Electronic component and circuit board equipment

Abstract

The embodiment of the utility model relates to an electronic component and circuit board equipment. The electronic component comprises a ceramic body; the end electrode is arranged at one end of the ceramic body, and the end electrode comprises a first layer, a first electrode layer, a second electrode layer and a third electrode layer; the first layer comprises an elastic material body, the first layer surrounds the side wall of the ceramic body, the first layer is provided with a through hole, and the end face of one end of the ceramic body is exposed out of the through hole; the first electrode layer wraps at least part of the first layer, and the first electrode layer is electrically connected with the inner electrode of the ceramic body at the through hole; the second electrode layer wraps the first electrode layer and is electrically connected with the first electrode layer; the third electrode layer wraps the second electrode layer and is electrically connected with the second electrode layer. During electrification, current can be connected with the inner electrode from the third electrode layer, the second electrode layer and the first electrode layer, so that the electrical conductivity is good, the use of raw materials of the first layer can be reduced, the heat productivity is lower, and the plate bending resistance, the mechanical shock resistance and the vibration resistance are improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of communication technologies. Background Art

[0002] The current world is at the intersection of two major innovations, namely the energy revolution and the computer revolution. Driven by fields such as 5G communication, smartphones, and new energy vehicles, the development of the electronic information industry is booming and has become an important pillar in the economic market. Among them, electronic components, especially multilayer ceramic capacitors (MLCCs), as the passive electronic components with the largest market share, have become one of the key products that need to break through key technologies in technological innovation. MLCCs have the advantages of high capacitance, small size, low cost, high reliability, etc., and are widely used in fields such as automotive electronics, electrical control, power grid frequency modulation, instrumentation, aerospace, etc., and are known as the "rice of the electronic industry".

[0003] When MLCCs are applied to automotive electronics, due to the high temperature, high vibration, strong mechanical shock, etc. of the working environment, the quality requirements for MLCCs themselves are significantly improved. For example: when MLCCs are applied to consumer electronics, it only needs to bend the board by 2 mm and maintain it for 60 s to ensure that the capacitance degradation rate does not exceed 10%, and there are no requirements for mechanical shock, vibration and other test items; while when it is applied to automotive electronics, the standard of the board bending test item is to bend the board by 10 mm and maintain it for 60 s to ensure that the capacitance degradation rate does not exceed 10%, the standard of the mechanical shock item is a pressure of 1500 G, a holding time of 0.5 ms, a dropping speed of 4.7 m / s, and the capacitance degradation rate of the MLCC is within 10%. The standard of the vibration test item is a cycle of 10 HZ, 2000 HZ, 10 HZ, 20 min for each cycle, an amplitude of 1.5 mm, and 12 cycles for each of the 3 directions (up and down, front and back, left and right), and the capacitance degradation rate of the MLCC is within 10%.

[0004] The conventional MLCC end electrode structure cannot meet the requirements of in-vehicle board bending, mechanical shock, vibration and other test items. Therefore, MLCCs with a soft terminal layer structure have emerged subsequently. The end electrode structure of the hard terminal of the MLCC in the prior art is: from the inside to the outside, it is the first electrode layer, the second electrode layer, and the third electrode layer in sequence; the end electrode structure of the soft terminal MLCC in the prior art is: from the inside to the outside, it is the first electrode layer, the soft terminal layer, the second electrode layer, and the third electrode layer in sequence.

[0005] In the process of implementing this application, the applicant found that: although the use of a soft terminal layer increases the resistance of electronic components to board bending, mechanical shock, and vibration, the use of the soft terminal layer requires passing through the soft terminal layer with a relatively large resistance during power-on, resulting in relatively large losses, reducing the conductivity of electronic components, having a large equivalent series resistance, and due to the use of the soft terminal layer, the heat generation of electronic components during operation is large, and their lifespan and safety are low. Summary of the Invention

[0006] In view of the above problems, the embodiments of this application provide an electronic component and a circuit board device, which overcome the above problems or at least partially solve the above problems.

[0007] According to one aspect of the embodiments of this application, an electronic component is provided, including a ceramic body; terminal electrodes, the terminal electrodes are arranged at one end of the ceramic body, and the terminal electrodes include a first layer, a first electrode layer, a second electrode layer, and a third electrode layer; wherein, the first layer includes an elastic material body, the first layer surrounds the side wall of the ceramic body, the first layer has a through hole, and the end face of one end of the ceramic body is exposed in the through hole; wherein, the direction from the terminal electrode to the ceramic body is the first direction, along the first direction, the first electrode layer wraps at least part of the first layer, and the first electrode layer is electrically connected to the inner electrode of the ceramic body at the through hole; the second electrode layer wraps the first electrode layer, and the second electrode layer is electrically connected to the first electrode layer; the third electrode layer wraps the second electrode layer, and the third electrode layer is electrically connected to the second electrode layer.

[0008] In an optional manner, the first layer can withstand a temperature of 650 degrees Celsius.

[0009] In an optional manner, the number of the terminal electrodes is two, and the two terminal electrodes are oppositely arranged at both ends of the ceramic body.

[0010] In an optional manner, one end of the ceramic body is arc-shaped.

[0011] In an optional manner, the terminal electrode is arc-shaped.

[0012] In an optional manner, the first electrode layer is a copper layer, the second electrode layer is a nickel layer, and the third electrode layer is a tin layer.

[0013] In an optional manner, the ceramic body includes a ceramic substrate and the inner electrode, the inner electrode is embedded in the ceramic substrate, and the inner electrode is electrically connected to the first electrode layer.

[0014] According to another aspect of the embodiments of the present application, a circuit board device is provided, including the above-mentioned electronic components and a PCB board, and the third electrode layer is electrically connected to the PCB board.

[0015] The beneficial effects of the embodiments of the present application include: providing an electronic component, including: a ceramic body; an end electrode, the end electrode is arranged at one end of the ceramic body, and the end electrode includes a first layer, a first electrode layer, a second electrode layer and a third electrode layer; wherein, the first layer includes an elastic material body, the first layer surrounds the side wall of the ceramic body, the first layer has a through hole, and the inner electrode of the ceramic body is exposed at the through hole; wherein, the direction from the end electrode to the ceramic body is the first direction, along the first direction, the first electrode layer wraps at least part of the first layer, and the first electrode layer is electrically connected to the inner electrode of the ceramic body at the through hole; the second electrode layer wraps the first electrode layer, and the second electrode layer is electrically connected to the first electrode layer; the third electrode layer wraps the second electrode layer, and the third electrode layer is electrically connected to the second electrode layer. Through the above arrangement, since the first layer only wraps the side wall of the ceramic body, and the first electrode layer and the inner electrode in the ceramic body are electrically connected at the through hole of the first layer, when energized, the current can connect from the third electrode layer to the second electrode layer, and then connect to the first electrode layer and then connect to the inner electrode of the ceramic body at the through hole, that is, the current can not pass through the first layer, so the conductivity of the end electrode is good. However, in the prior art, when energized, it must pass through the first layer with a large resistance, resulting in relatively large losses and heat generation. In addition, since the first layer has a through hole, not only the use of raw materials of the first layer can be reduced, but also the heat generation is lower compared with the soft terminal structure in the prior art, and the service life of the electronic component is longer. Furthermore, due to the arrangement of the first layer, when connecting the electronic component to an external PCB board, since the end electrode connected to the PCB board is provided with the first layer, and the first layer includes an elastic material body and can have elastic deformation, the anti-board bending, anti-mechanical shock and anti-vibration performance of the electronic component are improved. Description of the Drawings

[0016] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplary illustrations do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements, unless otherwise stated, and the drawings in the drawings do not constitute a proportional limitation.

[0017] Figure 1 is a schematic diagram of the electronic component provided by the embodiments of the present application;

[0018] Figure 2 is along Figure 1 the sectional view taken along line A-A in

[0019] Figure 3 is an enlarged schematic view of part B in the embodiments of the present application; Figure 2 in the figure;

[0020] Figure 4 is a partial exploded view of an electronic component provided by the embodiments of the present application;

[0021] Figure 5 is a schematic view of a circuit board device provided by the embodiments of the present application.

[0022] Reference numerals:

[0023] electronic component 100, ceramic body 1 and end electrode 2; first direction L1;

[0024] ceramic substrate 11 and internal electrode 12;

[0025] end face 101 at one end of ceramic body 1, side wall 102 of ceramic body 1;

[0026] first layer 21, first electrode layer 22, second electrode layer 23 and third electrode layer 24;

[0027] via hole 211;

[0028] circuit board device 200, PCB board 3, welding part 4. Detailed implementation manners

[0029] To facilitate the understanding of the present application, the present application will be described in more detail below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is expressed as "fixed to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is expressed as "connected to" another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween. The terms "vertical", "horizontal", "left", "right", "inner", "outer" and similar expressions used in this specification are only for the purpose of illustration.

[0030] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those skilled in the technical field to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments, and are not used to limit the present application. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0031] Please refer to Figure 1, an embodiment of the present application provides an electronic component 100, and the electronic component 100 includes a ceramic body 1 and end electrodes 2. The end electrodes 2 are disposed at one end of the ceramic body 1, the end electrodes 2 are electrically connected to the ceramic body 1, and the end electrodes 2 are used for electrically connecting to an external PCB board.

[0032] In some embodiments, the electronic component 100 is a capacitor, an inductor, a resistor, etc.; in still some other embodiments, the electronic component 100 is a multilayer ceramic capacitor (MLCC).

[0033] Regarding the above-mentioned ceramic body 1, please refer to Figure 2 and Figure 3 , in some embodiments, the ceramic body 1 includes a ceramic substrate 11 and internal electrodes 12, the internal electrodes 12 are embedded in the ceramic substrate 11, and the internal electrodes 12 are electrically connected to the end electrodes 2.

[0034] Regarding the above-mentioned end electrodes 2, please refer to Figure 3 and Figure 4, the end electrode 2 includes a first layer 21, a first electrode layer 22, a second electrode layer 23, and a third electrode layer 24; wherein, the first layer 21 includes an elastic material body, the first layer 21 surrounds the side wall 102 of the ceramic body 1, the first layer 21 has a through hole 211, and one end face 101 of the ceramic body 1 is exposed in the through hole 211; wherein, the direction from the end electrode 2 to the ceramic body 1 is the first direction L1, along the first direction L1, the first electrode layer 22 wraps at least part of the first layer 21, and the first electrode layer 22 is electrically connected to the internal electrode 12 of the ceramic body 1 at the through hole 211; the second electrode layer 23 wraps the first electrode layer 22, and the second electrode layer 23 is electrically connected to the first electrode layer 22; the third electrode layer 24 wraps the second electrode layer 23, and the third electrode layer 24 is electrically connected to the second electrode layer 23. Since the first layer 21 only wraps the side wall 102 of the ceramic body 1, and the first electrode layer 22 and the ceramic body 1 are electrically connected at the through hole 211 of the first layer 21, when powered on, the current can connect the second electrode layer 23 from the third electrode layer 24, then connect the first electrode layer 22, and then connect the internal electrode 12 of the ceramic body 1, that is, the current can bypass the first layer 21, so the end electrode 2 has good electrical conductivity. However, in the prior art, when powered on, it must pass through the first layer 21 with a relatively large resistance, resulting in relatively large losses and heat generation. In addition, since the first layer 21 has a through hole 211, not only can the use of raw materials of the first layer 21 be reduced, but also compared with the soft terminal structure in the prior art, the heat generation is lower, and the service life of the electronic component 100 is longer. Furthermore, due to the setting of the first layer 21, when connecting the electronic component 100 to an external PCB board, since the end electrode 2 connected to the PCB board is provided with the first layer 21, and the first layer 21 includes an elastic material body and can have elastic deformation, the anti-board bending, anti-mechanical shock, and anti-vibration performance of the electronic component 100 are improved.

[0035] It should be noted that, along the first direction L1, the first electrode layer 22 wraps at least part of the first layer 21. In some embodiments, the first electrode layer 22 may also entirely wrap the first layer 21.

[0036] Wherein, it can be understood that the first direction L1 is also the direction in which the first electrode layer 22, the second electrode layer 23, and the third electrode layer 24 are stacked.

[0037] In some embodiments, the elastic material body in the first layer 21 is heat-resistant; in still some embodiments, the first layer 21 can withstand a temperature of 650 degrees Celsius.

[0038] In some embodiments, the ceramic body 1 is arc-shaped, and the end electrode 2 is arc-shaped, which facilitates the mating connection between the ceramic body 1 and the end electrode 2.

[0039] In some embodiments, the first electrode layer 22 is a copper layer, the second electrode layer 23 is a nickel layer, and the third electrode layer 24 is a tin layer, so as to enable the electronic component 100 to function as a multilayer ceramic capacitor (MLCC).

[0040] In the embodiments of the present application, the electronic component 100 includes: a ceramic body 1; an end electrode 2 disposed at one end of the ceramic body 1, and the end electrode 2 includes a first layer 21, a first electrode layer 22, a second electrode layer 23, and a third electrode layer 24; wherein, the first layer 21 includes an elastic material body, the first layer 21 surrounds the side wall 102 of the ceramic body 1, the first layer 21 has a through hole 211, and the end face 101 of one end of the ceramic body 1 is exposed in the through hole 211; wherein, the direction from the end electrode 2 to the ceramic body 1 is the first direction L1, along the first direction L1, the first electrode layer 22 wraps at least a part of the first layer 21, and the first electrode layer 22 is electrically connected to the internal electrode 12 of the ceramic body 1 at the through hole 211; the second electrode layer 23 wraps the first electrode layer 22, and the second electrode layer 23 is electrically connected to the first electrode layer 22; the third electrode layer 24 wraps the second electrode layer 23, and the third electrode layer 24 is electrically connected to the second electrode layer 23. Through the above arrangement, since the first layer 21 only wraps the side wall 102 of the ceramic body 1, and the first electrode layer 22 and the ceramic body 1 are electrically connected at the through hole 211 of the first layer 21, when energized, the current can connect the second electrode layer 23 from the third electrode layer 24, then connect the first electrode layer 22, and then connect the internal electrode 12 of the ceramic body 1, that is, the current can not pass through the first layer 21, so the conductivity of the end electrode 2 is good. However, in the prior art, when energized, it must pass through the first layer 21 with a relatively large resistance, resulting in relatively large losses and heat generation. In addition, since the first layer 21 has a through hole 211, not only can the use of raw materials of the first layer 21 be reduced, but also the heat generation is lower compared with the soft terminal structure in the prior art, and the service life of the electronic component 100 is longer. Moreover, due to the setting of the first layer 21, when connecting the electronic component 100 to an external PCB board, since the end electrode 2 connected to the PCB board is provided with the first layer 21, and the first layer 21 includes an elastic material body and can have elastic deformation, the anti-board bending, anti-mechanical shock, and anti-vibration performance of the electronic component 100 are improved.

[0041] An embodiment of the present application also provides an embodiment of a circuit board device, as Figure 5 shown, the circuit board device includes the electronic component 100 and the PCB board 3. For the specific structure and function of the electronic component 100, reference may be made to the above embodiments, which will not be elaborated herein one by one. The third electrode layer 24 of the electronic component 100 is electrically connected to the PCB board 3. In some embodiments, the third electrode layer 24 is soldered to the PCB board 3, and a soldering portion 4 is formed between the electronic component 100 and the PCB board 3.

[0042] It should be noted that the description and drawings of the present application provide preferred embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described in this specification. These embodiments are not additional limitations to the content of the present application. The purpose of providing these embodiments is to make the understanding of the disclosed content of the present application more thorough and comprehensive. Moreover, the above technical features continue to be combined with each other to form various embodiments not listed above, which are all regarded as within the scope described in the specification of the present application; further, for those of ordinary skill in the art, improvements or changes can be made according to the above description, and all such improvements and changes should fall within the protection scope of the appended claims of the present application.

Claims

1. An electronic component, characterized in that: include: Ceramic body; An end electrode, the end electrode being disposed at one end of the ceramic body, the end electrode comprising a first layer, a first electrode layer, a second electrode layer and a third electrode layer; Wherein, the first layer comprises an elastic material body, the first layer is arranged around the side wall of the ceramic body, the first layer has a through hole, and the end surface of one end of the ceramic body is exposed in the through hole; The direction from the terminal electrode to the ceramic body is a first direction, along the first direction, the first electrode layer wraps at least a portion of the first layer, and the first electrode layer is electrically connected to the inner electrode of the ceramic body at the through hole; The second electrode layer wraps the first electrode layer, and the second electrode layer is electrically connected to the first electrode layer; The third electrode layer wraps the second electrode layer, and the third electrode layer is electrically connected to the second electrode layer.

2. The electronic component according to claim 1, characterized in that: The first layer can withstand temperatures of 650 degrees Celsius.

3. The electronic component according to claim 1, characterized in that: The number of the terminal electrodes is two, and the two terminal electrodes are arranged oppositely at two ends of the ceramic body.

4. The electronic component according to claim 1, characterized in that: One end of the ceramic body is in an arc shape.

5. The electronic component according to claim 4, characterized in that: The terminal electrode is in an arc shape.

6. The electronic component according to claim 1, characterized in that: The first electrode layer is a copper layer, the second electrode layer is a nickel layer, and the third electrode layer is a tin layer.

7. The electronic component according to claim 1, characterized in that: The ceramic body includes a ceramic matrix and the inner electrode, the inner electrode is embedded in the ceramic matrix, and the inner electrode is electrically connected to the first electrode layer.

8. A circuit board device, characterized in that: It comprises the electronic component and PCB board as described in any one of claims 1 to 7, wherein the third electrode layer is electrically connected to the PCB board.

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