Gas supply system of semiconductor etching equipment

Abstract

The utility model discloses a semiconductor etching equipment gas supply system in the technical field of semiconductor etching equipment, which comprises semiconductor etching equipment, a semiconductor etching bin is mounted at the top of the semiconductor etching equipment, a mounting box is mounted at the top of the semiconductor etching bin, a connecting pipeline is mounted at the upper part of the interior of the mounting box, and a gas supply pipeline is mounted at the lower part of the mounting box. The device is reasonable in structure, through the arrangement of the T-shaped grooves and the L-shaped clamping plates, the air filter plate A is arranged between the semiconductor etching bin and the mounting box, the air filter plate B is placed in the T-shaped grooves in a sliding mode, and the air filter plate C is pushed between the two L-shaped clamping plates in a sliding mode. When the air supply pipeline carries out normal air supply treatment on the interior of the semiconductor etching bin, the air filtering plate A, the air filtering plate B and the air filtering plate C can carry out air filtering treatment, and the situation that semiconductor etching is affected by impurities existing in the air supply process is avoided as much as possible.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor etching equipment, and particularly relates to a gas supply system for a semiconductor etching equipment. Background Technique

[0002] A semiconductor etching equipment is a device used for precisely etching semiconductor materials. In the semiconductor manufacturing process, etching is a key process step for creating tiny structures and patterns on semiconductor wafers. Semiconductor etching equipment typically uses chemical vapor deposition or physical vapor deposition techniques. By introducing chemical gases or plasma beams into the reaction chamber, the etching of semiconductor materials can be achieved. Semiconductor etching equipment features high precision, high efficiency, and high controllability, enabling fine processing of semiconductor materials, thus playing an important role in the semiconductor device manufacturing process. In the semiconductor industry, etching equipment is widely used in the manufacture of various semiconductor devices such as transistors, integrated circuits, and optoelectronic devices. Currently, there are still some problems with the gas supply on semiconductor etching equipment. Gas supply needs to ensure that the gas does not contain particulate matter or impurities before gas supply processing can be carried out. To ensure the purity and impurity-free of gas supply, gas filtration-related devices are usually adopted. Since gas filtration-related devices usually require corresponding tools for installation and fixation, when the gas filtration-related devices need to be maintained and cleaned later, they need to be removed from the semiconductor etching equipment, maintained and cleaned, and then reinstalled. The process is relatively troublesome and cumbersome, affecting the more effective maintenance and cleaning efficiency, and also directly affecting the gas supply effect of the semiconductor etching equipment.

[0003] Therefore, it is necessary to develop a gas supply system for semiconductor etching equipment. Summary of the Utility Model

[0004] The utility model aims to provide a gas supply system for semiconductor etching equipment. By providing a T-slot and an L-shaped card plate, an air filter plate A is arranged between the semiconductor etching chamber and the installation box, and the air filter plate B is placed in the T-slot in a sliding manner, and the air filter plate C is pushed between the two groups of L-shaped card plates in a sliding manner, so that when the gas supply pipeline takes normal gas supply treatment in the semiconductor etching chamber, the air filter plate A, the air filter plate B and the air filter plate C can perform gas filtering treatment, and the situation in which impurities exist in the gas supply process and affect the semiconductor etching is avoided as much as possible. At the same time, the air filter plate B and the air filter plate C are detachable, and no tools are required for disassembly, so that the air filter plate B and the air filter plate C are easy to disassemble and maintain and clean, and the situation in which the maintenance and cleaning effect and efficiency are affected by the difficulty of disassembly is avoided as much as possible, the gas supply system of the semiconductor etching equipment is effectively guaranteed, and the use effect of the semiconductor etching equipment is effectively improved, so as to solve the problems existing in the gas supply system of the semiconductor etching equipment proposed in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor etching equipment gas supply system, comprising a semiconductor etching equipment, a semiconductor etching chamber is installed on the top of the semiconductor etching equipment, a mounting box is installed on the top of the semiconductor etching chamber, and a connecting pipe is installed on the upper part of the mounting box;

[0006] An air supply pipeline is installed above one side outer wall of the installation box.

[0007] Preferably, an air filter plate A is installed at the center of the upper surface of the semiconductor etching chamber, and an air valve is provided at the bottom of the semiconductor etching chamber.

[0008] Preferably, an exhaust head is provided on the outer wall of the connecting pipe, and a bracket is installed at the lower part of the interior of the installation box.

[0009] Preferably, fans are installed inside the brackets, L-shaped clamping plates are provided on both sides of the top of the installation box, and a T-shaped slot is provided at the center of the upper surface of the installation box.

[0010] Preferably, an air filter plate B is installed inside the T-slot, and the outer wall of the air filter plate B is slidably connected to the inside of the T-slot.

[0011] Preferably, an air filter plate C is installed at the top center position of the installation box, and the outer wall of the air filter plate C is slidably connected to the inner walls of the two groups of L-shaped card plates.

[0012] Preferably, one end of the air supply pipe passes through the installation box and is fixedly connected to one end of the connecting pipe, the other end of the air supply pipe is installed with an air supply device, and one side of the outer wall of the air supply pipe is installed with an air velocity flow meter.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] By providing a T-shaped groove and an L-shaped clamping plate, an air filter plate A is arranged between the semiconductor etching chamber and the installation box, and the air filter plate B is placed in the T-shaped groove in a sliding manner. The air filter plate C is pushed into the space between the two L-shaped clamping plates in a sliding manner. When the air supply pipeline supplies normal air to the semiconductor etching chamber, the air filter plates A, B, and C can perform gas filtration treatment, so as to avoid the situation that impurities in the gas supply process affect semiconductor etching. At the same time, the air filter plates B and C are detachable and can be disassembled without tools, which is convenient for maintenance and cleaning after the air filter plates B and C are disassembled, and avoids the situation that difficult disassembly affects the maintenance and cleaning effect and efficiency. This effectively guarantees the gas supply system of the semiconductor etching equipment and also effectively improves the use effect of the semiconductor etching equipment. Description of the Drawings

[0015] Figure 1 It is a schematic diagram of the overall structure provided by the present utility model;

[0016] Figure 2 It is a schematic cross-sectional view of a partial structure provided by the present utility model;

[0017] Figure 3 Provided by the present utility model Figure 2 The enlarged view of the structure at A in;

[0018] Figure 4 It is a schematic diagram of the semiconductor etching gas supply system provided by the present utility model.

[0019] In the figure: 1. Semiconductor etching equipment; 2. Semiconductor etching chamber; 201. Air filter plate A; 202. Air valve; 3. Installation box; 301. Connecting pipeline; 302. Exhaust head; 303. Bracket; 304. Fan; 305. L-shaped clamping plate; 306. T-shaped groove; 307. Air filter plate B; 308. Air filter plate C; 4. Air supply pipeline; 401. Air supply device; 402. Air velocity flowmeter. Detailed Embodiments

[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0021] The utility model provides the following technical solution: a gas supply system for a semiconductor etching device. Please refer to Figures 1-4 , which includes a semiconductor etching device 1. A semiconductor etching chamber 2 is installed on the top of the semiconductor etching device 1. An air filter plate A201 is installed at the center position of the upper surface of the semiconductor etching chamber 2. Air valves 202 are arranged at the bottom of the semiconductor etching chamber 2. An installation box 3 is installed on the top of the semiconductor etching chamber 2. An air filter plate A201 is arranged between the semiconductor etching chamber 2 and the installation box 3. By using the air filter plate A201 with the effect of gas filtration, the situation that impurities or particles exist in the gas entering the semiconductor etching chamber 2 can be avoided as much as possible. A connecting pipe 301 is installed above the interior of the installation box 3. Exhaust heads 302 are arranged on the outer wall of the connecting pipe 301. A bracket 303 is installed below the interior of the installation box 3. Fans 304 are installed inside the brackets 303. The multiple groups of fans 304 are correspondingly installed in the brackets 303 on the installation box 3, so that the fans 304 can inject gas into the semiconductor etching chamber 2. L-shaped clamping plates 305 are arranged on both sides of the top of the installation box 3. A T-shaped groove 306 is opened at the center position of the upper surface of the installation box 3. An air filter plate B307 is installed inside the T-shaped groove 306. The outer wall of the air filter plate B307 is slidably connected with the inside of the T-shaped groove 306. An air filter plate C308 is installed at the center position of the top of the installation box 3. The outer wall of the air filter plate C308 is slidably connected with the inner walls of the two L-shaped clamping plates 305;

[0022] A gas supply pipe 4 is installed above one outer wall of the installation box 3. One end of the gas supply pipe 4 penetrates through the installation box 3 and is fixedly connected with one end of the connecting pipe 301. The other end of the gas supply pipe 4 is installed with a gas supply device 401. An air velocity flowmeter 402 is installed on one side of the outer wall of the gas supply pipe 4. A T-shaped groove 306 is opened on the upper surface of the installation box 3, and the air filter plate B307 is placed in the T-shaped groove 306 in a sliding manner. The air filter plate C308 is pushed into the space between the two L-shaped clamping plates 305 in a sliding manner. When the gas supply pipe 4 supplies gas to the semiconductor etching chamber 2 normally, the gas can be filtered by the air filter plate A201, the air filter plate B307 and the air filter plate C308, so as to avoid the situation that impurities in the gas supply process affect semiconductor etching as much as possible. At the same time, the air filter plate B307 and the air filter plate C308 are detachable and do not require tools for disassembly, which is convenient for maintenance and cleaning after the air filter plate B307 and the air filter plate C308 are disassembled, and can avoid the situation that difficult disassembly affects the maintenance and cleaning effect and efficiency.

[0023] Working principle: When using the present utility model, an air filter plate A201 is arranged between the semiconductor etching chamber 2 and the installation box 3. By utilizing the gas filtering effect of the air filter plate A201, the situation that the gas entering the semiconductor etching chamber 2 contains impurities or particles can be avoided as much as possible. Multiple groups of fans 304 are correspondingly installed in the brackets 303 on the installation box 3, so that the fans 304 can inject gas into the semiconductor etching chamber 2. By opening a T-shaped groove 306 on the upper surface of the installation box 3 and placing the air filter plate B307 in the T-shaped groove 306 in a sliding manner, and pushing the air filter plate C308 into the space between two L-shaped clamping plates 305 in a sliding manner, when the air supply pipeline 4 supplies gas to the semiconductor etching chamber 2 normally, the gas can be filtered by the air filter plate A201, the air filter plate B307 and the air filter plate C308, and the situation that the semiconductor etching is affected by impurities during the gas supply process can be avoided as much as possible. At the same time, the air filter plate B307 and the air filter plate C308 are detachable and no tools are required for disassembly, which is convenient for maintenance and cleaning after the air filter plate B307 and the air filter plate C308 are disassembled, and the situation that the maintenance and cleaning effect and efficiency are affected due to difficult disassembly can be avoided as much as possible, effectively ensuring the gas supply system of the semiconductor etching equipment and effectively improving the use effect of the semiconductor etching equipment.

[0024] Although the present utility model has been described above with reference to the embodiments, various improvements can be made to it and components therein can be replaced with equivalents without departing from the scope of the present utility model. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present utility model can be combined with each other in any way. The exhaustive description of these combinations is not given in this specification only for the sake of saving space and resources. Therefore, the present utility model is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A semiconductor etching equipment gas supply system, comprising a semiconductor etching equipment (1), a semiconductor etching chamber (2) being installed on the top of the semiconductor etching equipment (1), and a mounting box (3) being installed on the top of the semiconductor etching chamber (2), characterized in that: A connecting pipe (301) is installed on the upper part of the interior of the installation box (3); An air supply pipeline (4) is installed above one side outer wall of the installation box (3).

2. A semiconductor etching equipment gas supply system according to claim 1, characterized in that: An air filter plate A (201) is installed at the center of the upper surface of the semiconductor etching chamber (2), and an air valve (202) is provided at the bottom of the semiconductor etching chamber (2).

3. A semiconductor etching equipment gas supply system according to claim 1, characterized in that: An exhaust head (302) is provided on the outer wall of the connecting pipe (301), and a bracket (303) is installed at the lower part of the interior of the installation box (3).

4. A semiconductor etching equipment gas supply system according to claim 3, characterized in that: A fan (304) is installed inside the bracket (303), L-shaped clamping plates (305) are arranged on both sides of the top of the installation box (3), and a T-shaped slot (306) is opened at the center of the upper surface of the installation box (3).

5. A semiconductor etching equipment gas supply system according to claim 4, characterized in that: An air filter plate B (307) is installed inside the T-shaped groove (306), and the outer wall of the air filter plate B (307) is slidably connected to the inside of the T-shaped groove (306).

6. A semiconductor etching equipment gas supply system according to claim 5, characterized in that: An air filter plate C (308) is installed at the top center of the installation box (3), and the outer wall of the air filter plate C (308) is slidably connected to the inner walls of the two groups of L-shaped clamping plates (305).

7. A semiconductor etching equipment gas supply system according to claim 1, characterized in that: One end of the air supply pipe (4) passes through the installation box (3) and is fixedly connected to one end of the connecting pipe (301); the other end of the air supply pipe (4) is installed with an air supply device (401); and one side of the outer wall of the air supply pipe (4) is installed with an air velocity flow meter (402).

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