Server

Abstract

The utility model discloses a server which comprises a case, a heating device, a liquid cooling mechanism and a cooling pipe, and the heating device, the liquid cooling mechanism and the cooling pipe are contained in the case. The cold pipe comprises a contact area, a heat exchange area and a refrigerant, the contact area is communicated with the heat exchange area, and the included angle between the contact area and the heat exchange area comprises an obtuse angle. And a refrigerant circularly flows between the contact area and the heat exchange area. The contact area abuts against the surface of the heating device, and the end, away from the contact area, of the heat exchange area abuts against the liquid cooling mechanism. The liquid cooling mechanism is used for cooling the refrigerant in the heat exchange area. By adopting the server provided by the utility model, the heat dissipation of the heating device is realized through the two-phase change of the refrigerant in the cold pipe between the contact area and the heat exchange area, so that the heat dissipation efficiency of the server is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of data centers, and particularly relates to a server. Background Art

[0002] Traditional data centers dissipate heat from servers by air cooling. Specifically, an air conditioner is installed inside the data center, and a cooling fan is installed inside the server chassis. In addition, an air circulation path needs to be reserved inside the server chassis. During the operation of the server, the fan enables the cold air blown out by the air conditioner to quickly circulate along the air circulation path inside the chassis, thereby taking away the heat inside the server. However, as the computing power of the server increases, the heat generated by the server also continuously increases. If the traditional air cooling method continues to be used, it is necessary to increase the air circulation path inside the chassis and the number of fans to accelerate the cold air circulation speed and circulation volume inside the server, so as to meet the heat dissipation requirements of the server. However, this will also lead to an increase in the volume of the server chassis and an increase in the operating cost of the data center.

[0003] Therefore, how to provide an effective and low-cost server heat dissipation solution has become a difficult problem that needs to be solved urgently by those skilled in the art. Summary of the Utility Model

[0004] The utility model provides a server for providing an effective and low-cost server heat dissipation solution.

[0005] A server provided by the utility model includes a chassis and a heating device. The heating device is accommodated in the chassis. The server further includes a liquid cooling mechanism and a cold pipe. The liquid cooling mechanism is located inside the chassis. The cold pipe is located inside the chassis and includes a contact area, a heat exchange area and a refrigerant. The contact area is communicated with the heat exchange area, and the included angle between the contact area and the heat exchange area includes an obtuse angle. The refrigerant circulates between the contact area and the heat exchange area. At least a part of the contact area abuts against the surface of the heating device, and one end of the heat exchange area away from the contact area abuts against the liquid cooling mechanism. The liquid cooling mechanism is used to cool the refrigerant in the heat exchange area.

[0006] By using the server provided by the utility model, since there is a cold pipe with an obtuse included angle between the heating device and the liquid cooling mechanism, the contact area of the cold pipe abuts against the heating device, and the heat exchange area of the cold pipe abuts against the liquid cooling mechanism. When the heating device operates, the liquid refrigerant in the contact area is heated and vaporized. The vaporized refrigerant flows towards the heat exchange area along the bending direction of the cold pipe. The gaseous refrigerant in the heat exchange area is cooled by the liquid cooling mechanism and re-liquefied. The re-liquefied liquid refrigerant flows back to the contact area along the bending direction of the cold pipe. Thus, through the two-phase change of the refrigerant in the cold pipe, the refrigerant in the cold pipe can circulate rapidly and continuously between the contact area and the heat exchange area, thereby effectively improving the heat dissipation efficiency of the server.

[0007] In a possible implementation of the utility model, the cold pipe includes two heat exchange areas, the contact area is located between the two heat exchange areas, and the two heat exchange areas are located on the same side of the contact area. In this way, after the refrigerant in the contact area is heated and vaporized, it can move toward the heat exchange area on either side or both sides, and the refrigerant liquefied in the heat exchange area can quickly flow back to the contact area, thereby further improving the heat dissipation efficiency of the server.

[0008] In a possible implementation of the utility model, the chassis includes a top wall and a bottom wall that are arranged relatively to each other, and the heat exchange zone is close to the top wall relative to the contact zone. Since the bottom wall of the chassis is close to the ground relative to the top wall when the chassis is in normal use, the heat exchange zone is higher than the contact zone in the direction of gravity (physical position) relative to the contact zone, so that the refrigerant that is heated and converted into a gas in the contact zone can move rapidly toward the top wall of the chassis in the cold pipe to enter the heat exchange zone. The gaseous refrigerant that enters the heat exchange zone is cooled by the low-temperature refrigerant in the liquid cooling mechanism and converted into a liquid refrigerant, and the liquid refrigerant moves rapidly toward the bottom wall of the chassis along the direction of gravity to flow back to the contact zone, thereby realizing the gas-liquid conversion and uninterrupted rapid circulation of the refrigerant in the cold pipe, and realizing rapid heat dissipation of the server.

[0009] In a possible implementation of the utility model, the server further includes a first thermal conductive paste, which is located between the heating device and the cold pipe, and the first thermal conductive paste abuts against the heating device and the cold pipe. This can reduce the contact gap between the heating device and the cold pipe, increase the contact area between the heating device and the cold pipe, and further improve the heat dissipation efficiency of the cold pipe to the heating device.

[0010] In a possible implementation of the present invention, the server further includes a second thermal conductive paste, which is located between the liquid cooling mechanism and the heat exchange area, and the second thermal conductive paste abuts against the liquid cooling mechanism and the heat exchange area, so as to further improve the heat dissipation efficiency of the server.

[0011] In a possible implementation of the utility model, the server further includes a heat sink, which is located on the side of the cold pipe away from the heating device, and the cold pipe is embedded in the heat sink, and the side of the heat sink close to the cold pipe is in contact with the surface of the heating device; the end of the heat sink away from the contact area is in contact with the liquid cooling mechanism. In this way, the cold pipe and the heat sink can dissipate heat from the heating device at the same time, thereby effectively improving the heat dissipation efficiency of the server.

[0012] In a possible implementation of the utility model, the server further includes a liquid cooling plate, the liquid cooling plate is located in the chassis, the heating device is installed on the liquid cooling plate, and the liquid cooling mechanism is connected to the liquid cooling plate. In this way, the heating device can be cooled by the cooling pipe while the cooling medium in the liquid cooling plate can be used to cool the heating device, thereby further improving the heat dissipation efficiency of the server.

[0013] In a possible implementation manner of the present utility model, the server includes a liquid storage tank, a main liquid distributor, a plurality of liquid distribution pipelines, and a plurality of liquid cooling mechanisms. The liquid storage tank is arranged outside the chassis. The main liquid distributor is connected to the chassis, the main liquid distributor is communicated with the liquid storage tank, and the plurality of liquid cooling mechanisms are respectively communicated with the main liquid distributor through the plurality of liquid distribution pipelines. By using the server provided by the present utility model, since the main liquid distributor connected to the liquid storage tank is communicated with the plurality of liquid cooling mechanisms through the plurality of liquid distribution pipelines, multiple heat generating devices can be cooled simultaneously, thereby further improving the heat dissipation efficiency of the server and reducing the energy consumption of the data center.

[0014] In a possible implementation manner of the present utility model, the server further includes a liquid leakage detection module. The liquid leakage detection module includes a detection cable, and the detection cable wraps the outer side wall of the liquid distribution pipeline. By using the server provided by the present utility model, the detection cable can be used to detect whether the liquid distribution pipeline leaks, thereby improving the safety of the server.

[0015] In a possible implementation manner of the present utility model, the liquid leakage detection module further includes a liquid accumulation tray and an overflow pipe. The liquid accumulation tray is used to receive the refrigerant leaked from the liquid cooling mechanism. One end of the overflow pipe is communicated with the liquid accumulation tray, and the other end extends out of the chassis. When the liquid cooling mechanism of the server leaks, the liquid accumulation tray can be used to receive the leaked refrigerant, and then the refrigerant flowing into the liquid accumulation tray is discharged outside the chassis through the overflow pipe to improve the safety of the server. Description of the Drawings

[0016] Figure 1 It is a schematic structural diagram of a server provided by the present utility model;

[0017] Figure 2 It is a schematic structural diagram of a cold pipe provided by the present utility model;

[0018] Figure 3 It is a schematic structural diagram of the main liquid distributor of the server provided by the present utility model;

[0019] Figure 4 It is a schematic cross-sectional structural diagram of a server provided by the present utility model;

[0020] Figure 5 For Figure 4 A partial enlarged view of the A position of the server provided;

[0021] Figure 6 It is a schematic structural diagram of a chassis provided by the present utility model;

[0022] Figure 7 It is an exploded view of a CPU, DIMM and related components provided by the present utility model;

[0023] Figure 8Another schematic structural diagram of the cold pipe provided by the present utility model;

[0024] Figure 9 An exploded view of the GPU and related components provided by the present utility model;

[0025] Figure 10 A schematic structural diagram of a power supply provided by the present utility model;

[0026] Figure 11 A schematic structural diagram of a power supply installation bin provided by the present utility model;

[0027] Figure 12 For Figure 4 A partial enlarged view of the B part of the server provided;

[0028] Figure 13 A schematic structural diagram of a liquid leakage detection module provided by the present utility model.

[0029] Reference numerals: 1 - chassis; 11 - top wall; 12 - bottom wall; 13 - left box ear; 14 - right box ear; 15 - hard disk bin; 16 - power supply installation bin; 161 - elastic arm; 1611 - bending structure; 17 - liquid accumulation tray; 18 - overflow pipe; 2 - heating device; 21 - hard disk; 211 - hard disk box; 22 - central processing unit; 221 - main board; 222 - cover plate; 23 - storage module; 24 - microprocessor; 241 - GPU installation box; 242 - GPU liquid inlet; 243 - GPU liquid outlet; 244 - GPU support; 245 - GPU board; 25 - power supply; 251 - power supply box; 252 - power supply box liquid inlet; 253 - power supply box liquid outlet; 3 - liquid cooling mechanism; 31 - distributor; 4 - cold pipe; 41 - contact area; 42 - heat exchange area; 5 - main distributor; 51 - liquid distribution pipeline; 52 - liquid inlet chamber; 53 - liquid outlet chamber; 6 - first thermal conductive sticker; 7 - heat dissipation plate; 8 - second thermal conductive sticker; 9 - liquid cooling plate; 2511 - groove. Detailed implementation manners

[0030] In order to make the objectives, technical solutions, and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in various forms and should not be construed as being limited to the embodiments described herein. The same reference numerals in the drawings represent the same or similar structures, and thus their repeated description will be omitted. The words expressing positions and directions described in the embodiments of the present utility model are all illustrated with reference to the drawings, but can be changed according to needs, and all changes are included within the protection scope of the present utility model. The drawings in the embodiments of the present utility model are only used to illustrate the relative positional relationship, and they do not represent the actual proportion.

[0031] It should be noted that specific details are set forth in the following description to facilitate the understanding of the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0032] In a traditional data center, the servers are cooled by air cooling. Specifically, an air conditioner is installed inside the data center, and a cooling fan is installed inside the server chassis. In addition, an air circulation path needs to be reserved inside the server chassis. During the operation of the servers, the fan can make the cold air blown out by the air conditioner flow rapidly along the air circulation path inside the chassis, thereby taking away the heat inside the servers. However, as the computing power of the servers increases, the heat generated by the servers also continuously increases. If the traditional air cooling method continues to be used, it is necessary to increase the air circulation path inside the chassis and the number of fans to accelerate the cold air circulation speed and volume inside the servers, so as to meet the heat dissipation requirements of the servers. However, this will also lead to an increase in the volume of the server chassis and an increase in the operating cost of the data center.

[0033] In view of this, the server provided by the present utility model dissipates heat from the heat-generating components inside the server by means of liquid cooling without increasing the volume of the server chassis, thereby effectively improving the heat dissipation efficiency of the server and reducing the energy consumption of the data center. In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0034] Reference Figure 1 , Figure 1 is a schematic structural diagram of a server provided by the present utility model. The server includes a chassis 1, a heat-generating component 2, a liquid cooling mechanism 3, and a cold pipe 4. The present utility model does not limit the specific type of the heat-generating component 2. Exemplarily, the heat-generating component 2 can be a hard disk, a central processing unit (CPU), a dual inline memory module (DIMM), a graphics processing unit (GPU), a power supply, etc. In addition, exemplarily, the liquid cooling mechanism 3 can be a liquid distributor, which includes a housing, a liquid inlet, and a liquid outlet. A circulating flow path for the refrigerant is provided in the inner cavity of the housing. After the refrigerant flows into the circulating flow path through the liquid inlet, it then flows out through the liquid outlet. And a liquid storage tank is provided in the server at the same time ( Figure 1The liquid storage tank is used to store the refrigerant, and the liquid storage tank is arranged outside the chassis 1, and the liquid inlet and the liquid outlet of the liquid distributor are both connected to the liquid storage tank, so that the refrigerant in the liquid storage tank can circulate between the liquid distributor and the liquid storage tank. Next, the server provided by the utility model is described in detail by taking the heating devices 2 as hard disk, CPU, DIMM, GPU and power supply, and the liquid cooling mechanism 3 as a liquid distributor as an example.

[0035] Continue to refer Figure 1 The hard disk 21 and the liquid distributor 31 of the server are both contained in the chassis 1, and the liquid distributor 31 is connected to the chassis 1. The cold pipe 4 is located in the chassis 1, and it can be a sealed metal pipe, which is conducive to improving the heat dissipation efficiency of the cold pipe 4. Figure 2 , Figure 2 A schematic diagram of a cold pipe provided by the utility model is shown in FIG. The cold pipe 4 is a sealed pipeline, which includes a contact area 41, a heat exchange area 42 and a refrigerant, the contact area 41 is connected to the heat exchange area 42, and the angle between the contact area 41 and the heat exchange area 42 includes an obtuse angle.

[0036] In the actual application process of the server provided by the utility model, continue to refer to Figure 2 , since the angle between the contact area 41 and the heat exchange area 42 includes an obtuse angle, and at least part of the contact area 41 abuts against the surface of the hard disk 21, the end of the heat exchange area 42 away from the contact area 41 abuts against the liquid distributor 31, or the heat exchange area 42 is plugged into the liquid distributor 31, and the side wall and end of the heat exchange area 42 are in contact with the liquid distributor 31. In this way, when the heating device 2 is running, the refrigerant in the contact area 41 that is heated and vaporized can flow to the heat exchange area 42 along the bending direction of the cold pipe 4. In the present utility model, the refrigerant in the liquid distributor 31 is used to cool the refrigerant in the heat exchange area 42, so that the gas refrigerant in the heat exchange area 42 can be reliquefied, and the reliquefied liquid refrigerant flows back to the contact area 41 along the bending direction of the cold pipe 4, so that the refrigerant in the cold pipe 4 can achieve uninterrupted rapid circulation between the contact area 41 and the heat exchange area 42 through the two-phase change of the refrigerant in the cold pipe 4, thereby effectively improving the heat dissipation efficiency of the server.

[0037] It is worth mentioning that in the present invention, the refrigerant can be circulated between the liquid storage tank and the liquid separator 31 so that the refrigerant in the liquid separator 31 is always in a low-temperature state, thereby effectively improving the cooling speed of the refrigerant in the heat exchange area 42, thereby further improving the heat dissipation efficiency of the server.

[0038] It is understandable that if Figure 2As shown in the figure, the hard disk 21 is installed in the hard disk case 211, and the hard disk 21, the hard disk case 211, and the cold pipe 4 can be designed as a modular structure (hereinafter simply referred to as the hard disk module). Since the hard disk module and the liquid distributor 31 are in contact with each other, the installation and disassembly between the hard disk module and the chassis 1 can be quickly completed without cutting off the liquid cooling pipeline. And when the hard disk module fails, the maintenance convenience of the hard disk module can be effectively improved. In addition, a handle of the hard disk case 211 is provided on one side of the hard disk module close to the opening end of the chassis 1, so that the hard disk module can be easily pulled out from the chassis.

[0039] In addition, in order to realize the computing function of the server, components such as a hard disk, a central processing unit, a storage module, a microprocessor, and a power supply need to be set inside the chassis 1 of the server at the same time. The server provided by the present utility model can design the above-mentioned components as a modular structure, and each module can be separately separated from the chassis 1, so as to improve the maintenance convenience of each module.

[0040] As Figure 1 shown, a main liquid distributor 5 is further provided on one side of the chassis 1 far from the opening end. The main liquid distributor 5 is connected to the chassis 1 and communicated with the liquid storage tank, so that the refrigerant in the liquid storage tank can be split into each module through the main liquid distributor 5 and the liquid distribution pipeline 51, thereby realizing the heat dissipation of each module. Specifically, referring to Figure 3 , Figure 3 is a schematic structural diagram of the main liquid distributor of the server provided by the present utility model. The main liquid distributor 5 includes a liquid inlet chamber 52 and a liquid outlet chamber 53, and the liquid inlet chamber 52 is communicated with the liquid inlet of the liquid distributor 31 through the liquid distribution pipeline 51, and the liquid outlet chamber 53 is communicated with the liquid outlet of the liquid distributor 31 through the liquid distribution pipeline 51, so as to effectively avoid the mixing of the low-temperature refrigerant and the heated refrigerant. It can be understood that the liquid inlet chamber 52 and the liquid outlet chamber 53 can be communicated with multiple modules or multiple liquid distributors of the server through multiple liquid distribution pipelines 51 for simultaneously dissipating heat from multiple modules. And the liquid distribution pipeline 51 is fixedly connected to the main liquid distributor 5, each module, and the liquid distributor 31 through quick plugs to improve the connection reliability between the liquid distribution pipeline 51 and the main liquid distributor 5, each module, and the liquid distributor 31.

[0041] After a preliminary understanding of each part of the server, the structure of the cold pipe 4 will be further described below in combination with the state of the server in actual application. Referring to Figure 4 , Figure 4 is a schematic cross-sectional structure diagram of the server provided by the present utility model. The chassis 1 includes a top wall 11 and a bottom wall 12 arranged oppositely. Referring to Figure 5 , Figure 5 is Figure 4Partial enlarged view of the server at location A. The heat exchange area 42 of the cold pipe 4 is closer to the top wall 11 relative to the contact area 41. Since the bottom wall 12 of the chassis 1 is closer to the ground relative to the top wall 11 when the chassis 1 is in normal use, the heat exchange area 42 is higher than the contact area 41 in the direction of gravity (physical position) relative to the contact area 41. Then, according to the principle of the flow of hot and cold air, the refrigerant that is heated and converted into a gaseous state in the contact area 41 can quickly move in the cold pipe 4 towards the direction of the top wall 11 of the chassis 1 to enter the heat exchange area 42. The gaseous refrigerant that enters the heat exchange area 42 is cooled by the low-temperature refrigerant in the liquid distributor 31 and is converted into a liquid refrigerant, and the liquid refrigerant quickly moves towards the direction of the bottom wall 12 of the chassis 1 along the direction of gravity to flow back to the contact area 41, thereby realizing the gas-liquid two-phase conversion and continuous and rapid circulation flow of the refrigerant in the cold pipe 4, and realizing the rapid heat dissipation of the server.

[0042] In addition, referring to Figure 6 , Figure 6 is a schematic structural view of a chassis provided by the present utility model. The chassis 1 further includes a left chassis ear 13, a right chassis ear 14, and a hard disk compartment 15. The chassis ears are located on both sides of the open end of the chassis 1 to facilitate the disassembly of the server. The hard disk compartment 15 extends from the open end of the chassis 1 towards the inside of the chassis 1 to accommodate the hard disk 21.

[0043] It is worth mentioning that, as Figure 2 shown, the server is further provided with a first heat-conducting sticker 6. The first heat-conducting sticker 6 can be heat-conducting silica gel, heat-conducting graphite, or heat-conducting metal oxide, etc., and the first heat-conducting sticker 6 is located between the hard disk 21 and the cold pipe 4. At the same time, the first heat-conducting sticker 6 is in contact with both the hard disk 21 and the cold pipe 4, so as to reduce the contact gap between the hard disk 21 and the cold pipe 4 and increase the contact area between the hard disk 21 and the cold pipe 4, thereby further improving the heat dissipation efficiency of the cold pipe 4 for the hard disk 21.

[0044] Continuing to refer to Figure 2 , a heat dissipation plate 7 is further provided on the side of the cold pipe 4 facing away from the hard disk 21, and the cold pipe 4 is embedded in the heat dissipation plate 7. It is worth mentioning that multiple cold pipes 4 can be embedded in the heat dissipation plate 7, and the contact area 41 of each cold pipe 4 and the side of the heat dissipation plate 7 close to the cold pipe 4 are both in contact with the surface of the hard disk 21. And one end of the heat dissipation plate 7 facing away from the contact area 41 is in contact with the liquid cooling mechanism 3. This can enable the cold pipe 4 and the heat dissipation plate 7 to dissipate heat from the hard disk 21 at the same time, thereby effectively improving the heat dissipation efficiency of the server. In addition, the first heat-conducting sticker 6 located between the cold pipe 4 and the hard disk 21 can be in contact with the heat dissipation plate 7 at the same time to further improve the heat dissipation efficiency of the heat dissipation plate 7 for the hard disk 21.

[0045] The heat dissipation plate 7 of the server provided by the present utility model can be fixedly connected to the hard disk box 211 through screws, so as to improve the structural reliability of the heat dissipation plate 7 and enhance the supporting effect of the heat dissipation plate 7 on the cold pipe 4. It is worth mentioning that the material of the heat dissipation plate 7 can be selected as a metal material with good heat conduction, so as to further improve the heat dissipation efficiency of the server.

[0046] As Figure 5 shown, the server can also be provided with a second heat conduction sticker 8, and the second heat conduction sticker 8 is heat-conducting silica gel, heat-conducting graphite or heat-conducting metal oxide, etc. The second heat conduction sticker 8 is located between the liquid distributor 31 and the heat exchange area 42, and the second heat conduction sticker 8 abuts against the liquid distributor 31 and the heat exchange area 42. So as to further improve the heat dissipation efficiency of the server. It can be understood that while the second heat conduction sticker 8 abuts against the liquid distributor 31 and the heat exchange area 42, it also abuts against the heat dissipation plate 7. And because the texture of the second heat conduction sticker 8 is relatively soft, this can also avoid the formation of a rigid connection between the cold pipe 4 and the liquid distributor 31 and between the heat dissipation plate 7 and the liquid distributor 31, thereby improving the connection reliability between the cold pipe 4 and the liquid distributor 31 and between the heat dissipation plate 7 and the liquid distributor 31.

[0047] In a specific embodiment provided by the present utility model, refer to Figure 7 , Figure 7 is an exploded view of the CPU, DIMM and related components provided by the present utility model. A liquid cooling plate 9 can be arranged inside the chassis 1 of the server. Since the central processing unit 22 generates a large amount of heat, therefore, in the server provided by the present utility model, the central processing unit 22 is installed on the liquid cooling plate 9, and at the same time the liquid distributor 31 is communicated with the liquid cooling plate 9, so that the refrigerant in the liquid storage tank can directly enter the liquid cooling plate 9 after passing through the liquid distributor 31, and then circulate back to the liquid storage tank through the liquid cooling plate 9. In this way, while the central processing unit 22 is cooled by the cold pipe 4, the refrigerant in the liquid cooling plate 9 can also be used to cool the central processing unit 22, thereby further improving the heat dissipation efficiency of the server. In addition, at least part of the contact area 41 of the cold pipe 4 is in contact with the surface of the storage module 23 while being in contact with the liquid cooling plate 9. So as to further improve the heat dissipation efficiency of the server.

[0048] Refer to Figure 8 , Figure 8 is another structural schematic diagram of the cold pipe provided by the present utility model. The cold pipe 4 can include two heat exchange areas 42, the contact area 41 is located between the two heat exchange areas 42, and the two heat exchange areas 42 are located on the same side of the contact area 41. And as Figure 1 shown, one ends of the two heat exchange areas 42 departing from the contact area 41 are respectively abutted or inserted into the liquid distributor 31. In this way, after the refrigerant in the contact area 41 is heated and vaporized, it can move towards one or both sides of the heat exchange areas 42, and the refrigerant liquefied in the heat exchange areas 42 can quickly flow back to the contact area 41, thereby further improving the heat dissipation efficiency of the server.

[0049] It is worth mentioning that, as Figure 7 shown, the server provided by the present utility model can be provided with a plurality of cold pipes 4 according to actual needs. Specifically, at least two cold pipes 4 are arranged oppositely, and the liquid cooling plate 9 can be located between the contact areas 41 of the two oppositely arranged cold pipes 4 and respectively abut against the contact areas 41 of the two cold pipes 4 to further improve the heat dissipation efficiency of the liquid cooling plate 9.

[0050] In addition, a first heat-conducting sticker 6 can be arranged between the liquid cooling plate 9 and the cold pipe 4 and between the cold pipe 4 and the storage module 23, and the first heat-conducting sticker 6 abuts against the liquid cooling plate 9, the cold pipe 4 and the storage module 23. A second heat-conducting sticker 8 is arranged between the heat exchange area 42 of the liquid distributor 31 and the cold pipe 4, and the second heat-conducting sticker 8 abuts against the heat exchange area 42 and the liquid distributor 31, thereby further improving the heat dissipation efficiency of the server.

[0051] It should be noted that, as Figure 7 shown, the server provided by the present utility model further includes a main board 221 and a cover plate 222. Referring to Figure 1 together, the cover plate 222 is closer to the top wall 11 of the chassis 1 relative to the bottom wall 12 of the chassis 1. The cover plate 222 is fixedly connected to the liquid cooling plate 9 and the liquid distributor 31 by screws, so that the central processing unit 22 and the storage module 23 form a modular structure (hereinafter referred to as the CPU+DIMM module), which facilitates the installation of the CPU+DIMM module. In addition, the CPU+DIMM module can be installed on the main board 221 through a mounting bracket, and the main board 221 is installed on the bottom wall 12 of the chassis 1, and a handle is further arranged on the main board 221 to further improve the installation convenience of the main board 221 and the CPU+DIMM module.

[0052] In another specific embodiment provided by the present utility model, referring to Figure 9 Figure 9 is an exploded view of the GPU and related components provided by the present utility model. The microprocessor 24 is installed in the GPU installation box 241, and a GPU liquid cooling circulation path is arranged inside the GPU installation box 241. The GPU liquid cooling circulation path is communicated with the GPU liquid inlet 242 and the GPU liquid outlet 243 outside the GPU installation box 241. The refrigerant in the liquid storage tank can sequentially enter the GPU liquid cooling circulation path through the liquid inlet cavity 52 of the total liquid distributor 5, the liquid distribution pipeline 51 and the GPU liquid inlet 241, and then flow back to the liquid outlet cavity 53 of the total liquid distributor 5 through the GPU liquid outlet 242 to realize the rapid heat dissipation of the microprocessor 24 through the circulation of the refrigerant. It is worth mentioning that the microprocessor 24, the GPU installation box 241 and the GPU liquid cooling circulation path can be designed as a modular structure (hereinafter referred to as the GPU module) to improve the installation convenience of the GPU module.

[0053] In addition, continuing to refer to Figure 9 ​, the GPU module further includes a GPU bracket 244 and a GPU board 245, where the GPU installation box 241 is connected to the GPU board 245 through the GPU bracket 244 to increase the overall stability of the GPU module.

[0054] It can be understood that the heat dissipation method of the server power supply 25 provided by the present utility model can refer to the design scheme of the GPU module. Specifically, refer to Figure 10 , Figure 10 is a schematic structural diagram of a power supply provided by the present utility model. The power supply 25 is installed in the power supply box 251, and a power liquid cooling circulation flow path is provided inside the power supply box 251. The power liquid cooling circulation flow path is communicated with the power supply box inlet 252 and the power supply box outlet 253 outside the power supply box 251. And the refrigerant in the liquid storage tank can enter the power liquid cooling circulation flow path after passing through the liquid inlet cavity 52 of the total liquid distributor 5, the liquid distribution pipeline 51 and the power supply box inlet 252 in sequence, and then flow back to the liquid outlet cavity 53 of the total liquid distributor 5 through the power supply box outlet 253, so as to realize the rapid heat dissipation of the power supply 25 through the circulation of the refrigerant. It is worth mentioning that the power supply 25, the power supply box 251 and the power liquid cooling circulation flow path can be designed modularly (hereinafter referred to as the power supply module) to improve the installation convenience of the power supply module.

[0055] In addition, the server chassis 1 further includes a power supply installation bin 16. Refer to Figure 11 , Figure 11 is a schematic structural diagram of a power supply installation bin provided by the present utility model. The power supply module is plugged into the power supply installation bin 16. Refer to Figure 12 , Figure 12 is Figure 4 a partial enlarged view of the B part of the server provided. The power supply installation bin 16 includes an elastic arm 161, and a bending structure 1611 is provided on the elastic arm 161. Combining Figure 10 together, the power supply box 251 of the power supply module is provided with a groove 2511. When the power supply module is plugged into the power supply installation bin 16, the bending structure 1611 of the elastic arm 161 is plugged into the groove 2511 of the power supply box 251, thereby realizing the limit of the power supply module and effectively avoiding the power supply module being pulled out due to misoperation. At the same time, when the power supply box inlet 252 and / or the power supply box outlet 253 are communicated with the liquid distribution pipeline 51, this can also effectively avoid the liquid distribution pipeline 51 being damaged due to mispulling the power supply 25, thereby improving the use safety of the server.

[0056] It is worth mentioning that the server provided by the present utility model includes a plurality of GPU modules and a plurality of power supply modules. The GPU liquid cooling circulation paths of the plurality of GPU modules can be connected in series through a liquid distribution pipeline 51, and the power supply liquid cooling circulation paths of the plurality of power supply modules can also be connected in series through the liquid distribution pipeline 51, so as to reduce the occupied volume of the liquid distribution pipeline 51 and the liquid distributor 31 inside the chassis 1.

[0057] In another specific embodiment provided by the present utility model, refer to Figure 13 , Figure 13 which is a schematic structural diagram of a liquid leakage detection module provided by the present utility model. Specifically, the liquid leakage detection module includes a detection cable, and the detection cable wraps the outer side wall of the liquid distribution pipeline 51. When the refrigerant in the liquid distribution pipeline 51 leaks, the detection cable will send out an alarm signal and upload it to the data center management platform, and the data center management platform will control the switch valve and the circulation pump between the liquid storage tank and the main liquid distributor 5 to close, so as to cut off the refrigerant supply of the liquid storage tank to the server.

[0058] It can continue to refer to Figure 13 , the liquid leakage detection module further includes a liquid accumulation tray 17 and an overflow pipe 18. When the liquid distributor 31, the main liquid distributor 5 or other modules of the server leak liquid, the liquid accumulation tray 17 can be used to receive the leaked refrigerant, and then the refrigerant flowing into the liquid accumulation tray 17 is discharged to the outside of the chassis 1 through the overflow pipe 18, so as to improve the safety of the server.

[0059] In addition, the server provided by the present utility model further includes a temperature sensor, and the temperature sensor is used to monitor the temperature of each module. The data center management platform can adjust the temperature of the refrigerant in the liquid storage tank according to the real-time temperature data, so as to change the temperature of the refrigerant flowing into each module, thereby improving the accuracy of the server temperature control and the operation stability of the data center, and reducing the energy consumption of the data center.

[0060] In summary, when using the server provided by the present utility model, since there is an included angle including an obtuse angle between the heating device 2 and the liquid cooling mechanism 3, and the contact area 41 of the cold pipe 4 abuts against the heating device 2, and at the same time the heat exchange area 42 of the cold pipe 4 abuts against the liquid cooling mechanism 3, when the heating device 2 operates, the refrigerant in the contact area 41 is heated and vaporized, and the vaporized refrigerant flows along the bending direction of the cold pipe 4 to the heat exchange area 42. The gaseous refrigerant in the heat exchange area 42 is re-liquefied by the liquid cooling mechanism 3, and the re-liquefied liquid refrigerant flows back to the contact area 41 along the bending direction of the cold pipe 4, so as to realize the uninterrupted and rapid circulation flow of the refrigerant in the cold pipe 4 between the contact area 41 and the heat exchange area 42 through the two-phase change of the refrigerant in the cold pipe 4, thereby effectively improving the heat dissipation efficiency of the server.

[0061] Obviously, those skilled in the art can make various modifications and variations to the present utility model without departing from the spirit and scope of the present utility model. Thus, if these modifications and variations of the present utility model fall within the scope of the claims of the present utility model and their equivalent technologies, the present utility model also intends to include these modifications and variations.

Claims

1. A server, comprising a chassis and a heating device, wherein the heating device is accommodated in the chassis, characterized in that: The server also includes a liquid cooling mechanism and a cooling pipe, wherein: The liquid cooling mechanism is located inside the chassis; The cold pipe is located in the chassis, and the cold pipe includes a contact area, a heat exchange area and a refrigerant. The contact area is connected to the heat exchange area, and the angle between the contact area and the heat exchange area includes an obtuse angle; the refrigerant circulates between the contact area and the heat exchange area; At least part of the contact zone abuts against the surface of the heat-generating device, and one end of the heat exchange zone away from the contact zone abuts against the liquid cooling mechanism; the liquid cooling mechanism is used to cool the refrigerant in the heat exchange zone.

2. The server according to claim 1, characterized in that: The cold pipe includes two heat exchange areas, the contact area is located between the two heat exchange areas, and the two heat exchange areas are located on the same side of the contact area.

3. The server according to claim 1 or 2, characterized in that: The chassis comprises a top wall and a bottom wall which are arranged opposite to each other, and the heat exchange area is close to the top wall relative to the contact area.

4. The server according to claim 1, characterized in that: The server further includes a first thermal conductive paste, which is located between the heat generating device and the cold pipe, and the first thermal conductive paste abuts against the heat generating device and the cold pipe.

5. The server according to claim 1, characterized in that: The server further includes a second thermally conductive paste, which is located between the liquid cooling mechanism and the heat exchange area, and the second thermally conductive paste abuts against the liquid cooling mechanism and the heat exchange area.

6. The server according to claim 1, characterized in that: The server also includes a heat sink, which is located on a side of the cold pipe away from the heating device, and the cold pipe is embedded in the heat sink. A side of the heat sink close to the cold pipe abuts against the surface of the heating device; an end of the heat sink located in the heat exchange zone away from the contact zone contacts the liquid cooling mechanism.

7. The server according to claim 1, characterized in that: The server further includes a liquid cooling plate, the liquid cooling plate is located in the chassis, the heating device is mounted on the liquid cooling plate, and the liquid cooling mechanism is in communication with the liquid cooling plate.

8. The server according to claim 1, characterized in that: The server includes a liquid storage tank, a main liquid distributor, multiple liquid distribution pipelines and multiple liquid cooling mechanisms. The liquid storage tank is arranged on the outside of the chassis; the main liquid distributor is connected to the chassis; the main liquid distributor is connected to the liquid storage tank, and the multiple liquid cooling mechanisms are connected to the main liquid distributor one by one through multiple liquid distribution pipelines.

9. The server according to claim 8, characterized in that: The server further includes a liquid leakage detection module, wherein the liquid leakage detection module includes a detection cable, and the detection cable wraps around an outer side wall of the liquid separation pipeline.

10. The server according to claim 9, characterized in that The liquid leakage detection module also includes a liquid accumulation tray and an overflow pipe. The liquid accumulation tray is used to receive the refrigerant leaked from the liquid cooling mechanism. One end of the overflow pipe is connected to the liquid accumulation tray, and the other end extends out of the chassis.

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