Module body in LED packaging

Abstract

The utility model relates to the technical field of LED module bodies, in particular to a module body in LED packaging, which comprises an LED lamp wick, a welding plate and a screw, an anode lead is fixedly connected to the central position of the left side of the upper end of the LED lamp wick, an anode wiring plate is fixedly connected to the lower end of the anode lead, a cathode lead is fixedly connected to the central position of the right side of the upper end of the LED lamp wick, and an anode wiring plate is fixedly connected to the lower end of the cathode lead. The lower end of the negative lead is fixedly connected with a negative wiring board, the lower end of the LED lamp wick is provided with heat-conducting silicone grease, and the lower side of the heat-conducting silicone grease is fixedly connected with a welding plate. Heat generated by the LED lamp wick can be better conducted to the position of the welding plate through the arranged heat-conducting silicone pad, and meanwhile through the arranged heat-conducting silicone pad and the arranged metal base pad, heat generated by the LED lamp wick can be better conducted to the position of the welding plate. The welding plate, the heat conduction silica gel pad and the metal base pad can be well connected together at the same time through the arranged screws and nuts, and the situation that in the installation process, the welding plate, the heat conduction silica gel pad and the metal base pad fall off, and consequently installation is affected is prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of LED module bodies, and specifically relates to a module body in LED packaging. Background Technique

[0002] LED, also known as a light-emitting diode, is a commonly used light-emitting device. An LED includes an LED module body. Specifically, the LED packaging module body is formed by MCOB (multi-chip on board), and a plurality of reflecting cups are formed on the MCOB.

[0003] In the case of using high-power LEDs, the heat dissipation of the LED module body becomes extremely important. Most LED module bodies on the market are composed of a heat sink and a metal base pad. Due to volume limitations, the heat sink and the metal base pad cannot effectively conduct heat, thus affecting the service life of the LED module body, and further affecting the service life of the LED. Therefore, a module body in LED packaging is proposed to solve the above problems. Content of the Utility Model

[0004] The purpose of the utility model is to provide a module body in LED packaging to solve the problems that the volume of high-power LEDs is limited, and the heat sink and the metal base pad cannot effectively conduct heat, affecting the service life of the LEDs.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] A module body in LED packaging includes an LED chip, a welding plate and a screw. A positive lead is fixedly connected to the center position on the left side of the upper end of the LED chip. A positive wiring board is fixedly connected to the lower end of the positive lead. A negative lead is fixedly connected to the center position on the right side of the upper end of the LED chip. A negative wiring board is fixedly connected to the lower end of the negative lead. Thermal grease is provided at the lower end of the LED chip. A welding plate is fixedly connected to the lower side of the thermal grease. A hemispherical lens is fixedly connected to the upper end of the outer side of the welding plate. The screw passes through the welding plate, a thermal silicone pad and a metal base pad and is screwed with a nut. A thermal silicone pad is provided on the side of the welding plate away from the LED chip. A metal base pad is provided on the side of the thermal silicone pad away from the welding plate. First air holes are provided on both sides of the metal base pad. A heat sink groove is opened at the lower end of the metal base pad. A fixing block is fixedly connected to the lower end of the metal base pad. A heat sink is fixedly connected to the fixing block. A fixing block groove is opened at the upper end of the heat sink. A nut groove is opened at the upper end of the heat sink. Heat dissipation fins are provided at the lower end of the heat sink. Second air holes are opened at the lower end of the heat dissipation fins. A thin plate connecting body is fixedly connected to the lower end of the heat sink.

[0007] Preferably, the positive lead and the negative lead are symmetrically arranged on both sides of the LED chip, and the positive wiring board and the negative wiring board are symmetrically arranged on both sides of the welding board.

[0008] Preferably, the first air holes are symmetrically arranged on both sides of the metal base pad, and there are several first air holes.

[0009] Preferably, the screws are symmetrically arranged at the four corners of the welding board, and the total number of screws is 4.

[0010] Preferably, the heat dissipation fins and the heat dissipation pad are integrally arranged. There are several heat dissipation fins, several second air holes, and several thin sheet connectors.

[0011] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0012] By providing the thermal conductive silica gel pad, the heat generated by the LED chip can be better conducted to the welding board. At the same time, by providing the thermal conductive silica gel pad and the metal base pad, the heat can be better conducted out. By providing the screws and nuts, the welding board, the thermal conductive silica gel pad, and the metal base pad can be better connected together to prevent the three from falling off during the installation process, thus affecting the installation. At the same time, by providing the first air holes, the contact area between the metal base pad and the air can be increased, and the heat can be better dissipated. By providing the heat dissipation pad groove, the heat dissipation pad can be better filled into the lower end of the metal base pad. At the same time, by providing the fixing block and the fixing block groove, the heat dissipation pad and the metal base pad can be better connected together. At the same time, by providing the nut groove, the nut can be better hidden in the heat dissipation pad to prevent the nut from affecting the installation of the LED module. By providing the heat dissipation fins and the ventilation holes, the contact area between the heat dissipation pad and the air is increased, and the heat dissipation effect is improved. At the same time, by providing the thin sheet connectors, when the heat dissipation pad is squeezed, the thin sheet connectors can squeeze the surrounding air to cause air flow, which can better increase the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0014] Figure 2 is of the present utility model Figure 1 schematic diagram of the structure at A;

[0015] Figure 3 is a schematic diagram of the LED chip structure of the present utility model;

[0016] Figure 4 is a schematic diagram of the heat dissipation pad structure of the present utility model.

[0017] In the figure: 1 - positive terminal wiring board, 2 - metal base pad, 3 - thermal conductive silicone pad, 4 - positive lead, 5 - hemispherical lens, 6 - welding plate, 7 - LED chip, 8 - negative lead, 9 - screw, 10 - negative terminal wiring board, 11 - first air hole, 12 - heat sink pad groove, 13 - heat sink pad, 14 - fixing block, 15 - nut, 16 - thermal conductive grease, 17 - second air hole, 18 - heat sink fin, 19 - fixing block groove, 20 - nut groove, 21 - thin sheet connecting body. Detailed implementation mode

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0019] Please refer to Figures 1-4 , the present invention provides a technical solution:

[0020] A module body in an LED package includes an LED chip 7, a welding plate 6 and a screw 9. A positive lead 4 is fixedly connected to the center position on the left side of the upper end of the LED chip 7, and the lower end of the positive lead 4 is fixedly connected to a positive terminal wiring board 1. A negative lead 8 is fixedly connected to the center position on the right side of the upper end of the LED chip 7, and the lower end of the negative lead 8 is fixedly connected to a negative terminal wiring board 10. Thermal conductive grease 16 is provided at the lower end of the LED chip 7, and a welding plate 6 is fixedly connected to the lower side of the thermal conductive grease 16. A hemispherical lens 5 is fixedly connected to the upper end outside the welding plate 6. The screw 9 passes through the welding plate 6, the thermal conductive silicone pad 3 and the metal base pad 2 and is screwed with a nut 15. A thermal conductive silicone pad 3 is provided on the side of the welding plate 6 away from the LED chip 7, a metal base pad 2 is provided on the side of the thermal conductive silicone pad 3 away from the welding plate 6. First air holes 11 are provided on both sides of the metal base pad 2. A heat sink pad groove 12 is opened at the lower end of the metal base pad 2. A fixing block 14 is fixedly connected to the lower end of the metal base pad 2. A heat sink pad 13 is fixedly connected to the fixing block. A fixing block groove 19 is opened at the upper end of the heat sink pad 13. A nut groove 20 is opened at the upper end of the heat sink pad 13. Heat sink fins 18 are provided at the lower end of the heat sink pad 13. A second air hole 17 is opened at the lower end of the heat sink fins 18. A thin sheet connecting body 21 is fixedly connected to the lower end of the heat sink pad 13.

[0021] The positive lead 4 and the negative lead 8 are symmetrically arranged on both sides of the LED chip 7, and the positive connection board 1 and the negative connection board 10 are symmetrically arranged on both sides of the welding plate 6, which can better weld the positive connection and the negative connection to the positive connection board 1 and the negative connection board 10; the first air holes 11 are symmetrically arranged on both sides of the metal base pad 2, and there are several first air holes 11, which can increase the contact area between the metal base pad 2 and the air and improve the heat dissipation effect of the metal base pad 2; the screws 9 are symmetrically arranged at the four corners of the welding plate 6, and the number of the screws 9 is 4 in total, which can improve the stability of the entire LED module body and prevent other components from falling off during the installation process; the heat dissipation fins 18 and the heat dissipation pad 13 are integrally arranged, there are several heat dissipation fins 18, there are several second air holes 17 in total, and there are several thin sheet connectors 21 in total, which increase the contact area between the heat dissipation pad 13 and the air and better improve the heat dissipation effect of the entire LED module body.

[0022] Working process: When installing the LED module body, connect the positive connection and the negative connection to the positive connection board 1 and the negative connection board 2 respectively to connect the circuit, and debug whether the LED chip 7 emits light normally. When the LED chip emits light normally, the generated heat will be transferred to the welding plate 6 through the thermal conductive silicone grease 16, and the welding plate 6 will transfer the heat to the metal base pad 2 through the thermal conductive silicone pad 3. The metal base pad 2 increases the contact area with the air through the provided first air holes, and combined with the contact position of the metal base pad 2 itself with the air, the heat dissipation effect is increased. After connecting the heat dissipation pad 13 to the component to be installed, through the provided heat dissipation pad 13, the heat can be transferred out better. The heat dissipation fins 18 and the second air holes 17 provided on the heat dissipation pad 13 increase the contact area between the heat dissipation pad 13 and the air, thereby increasing the heat dissipation effect. After the installation position is squeezed against the heat dissipation pad 13, the thin sheet connector 21 is squeezed, and the thin sheet connector 21 squeezes the surrounding air, causing the surrounding air to flow, thereby increasing the heat dissipation effect of the heat dissipation pad 13, and further increasing the heat dissipation effect of the entire LED module body and extending the service life of the LED.

[0023] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A module body in an LED package, comprising an LED wick (7), a welding plate (6) and a screw (9), characterized in that: A positive lead (4) is fixedly connected at the center position of the left upper end of the LED wick (7), and a positive terminal board (1) is fixedly connected at the lower end of the positive lead (4). A negative lead (8) is fixedly connected at the center position of the right upper end of the LED wick (7), and a negative terminal board (10) is fixedly connected at the lower end of the negative lead (8). A thermal conductive silicone grease (16) is provided at the lower end of the LED wick (7), and a welding plate (6) is fixedly connected at the lower side of the thermal conductive silicone grease (16). A hemispherical lens (5) is fixedly connected at the upper outer end of the welding plate (6). The screw (9) passes through the welding plate (6), the thermal conductive silicone pad (3) and the metal base pad (2) and is spirally connected to the nut (15). The welding plate (6) is away from the LED wick (7). A heat-conducting silicone pad (3) is provided on one side of the heat-conducting silicone pad (3), a metal base pad (2) is provided on one side of the heat-conducting silicone pad (3) away from the welding plate (6), first air holes (11) are provided on both sides of the metal base pad (2), a heat-dissipating pad groove (12) is provided at the lower end of the metal base pad (2), a fixing block (14) is fixedly connected to the lower end of the metal base pad (2), the fixing block is fixedly connected to the heat-dissipating pad (13), a fixing block groove (19) is provided at the upper end of the heat-dissipating pad (13), a nut groove (20) is provided at the upper end of the heat-dissipating pad (13), a heat-dissipating fin (18) is provided at the lower end of the heat-dissipating fin (18), a second air hole (17) is provided at the lower end of the heat-dissipating fin (18), and a thin-sheet connector (21) is fixedly connected to the lower end of the heat-dissipating pad (13).

2. The module body in the LED package according to claim 1, characterized in that: The positive electrode lead (4) and the negative electrode lead (8) are symmetrically arranged on both sides of the LED lamp core (7), and the positive electrode connection plate (1) and the negative electrode connection plate (10) are symmetrically arranged on both sides of the welding plate (6).

3. The module body in the LED package according to claim 1, characterized in that: The first air holes (11) are symmetrically arranged on both sides of the metal base pad (2), and there are a plurality of the first air holes (11).

4. The module body in the LED package according to claim 1, characterized in that: The screws (9) are symmetrically arranged at the four corners of the welding plate (6), and there are four screws (9) in total.

5. The module body in the LED package according to claim 1, characterized in that: The heat dissipation fins (18) and the heat dissipation pad (13) are integrally arranged, there are a plurality of heat dissipation fins (18), there are a plurality of second air holes (17), and there are a plurality of thin sheet connectors (21).

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