Temperature acquisition structure, battery pack and electric equipment

Abstract

The utility model provides a temperature acquisition structure, a battery pack and electric equipment, and relates to the technical field of temperature acquisition. The temperature acquisition structure comprises an installation seat, a heat conduction member and at least one temperature acquisition member. The temperature acquisition part and the heat conduction part are located in the mounting seat, the heat conduction part wraps at least part of the outer surface of the temperature acquisition part, at least one of the heat conduction part and the temperature acquisition part is connected with the mounting seat, and the temperature acquisition part is used for being electrically connected with a temperature monitoring system; the mounting base is used for being attached to the electrical equipment so as to transmit the temperature of the electrical equipment to the temperature acquisition part. According to the temperature acquisition structure provided by the embodiment of the invention, the heat exchange between the temperature acquisition part and the peripheral air is reduced, the accuracy of the temperature information acquired by the temperature acquisition part is improved, and meanwhile, the reliability and the safety of the temperature acquisition structure are relatively good.

Description

Technical Field

[0001] The present application relates to the technical field of temperature acquisition, and particularly relates to a temperature acquisition structure, a battery pack, and an electrical device. Background Art

[0002] The temperature of the battery pack is crucial for the reliability and efficient operation of the battery pack. To ensure the reliability of the battery pack, a temperature acquisition component is usually provided on the battery pack, and the temperature of the battery pack is acquired through the temperature acquisition component.

[0003] In the prior art, the temperature acquisition component includes a substrate, a temperature sampling piece, and a protective cover. The temperature sampling piece is disposed on one side of the substrate, the other side of the substrate is attached to the battery pack, the protective cover has an installation cavity and an installation port communicating with the installation cavity, the protective cover is disposed on the substrate through the installation port, and the temperature sampling piece is located in the installation cavity.

[0004] However, the accuracy of the temperature sampling piece described above is relatively poor, and the safety of the temperature acquisition component is relatively poor. Summary of the Utility Model

[0005] The present application provides a temperature acquisition structure, a battery pack, and an electrical device to solve the problems that the accuracy of the temperature sampling piece in the prior art is relatively poor and the safety of the temperature acquisition component is relatively poor.

[0006] In a first aspect, the temperature acquisition structure provided by the present application is used to acquire temperature information of an electrical device and transmit the temperature information to a temperature monitoring system of the electrical device. The temperature acquisition structure includes: a mounting seat, a heat conducting member, and at least one temperature acquisition piece;

[0007] The temperature acquisition piece and the heat conducting member are located in the mounting seat, and the heat conducting member wraps at least a part of the outer surface of the temperature acquisition piece. At least one of the heat conducting member and the temperature acquisition piece is connected to the mounting seat. The temperature acquisition piece is used to be electrically connected to the temperature monitoring system; the mounting seat is used to be attached to the electrical device to transfer the temperature of the electrical device to the temperature acquisition piece.

[0008] In some embodiments, the mounting seat has a receiving cavity, the temperature acquisition piece is located in the receiving cavity, and the heat conducting member is filled in the receiving cavity.

[0009] In some embodiments, the heat conducting member is potting glue.

[0010] In some embodiments, the heat conducting member is an epoxy resin layer.

[0011] In some embodiments, a protective member is further included, and the protective member is located between the temperature acquisition piece and the heat conducting member.

[0012] In some embodiments, the protective member is a heat-conductive silica gel member.

[0013] In some embodiments, the mounting base includes a base and a mounting frame. The mounting frame has a receiving cavity therein. The temperature acquisition member is disposed on the base, and the base is located within the receiving cavity. The mounting frame is used to fit with the electrical device.

[0014] In some embodiments, the mounting frame has at least two mounting portions. The mounting portions are located within the receiving cavity. The mounting portions define mounting grooves, and the base is located within the mounting grooves.

[0015] In some embodiments, the number of the temperature acquisition members is at least two, and each of the temperature acquisition members is independently disposed within the mounting base.

[0016] In some embodiments, a connection line is further included. The connection line is used to electrically connect the temperature acquisition member and the temperature monitoring system.

[0017] In some embodiments, a protective shell is further included. The protective shell wraps the outer surface of part of the mounting base and exposes the surface of part of the mounting base, so as to enable the mounting base to fit with the electrical device.

[0018] In some embodiments, the protective shell is an injection molded part injection molded on the mounting base.

[0019] In some embodiments, the mounting base has at least one fixing portion. The fixing portion is located on the periphery of the mounting base, and the fixing portion is connected to the protective shell.

[0020] In some embodiments, the fixing portion includes at least one of a convex portion and a concave portion.

[0021] In a second aspect, a battery pack provided by the present application includes: a battery pack body and any one of the temperature acquisition structures in the first aspect described above provided on the battery pack body.

[0022] In a third aspect, an electrical device provided by the present application includes: a device body, and any one of the temperature acquisition structures in the first aspect described above or the battery pack in the second aspect provided on the device body.

[0023] A temperature acquisition structure, a battery pack and an electrical device proposed in the present application. The temperature acquisition structure includes a mounting base, a heat conducting member and at least one temperature acquisition member. The temperature acquisition member and the heat conducting member are located inside the mounting base, and the heat conducting member wraps at least part of the outer surface of the temperature acquisition member. The temperature acquisition member is used for electrically connecting with a temperature monitoring system. The mounting base is used for fitting with an electrical device to transfer the temperature of the electrical device to the temperature acquisition member. By arranging the temperature acquisition member inside the mounting base and the mounting base fitting on the electrical device, the temperature of the electrical device can be transferred to the temperature acquisition member through the mounting base, and then the temperature information of the electrical device can be acquired through the temperature acquisition member. By wrapping the heat conducting member on the outer surface of the temperature acquisition member, direct contact between the temperature acquisition member and air is avoided, thereby reducing the heat exchange between the temperature acquisition member and the surrounding air and improving the accuracy of the temperature information acquired by the temperature acquisition member. At the same time, by directly arranging the temperature acquisition member inside the mounting base and directly connecting with the mounting base or connecting with the mounting base through the heat conducting member, the connection between the temperature acquisition member and the mounting base is relatively stable and reliable, and the temperature acquisition member is not easily disconnected from the mounting base. Thus, the reliability and safety of the temperature acquisition structure are relatively good. Description of the Drawings

[0024] The drawings herein are incorporated into the specification and form a part of this specification, showing embodiments consistent with the present application and, together with the specification, are used to explain the principles of the present application.

[0025] Figure 1 Schematic structural diagram of the temperature acquisition structure provided by the embodiment of the present application;

[0026] Figure 2 is Figure 1 Schematic structural diagram of removing the protective shell in

[0027] Figure 3 is Figure 2 Schematic structural diagram of removing the mounting bracket and the heat conducting member in

[0028] Figure 4 is Figure 3 Schematic structural diagram of the base and the temperature acquisition member in

[0029] Figure 5 is Figure 2 Schematic structural diagram of the mounting bracket in

[0030] Through the above drawings, the specific embodiments of the present application have been shown, and there will be more detailed descriptions hereinafter. These drawings and the textual descriptions are not intended to limit the scope of the inventive concept of the present utility model in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments.

[0031] Description of the Reference Numerals:

[0032] 100 - Mounting base;

[0033] 110 - Base; 111 - First electrical connection part; 112 - Second electrical connection part;

[0034] 120 - Mounting frame; 121 - Accommodating cavity; 122 - Mounting part; 123 - Fixing part; 124 - Convex part; 125 - Concave part; 126 - Mounting groove;

[0035] 200 - Heat conducting part;

[0036] 300 - Temperature acquisition part;

[0037] 400 - Protective part;

[0038] 500 - Connecting wire;

[0039] 600 - Protective shell. Detailed implementation mode

[0040] Hereinafter, exemplary embodiments will be described in detail, and examples thereof are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0041] In the prior art, the temperature acquisition component includes a substrate, a temperature sampling part and a protective cover. The temperature sampling part is arranged on one side of the substrate, the other side of the substrate is attached to the battery pack, the protective cover has a mounting cavity and a mounting opening communicating with the mounting cavity, the protective cover is covered on the substrate through the mounting opening, and the temperature sampling part is located in the mounting cavity. However, there is a large amount of air medium in the above-mentioned mounting cavity, and the temperature sampling part will exchange heat with the air in the mounting cavity, resulting in poor accuracy of the temperature collected by the temperature sampling part. At the same time, the protective cover is directly covered on the substrate through the mounting opening, resulting in poor reliability and sealing performance of the connection between the protective cover and the substrate, and it is easy for the protective cover to be disconnected from the substrate. After the protective cover is disconnected from the substrate, the temperature acquisition part will be exposed, and then the temperature acquisition part is liable to be damaged. Therefore, the safety of the above-mentioned temperature acquisition component is poor.

[0042] Based on this, an embodiment of the present application provides a temperature acquisition structure, which includes a mounting base, a heat conducting member, and at least one temperature acquisition member. The temperature acquisition member and the heat conducting member are located within the mounting base, and the heat conducting member wraps around at least a part of the outer surface of the temperature acquisition member. The temperature acquisition member is used for electrically connecting to a temperature monitoring system. The mounting base is used for fitting with an electrical device to transfer the temperature of the electrical device to the temperature acquisition member. By arranging the temperature acquisition member in the accommodation cavity and the mounting base fitting on the electrical device, the temperature of the electrical device can be transferred to the temperature acquisition member through the mounting base, and then the temperature information of the electrical device can be acquired through the temperature acquisition member. By wrapping the heat conducting member around the outer surface of the temperature acquisition member, it is possible to prevent the temperature acquisition member from directly contacting the air, thereby reducing the heat exchange between the temperature acquisition member and the surrounding air and improving the accuracy of the temperature information acquired by the temperature acquisition member. At the same time, by directly arranging the temperature acquisition member within the mounting base and directly connecting it to the mounting base or connecting it to the mounting base through the heat conducting member, the connection between the temperature acquisition member and the mounting base is relatively stable and reliable, and the temperature acquisition member is not easily disconnected from the mounting base. Thus, the reliability and safety of the temperature acquisition structure are relatively good.

[0043] The embodiments of the present application will be described below with reference to the accompanying drawings.

[0044] Refer to Figures 1 to 5 , a temperature acquisition structure provided by an embodiment of the present application, the temperature acquisition structure is used for acquiring the temperature information of an electrical device and transmitting the temperature information to the temperature monitoring system of the electrical device. The temperature acquisition structure includes: a mounting base 100, a heat conducting member 200, and at least one temperature acquisition member 300.

[0045] The temperature acquisition member 300 and the heat conducting member 200 are located within the mounting base 100, and the heat conducting member 200 wraps around at least a part of the outer surface of the temperature acquisition member 300. At least one of the heat conducting member 200 and the temperature acquisition member 300 is connected to the mounting base 100. The temperature acquisition member 300 is used for electrically connecting to a temperature monitoring system.

[0046] The mounting base 100 is used for fitting with an electrical device to transfer the temperature of the electrical device to the temperature acquisition member 300.

[0047] Exemplarily, the temperature acquisition member 300 is an NTC thermistor. The NTC thermistor has high sensitivity, good stability, fast response speed, and a wide operating temperature range.

[0048] It should be noted that the heat conducting member 200 has good heat conducting performance so that the heat conducting member 200 can transfer the temperature to the temperature acquisition member 300 more accurately. For example, the thermal conductivity of the heat conducting member 200 is greater than 1 W / m·K (watts per meter per kelvin).

[0049] Specifically, the mounting base 100 is attached to the electrical device so that the temperature of the electrical device can be transferred to the mounting base 100. The temperature acquisition component 300 is located inside the mounting base 100 so that the temperature of the mounting base 100 can be transferred to the temperature acquisition component 300, and then the temperature information of the electrical device can be acquired through the temperature acquisition component 300. The temperature acquisition component 300 transmits the acquired temperature information to the temperature monitoring system.

[0050] Furthermore, the temperature acquisition component 300 can be located inside the heat conducting component 200. The heat conducting component 200 wraps around the outer surface of the temperature acquisition component 300, and the heat conducting component 200 is connected to the mounting base 100 so that the temperature of the mounting base 100 can be transferred to the temperature acquisition component 300 through the heat conducting component 200, while avoiding the heat exchange between the temperature acquisition component 300 and the surrounding air. Alternatively, the temperature acquisition component 300 is located between the heat conducting component 200 and the mounting base 100, and at least one of the heat conducting component 200 and the temperature acquisition component 300 is connected to the mounting base 100, thereby reducing the heat exchange between the temperature acquisition component 300 and the surrounding air. At this time, the side of the mounting base 100 close to the temperature acquisition component 300 can be attached to the electrical device, so that the temperature of the electrical device can be directly transferred to the temperature acquisition component 300 through the mounting base 100, ensuring the accuracy of the temperature information acquired by the temperature acquisition component 300.

[0051] The temperature acquisition structure provided by the embodiments of the present application sets the temperature acquisition component 300 inside the mounting base 100, and the mounting base 100 is attached to the electrical device so that the temperature of the electrical device can be transferred to the temperature acquisition component 300 through the mounting base 100, and then the temperature information of the electrical device can be acquired through the temperature acquisition component 300. By setting the heat conducting component 200, the heat conducting component 200 wraps around the outer surface of the temperature acquisition component 300 to avoid the direct contact between the temperature acquisition component 300 and the air, thereby reducing the heat exchange between the temperature acquisition component 300 and the surrounding air and improving the accuracy of the temperature information acquired by the temperature acquisition component 300. At the same time, by directly setting the temperature acquisition component 300 inside the mounting base 100 and directly connecting it to the mounting base 100 or connecting it to the mounting base 100 through the heat conducting component 200, the connection between the temperature acquisition component 300 and the mounting base 100 is relatively stable and reliable, and the temperature acquisition component 300 is not easily disconnected from the mounting base 100. Thus, the reliability and safety of the temperature acquisition structure are relatively good.

[0052] In specific implementation, the mounting base 100 has a receiving cavity 121, the temperature acquisition component 300 is located inside the receiving cavity 121, and the heat conducting component 200 is filled inside the receiving cavity 121.

[0053] In this way, by filling the accommodating cavity 121 with the heat-conducting member 200 so that the heat-conducting member 200 completely wraps the outer surface of the temperature acquisition member 300, the sealing performance of the temperature acquisition member 300 is improved, preventing heat exchange between the temperature acquisition member 300 and the surrounding air, and thus ensuring the accuracy of the temperature information collected by the temperature acquisition member 300. At the same time, the heat-conducting member 200 fills all the gaps between the mounting base 100 and the temperature acquisition member 300, improving the sealing performance of the temperature acquisition structure.

[0054] In some embodiments, the heat-conducting member 200 is potting glue.

[0055] Specifically, the potting glue can be potted in the accommodating cavity 121 through a dispensing machine, then the temperature acquisition member 300 is placed in the accommodating cavity 121, and the potting glue completely wraps the outer surface of the temperature acquisition member 300. Finally, the mounting base 100, the heat-conducting member 200, and the temperature acquisition member 300 are placed in a baking device to cure the potting glue.

[0056] In this way, it is convenient for the heat-conducting member 200 to completely fill the space between the temperature acquisition member 300 and the mounting base 100 and completely wrap the temperature acquisition member 300, thereby making the sealing performance of the temperature acquisition member 300 better.

[0057] In some embodiments, the heat-conducting member 200 is an epoxy resin layer.

[0058] Among them, the epoxy resin layer has a relatively high thermal conductivity, good insulation performance and water resistance, and a low water absorption rate. The epoxy resin layer is filled in the accommodating cavity 121, which can effectively prevent the temperature acquisition member 300 from contacting the water outside the mounting base 100 to prevent the temperature acquisition member 300 from short-circuiting. At the same time, it ensures the stability of the temperature acquisition structure under different working conditions.

[0059] Specifically, the epoxy resin layer is formed by potting epoxy resin.

[0060] Referring to Figure 2 、 Figure 3 and Figure 4 , in some embodiments, the temperature acquisition structure provided by the embodiments of the present application further includes a protective member 400, and the protective member 400 is located between the temperature acquisition member 300 and the heat-conducting member 200.

[0061] Among them, the protective member 400 covers at least part of the outer surface of the temperature acquisition member 300 to prevent the heat-conducting member 200 from directly contacting the temperature acquisition member 300. The protective member 400 has elasticity, so that when the heat-conducting member 200 cures and expands slightly, the elastic deformation of the protective member 400 is used to adapt to and absorb the dimensional changes caused by the expansion of the heat-conducting member 200, thereby preventing the expansion of the heat-conducting member 200 from damaging and injuring the temperature acquisition member 300, and thus protecting the temperature acquisition member 300.

[0062] In specific implementation, the protective member 400 is a heat-conducting silicone member.

[0063] Among them, the heat-conducting silicone member has a relatively high heat-conducting coefficient, good insulation performance and high-temperature resistance, so as to facilitate the transfer of temperature to the temperature acquisition member 300. At the same time, the heat-conducting silicone member has relatively low stress, so that the heat-conducting silicone member will not cause excessive mechanical stress to the temperature acquisition member 300, avoiding damage to the temperature acquisition member 300, and thus can protect the temperature acquisition member 300.

[0064] In addition, the heat-conducting silicone member also has good flexibility and compressibility, so that the heat-conducting silicone member can fill the gaps on the periphery of the temperature acquisition member 300, ensuring the sealing performance on the periphery of the temperature acquisition member 300.

[0065] Specifically, first apply heat-conducting silicone on the surface of the temperature acquisition member 300, and wait for the heat-conducting silicone to stand for a period of time and solidify to form a heat-conducting silicone member.

[0066] Referring to Figure 2 、 Figure 4 and Figure 5 , in some embodiments, the mounting base 100 includes a base 110 and a mounting frame 120. The mounting frame 120 has a receiving cavity 121. The temperature acquisition member 300 is disposed on the base 110. The base 110 is located in the receiving cavity 121, and the mounting frame 120 is used to fit with an electrical device.

[0067] Among them, by providing the base 110, the temperature acquisition member 300 is connected to the base 110 to support the temperature acquisition member 300 through the base 110.

[0068] Exemplarily, the base 110 is an aluminum substrate, and the aluminum substrate is made of aluminum-based copper clad laminate. The aluminum substrate has good processing performance, and good heat-conducting performance and insulation performance. The mounting frame 120 is made of PPS material. The PPS material has good heat-conducting performance, good water resistance and high temperature resistance. Thus, the base 110 and the mounting frame 120 can quickly transfer the temperature to the temperature acquisition member 300, and further can realize real-time acquisition of the temperature information of the electrical device.

[0069] In some examples, the temperature acquisition member 300 can be welded to the base 110. Further, the temperature acquisition member can be attached to the base 110 by an SMT machine.

[0070] Referring to Figure 4 and Figure 5 , in specific implementation, the mounting frame 120 has at least two mounting portions 122. The mounting portions 122 are located in the receiving cavity 121. The mounting portions 122 define mounting grooves 126, and the base 110 is located in the mounting grooves 126.

[0071] Among them, by arranging the base 110 in the installation groove 126, the base 110 is installed and limited, preventing the base 110 from having a large displacement in the accommodation cavity 121, thereby improving the stability of the temperature acquisition structure.

[0072] Exemplarily, the base 110 is a rectangular plate, and the installation groove 126 is a rectangular groove matching the rectangular plate.

[0073] In some examples, the installation part 122 is L-shaped, the installation part 122 is connected to the inner wall of the accommodation cavity 121, and the installation parts 122 are symmetrically arranged in pairs.

[0074] Furthermore, the number of the installation parts 122 is two. The two installation parts 122 and a side wall of the accommodation cavity 121 jointly define the installation groove 126, and the base 110 abuts against both the installation part 122 and this side wall at the same time. The side of the mounting bracket 120 opposite to this side wall is attached to the electrical device, so that the temperature of the electrical device can be transmitted to the temperature acquisition component 300 through the mounting bracket 120 and the base 110 in sequence, improving the consistency of the temperature acquired by the temperature acquisition component 300. The temperature acquisition component 300 is located between the two installation parts 122.

[0075] In some embodiments, the number of the temperature acquisition components 300 is at least two, and each temperature acquisition component 300 is independently arranged in the mounting seat 100.

[0076] Among them, the independent arrangement of each temperature acquisition component 300 means that there is no direct contact between the temperature acquisition components 300, and each temperature acquisition component 300 is independently electrically connected to the temperature monitoring system, that is, each temperature acquisition component 300 independently acquires temperature information. Each temperature acquisition component 300 simultaneously acquires the temperature information of the same electrical device to reduce the error tolerance rate of the temperature acquisition structure and improve the accuracy of the temperature acquisition structure in acquiring temperature information, thereby improving the stability of the electrical device.

[0077] Specifically, the number of the temperature acquisition components 300 is two, and the two temperature acquisition components 300 are respectively arranged on the opposite two surfaces of the base 110.

[0078] Refer to Figure 2 、 Figure 3 and Figure 4 In specific implementation, the temperature acquisition structure provided by the embodiment of the present application further includes a connection line 500, and the connection line 500 is used to electrically connect the temperature acquisition component 300 and the temperature monitoring system.

[0079] Among them, part of the connection line 500 is located in the accommodation cavity 121 to facilitate the electrical connection between the connection line 500 and the temperature acquisition component 300 in the accommodation cavity 121. The remaining part of the connection line 500 is located outside the accommodation cavity 121 to facilitate the electrical connection between the connection line 500 and the temperature monitoring system.

[0080] Specifically, the base 110 is provided with two first electrical connection parts 111 and two second electrical connection parts 112. The first electrical connection parts 111 and the second electrical connection parts 112 are correspondingly electrically connected. The temperature acquisition component 300 is electrically connected to both of the two first electrical connection parts 111, and the connection wire 500 is correspondingly electrically connected to the second electrical connection parts 112, thereby enabling the connection wire 500 to be electrically connected to the temperature acquisition component 300.

[0081] Furthermore, the first electrical connection part 111 can be a copper foil, and the second electrical connection part 112 can be a solder pad. The solder pad is arranged on the copper foil to electrically connect the first electrical connection part 111 and the second electrical connection part 112. The connection wire 500 is soldered to the solder pad to electrically connect the connection wire 500 and the second electrical connection part 112.

[0082] The heat conducting component 200 wraps the connection part of the connection wire 500 and the second electrical connection part 112 to increase the stability and reliability of the connection between the connection wire 500 and the second electrical connection part 112.

[0083] Referring to Figure 1 , in some embodiments, the temperature acquisition structure provided by the embodiments of the present application further includes a protective shell 600. The protective shell 600 wraps the outer surface of a part of the mounting base 100 and exposes the surface of a part of the mounting base 100 for the mounting base 100 to be attached to an electrical device.

[0084] Wherein, by providing the protective shell 600, the mounting base 100 and the temperature acquisition component 300 located inside the mounting base 100 are protected, thereby improving the safety of the temperature acquisition structure.

[0085] Exemplarily, the protective shell 600 is made of TPE material. The TPE material has high strength and high resilience, and good anti-fatigue property and temperature resistance. At the same time, the TPE material has good insulation performance, thereby improving the insulation performance of the temperature acquisition structure.

[0086] Specifically, the protective shell 600 wraps a part of the outer surface of the mounting base 100. The part of the outer surface of the mounting base 100 not wrapped by the protective shell 600 is attached to the electrical device, so that the temperature of the electrical device can be transmitted to the temperature acquisition component 300 through the mounting base 100 and the heat conducting component 200 without passing through the protective shell 600, thereby improving the accuracy of the temperature information collected by the temperature acquisition component 300.

[0087] In specific implementation, the protective shell 600 is an injection molded part injection molded on the mounting base 100.

[0088] Among them, the protective shell 600 is formed by injection molding on the mounting base 100 to improve the bonding force between the protective shell 600 and the mounting base 100, so that the protective shell 600 is not easily detached from the mounting base 100. At the same time, the sealing effect between the protective shell 600 and the mounting base 100 is better. In addition, injection molding on the mounting base 100 can reduce the assembly operation between the protective shell 600 and the mounting base 100.

[0089] Exemplarily, in order to prevent damage to the mounting base 100 during the injection molding process, the protective shell 600 can be formed by low-pressure injection molding or low-temperature injection molding.

[0090] It can be understood that the shape of the protective shell 600 can be adaptively set according to actual needs.

[0091] Refer to Figure 1 and Figure 2 , in a specific implementation, the mounting base 100 has at least one fixing portion 123, the fixing portion 123 is located on the circumferential side of the mounting base 100, and the fixing portion 123 is connected to the protective shell 600.

[0092] Among them, by connecting the fixing portion 123 to the protective shell 600, the bonding force between the mounting base 100 and the protective shell 600 is further improved, so that the protective shell 600 is not easily detached from the mounting base 100.

[0093] Exemplarily, the number of the fixing portions 123 is at least two, and each fixing portion 123 is respectively located on at least two side surfaces of the mounting bracket 120.

[0094] Refer to Figure 1 and Figure 2 , in a specific implementation, the fixing portion 123 includes at least one of a convex portion 124 and a concave portion 125.

[0095] Among them, by providing the convex portion 124, it is convenient to position the mounting base 100 in the mold when the protective shell 600 is injection molded. Exemplarily, the convex portion 124 is a rectangular protrusion, and the protective shell 600 fits against the outer surface of the convex portion 124.

[0096] In some examples, the mounting bracket 120 has a first side surface and two stepped surfaces. The first side surface is located between the two stepped surfaces. The first side surface is a flat surface and is used to fit against the electrical device. The stepped surfaces form the concave portion 125. The protective shell 600 fits against both stepped surfaces, and the protective shell 600 does not fit against the first side surface, so as to facilitate the first side surface to fit against the electrical device.

[0097] Based on the above embodiments, an embodiment of the present application provides a battery pack, including: a battery pack body and a temperature acquisition structure provided on the battery pack body.

[0098] Among them, the specific structure of the temperature acquisition structure has been described in detail in the above embodiments, and will not be elaborated here.

[0099] Specifically, the mounting seat 100 of the temperature acquisition structure is attached to the battery pack body, and the temperature of the battery pack body is sequentially transmitted to the temperature acquisition member 300 through the mounting seat 100 and the heat conducting member 200. The temperature acquisition member 300 acquires temperature information.

[0100] The battery pack further includes a temperature management system for managing the temperature of the battery pack body. The temperature acquisition member 300 is electrically connected to the temperature management system to transmit the acquired temperature information to the temperature management system, thereby facilitating the temperature management system to manage the temperature of the battery pack body.

[0101] In the battery pack provided by the embodiment of the present application, the temperature acquisition structure sets the temperature acquisition member 300 in the accommodation cavity 121, and the mounting seat 100 is attached to the battery pack body, so that the temperature of the battery pack body can be transmitted to the temperature acquisition member 300 through the mounting seat 100, and then the temperature information of the battery pack body can be acquired through the temperature acquisition member 300. By providing the heat conducting member 200, the heat conducting member 200 is wrapped on the outer surface of the temperature acquisition member 300 to prevent the temperature acquisition member from directly contacting the air, thereby reducing the heat exchange between the temperature acquisition member 300 and the surrounding air and improving the accuracy of the temperature acquisition member 300 in acquiring the temperature information of the battery pack body.

[0102] On the basis of the above embodiments, the embodiment of the present application further provides an electrical device, including: a device body, and a temperature acquisition structure or a battery pack provided on the device body.

[0103] Exemplarily, the electrical device includes a vehicle.

[0104] The terms "first", "second", etc. in the description, claims and drawings of the embodiments of the present application are used to distinguish similar objects and do not necessarily describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances for the embodiments described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion.

[0105] In the embodiments of the present application, the orientation or positional relationship indicated by terms such as "upper", "lower", "inner", "middle", "outer", "front", "rear", etc. is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit that the indicated device, element or component must have a specific orientation, or be constructed and operated in a specific orientation. Moreover, in addition to being used to represent the orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present application can be understood according to specific circumstances.

[0106] In addition, the terms "arranged", "connected", "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can be internal communication between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0107] Unless otherwise specified, the term "plurality" means two or more.

[0108] After considering the specification and practicing the application disclosed herein, those skilled in the art will readily conceive of other embodiments of the present application. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include known common knowledge or conventional technical means in the technical field not disclosed in the present application. The specification and embodiments are only regarded as exemplary, and the scope of the present application is only limited by the appended claims.

Claims

1. A temperature acquisition structure, which is used to collect temperature information of electrical equipment and transmit the temperature information to a temperature monitoring system of the electrical equipment, characterized in that: The temperature collection structure comprises: a mounting seat (100), a heat conducting member (200) and at least one temperature collection member (300); The temperature collection component (300) and the heat conducting component (200) are located in the mounting seat (100), and the heat conducting component (200) is wrapped around at least a portion of the outer surface of the temperature collection component (300), at least one of the heat conducting component (200) and the temperature collection component (300) is connected to the mounting seat (100), and the temperature collection component (300) is used to be electrically connected to the temperature monitoring system; The mounting seat (100) is used to fit the electrical device so as to transfer the temperature of the electrical device to the temperature collecting member (300).

2. The temperature collection structure according to claim 1, characterized in that: The mounting seat (100) has a receiving cavity (121) therein, the temperature collecting component (300) is located in the receiving cavity (121), and the heat conducting component (200) is filled in the receiving cavity (121).

3. The temperature collection structure according to claim 2, characterized in that: The heat conducting member (200) is potting glue.

4. The temperature collection structure according to claim 3, characterized in that: The heat conducting member (200) is an epoxy resin layer.

5. The temperature collection structure according to claim 3, characterized in that: It also comprises a protective member (400), wherein the protective member (400) is located between the temperature collecting member (300) and the heat conducting member (200).

6. The temperature collection structure according to claim 5, characterized in that: The protective member (400) is a heat-conductive silicone member.

7. The temperature collection structure according to claim 2, characterized in that: The mounting base (100) comprises a base (110) and a mounting frame (120); the mounting frame (120) has a receiving cavity (121); the temperature collecting component (300) is arranged on the base (110); the base (110) is located in the receiving cavity (121); and the mounting frame (120) is used to fit the electrical device.

8. The temperature collection structure according to claim 7, characterized in that: The mounting frame (120) has at least two mounting portions (122), the mounting portions (122) are located in the accommodating cavity (121), the mounting portions (122) define mounting grooves (126), and the base (110) is located in the mounting grooves (126).

9. The temperature collection structure according to claim 1, characterized in that: The number of the temperature collection components (300) is at least two, and each of the temperature collection components (300) is independently arranged in the mounting seat (100).

10. The temperature collection structure according to any one of claims 1 to 9, characterized in that: It also includes a connecting line (500), wherein the connecting line (500) is used to electrically connect the temperature collecting component (300) and the temperature monitoring system.

11. The temperature collection structure according to any one of claims 1 to 9, characterized in that: It also includes a protective shell (600), which wraps part of the outer surface of the mounting seat (100) and exposes part of the surface of the mounting seat (100) so that the mounting seat (100) can be fitted with the electrical device.

12. The temperature collection structure according to claim 11, characterized in that: The protective shell (600) is an injection-molded part that is injection-molded on the mounting seat (100).

13. The temperature collection structure according to claim 11, characterized in that: The mounting seat (100) has at least one fixing portion (123), the fixing portion (123) is located on the peripheral side of the mounting seat (100), and the fixing portion (123) is connected to the protective shell (600).

14. The temperature collection structure according to claim 13, characterized in that: The fixing portion (123) includes at least one of a convex portion (124) and a concave portion (125).

15. A battery pack, characterized in that: include: A battery pack body and a temperature collection structure as described in any one of claims 1 to 14 arranged on the battery pack body.

16. An electrical equipment, characterized in that: include: A device body, and a temperature acquisition structure as described in any one of claims 1 to 14 or a battery pack as described in claim 15 arranged on the device body.

Images