Coupling heat dissipation device and server

Abstract

The utility model relates to the field of heat dissipation, and discloses a coupling heat dissipation device and a server, and the coupling heat dissipation device comprises a cold head and a frame structure surrounding the outer side of the cold head; the cold head comprises a first heat dissipation surface used for being in contact with the first heating element for heat dissipation; the frame structure comprises a first locking frame and a second locking frame, the first locking frame comprises a first heat conduction part, the second locking frame comprises a second heat conduction part, and the first heat conduction part and the second heat conduction part are spliced to form a heat conduction structure; the heat conduction structure comprises a second heat dissipation face used for being in contact with the second heating element for heat dissipation. According to the coupling heat dissipation device, the heat conduction structure for dissipating heat of the second heat conduction element and the frame structure for locking the cold head are coupled into a whole, that is to say, the coupling heat dissipation device adopts one cold head to carry out liquid cooling heat dissipation on different heating elements, a cold plate structure is omitted, and the weight and the occupied space are greatly reduced.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and particularly to a coupled heat dissipation device and a server. Background Art

[0002] In today's digital age, as the core carrier for data processing, the efficient and stable operation of servers has become the key to an enterprise's competitiveness. Among them, the Voltage Regulator Module (VRM), as the heart of the server power management system, is responsible for providing precise and stable voltage supply to high-power components such as the Central Processing Unit (CPU). Its performance directly affects the energy efficiency and stability of the entire system. With the rapid improvement in the performance of server central processors, their power consumption and power management requirements have also increased dramatically, resulting in a large amount of heat generated by the voltage regulator module under high load conditions. Therefore, an efficient heat dissipation mechanism is particularly important for maintaining the normal operating temperature of the voltage regulator module, avoiding system failures caused by overheating, and extending the service life of the server. Summary of the Utility Model

[0003] This application discloses a coupled heat dissipation device and a server, which are used to couple the cold plates of the voltage regulator module and the central processor into an integrated structure to achieve the purpose of weight reduction and space saving on the basis of liquid cooling heat dissipation.

[0004] To achieve the above object, this application provides the following technical solutions:

[0005] In a first aspect, an embodiment of this application provides a coupled heat dissipation device, including: a cold head and a frame structure surrounding the outside of the cold head;

[0006] The cold head includes a first heat dissipation surface for contacting and dissipating heat from a first heat generating element;

[0007] The frame structure includes a first locking frame and a second locking frame. The first locking frame includes a first heat conducting part, and the second locking frame includes a second heat conducting part. The first heat conducting part and the second heat conducting part are spliced to form a heat conducting structure; the heat conducting structure includes a second heat dissipation surface for contacting and dissipating heat from a second heat generating element.

[0008] The above-mentioned coupled heat dissipation device includes a cold head and a frame structure, and the cold head is fixed through the frame structure. To facilitate the installation and fixation of the cold head, the frame structure adopts a split frame. For example, the first locking frame and the second locking frame are respectively located on opposite sides of the cold head and are spliced to form the frame structure. The cold head has a first heat dissipation surface for dissipating heat from a first heating element such as a central processing unit; the frame structure includes a heat conduction structure, and the heat conduction structure has a second heat dissipation surface for dissipating heat from a second heating element such as a voltage regulation module. The heat conduction structure is formed by splicing a first heat conduction part on the first locking frame and a second heat conduction part on the second locking frame, so that part of the heat of the second heating element is conducted to the cold head through the first heat conduction part and the first locking frame, and another part of the heat of the second heating element is conducted to the cold head through the second heat conduction part and the second locking frame. Finally, the heat is taken away by the coolant in the cold head. The above-mentioned coupled heat dissipation device integrates the heat conduction structure for dissipating heat from the second heating element with the frame structure for fixing the cold head. That is to say, the above-mentioned coupled heat dissipation device uses one cold head to perform liquid cooling heat dissipation for different heating elements, eliminating a cold plate structure, and greatly reducing the weight and space occupation.

[0009] In some embodiments, the second heat dissipation surface includes a first heat conduction surface and a second heat conduction surface with equal areas, where the first heat conduction surface is located on the first heat conduction part, and the second heat conduction surface is located on the second heat conduction part. The second heat dissipation surface is formed by splicing the first heat conduction surface and the second heat conduction surface with equal areas. The first heat conduction surface contacts and dissipates heat from the components in half of the area of the second heating element, and the second heat conduction surface contacts and dissipates heat from the components in the other half of the area of the second heating element, ensuring the uniform temperature effect of the entire second heating element.

[0010] In some embodiments, the first locking frame further includes a first fitting structure connected to the first heat conduction part, and the second locking frame further includes a second fitting structure connected to the second heat conduction part. The first fitting structure and the second fitting structure are fitted along the thickness direction of the cold head. The first fitting structure is connected to the first heat conduction part, and the second fitting structure is connected to the second heat conduction part. The heat conducted through the first heat conduction part is conducted to the first fitting structure, and the heat conducted through the second heat conduction part is conducted to the second fitting structure. The first fitting structure and the second fitting structure are fitted along the thickness direction of the cold head, so that the heat can be evenly heated between the first fitting structure and the second fitting structure, further evenly distributing the heat flux conducted by the second heating element, and balancing the temperature of the second heating element.

[0011] In some embodiments, the first fitting structure has a first fitting surface on the side facing the second fitting structure, and the second fitting structure has a second fitting surface on the side facing the first fitting structure. The area of the first fitting surface is equal to the area of the second fitting surface, so that the heat conduction paths of the two parts of the heat of the second heating element are the same, further playing a role in balancing the temperature of the second heating element.

[0012] In some embodiments, a heat-conducting element is filled between the first bonding surface and the second bonding surface to reduce thermal resistance and ensure heat transfer efficiency.

[0013] In some embodiments, the cold head includes a substrate and a cover plate, the cover plate includes a top plate and a plurality of side plates, the cover plate is buckled on the side of the substrate away from the first heat dissipation surface, and forms a cooling cavity with the substrate; the top plate is provided with an inlet and an outlet communicating with the cooling cavity;

[0014] The substrate includes a first overlapping surface, which is opposite to the first heat dissipation surface; the first locking frame and / or the second locking frame includes a second overlapping surface overlapping the first overlapping surface, and a heat conductive element is filled between the first overlapping surface and the second overlapping surface to reduce thermal resistance and ensure heat transfer efficiency.

[0015] A plurality of side plates and a top plate are connected to form a cavity structure of a cover plate, and the cover plate is buckled on the surface of the base plate to form a cooling cavity for containing coolant. An inlet and an outlet connected to the cooling cavity are arranged on the top plate to facilitate the connection of the liquid cooling pipeline. The first overlapping surface can be an annular surface surrounding the cover plate, half of the annular surface is in contact with the cold head fitting surface on the first locking frame, and the other half of the annular surface is in contact with the cold head fitting surface on the second locking frame to ensure the uniform temperature requirement of the first locking frame and the second locking frame. The cold head fitting surface on the first locking frame and the cold head fitting surface on the second locking frame are spliced ​​to form a second overlapping surface.

[0016] In some embodiments, the side panel is provided with a cold head fin; the first locking frame and / or the second locking frame is provided with a fin hole that cooperates with the cold head fin. The cold head fins provided on the side panel are inserted into the first locking frame or the second locking frame, thereby increasing the heat transfer area between the cold head and the frame structure. There can be multiple cold head fins. In order to ensure the uniformity of heat conduction between the first locking frame and the second locking frame, half of the multiple cold head fins are plugged into the first locking frame, and the other half are plugged into the second locking frame.

[0017] In some embodiments, a heat-conducting element is filled between the cold head fins and the side walls of the fin holes to reduce thermal resistance and ensure heat transfer efficiency.

[0018] In some embodiments, the side wall of the fin hole includes a guide surface at the opening to facilitate the cold head fin to be inserted into the fin hole. The guide surface can be formed by chamfering the opening.

[0019] In a second aspect, an embodiment of the present application provides a server, including a mainboard and a central processing unit installed on the mainboard, a voltage regulating module, and a coupling heat dissipation device as described in any one of the embodiments of the first aspect;

[0020] The first heat dissipation surface in the coupled heat dissipation device is in contact with the central processing unit;

[0021] The second heat dissipation surface in the coupled heat dissipation device is in contact with the voltage regulation module.

[0022] In the above server, the coupled heat dissipation device is fixed on the main board through a frame structure. The cold head is in corresponding contact with the central processing unit on the main board and is used to dissipate heat from the central processing unit; the heat conduction structure is in corresponding contact with the voltage regulation module and is used to dissipate heat from the voltage regulation module. The central processing unit and the voltage regulation module achieve liquid cooling through a single cold head, greatly reducing the weight and space occupancy of the cold plate in the server and enhancing the overall aesthetics. Description of the Drawings

[0023] Figure 1 It is a schematic diagram of the air-cooled heat dissipation structure of the voltage regulation module in the related art;

[0024] Figure 2 It is a schematic diagram of the liquid-cooled heat dissipation structure of the voltage regulation module in the related art;

[0025] Figure 3 It is a three-dimensional perspective Figure 1 ;

[0026] Figure 4 It is a three-dimensional perspective Figure 2 ;

[0027] Figure 5 It is a schematic diagram of one side structure of a coupled heat dissipation device provided by an embodiment of the present application;

[0028] Figure 6 It is a three-dimensional perspective view of the cold head in a coupled heat dissipation device provided by an embodiment of the present application;

[0029] Figure 7 It is a schematic diagram of one side structure of the cold head in a coupled heat dissipation device provided by an embodiment of the present application;

[0030] Figure 8 It is a three-dimensional perspective Figure 1 ;

[0031] Figure 9 It is a three-dimensional perspective Figure 2 ;

[0032] Figure 10 It is a three-dimensional perspective Figure 1 ;

[0033] Figure 11 The three-dimensional solid of the second locking frame in a coupling heat dissipation device provided by an embodiment of the present application Figure 2 ;

[0034] Figure 12 The three-dimensional solid of a coupling heat dissipation device provided by an embodiment of the present application Figure 3 ;

[0035] Icons: 1 - Voltage regulation module radiator; 2 - Locking piece; 3 - Voltage regulation module; 4 - Heat conduction block; 5 - Cold plate; 100 - Cold head; 200 - Frame structure; 300 - Cold plate buckle; 110 - Substrate; 120 - Cover plate; 130 - Cold head fins; 111 - First heat dissipation surface; 210 - First locking frame; 220 - Second locking frame; 112 - First overlapping surface; 121 - Top plate; 122 - Side plate; 131 - Heat conduction element; 211 - First heat conduction part; 212 - First fitting structure; 213 - Fin hole; 214 - Third fitting surface; 215 - Cold head fitting surface; 216 - First splicing surface; 221 - Second heat conduction part; 222 - Second fitting structure; 223 - Fin hole; 224 - Fourth fitting surface; 225 - Cold head fitting surface; 226 - Second splicing surface; 1111 - First heat conduction piece; 1211 - Inlet; 1212 - Outlet; 2111 - First heat conduction surface; 2121 - First fitting surface; 2131 - Guide surface; 2151 - Heat conduction element; 2211 - Second heat conduction surface; 2221 - Second fitting surface; 2222 - Heat conduction element; 2231 - Guide surface; 2251 - Heat conduction element; Q - Heat conduction structure; Q1 - Second heat dissipation surface; Q2 - Second heat conduction piece; L1 - First locking screw; L2 - Second locking screw; L3 - Third locking screw. Detailed implementation manners

[0036] First, introduce the application scenario of the present application:

[0037] The function of the voltage regulation module in a server is to output working voltages with multiple voltage amplitudes to meet the load requirements of the central processing unit in different working states. As the power consumption of the central processing unit continues to increase, the power consumption of the voltage regulation module is also continuously rising. In addition, the voltage regulation module is relatively low in height, and there are high central processing unit radiators or other electronic components blocking in the air flow direction, which will cause the air speed on the surface of the voltage regulation module to be relatively low. Therefore, it is very difficult to make the temperature of the voltage regulation module lower than its optimal working temperature by exchanging heat with cold air through itself.

[0038] In related technologies, the heat dissipation solutions for voltage regulation modules can be generally divided into two types: air cooling and liquid cooling.

[0039] The air cooling solution is as Figure 1, a voltage regulation module radiator 1 is assembled on the voltage regulation module. The voltage regulation module radiator 1 is fixed above the voltage regulation module through a locking member 2, and the temperature of the voltage regulation module is reduced by increasing the heat dissipation area of the voltage regulation module. This solution usually needs to be combined with a fan to increase the air volume passing through the voltage regulation module radiator, and the use of the fan will increase the system noise. At the same time, since there are relatively high components such as the central processing unit radiator in the air flow direction of the voltage regulation module radiator, the air resistance passing through the voltage regulation module radiator will be increased. In addition, the air-cooled heat dissipation solution is also affected by the heating components in its air flow direction, and the incoming air will be preheated, which will reduce the air-cooled heat dissipation effect of the voltage regulation module. All in all, the air-cooled heat dissipation efficiency is not high and there are many influencing factors. As the heat flux of the voltage regulation module increases, it becomes increasingly difficult to use the voltage regulation module radiator to dissipate heat from the voltage regulation module.

[0040] The liquid-cooled solution such as Figure 2 , the heat of the voltage regulation module 3 is conducted to the cold plate 5 through the heat conduction block 4, and finally the heat of the voltage regulation module 3 is taken away by the liquid working medium flowing in the cold plate 5. However, most current liquid-cooled solutions separately set up a heat dissipation cold plate for the voltage regulation module, such as Figure 2 . This solution will increase the weight of the system liquid-cooled radiator and reduce the system reliability.

[0041] Based on the above application scenarios, the embodiments of the present application provide a coupled heat dissipation device and a server, which are used to couple the cold plates of the voltage regulation module and the central processing unit into an integrated structure, so as to achieve the purpose of weight reduction and space saving on the basis of liquid-cooled heat dissipation.

[0042] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application. Among them, in the description of the embodiments of the present application, unless otherwise specified, " / " means "or". For example, A / B may represent A or B; "and / or" in the text is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. These three situations. In addition, in the description of the embodiments of the present application, "a plurality" means two or more than two.

[0043] Hereinafter, the terms "first" and "second" are for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0044] As Figures 3 to 5 shown, an embodiment of the present application provides a coupled heat dissipation device, including: a cold head 100 and a frame structure 200 surrounding the outside of the cold head 100;

[0045] The cold head 100 includes a first heat dissipation surface 111 for contacting and dissipating heat from a first heat generating element;

[0046] The frame structure 200 includes a first locking frame 210 and a second locking frame 220. The first locking frame 210 includes a first heat conducting portion 211, and the second locking frame 220 includes a second heat conducting portion 221. The first heat conducting portion 211 and the second heat conducting portion 221 are spliced to form a heat conducting structure Q; the heat conducting structure Q includes a second heat dissipation surface Q1 for contacting and dissipating heat from a second heat generating element.

[0047] The above-mentioned coupled heat dissipation device includes a cold head 100 and a frame structure 200, and the cold head 100 is locked through the frame structure 200. For the convenience of installation and fixation of the cold head 100, the frame structure 200 adopts a split frame. For example, the first locking frame 210 and the second locking frame 220 are respectively located on opposite sides of the cold head 100 and are spliced to form the frame structure 200. The cold head 100 has a first heat dissipation surface 111 for dissipating heat from a first heat generating element such as a central processing unit; the frame structure 200 includes a heat conducting structure Q, and the heat conducting structure Q has a second heat dissipation surface Q1 for dissipating heat from a second heat generating element such as a voltage regulation module. The heat conducting structure Q is formed by splicing the first heat conducting portion 211 on the first locking frame 210 and the second heat conducting portion 221 on the second locking frame 220, so that part of the heat of the second heat generating element is conducted to the cold head 100 through the first heat conducting portion 211 and the first locking frame 210, and another part of the heat of the second heat generating element is conducted to the cold head 100 through the second heat conducting portion 221 and the second locking frame 220. Finally, the heat is taken away by the coolant in the cold head 100. The above-mentioned coupled heat dissipation device couples the heat conducting structure Q for dissipating heat from the second heat generating element with the frame structure 200 for locking the cold head 100 into one body. That is to say, the above-mentioned coupled heat dissipation device uses a cold head 100 to perform liquid cooling for different heat generating elements, omitting a cold plate structure, and greatly reducing the weight and space occupation.

[0048] In a possible implementation manner, the coupling heat dissipation device provided by the embodiments of the present application is applied to a server. The first heat dissipation surface 111 of the cold head 100 is in contact with the central processing unit for heat conduction, and is used for liquid cooling heat dissipation of the central processing unit; the second heat dissipation surface Q1 of the heat conduction structure Q is in contact with the voltage regulation module for heat conduction, and is used for heat conduction contact with the voltage regulation module. The heat conduction structure Q and the frame 200 coupled to the frame for fixing the cold head 100 are integrated into a frame structure. The cold head 100 is fixedly installed through the cold plate fastener 300 on the frame structure 200. Due to the height difference between the central processing unit and the voltage regulation module, there is a height difference between the first heat dissipation surface 111 and the second heat dissipation surface Q1, as Figure 5 shown by H in

[0049] In some embodiments, as Figure 4 shown, the second heat dissipation surface Q1 includes a first heat conduction surface 2111 and a second heat conduction surface 2211 with equal areas. The first heat conduction surface 2111 is located in the first heat conduction part 211, and the second heat conduction surface 2211 is located in the second heat conduction part 221. The second heat dissipation surface Q1 is formed by splicing the first heat conduction surface 2111 and the second heat conduction surface 2211 with equal areas. The first heat conduction surface 2111 is in contact with the components in half of the areas of the second heating element for heat dissipation, and the second heat conduction surface 2211 is in contact with the components in the other half of the areas of the second heating element for heat dissipation, ensuring the uniform temperature effect of the entire second heating element.

[0050] As Figure 4 shown, both the first heat conduction surface 2111 and the second heat conduction surface 2211 are trapezoidal. The first heat conduction part 211 and the second heat conduction part 221 are attached by an inclined surface that forms an obtuse angle with the first heat conduction surface 2111, increasing the heat transfer area between the first heat conduction part 211 and the second heat conduction part 221.

[0051] In some embodiments, as Figure 6 shown, the cold head 100 includes a substrate 110 and a cover plate 120. The cover plate 120 includes a top plate 121 and a plurality of side plates 122. The cover plate 120 is fastened to the side of the substrate 110 facing away from the first heat dissipation surface 111 and forms a cooling cavity with the substrate 110; an inlet 1211 and an outlet 1212 communicating with the cooling cavity are provided on the top plate 121;

[0052] The substrate 110 includes a first overlapping surface 112, and the first overlapping surface 112 faces the first heat dissipation surface 111; the first locking frame 210 and / or the second locking frame 220 includes a second overlapping surface that overlaps with the first overlapping surface 112. A heat conduction element is filled between the first overlapping surface 112 and the second overlapping surface to reduce the thermal resistance and ensure the heat transfer efficiency.

[0053] As Figure 6 and Figure 7As shown, a plurality of side plates 122 and a top plate 121 are connected to form a cover plate 120 of a cavity structure. The cover plate 120 is fastened to the surface of the substrate 110 facing away from the first heat dissipation surface 111 to form a cooling cavity for containing a coolant. The first overlapping surface 112 on the substrate 110 can be an annular surface surrounding the cover plate 120 for fitting with the frame structure 200 that fixes the cold head 100. Exemplarily, the cover plate 120 and the substrate 110 are welded together by vacuum brazing to form a closed cooling cavity inside. The liquid cooling working medium flows into the cooling cavity from the inlet 1211 and flows out from the outlet 1212, taking away the heat of the heating element in contact with the cold head 100. Exemplarily, the material of the cold head 100 is copper. Since copper has a relatively high thermal conductivity, it can efficiently conduct the heat of the heating element in contact with the cold head 100.

[0054] In a possible implementation manner, the inlet 1211 and the outlet 1212 communicated with the cooling cavity are arranged on the top plate 121. The inlet 1211 and the outlet 1212 need to be connected with an L-shaped joint to facilitate the connection of the liquid cooling pipeline. The inlet 1211 and the outlet 1212 on the top plate 121 are both close to the edge of the top plate 121. Therefore, a part of the orthographic projection of the L-shaped joint on the top plate 121 will fall on the edge of the substrate 110 outside the top plate 121, and the L-shaped joint will interfere with the frame structure 200 that fixes the cold head 100, resulting in that the frame structure 200 cannot be placed on the first overlapping surface 112 of the substrate 110 along the thickness direction of the cold head 100 and fit with the first overlapping surface 112, thus affecting the fixation of the cold head 100. In this regard, in order to facilitate the installation and fixation of the cold head 100, the frame structure 200 that fixes the cold head 100 is set as a split structure, which are respectively the first locking frame 210 and the second locking frame 220 on both sides of the cold head 100. And the splicing parts of the first locking frame 210 and the second locking frame 220 are respectively located on the side close to the inlet 1211 and the side close to the outlet 1212, which is convenient for the first locking frame 210 to slide in from the left or right side of the L-shaped joint along the direction parallel to the substrate 110, and is convenient for the second locking frame 220 to slide in from the right or left side of the L-shaped joint along the direction parallel to the substrate 110 and fit with the first overlapping surface 112, so as to realize the locking of the cold head 100 and the substrate 110.

[0055] As Figure 6 shown, and in combination with Figure 8 and Figure 10, half of the area of the first overlapping surface 112 on the substrate 110 is used to fit with the cold head fitting surface 215 on the first locking frame 210, and the other half of the area is used to fit with the cold head fitting surface 225 on the second locking frame 220 to ensure the temperature uniformity requirements of the first locking frame 210 and the second locking frame 220. The cold head fitting surface 215 on the first locking frame 210 and the cold head fitting surface 225 on the second locking frame 220 are spliced to form a second overlapping surface. A heat-conducting element 2151 is filled between the cold head fitting surface 215 on the first locking frame 210 and the first overlapping surface 112. The heat-conducting element 2151 can fill the gap between the cold head fitting surface 215 and the first overlapping surface 112, reduce the thermal resistance between the cold head fitting surface 215 and the first overlapping surface 112, and enhance the heat conduction performance between the first locking frame 210 and the cold head 100. A heat-conducting element 2251 is filled between the cold head fitting surface 225 on the second locking frame 220 and the first overlapping surface 112. The heat-conducting element 2251 can fill the gap between the cold head fitting surface 225 and the first overlapping surface 112, reduce the thermal resistance between the cold head fitting surface 225 and the first overlapping surface 112, and enhance the heat conduction performance between the second locking frame 220 and the cold head 100.

[0056] In some embodiments, a cold head fin 130 is provided on the side plate 122; the first locking frame 210 and / or the second locking frame 220 is provided with a fin hole that cooperates with the cold head fin 130.

[0057] As Figure 6 and Figure 7 shown, a cold head fin 130 parallel to the substrate 110 is connected to the side plate 122 for increasing the surface area of the cold head 100. The cold head fin 130 is used to be inserted into the frame structure 200 such as the first locking frame 210 and / or the second locking frame 220 to increase the heat transfer area between the cold head 100 and the frame structure 200. There can be multiple cold head fins 130. To ensure the uniformity of the heat conducted by the first locking frame 210 and the second locking frame 220, half of the multiple cold head fins 130 are inserted into the first locking frame 210, and the other half of the cold head fins 130 are inserted into the second locking frame 220. Taking Figure 7 the direction example in

[0058] as an example, there are two cold head fins 130 of the cold head 100, and the two cold head fins 130 are symmetrically arranged on both sides of the cover plate 120. The left cold head fin 130 is used to be inserted into the first locking frame 210, and the right cold head fin 130 is used to be inserted into the second locking frame 220.

[0058] Combined with Figure 6 and Figure 7 , the cold head fins 130 on both sides of the cover plate 120 are both strip-shaped. Of course, the cold head fins 130 on both sides can also be strip-shaped formed by multiple spaced cold head fins 130. Exemplarily, the cold head 100 and the frame structure 200 are connected by screws, as Figure 6As shown, along the length direction of the cold head fin 130, four mounting holes are provided on the substrate 110, each cold head fin 130 is located between two mounting holes, and the four mounting holes are used to install the first locking screw L1 and the second locking screw L2, respectively. Figure 3 shown.

[0059] It should be noted that the cold head 100 and the frame structure 200 can be connected by screw threads, or can be combined and connected into an integrated structure by other methods such as welding and gluing, and heat is dissipated for the first heating element and the second heating element at the same time.

[0060] like Figure 7 As shown, along the width direction of the cold head fin 130, the edge of the cold head fin 130 protrudes from the edge of the substrate 110, that is, the width of the cold head fin 130 is greater than the width of the first overlap surface 112. The sizes of the cold head fins 130 on both sides can be equal, which is convenient for manufacturing and processing, and can also meet the temperature uniformity requirements of the first locking frame 210 and the second locking frame 220. The edges of the cold head fins 130 are processed with rounded corners to facilitate plugging and matching with the first locking frame 210 and the second locking frame 220.

[0061] In some embodiments, Figure 6 and Figure 7 As shown, a heat conducting element 131 is filled between the cold head fin 130 and the side wall of the fin hole to reduce thermal resistance and ensure heat transfer efficiency. In a possible implementation, for easy layout, the heat conducting element 131 is arranged on the surface of the cold head fin 130, and the heat conducting element 131 is located on the side of the cold head fin 130 away from the first overlapping surface 112. Exemplarily, the heat conducting element 131 can be a thermal conductive silicone grease, which is applied to the surface of the cold head fin 130 for easy operation.

[0062] In some embodiments, Figures 8 - 9 As shown, the first locking frame 210 is a U-shaped structure, and a rib hole 213 matching with the cold head rib 130 is provided on the bottom wall of the U-shaped structure toward its opening side, and the side wall of the rib hole 213 includes a guide surface 2131 located at the opening of the rib hole 213, so as to facilitate the cold head rib 130 to be inserted into the rib hole 213. The guide surface 2131 can be formed by chamfering the opening of the rib hole 213.

[0063] Likewise, if Figure 11 As shown, the second locking frame 220 is a U-shaped structure, and a rib hole 223 that matches the cold head rib 130 is provided on the bottom wall of the U-shaped structure toward its opening side, and the side wall of the rib hole 223 includes a guide surface 2231 located at the opening of the rib hole 223, so as to facilitate the cold head rib 130 to be inserted into the rib hole 223. The guide surface 2231 can be formed by chamfering the opening of the rib hole 223.

[0064] It can be understood that chamfering is performed on the rib holes in the locking frame, and the rounded corner design at the farthest end of the cold head rib 130 can enable the cold head rib 130 to be smoothly inserted into the rib holes, further increasing the contact area between the locking frame and the cold head 100. Among them, the locking frame is the first locking frame 210 and the second locking frame 220.

[0065] Combined Figure 4 , both the first locking frame 210 and the second locking frame 220 are U-shaped structures, and the opening positions overlap each other to form the entire frame structure 200. Define Figure 8 The middle view is the reverse side of the first locking frame 210, and define Figure 9 The middle view is the front side of the first locking frame 210, where the front side can be understood as the surface observed from the direction of the cover plate 120 of the cold head 100 to the substrate 110. As Figure 8 shown, the reverse side of the first locking frame 210 has a cold head fitting surface 215 for fitting with the first overlapping surface 112 on the substrate 110 of the cold head 100, and the heat conducting element 2151 can be attached to the cold head fitting surface 215. The first locking screw L1 penetrates the first locking frame 210 from the front side to the reverse side of the first locking frame 210 and is used for threaded connection with the mounting hole on the substrate 110. Exemplarily, the heat conducting element 2151 can be heat conducting silicone grease, which is applied to the cold head fitting surface 215 for convenient operation.

[0066] Correspondingly, define Figure 10 The middle view is the reverse side of the second locking frame 220, and define Figure 11 The middle view is the front side of the second locking frame 220, where the front side can be understood as the surface observed from the direction of the cover plate 120 of the cold head 100 to the substrate 110. As Figure 10 shown, the reverse side of the second locking frame 220 has a cold head fitting surface 225 for fitting with the first overlapping surface 112 on the substrate 110 of the cold head 100, and the heat conducting element 2251 can be attached to the cold head fitting surface 225. The second locking screw L2 penetrates the second locking frame 220 from the front side to the reverse side of the second locking frame 220 and is used for threaded connection with the mounting hole on the substrate 110. Exemplarily, the heat conducting element 2251 can be heat conducting silicone grease, which is applied to the cold head fitting surface 225 for convenient operation.

[0067] In some embodiments, as Figures 8 - 11 shown, the first locking frame 210 further includes a first fitting structure 212 connected to the first heat conducting part 211, and the second locking frame 220 further includes a second fitting structure 222 connected to the second heat conducting part 221. The first fitting structure 212 and the second fitting structure 222 are fitted along the thickness direction of the cold head 100.

[0068] One end of the first locking frame 210 close to the inlet 1211 is the first end, and one end of the first locking frame 210 close to the outlet 1212 is the second end; one end of the second locking frame 220 close to the inlet 1211 is the first end, and one end of the second locking frame 220 close to the outlet 1212 is the second end. The first heat conducting part 211 is located at the second end of the first locking frame 210, and the second heat conducting part 221 is located at the second end of the second locking frame 220. The first fitting structure 212 is connected to the first heat conducting part 211, and the second fitting structure 222 is connected to the second heat conducting part 221. The heat conducted through the first heat conducting part 211 is conducted to the first fitting structure 212, and the heat conducted through the second heat conducting part 221 is conducted to the second fitting structure 222. The first fitting structure 212 and the second fitting structure 222 are attached along the thickness direction of the cold head 100, so that heat can be evenly distributed between the first fitting structure 212 and the second fitting structure 222, further evenly distributing the heat flux conducted by the second heating element and balancing the temperature of the second heating element.

[0069] In some embodiments, one side of the first fitting structure 212 facing the second fitting structure 222 has a first fitting surface 2121, and one side of the second fitting structure 222 facing the first fitting structure 212 has a second fitting surface 2221. The area of the first fitting surface 2121 is equal to the area of the second fitting surface 2221.

[0070] As Figure 8 shown, the reverse side of the first locking frame 210 has the first fitting surface 2121. As Figure 11 shown, the front side of the second locking frame 220 has the second fitting surface 2221, and the second fitting surface 2221 is attached to the first fitting surface 2121. That is to say, the first fitting structure 212 is located above the second fitting structure 222. The area of the first fitting surface 2121 is equal to the area of the second fitting surface 2221, so that the heat conduction paths of the two parts of the second heating element are the same, further playing a role in balancing the temperature of the second heating element.

[0071] As Figure 9 shown, the first heat conducting part 211 of the first locking frame 210 is used to conduct heat to half of the number of second heating elements. The inclined surface of the first heat conducting part 211 for attaching to the second heat conducting part 221 and the inclined surface of the first fitting structure 212 are on the same surface, namely the first splicing surface 216. As Figure 11As shown, the second heat conduction part 221 of the second locking frame 220 is used to conduct heat to the remaining half of the second heating elements. The inclined surface of the second heat conduction part 221 for fitting with the first heat conduction part 211 and the inclined surface above the second fitting structure 222 are on the same surface, that is, the second splicing surface 226. This design can shorten the heat transfer path. The contact area between the first heat conduction part 211 and the second heating element is the same as the contact area between the second heat conduction part 221 and the second heating element, which can play a role in temperature uniformity. Moreover, the fitting surfaces of the first locking frame 210 and the second locking frame 220, that is, the first splicing surface 216 and the second splicing surface 226, have the same area and the same heat transfer path. At the same time, the lower surface of the first fitting structure 212 on the first locking frame 210 and the upper surface of the second fitting structure 222 on the second locking frame 220 are mutually fitted, which can further play a role in temperature uniformity.

[0072] The second end of the first locking frame 210 and the second end of the second locking frame 220 are locked by the third locking screw L3. After the first fitting surface 2121 and the second fitting surface 2221 are fitted, the third locking screw L3 penetrates the second locking frame 220 from the back to the front along the second locking frame 220 and is threadedly connected to the threaded hole on the first locking frame 210.

[0073] As Figure 9 shown, the front surface of the first end of the first locking frame 210 has a third fitting surface 214. As Figure 10 shown, the back surface of the first end of the second locking frame 220 has a fourth fitting surface 224, and the fourth fitting surface 224 is fitted with the third fitting surface 214. That is to say, the first end of the first locking frame 210 is located below the first end of the second locking frame 220. The first end of the first locking frame 210 and the first end of the first locking frame 210 are locked by the third locking screw L3. After the fourth fitting surface 224 and the third fitting surface 214 are fitted, the third locking screw L3 penetrates the first locking frame 210 from the back to the front along the first locking frame 210 and is threadedly connected to the threaded hole on the second locking frame 220.

[0074] It should be noted that the third locking screw L3 for locking the first fixing frame and the second fixing frame is tightened from bottom to top, and the first locking screw L1 for locking the first fixing frame and the cold head 100 and the second locking screw L2 for locking the second fixing frame and the cold head 100 are tightened from top to bottom. The strong pressing force formed by the interaction of the two kinds of screws can stably fix the cold head 100 in the middle of the frame structure 200.

[0075] In some embodiments, a heat conduction element 2222 is filled between the first fitting surface 2121 and the second fitting surface 2221 to reduce the thermal resistance and ensure the heat transfer efficiency.

[0076] In a possible implementation manner, as Figure 11As shown, a heat-conducting element 2222 is attached to the second joint surface 2221 to fill the gap between the first joint surface 2121 and the second joint surface 2221, enhancing the heat transfer performance between the first locking frame 210 and the second locking frame 220, and further ensuring the uniformity of heat transfer of the second heating element. Exemplarily, the heat-conducting element 2222 can be heat-conducting silicone grease, which is applied to the second joint surface 2221 for convenient operation.

[0077] It should be noted that, in addition to using heat-conducting silicone grease, the heat-conducting element 131, the heat-conducting element 2222, the heat-conducting element 2151, and the heat-conducting element 2251 can also use heat-conducting gel, compressible heat-conducting gaskets, etc.

[0078] In the coupling heat dissipation device provided by the embodiment of the present application, the heat-conducting structure Q of the second heating element and the cold head 100 locking frame of the first heating element are made into an integrated cold plate. The locking frame is in close contact with the cold head 100, and the heat of the second heating element is conducted to the cold head 100 through the locking frame. While the liquid in the cold head 100 takes away the heat in the first heating element, it can also take away the heat of the second heating element. Among them, the locking frames are the first locking frame 210 and the second locking frame 220. The coupling heat dissipation device is also equipped with four cold plate fasteners 300, which are respectively located at the four corners of the cold head 100 and are used to lock the entire coupling heat dissipation device on the main board, as Figure 3 and Figure 4 shown. This coupling heat dissipation device can greatly reduce the overall weight. At the same time, the integrated liquid cooling of the second heating element such as the voltage regulation module and the first heating element such as the central processing unit can save the entire system space, thereby enhancing the flexibility of the liquid cooling solutions for other components inside the server, and can also improve the overall aesthetics of the coupling heat dissipation device.

[0079] In a second aspect, the embodiment of the present application provides a server, including a main board and a central processing unit, a voltage regulation module, and any one of the coupling heat dissipation devices in the first aspect embodiment installed on the main board;

[0080] The first heat dissipation surface 111 in the coupling heat dissipation device is in contact with the central processing unit;

[0081] The second heat dissipation surface Q1 in the coupling heat dissipation device is in contact with the voltage regulation module.

[0082] In the above server, the coupling heat dissipation device is fixed on the main board through the frame structure 200. The cold head 100 is in corresponding contact with the central processing unit on the main board and is used to dissipate heat for the central processing unit; the heat-conducting structure Q is in corresponding contact with the voltage regulation module and is used to dissipate heat for the voltage regulation module. The central processing unit and the voltage regulation module achieve liquid cooling through a cold head 100, greatly reducing the weight and space occupation ratio of the cold plate in the server, and improving the overall aesthetics.

[0083] In a possible implementation, as Figure 12 shown, a first heat conducting member 1111 is attached to the first heat dissipation surface 111, and a second heat conducting member Q2 is attached to the second heat dissipation surface Q1. The first heat conducting member 1111 can fill the gap between the cold head 100 and the central processing unit to enhance the heat transfer performance between the central processing unit and the cold head 100. The second heat conducting member Q2 has a certain amount of compression and is used to fill the gap between the voltage regulation module and the heat conducting structure Q to enhance the heat transfer performance between the voltage regulation module and the heat conducting structure Q.

[0084] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these changes and modifications.

Claims

1. A coupled heat dissipation device, characterized in that: include: A cold head and a frame structure arranged around the outside of the cold head; The cold head comprises a first heat dissipation surface for contacting with the first heating element to dissipate heat; The frame structure includes a first locking frame and a second locking frame, the first locking frame includes a first heat-conducting part, the second locking frame includes a second heat-conducting part, the first heat-conducting part and the second heat-conducting part are spliced ​​to form a heat-conducting structure; the heat-conducting structure includes a second heat dissipation surface for contacting with a second heating element to dissipate heat.

2. The coupling heat dissipation device according to claim 1, characterized in that: The second heat dissipation surface includes a first heat conducting surface and a second heat conducting surface with equal areas, wherein the first heat conducting surface is located at the first heat conducting portion, and the second heat conducting surface is located at the second heat conducting portion.

3. The coupling heat dissipation device according to claim 1, characterized in that: The first locking frame further includes a first fitting structure connected to the first heat conducting portion, and the second locking frame further includes a second fitting structure connected to the second heat conducting portion, and the first fitting structure and the second fitting structure are fitted together along the thickness direction of the cold head.

4. The coupling heat dissipation device according to claim 3, characterized in that: The first bonding structure has a first bonding surface on a side facing the second bonding structure, and the second bonding structure has a second bonding surface on a side facing the first bonding structure. The area of ​​the first bonding surface is equal to the area of ​​the second bonding surface.

5. The coupling heat dissipation device according to claim 4, characterized in that: A heat-conducting element is filled between the first bonding surface and the second bonding surface.

6. The coupling heat dissipation device according to any one of claims 1 to 5, characterized in that: The cold head comprises a base plate and a cover plate, the cover plate comprises a top plate and a plurality of side plates, the cover plate is buckled on the side of the base plate away from the first heat dissipation surface, and forms a cooling cavity with the base plate; the top plate is provided with an inlet and an outlet communicating with the cooling cavity; The substrate includes a first overlapping surface, which is opposite to the first heat dissipation surface; the first locking frame and / or the second locking frame includes a second overlapping surface overlapping the first overlapping surface, and a heat conductive element is filled between the first overlapping surface and the second overlapping surface.

7. The coupling heat sink device according to claim 6, characterized in that: The side plate is provided with cold head fins; the first locking frame and / or the second locking frame is provided with fin holes matched with the cold head fins.

8. The coupling heat sink device according to claim 7, characterized in that: A heat conducting element is filled between the cold head fins and the side walls of the fin holes.

9. The coupling heat sink device according to claim 7, characterized in that: The side wall of the rib hole includes a guide surface located at the opening.

10. A server, characterized in that: It comprises a mainboard, a central processing unit installed on the mainboard, a voltage regulating module and a coupling heat dissipation device as claimed in any one of claims 1 to 9; The first heat dissipation surface in the coupled heat dissipation device is in contact with the central processing unit; The second heat dissipation surface in the coupled heat dissipation device is in contact with the voltage regulation module.

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