Heat dissipation device and notebook computer

Abstract

The utility model relates to a heat dissipation device and a notebook computer. The heat dissipation device comprises a heat conduction module; the heat exchange component is provided with a plurality of radiating fins; the heat exchange component and the fan are fixed to at least part of the heat conduction module. The fan is provided with an air inlet and an air outlet, and an airflow cavity is formed in the fan. The fan can suck cold airflow into the airflow cavity from the air inlet and exhaust the cold airflow from the air outlet; the heat exchange component is provided with a through airflow channel in the first direction, and the air outlet communicates with the airflow channel so that cold airflow can enter the airflow channel. The plurality of heat dissipation fins extend along the first direction and are arranged at preset target intervals in the second direction; the cross section of each heat dissipation fin is in a wave shape. The heat dissipation fins of the heat dissipation device are designed to be wave-shaped, so that the heat dissipation device has larger heat exchange area and heat exchange coefficient, the heat dissipation device has higher heat exchange efficiency or better heat dissipation effect, and the light and thin design of the heat dissipation device is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, and particularly relates to a heat dissipation device and a notebook computer. Background Art

[0002] As consumers' performance expectations for notebook computers gradually increase, the power consumption of consumer notebook computers in the current market has also gradually increased, and the greater power consumption demand poses a more stringent challenge to the heat dissipation design of notebook computers.

[0003] In a notebook computer, the CPU chip, GPU chip, and a considerable part of the functional components on the motherboard have huge power consumption and generate high-wattage heat, and this heat must rely on a reliable heat dissipation device for heat dissipation.

[0004] In the prior art, there are still some defects in the traditional heat dissipation device in a notebook computer:

[0005] (1). When the system occupied space of the traditional heat dissipation device is limited, due to the small heat exchange area of the heat dissipation fins, the heat dissipation effect of the traditional heat dissipation device is poor (or the heat exchange efficiency is low).

[0006] (2). In the traditional heat dissipation device, since the heat dissipation fins are linear, the cold air flow is in a laminar state on the surface of the heat dissipation fins, which makes the heat transfer coefficient of the heat dissipation fins low, resulting in low heat exchange efficiency (or poor heat dissipation effect) of the traditional heat dissipation device.

[0007] (3). Due to the traditional heat dissipation device having a low heat exchange area and heat transfer coefficient, in order to ensure the heat dissipation effect (or heat exchange efficiency) under the same power consumption, it is necessary to increase the number of heat dissipation fins to expand the heat exchange area, resulting in difficulty in realizing a thin and light design for the traditional heat dissipation device. Summary of the Utility Model

[0008] The heat dissipation device and notebook computer provided by the utility model aim to solve at least some of the defects of the existing heat dissipation devices applicable to notebook computers.

[0009] In a first aspect, an embodiment of the utility model provides a heat dissipation device. The heat dissipation device includes:

[0010] A heat conduction module;

[0011] A fan and a heat exchange component having a plurality of heat dissipation fins; the heat exchange component and the fan are both fixedly installed on at least a part of the heat conduction module;

[0012] The fan has an air inlet and an air outlet, and an air flow cavity is formed inside the fan; the fan can suck cold air into the air flow cavity from the air inlet and discharge the cold air from the air outlet;

[0013] The heat exchange component has an air flow channel extending in a first direction, and the air outlet is connected to the air flow channel so that the cold air flows into the air flow channel;

[0014] A plurality of the heat dissipation fins extend along the first direction and are arranged at a preset target spacing in the second direction; the cross-sectional shape of each of the heat dissipation fins is wavy, which can increase the contact area between the cold airflow and the heat dissipation fins and change the flow state of the cold airflow on the surface of the heat dissipation fins;

[0015] The first direction and the second direction are orthogonal to each other; and the cross section is perpendicular to the first direction.

[0016] In some embodiments, the heat exchange component further comprises:

[0017] A pair of connecting plates; the pair of connecting plates both extend along the second direction;

[0018] Two ends of the heat dissipation fins that are away from each other in the third direction are respectively in contact with the surfaces of a pair of the connecting plates;

[0019] The third direction, the second direction and the first direction are orthogonal to each other, and the third direction is perpendicular to the surface of the connecting plate.

[0020] In some embodiments, the thermal conductivity module includes:

[0021] A bracket, a heat conducting plate and a heat conducting part; two ends of the heat conducting part are respectively connected to the bracket and the heat conducting plate;

[0022] Wherein, any one of the connecting plates abuts against an end of the heat conducting portion away from the heat conducting plate, so that the heat accumulated on the heat conducting plate is transferred to the heat exchange component through the heat conducting portion.

[0023] In some embodiments, when the heat on the heat conducting plate is transferred to the heat exchange component, the heat can be dispersed to a plurality of the heat dissipation fins;

[0024] The heat can convert the cold airflow entering the airflow channel into a hot airflow, and the hot airflow can be discharged from the airflow channel to remove the heat.

[0025] In some embodiments, the fan comprises:

[0026] A fan body and a cable; one end of the cable is connected to at least a part of the fan body, and the other end is provided with a connector;

[0027] Both the air inlet and the air outlet are provided on at least a part of the fan body, and at least a part of the fan body is provided with an opening communicating with the air flow cavity; the opening and the air inlet face away from each other;

[0028] Wherein, the fan body is fixedly installed on the bracket, and the opening corresponds to the heat conducting plate, so that at least a part of the cold air flow can pass through the opening and contact the heat conducting plate.

[0029] In some embodiments, the fan body includes:

[0030] A housing, a fan blade and a motor; the motor is fixed at the bottom of the housing, and the fan blade is connected to the motor;

[0031] Wherein, the end of the cable away from the connector can be connected to the motor; the air inlet, the air outlet and the opening are all provided on the housing;

[0032] Wherein, both the fan blade and the motor are located in the air flow cavity, and the fan blade corresponds to the air inlet.

[0033] In some embodiments, the flow state of the hot air flow or the cold air flow in the air flow channel is a transitional flow state or a turbulent flow state.

[0034] In some embodiments, the heat dissipation fins are made of copper material or aluminum material; the wavy surface of the heat dissipation fins can be used as the convective heat exchange surface of the heat exchange component.

[0035] In a second aspect, an embodiment of the present invention provides a notebook computer. The notebook computer includes:

[0036] A computer main body and a main board; the main board is arranged on the computer main body;

[0037] Wherein, the above-mentioned heat dissipation device is fixedly installed on at least a part of the main board.

[0038] In some embodiments, the main board at least includes:

[0039] A PCB board, several functional components, several heat conducting gaskets, a CPU chip and an insulating layer;

[0040] The CPU chip and several of the functional components are all arranged on the PCB board, and several of the heat conducting gaskets are respectively pasted on the CPU chip and several of the functional components;

[0041] The heat conducting plate of the heat dissipation device can be abutted against a plurality of the heat conducting gaskets, so that the heat generated by the CPU chip and the plurality of functional components is gathered on the heat conducting plate;

[0042] The bracket of the heat dissipation device is fixed on the PCB board and is far away from the CPU chip; the insulating layer is attached to the surface of the heat conducting plate, so that the heat conducting plate and the CPU chip are in insulating contact.

[0043] At least one beneficial effect of the heat dissipation device and the notebook computer provided by the embodiment of the present invention is: a novel heat dissipation device applicable to a notebook computer is proposed. By designing the heat dissipation fins in the heat dissipation device into a wavy shape, compared with the straight heat dissipation fins in the traditional heat dissipation device, under the same system occupied space, the heat dissipation fins have a larger heat exchange area; moreover, the wavy structure design can also change the flow state of the cold air flow on the surface of the heat dissipation fins. Specifically, the cold air flow is in a transitional flow state or a turbulent flow state on the surface of the heat dissipation fins of the present invention. Therefore, the wavy structure design can also improve the heat transfer coefficient of the heat dissipation fins of the present invention, so that the heat dissipation device has a higher heat exchange efficiency or a better heat dissipation effect. Since the heat dissipation device has a higher heat transfer coefficient and a larger heat exchange area, under the premise of the same power consumption requirement, fewer heat dissipation fin numbers can meet the heat dissipation requirement, which is beneficial to the thin and light design of the heat dissipation device. Description of the Drawings

[0044] One or more embodiments are exemplarily illustrated by the pictures in the corresponding drawings. These exemplary illustrations do not limit the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements, unless otherwise stated, and the drawings in the drawings do not constitute a proportional limitation.

[0045] Figure 1 It is a schematic structural diagram of the heat dissipation device and the main board provided by the embodiment of the present invention;

[0046] Figure 2 It is an exploded schematic diagram of the heat dissipation device and the main board provided by the embodiment of the present invention;

[0047] Figure 3 It is a schematic structural diagram of the heat exchange component provided by the embodiment of the present invention;

[0048] Figure 4 It is a schematic cross-sectional shape diagram of the heat dissipation fin provided by the embodiment of the present invention;

[0049] Figure 5 It is a schematic structural diagram of a traditional heat exchange component;

[0050] Figure 6Schematic cross-sectional view of a traditional heat dissipation fin

[0051] Figure 7 Exploded schematic view of the fan provided by the embodiment of the present invention

[0052] Reference numerals:

[0053] 100, heat dissipation device; 1001, first direction; 1002, second direction; 1003, third direction; 1, heat conduction module; 11, bracket; 12, heat conduction plate; 13, heat conduction part; 2, fan; 21, fan main body; 22, cable; 211, housing; 212, fan blade; 213, motor; 2111, air inlet; 2112, air outlet; 2113, opening; 2114, air flow cavity; 2201, connector; 3, heat exchange component; 31, heat dissipation fin; 32, connecting plate; 301, air flow channel

[0054] 200, main board; 2001, PCB board; 2002, functional component; 2003, heat conduction gasket; 2004, CPU chip; 2005, insulating layer

[0055] 300, traditional heat exchange component; 3001, traditional heat dissipation fin Detailed implementation manners

[0056] For the convenience of understanding the present invention, the present invention will be described in more detail below with reference to the drawings and specific embodiments. It should be noted that when an element is expressed as "fixed to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is expressed as "connected to" another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween. The terms "upper", "lower", "inner", "outer", "bottom", etc. used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0057] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in this specification in the description of the present invention are only for the purpose of describing specific embodiments and are not used to limit the present invention. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0058] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0059] Figure 1 A schematic diagram of the structure of a heat dissipation device and a mainboard provided in an embodiment of the utility model. Figure 2 This is a schematic diagram of an exploded view of a heat dissipation device and a mainboard provided in an embodiment of the utility model. Figure 3 A schematic structural diagram of a heat exchange component provided in an embodiment of the utility model. Figure 4 A schematic diagram of the cross-sectional shape of the heat dissipation fins provided in an embodiment of the utility model. Figure 5 Schematic diagram of the structure of a traditional heat exchange component. Figure 6 Schematic diagram of the cross-sectional shape of a traditional heat sink fin.

[0060] See also Figures 1-6 The heat dissipation device 100 includes: a heat conduction module 1, a fan 2 and a heat exchange component 3 having a plurality of heat dissipation fins 31.

[0061] It should be noted that the heat sink fin, also known as the Fin, is a structure used for convective heat exchange; the traditional heat sink fin 3001 in the traditional heat exchange component 300 is in a straight line shape (it can also be a broken line shape), so that the cold air flow is in a laminar state on the surface of the traditional heat sink fin 3001. Such a design will not only result in a smaller heat exchange area of ​​the traditional heat sink fin 3001, thereby causing the traditional heat exchange component 300 to have a lower heat exchange efficiency, but also affect the heat dissipation effect of the traditional heat dissipation device; in addition, due to the low heat exchange efficiency of the traditional heat exchange component 300, the heat dissipation area of ​​the traditional heat exchange component 300 is limited within the limited system space. In order to meet the power consumption requirements, it is necessary to increase the number of traditional heat sink fins 3001 to expand the heat dissipation area, which will cause the traditional heat dissipation device to produce a larger flow resistance and a larger noise; and the traditional heat exchange component 300 has more traditional heat sink fins 3001, which is not conducive to the lightweight design of the traditional heat dissipation device.

[0062] Specifically, laminar flow refers to the relative sliding between two adjacent layers of fluid, that is, there is no lateral mixing between the flow layers, and the trajectory of the fluid particles is a regular smooth curve (or straight line); in addition, turbulent flow (or turbulent flow) refers to the flow of fluid, in which the flow layers are not only mixed with each other, but also the flow velocities are quite different, and the trajectories of the fluid particles are no longer clearly distinguishable, and many small vortices can appear in the flow field; finally, transitional flow is a flow state between laminar flow and turbulent flow, in which the flow of the fluid becomes unstable, and local flow velocity disturbances can cause vortex motion; generally speaking, a fluid in a turbulent state can have a higher heat transfer coefficient in convective heat transfer, and the transitional flow state is second.

[0063] Among them, the heat exchange component 3 and the fan 2 are both fixedly installed on at least a part of the heat conduction module 1.

[0064] In addition, the fan 2 has an air inlet 2111 and an air outlet 2112, and an air flow cavity 2114 is formed inside the fan 2; the fan 2 can suck cold air flow from the air inlet 2111 into the air flow cavity 2114 and discharge the cold air flow from the air outlet 2112.

[0065] Furthermore, the heat exchange component 3 has a through air flow channel 301 in the first direction 1001, and the air outlet 2112 is communicated with the air flow channel 301 so that the cold air flow enters the air flow channel 301.

[0066] Specifically, a plurality of heat dissipation fins 31 all extend along the first direction 1001 and are arranged at a preset target spacing in the second direction 1002; the cross-sectional shape of each heat dissipation fin 31 is in a wavy shape, which can increase the contact area between the cold air flow and the heat dissipation fin 31 (that is, the surface area of the wavy structure is larger in the same structural space); and, the wavy structure design can also change the flow state of the cold air flow on the surface of the heat dissipation fin 31. Specifically, the cold air flow is in a transitional flow state or a turbulent flow state on the surface of the heat dissipation fin 31; therefore, designing the heat dissipation fin 31 into a wavy structure can not only increase the heat exchange area of the heat dissipation fin 31, but also improve the heat transfer coefficient of the heat dissipation fin 31, so that the heat dissipation device has higher heat exchange efficiency or better heat dissipation effect; in addition, since a plurality of heat dissipation fins 31 in the heat dissipation device 100 all have higher heat transfer coefficients and larger heat exchange areas, under the premise of the same power consumption requirement, a smaller number of heat dissipation fins can meet the heat dissipation requirement, which is beneficial to the thin and light design of the heat dissipation device.

[0067] It can be understood that the first direction 1001 and the second direction 1002 are perpendicular to each other; the cross-section is perpendicular to the first direction 1001.

[0068] In some embodiments, as Figure 3 shown, the heat exchange component 3 further includes: a pair of connecting plates 32.

[0069] In the embodiments of the present application, a pair of connecting plates 32 both extend along the second direction 1002; the two ends of the heat dissipation fins 31 facing away from each other in the third direction 1003 respectively abut against the surfaces of the pair of connecting plates 32.

[0070] Specifically, the third direction 1003, the second direction 1002 and the first direction 1001 are perpendicular to each other, and the third direction 1003 is perpendicular to the surface of the connecting plate 32.

[0071] In some embodiments, referring to Figure 1 and Figure 2It can be seen that the heat conduction module 1 includes: a bracket 11 , a heat conduction plate 12 and a heat conduction portion 13 .

[0072] Two ends of the heat conducting portion 13 are connected to the bracket 11 and the heat conducting plate 12 respectively.

[0073] In addition, any one of the connecting plates 32 abuts against one end of the heat conducting portion 13 away from the heat conducting plate 12 , so that the heat accumulated on the heat conducting plate 12 is transferred to the heat exchange component 3 through the heat conducting portion 13 .

[0074] In some embodiments, in combination Figures 1-3 It can be seen that when the heat on the heat conducting plate 12 is transferred to the heat exchange component 3 , the heat can be dispersed to a plurality of heat dissipating fins 31 .

[0075] It should be noted that the heat can convert the cold airflow entering the airflow channel 301 into a hot airflow, and the hot airflow can be discharged from the airflow channel 301, so that the heat is discharged.

[0076] Figure 7 This is a schematic diagram of an exploded view of a fan provided in an embodiment of the utility model.

[0077] In some embodiments, according to Figure 1 , Figure 2 and Figure 7 It can be seen that the fan 2 includes: a fan body 21 and a cable 22 .

[0078] It can be understood that one end of the cable 22 is connected to at least a portion of the fan body 21 , and the other end is provided with a connector 2201 .

[0079] To further illustrate, the air inlet 2111 and the air outlet 2112 are both arranged on at least a portion of the fan body 21 , and at least a portion of the fan body 21 is provided with an opening 2113 communicating with the airflow cavity 2114 ; the opening 2113 and the air inlet 2111 are separated from each other.

[0080] Specifically, the fan body 21 is fixedly mounted on the bracket 11 , and the opening 2113 corresponds to the heat conducting plate 12 , so that at least a portion of the cold air flow can pass through the opening 2113 to contact the heat conducting plate 12 .

[0081] In some embodiments, please refer to Figure 1 , Figure 2 and Figure 7 The fan body 21 includes: a housing 211 , fan blades 212 and a motor 213 .

[0082] In the embodiment of the present application, the motor 213 is fixed to the bottom of the housing 211 , and the fan blades 212 are connected to the motor 213 .

[0083] Specifically, one end of the cable 22 away from the connector 2201 can be connected to the motor 213; the air inlet 2111, the air outlet 2112, and the opening 2113 are all provided on the housing 211.

[0084] Moreover, the fan blade 212 and the motor 213 are both located inside the air flow cavity 2114, and the fan blade 212 corresponds to the air inlet 2111.

[0085] In some embodiments, as Figure 2 and Figure 3 it can be known, the flow state of the hot air flow or the cold air flow in the air flow channel 301 is a transitional flow state or a turbulent flow state.

[0086] In some embodiments, such as Figure 3 and Figure 4 it can be known, the heat dissipation fin 31 is made of copper material or aluminum material; the wavy surface of the heat dissipation fin 31 can serve as the convective heat exchange surface of the heat exchange component 3.

[0087] Please refer to Figure 1 and Figure 2 , the laptop computer (not shown in the figure) includes: a computer main body (not shown in the figure) and a main board 200.

[0088] Specifically, the main board 200 is arranged on the computer main body; the above-mentioned heat dissipation device 100 is fixedly installed on at least a part of the main board 200.

[0089] In some embodiments, in combination with Figure 1 and Figure 2 it can be known, the main board 200 at least includes: a PCB board 2001, several functional components 2002, several heat conduction gaskets 2003, a CPU chip 2004, and an insulating layer 2005.

[0090] Among them, the CPU chip 2004 and several functional components 2002 are both arranged on the PCB board 2001, and several heat conduction gaskets 2003 are respectively pasted on the CPU chip 2004 and several functional components 2002.

[0091] In addition, the heat conduction plate 12 of the heat dissipation device 100 can be abutted against several heat conduction gaskets 2003, so that the heat generated by the CPU chip 2004 and several functional components 2002 is gathered on the heat conduction plate 12.

[0092] Furthermore, the bracket 11 of the heat dissipation device 100 is fixed on the PCB board 2001 and is away from the CPU chip 2004; the insulating layer 2005 is pasted on the surface of the heat conduction plate 12, so that the heat conduction plate 12 and the CPU chip 2004 are in insulating contact.

[0093] In combination with Figures 1-7, a detailed description of the working principle of the heat dissipation device 100 is as follows: First, the fan 2 can suck cold air flow into the air flow cavity 2114 from the air inlet 2111; then, a part of the cold air flow entering the air flow cavity 2114 is passed into the air flow channel 301 of the heat exchange component 3 from the air outlet 2112, so that heat is transferred from the surface of the heat dissipation fins 31 to the outside air through convective heat transfer; in addition, the hot air flow formed by heat and cold air flow can be blown out through the other end of the air flow channel 301 to achieve heat release; furthermore, another part of the cold air flow entering the air flow cavity 2114 can pass through the opening and directly contact the heat conduction plate, so as to further conduct away the heat on the heat conduction plate.

[0094] Specifically, since the heat dissipation fins 31 in the heat dissipation device 100 adopt a wavy structure design, compared with the straight-line design of the traditional heat dissipation fins 3001, the heat dissipation fins 31 can provide a larger heat exchange area, so that under the conditions of the same height and the same Pitch (Pitch refers to the distance between two adjacent heat dissipation fins 31, that is, the target distance between two adjacent heat dissipation fins 31), the heat dissipation area of the heat exchange component 3 is more than 10% higher than that of the traditional heat exchange component 300.

[0095] In summary, for the heat dissipation device and the notebook computer provided by the embodiment of the present utility model, by designing the heat dissipation fins in the heat dissipation device into a wavy shape, compared with the straight-line heat dissipation fins in the traditional heat dissipation device, under the condition of the same system occupied space, the heat dissipation fins have a larger heat exchange area; and, the wavy structure design can also change the flow state of the cold air flow on the surface of the heat dissipation fins. Specifically, the cold air flow is in a transitional flow state or a turbulent flow state on the surface of the heat dissipation fins. Therefore, the wavy structure design can also improve the heat transfer coefficient of the heat dissipation fins, so that the heat dissipation device has a higher heat transfer efficiency or a better heat dissipation effect. Since the heat dissipation device has a higher heat transfer coefficient and a larger heat exchange area, under the premise of the same power consumption requirement, a smaller number of heat dissipation fins can meet the heat dissipation requirement, which is beneficial to the thin and light design of the heat dissipation device. Therefore, the heat dissipation device applicable to the notebook computer provided by the embodiment of the present utility model has a certain novelty compared with the traditional heat dissipation device applicable to the notebook computer.

[0096] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; under the idea of the present invention, the technical features in the above embodiments or different embodiments can also be combined, and the steps can be implemented in any order, and there are many other variations in different aspects of the present invention as described above. For the sake of brevity, they are not provided in detail; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A heat dissipation device, characterized in that: include: Thermal conductivity module; A fan and a heat exchange component having a plurality of heat dissipation fins; The heat exchange component and the fan are both fixedly mounted on at least a portion of the heat conduction module; The fan has an air inlet and an air outlet, and an air flow cavity is formed inside the fan; the fan can suck cold air into the air flow cavity from the air inlet and discharge the cold air from the air outlet; The heat exchange component has an air flow channel extending in a first direction, and the air outlet is connected to the air flow channel so that the cold air flows into the air flow channel; A plurality of the heat dissipation fins extend along the first direction and are arranged at a preset target spacing in the second direction; the cross-sectional shape of each of the heat dissipation fins is wavy, which can increase the contact area between the cold airflow and the heat dissipation fins and change the flow state of the cold airflow on the surface of the heat dissipation fins; The first direction and the second direction are orthogonal to each other; and the cross section is perpendicular to the first direction.

2. The heat dissipation device according to claim 1, characterized in that: The heat exchange component also includes: A pair of connecting plates; the pair of connecting plates both extend along the second direction; Two ends of the heat dissipation fins that are away from each other in the third direction are respectively in contact with the surfaces of a pair of the connecting plates; The third direction, the second direction and the first direction are orthogonal to each other, and the third direction is perpendicular to the surface of the connecting plate.

3. The heat dissipation device according to claim 2, characterized in that: The heat conduction module comprises: A bracket, a heat conducting plate and a heat conducting part; two ends of the heat conducting part are respectively connected to the bracket and the heat conducting plate; Wherein, any one of the connecting plates abuts against an end of the heat conducting portion away from the heat conducting plate, so that the heat accumulated on the heat conducting plate is transferred to the heat exchange component through the heat conducting portion.

4. The heat dissipation device according to claim 3, characterized in that: When the heat on the heat conducting plate is transferred to the heat exchange component, the heat can be dispersed to a plurality of the heat dissipation fins; The heat can convert the cold airflow entering the airflow channel into a hot airflow, and the hot airflow can be discharged from the airflow channel to remove the heat.

5. The heat dissipation device according to claim 3, characterized in that: The fan comprises: A fan body and a cable; one end of the cable is connected to at least a portion of the fan body, and the other end is provided with a connector; The air inlet and the air outlet are both arranged on at least a portion of the fan body, and at least a portion of the fan body is provided with an opening communicating with the air flow cavity; the opening and the air inlet are separated from each other; The fan body is fixedly mounted on the bracket, and the opening corresponds to the heat conducting plate, so that at least a portion of the cold air flow can pass through the opening and contact the heat conducting plate.

6. The heat dissipation device according to claim 5, characterized in that: The fan body comprises: A housing, a fan blade and a motor; the motor is fixed to the bottom of the housing, and the fan blade is connected to the motor; Wherein, one end of the cable away from the connector can be connected to the motor; the air inlet, the air outlet and the opening are all arranged on the housing; Wherein, the fan blades and the motor are both located in the airflow cavity, and the fan blades correspond to the air inlet.

7. The heat dissipation device according to claim 4, characterized in that: The flow state of the hot air flow or the cold air flow in the air flow channel is a transitional flow state or a turbulent flow state.

8. The heat dissipation device according to any one of claims 1 to 7, characterized in that: The heat dissipation fins are made of copper material or aluminum material; the wavy surface of the heat dissipation fins can be used as the convection heat exchange surface of the heat exchange component.

9. A notebook computer, characterized in that: include: A computer body and a main board; the main board is arranged on the computer body; Wherein, the heat dissipation device as described in any one of claims 1 to 8 is fixedly installed on at least a portion of the mainboard.

10. The notebook computer according to claim 9, characterized in that: The main board at least comprises: PCB board, several functional components, several thermal pads, CPU chip and insulation layer; The CPU chip and the functional components are all arranged on the PCB board, and the thermal conductive pads are respectively attached to the CPU chip and the functional components; The heat conducting plate of the heat dissipation device may abut against a plurality of the heat conducting pads, so that the heat generated by the CPU chip and a plurality of the functional components is gathered onto the heat conducting plate; The bracket of the heat dissipation device is fixed on the PCB board and is far away from the CPU chip; the insulating layer is attached to the surface of the heat conducting plate to ensure insulating contact between the heat conducting plate and the CPU chip.

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