Extrusion block; 13. Guide member; 1301. Connection piece; 1302. Bent clamping portion; 1303. Connection ring; 1304. First contact portion; 1305. Second contact portion; 14. Fixing nail. Detailed implementation manners

[0031] Next, in combination with the accompanying drawings in the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0032] Embodiment 1, the present invention provides an optical communication receiving device based on TO46 package as shown in Figure 1 - Figure 8 . The device includes a nickel-plated TO46 base 1. At the top of the nickel-plated TO46 base 1, a PCB board 4, a photoelectric chip 5, and a transimpedance amplifier 6 are respectively arranged. The PCB board 4 is used for the electrical connection between the photoelectric chip 5 and the transimpedance amplifier 6 and the nickel-plated TO46 base 1.

[0033] It should be noted that TO represents coaxial package, and 46 in TO46 means that the diameter of the TO cap is 4.6 mm. The diameter of the TO base is larger than that of the cap at the two parts where they are welded together. The radius of the top part is smaller than that of the bottom part, so as to support the cover body structure through the bottom.

[0034] The photoelectric chip 5, as a photosensitive element, is used to convert the light intensity into current; and it is of APD, PD type. The depletion layer of APD is heavily doped so that it can withstand high voltage. After photo-generated carriers are generated, they are accelerated by a high-voltage electric field, causing them to continue to collide with other atoms, generating more photo-generated carriers, achieving a multiplication effect similar to avalanche, and greatly improving the sensitivity of the receiver.

[0035] The transimpedance amplifier 6 is an amplifier that converts an input current into an output voltage. It is commonly used in applications such as photodetectors to convert optical signals into electrical signals. The basic principle of the transimpedance amplifier 6 is to use an operational amplifier (Op-Amp) and a feedback resistor (Rf) to achieve the conversion of input current to output voltage. The input current flows into the operational amplifier through the feedback resistor, and the operational amplifier generates an output voltage according to the values of the input current and the feedback resistor.

[0036] Specifically, a placement groove is formed in the middle of the top of the PCB board 4. The photoelectric chip 5 is electrically connected to the top of the nickel-plated TO46 base 1, and the photoelectric chip 5 passes through the placement groove. Electric connection components for electrical connection are arranged between the photoelectric chip 5 and the transimpedance amplifier 6 and the top of the PCB board 4.

[0037] It should be noted that through the design of the PCB board 4 in this solution, the signal capacitance and inductance can be adjusted to stabilize the signal output by bridging the leads of the nickel-plated TO46 base 1 and the photoelectric chip 5, thereby ensuring the stability of signal reception.

[0038] Further, the power connection component includes a power connection coil 7 and a conductive sheet 8. The power connection coil 7 is arranged at the top end of the PCB board 4 and located at the notch of the placement groove. The conductive sheet 8 is arranged at the top end of the PCB board 4 and is electrically connected to the side of the power connection coil 7. The conductive sheet 8 is electrically connected to the bottom end of the transimpedance amplifier 6, and the electrical transmission and conduction are realized by the conductive sheet 8 and the power connection coil 7.

[0039] A cover structure is sleeved on the outer wall of the top of the nickel-plated TO46 base 1.

[0040] Specifically, a plurality of connection plugs 101 are arranged around the side of the top end of the nickel-plated TO46 base 1, and the plurality of connection plugs 101 are used to assist in the docking of the cover structure and the nickel-plated TO46 base 1.

[0041] Further, the cover structure includes:

[0042] An optical metal tube cap 2, and a plurality of docking jacks are opened on the side of the bottom of the optical metal tube cap 2, and the plurality of docking jacks are respectively slidably inserted and connected with the plurality of connection plugs 101;

[0043] With such a structural design, the optical metal tube cap 2 can be more stably sleeved on the top of the nickel-plated TO46 base 1.

[0044] A condenser cover 3, the condenser cover 3 is arranged in the middle of the top end of the optical metal tube cap 2, the condenser cover 3 is a convex hemispherical structure, and the condenser cover 3 is used to condense light to the optoelectronic chip 5.

[0045] It should be noted that the optical fiber is focused to the APD through the condenser cover 3, and the photosensitive surface filter of the PD optoelectronic chip 5.

[0046] The cover structure is used to cover the top of the nickel-plated TO46 base 1, and a plurality of pin mechanisms are inserted through the bottom of the nickel-plated TO46 base 1, and the plurality of pin mechanisms are used for power connection.

[0047] Specifically, a plurality of through holes are vertically and penetratingly opened on the side of the top ends of the nickel-plated TO46 base 1 and the PCB board 4, and the plurality of through holes are all used to insert the pin mechanisms, and power connection structures for assisting the pin mechanisms to conduct electricity with the PCB board 4 are arranged at the plurality of through holes.

[0048] Further, the power connection structure includes solder pads 9, and the plurality of solder pads 9 are all arranged at the top end of the PCB board 4 and are respectively located at the plurality of through holes. Power connection tubes 901 are arranged at the bottom ends of the plurality of solder pads 9 and located in the through holes. The top of the pin mechanism is inserted into the middle of the power connection tube 901 and penetrates through the top end of the PCB board 4. The bottom radius of the through hole opened in the nickel-plated TO46 base 1 is twice the top radius.

[0049] Specifically, the pin mechanism includes:

[0050] Connecting pin 11, the top of the connecting pin 11 is inserted and connected to the middle part of the power connection tube 901;

[0051] Connection cap 10, the connection cap 10 is sleeved on the top of the connecting pin 11, and a guiding member 13 for assisting the power connection of the connecting pin 11 is arranged on the inner wall of the connection cap 10;

[0052] Restricting sleeve 12, the restricting sleeve 12 is sleeved on the top of the connecting pin 11, the restricting sleeve 12 is inserted and connected to the bottom area of the through-hole of the nickel-plated TO46 base 1, and a plurality of extrusion blocks 1201 are arranged on the outer wall of the restricting sleeve 12.

[0053] Furthermore, the guiding member 13 includes a connecting piece 1301, the connecting piece 1301 is attached to the inner wall of the connection cap 10, a fixing nail 14 for fixing the two is inserted between the connecting piece 1301 and the connection cap 10, a bent clamping part 1302 is arranged at the top of the connecting piece 1301, a connecting ring 1303 is arranged at the bottom of the connecting piece 1301, and a first contact part 1304 and a second contact part 1305 for contacting and conducting electricity are symmetrically arranged at the bottom of the connecting ring 1303.

[0054] It should be noted that, as shown in Figure 8 When shown, it is the initial state of the guiding member 13 at the connection cap 10. At this time, the bent clamping part 1302 is inclined towards the area close to the middle of the connection cap 10, and the first contact part 1304 and the second contact part 1305 are inclined towards the area close to the middle of the connection cap 10. In this way, during the insertion process of the connecting pin 11, the top of the connecting pin 11 first squeezes the second contact part 1305 in the direction away from each other, which drives the extrusion connection ring 1303 to make the first contact part 1304 closely adhere to the inner wall of the power connection tube 901. At the same time, during the continuous upward insertion process of the connecting pin 11, the bent clamping part 1302 will be squeezed, and it will react to clamp the top of the connecting pin 11.

[0055] Embodiment 2, the present invention provides a packaging method of an optical communication receiving device based on TO46 packaging as shown in Figure 9 shown, for packaging and preparing the optical communication receiving device of Embodiment 1, the packaging method includes the following steps:

[0056] S1, first, prepare and preprocess the materials. First, fix the PCB board 4 with the designed circuit on the nickel-plated TO46 base 1 through glue, and at the same time ensure that the through-holes are aligned with each other;

[0057] S2, place the optoelectronic chip 5 at the top of the nickel-plated TO46 base 1 and in the placement groove, and then electrically connect the transimpedance amplifier 6 to the corresponding circuit at the top of the PCB board 4;

[0058] S3. After electrically connecting the pad 9 and the power connection tube 901, press the bottom end of the power connection tube 901 tightly against the top end of the nickel-plated TO46 base 1 for conduction, and fix it with conductive adhesive.

[0059] S4. Press the connection cap 10 onto the top of the PCB board 4 and align it with the through-hole. Then, insert the connection pin 11 with the limiting sleeve 12 upward from the bottom of the nickel-plated TO46 base 1 into the through-hole. At this time, the bottom area of the through-hole of the nickel-plated TO46 base 1 cooperates with the extrusion block 1201 to squeeze and limit the limiting sleeve 12. At the same time, during the insertion process of the connection pin 11, the top of the connection pin 11 first squeezes the second contact part 1305 in the direction away from each other, which drives the extrusion connection ring 1303 to make the first contact part 1304 closely adhere to the inner wall of the power connection tube 901. At the same time, during the continuous upward insertion process of the connection pin 11, the bending and clamping part 1302 will be squeezed, and it will react to clamp the top of the connection pin 11. Through the above steps, all the pin mechanisms are connected.

[0060] S5. After aligning the docking jack with the connection block 101, sleeved the optical metal tube cap 2 on the top of the nickel-plated TO46 base 1, and fix them by gluing and sealing.

[0061] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An optical communication receiving device based on TO46 package, characterized in that: The invention comprises a nickel-plated TO46 base (1), wherein a PCB board (4), an optoelectronic chip (5) and a transimpedance amplifier (6) are respectively arranged on the top of the nickel-plated TO46 base (1), wherein the PCB board (4) is used for electrically connecting the optoelectronic chip (5) and the transimpedance amplifier (6) to the nickel-plated TO46 base (1), wherein a cover structure is sleeved on the outer wall of the top of the nickel-plated TO46 base (1), wherein the cover structure is used for covering the top of the nickel-plated TO46 base (1), and wherein a plurality of pin mechanisms are interspersed on the bottom of the nickel-plated TO46 base (1), wherein the plurality of pin mechanisms are used for electrical connection.

2. The optical communication receiving device based on TO46 package according to claim 1, characterized in that: A plurality of connection plugs (101) are arranged around the sides of the top of the nickel-plated TO46 base (1), and the plurality of connection plugs (101) are used to assist the cover structure in docking with the nickel-plated TO46 base (1).

3. The optical communication receiving device based on TO46 package according to claim 2, characterized in that: The cover structure comprises: An optical metal pipe cap (2), wherein a plurality of docking holes are provided on the side of the bottom of the optical metal pipe cap (2), and the plurality of docking holes are respectively connected to a plurality of connecting plug blocks (101) in a sliding manner; A condenser (3) is arranged at the middle of the top of the optical metal tube cap (2), the condenser (3) is a convex hemispherical structure, and the condenser (3) is used to concentrate light onto the optoelectronic chip (5).

4. The optical communication receiving device based on TO46 package according to claim 1, characterized in that: A placement groove is provided in the middle of the top of the PCB board (4); the optoelectronic chip (5) is electrically connected to the top of the nickel-plated TO46 base (1), and the optoelectronic chip (5) runs through the placement groove; and an electrical connection piece for electrical connection is provided between the optoelectronic chip (5) and the transimpedance amplifier (6) and the top of the PCB board (4).

5. The optical communication receiving device based on TO46 package according to claim 4, characterized in that: The power connection component comprises a power connection coil (7) and a conductive sheet (8); the power connection coil (7) is arranged at the top of the PCB board (4) and located at the notch of the placement slot; the conductive sheet (8) is arranged at the top of the PCB board (4) and is electrically connected to the side of the power connection coil (7); and the conductive sheet (8) is electrically connected to the bottom of the transimpedance amplifier (6).

6. The optical communication receiving device based on TO46 package according to claim 1, characterized in that: The nickel-plated TO46 base (1) and the side of the top of the PCB board (4) are provided with a plurality of through holes extending through the vertical direction, and the plurality of through holes are used for inserting the pin mechanism, and the plurality of through holes are provided with an electrical connection structure for assisting the pin mechanism to conduct electricity with the PCB board (4).

7. The optical communication receiving device based on TO46 package according to claim 6, characterized in that: The power connection structure comprises a solder pad (9), a plurality of the solder pads (9) are arranged at the top of the PCB board (4) and are respectively located at a plurality of through holes, a power connection tube (901) is arranged at the bottom of the plurality of solder pads (9) and is located in the through holes, the top of the pin mechanism is inserted in the middle of the power connection tube (901) and passes through the top of the PCB board (4), and the bottom radius of the through hole opened by the nickel-plated TO46 base (1) is twice the top radius.

8. The optical communication receiving device based on TO46 package according to claim 7, characterized in that: The pin mechanism comprises: A connecting pin (11), the top of which is inserted and connected to the middle of the electrical connection tube (901); A connecting cap (10), wherein the connecting cap (10) is sleeved on the top of the connecting pin (11), and the inner wall of the connecting cap (10) is provided with a guide (13) for assisting the connecting pin (11) in connecting electricity; A limiting sleeve (12), wherein the limiting sleeve (12) is sleeved on the top of the connecting pin (11), the limiting sleeve (12) is inserted and connected to the bottom area of ​​the through hole of the nickel-plated TO46 base (1), and the outer wall of the limiting sleeve (12) is provided with a plurality of extrusion blocks (1201).

9. The optical communication receiving device based on TO46 package according to claim 8, characterized in that: The guide member (13) comprises a connecting piece (1301), the connecting piece (1301) is arranged on the inner wall of the connecting cap (10), a fixing pin (14) is inserted and connected between the connecting piece (1301) and the connecting cap (10) for fixing the two, a bending clamping portion (1302) is arranged at the top of the connecting piece (1301), a connecting ring (1303) is arranged at the bottom of the connecting piece (1301), and a first contact portion (1304) and a second contact portion (1305) for contacting and conducting are symmetrically arranged at the bottom of the connecting ring (1303).

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