Film pressing mechanism and film pressing system
By introducing a flexible body into the film pressing mechanism and combining the expansion characteristics of the flexible parts, the problem that conventional film pressing mechanisms cannot fill the chip gap is solved, and effective filling and close bonding of adjacent chip gaps is achieved.
Patent Information
- Application Number
- CN202422199385.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-09
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-09-09
AI Technical Summary
Conventional film pressing mechanisms cannot effectively fill the gap between two adjacent chips, mainly because the flexible parts need to have a certain mechanical strength and cannot adapt to the small gap between chip spacing.
A membrane pressing mechanism is designed, including a frame, a stage, a flexible member and a flexible body. The flexible member expands under external pressure, driving the flexible body to apply force to the pressed film, so that it is closely linked to the wafer, and the flexibility of the flexible body enables it to fill the gap between adjacent chips.
It realizes good filling of the gap between two adjacent chips, improves the film compression effect, and is especially suitable for wafer gaps of high-level and deep ratios.
Smart Images
Figure CN223023234U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and in particular, to a film pressing mechanism and a film pressing system. Background Art
[0002] In the field of semiconductor technology, it is often necessary to press a film on a chip. However, conventional film pressing mechanisms have drawbacks. For example, since the distance between chips is small, and the flexible member used for film pressing requires a certain mechanical strength, therefore, it is often impossible to well fill the gap between two adjacent chips using a conventional film pressing mechanism. Summary of the Utility Model
[0003] Based on this, it is necessary to provide a film pressing mechanism and a film pressing system for the above problems.
[0004] According to the first aspect of the embodiments of the present application, a film pressing mechanism is provided, including:
[0005] A frame;
[0006] A stage, connected to the frame, the stage having a bearing surface;
[0007] A flexible member, connected to the frame, the flexible member being adapted to expand towards the bearing surface under an external pressure;
[0008] A flexible body, connected to the side of the flexible member facing the bearing surface, the hardness of the flexible body being less than the hardness of the flexible member.
[0009] In one embodiment, the Shore hardness of the flexible member is between 40HS and 60HS, and the Shore hardness of the flexible body is between 10HS and 30HS.
[0010] In one embodiment, the edge of the flexible body is fixedly connected to the flexible member.
[0011] In one embodiment, the flexible body is adhered to the surface of the flexible member facing the bearing surface.
[0012] In one embodiment, the flexible body includes a silicone pad.
[0013] In one embodiment, the thickness of the flexible body is 1 mm to 3 mm.
[0014] In one embodiment, the area of the flexible body is greater than or equal to the area of the flexible member.
[0015] In one embodiment, the bearing surface includes a plurality of spaced bearing positions.
[0016] According to a second aspect of the embodiments of the present application, a film pressing system is provided, including:
[0017] The film pressing mechanism as described above;
[0018] A wafer, disposed on the bearing surface;
[0019] A film to be laminated, covering a surface of the wafer on a side away from the bearing surface.
[0020] For the film pressing mechanism and the film pressing system provided by the embodiments of the present application, when the flexible member is subjected to an external pressure, it can expand toward the bearing surface of the stage. In practical applications, a wafer can be placed on the bearing surface, and a film to be laminated can be pre-placed on a surface of the wafer on a side away from the bearing surface. When the flexible member expands to a certain extent under the action of an external pressure, the flexible member can apply a certain force to the film to be laminated disposed on the wafer, thereby squeezing the film to be laminated and the wafer, so that the film to be laminated and the wafer are tightly combined. In the above process, since a flexible body is disposed on a surface of the flexible member facing the bearing surface, and the hardness of the flexible body is less than the hardness of the flexible member, when a plurality of wafers are disposed on the bearing surface, the flexible member and the flexible body are used in combination. The flexible member drives the softer flexible body to apply a force toward the wafer to the film to be laminated, so that while the film to be laminated and the wafer are tightly combined, the flexible member can also drive the softer flexible body to apply a force toward the bearing surface to the gap between two adjacent wafers to the film to be laminated. Thus, the film to be laminated can fill the gap between two adjacent wafers. However, since a conventional flexible member needs to have a certain degree of mechanical strength, it cannot well fill the gap between two adjacent wafers. Description of the Drawings
[0021] Figure 1 A schematic structural view of using a flexible member for film pressing in the prior art;
[0022] Figure 2 A schematic structural view of using the flexible member in the film pressing mechanism provided by an embodiment of the present application for film pressing;
[0023] Figure 3 A schematic view of the combination of the film to be laminated and the wafer after film pressing using the film pressing mechanism provided by an embodiment of the present application;
[0024] Figure 4 A schematic structural view of the film pressing mechanism provided by an embodiment of the present application;
[0025] Figure 5 A schematic structural view of the film pressing mechanism provided by an embodiment of the present application.
[0026] Description of the Reference Numerals:
[0027] 100, Frame; 200, Carrier stage; 300, Flexible member; 400, Flexible body; 500, Wafer; 600, Film to be laminated. Detailed implementation manners
[0028] For ease of understanding of this application, the following will describe this application more comprehensively with reference to the relevant drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of this application more thorough and comprehensive.
[0029] In this application, unless otherwise clearly defined and limited, terms such as "installed", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.
[0030] The terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of this application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the description of this application herein are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.
[0032] As described in the background art, in the field of semiconductor technology, it is often necessary to laminate a film on a chip. However, there are drawbacks in conventional lamination mechanisms. For example, since the spacing between chips is small, and the flexible member used for lamination requires a certain mechanical strength, therefore, it is often impossible to well fill the gap between two adjacent chips using a conventional lamination mechanism.
[0033] To solve the above problems, the embodiments of this application provide a lamination mechanism and a lamination system.
[0034] In one embodiment, a film pressing mechanism is provided. With the film pressing mechanism provided in this embodiment, the gap between two adjacent chips can be well filled.
[0035] Referring to Figure 4 and Figure 5 , the film pressing mechanism provided in this embodiment includes a frame 100, a stage 200, a flexible member 300, and a flexible body 400. Among them, the frame 100 provides support for other components in the entire film pressing mechanism. The stage 200 is connected to the frame 100, and the stage 200 has a bearing surface. The flexible member 300 is connected to the frame 100, and the flexible member 300 is adapted to expand toward the bearing surface under an external pressure. The flexible body 400 is connected to the side of the flexible member 300 facing the bearing surface, and the hardness of the flexible body 400 is less than the hardness of the flexible member 300.
[0036] For the above film pressing mechanism, when the flexible member 300 is under an external pressure, it can expand toward the bearing surface of the stage 200. In practical applications, a wafer 500 can be placed on the bearing surface, and the number of wafers 500 can be 1 or 2 or 3 or 4, etc. A film to be pressed 600 can be pre-placed on the surface of the wafer 500 away from the bearing surface. Referring to Figure 1 and Figure 2 , when the flexible member 300 expands to a certain extent under the action of an external pressure, the flexible member 300 can apply a certain force to the film to be pressed 600 provided on the wafer 500, thereby squeezing the film to be pressed 600 and the wafer 500 to make the film to be pressed 600 and the wafer 500 closely combined. Referring to Figure 2 and Figure 3 , in the above process, since the flexible body 400 is provided on the side surface of the flexible member 300 facing the bearing surface, and the hardness of the flexible body 400 is less than the hardness of the flexible member 300, when there are multiple wafers 500 provided on the bearing surface, the flexible member 300 and the flexible body 400 are used in cooperation. The flexible member 300 drives the softer flexible body 400 to apply a force toward the wafer 500 to the film to be pressed 600, so that while the film to be pressed 600 and the wafer 500 are closely combined, the flexible member 300 can also drive the softer flexible body 400 to apply a force toward the bearing surface to the film to be pressed 600 at the gap between two adjacent wafers 500. Thus, the film to be pressed 600 can fill the gap between two adjacent wafers 500. Figure 3 shows the bonding effect between the film to be pressed 600 and the wafer 500 after film pressing by the film pressing mechanism provided in this embodiment. As can be seen from the figure, the gap between two adjacent wafers 500 is also filled with the film to be pressed 600. And referring to Figure 1 , since the traditional flexible member 300 needs to have a certain degree of mechanical strength, it cannot well fill the gap between two adjacent wafers 500.
[0037] The film pressing mechanism provided in this embodiment can achieve an excellent filling effect on the gap of the wafer 500 with a high aspect ratio.
[0038] In one embodiment, the Shore hardness of the flexible member is between 40HS and 60HS, and the Shore hardness of the flexible body is between 10HS and 30HS. The Shore hardness of the flexible member can be 40HS or 45HS or 50HS or 55HS or 60HS, etc., and the Shore hardness of the flexible body can be 10HS or 15HS or 20HS or 25HS or 30HS, etc. In a specific example, the Shore hardness of the flexible member is 40HS, and the Shore hardness of the flexible body is 20HS; or, the Shore hardness of the flexible member is 50HS, and the Shore hardness of the flexible body is 30HS.
[0039] In one embodiment, the bearing surface includes a plurality of bearing positions arranged at intervals. A wafer 500 can be arranged on each bearing position, that is, the bearing positions correspond to the wafers 500 one by one. In a specific example, the interval between two adjacent bearing positions is 240 micrometers, and the height of the wafer 500 is 150 micrometers.
[0040] When it is necessary to press the film on the wafer 500, each wafer 500 can be placed on each bearing position first, and then a film 600 to be pressed is spread on each wafer 500. The film 600 to be pressed also covers the gap between two adjacent wafers 500. However, since the wafer 500 has a certain height and there is a certain gap between two adjacent wafers 500, at this time, the film 600 to be pressed between two adjacent wafers 500 is in a suspended state and does not fit the gap between two adjacent wafers 500. When using the film pressing mechanism provided in this embodiment, the flexible member 300 can drive the softer flexible body 400 to extrude the film 600 to be pressed, and it can extrude the film 600 to be pressed between two adjacent wafers 500 to make it fill and fit the gap between two adjacent wafers 500, so as to achieve an excellent film pressing effect.
[0041] There can be various connection methods and connection positions between the flexible body 400 and the flexible member 300.
[0042] In one embodiment, the edge of the flexible body 400 can be fixedly connected to the flexible member 300. Specifically, the edge of the flexible body 400 can be fixed on the flexible member 300 by means of bolt connection.
[0043] In another alternative embodiment, the flexible body 400 can be pasted on the surface of the flexible member 300 facing the bearing surface. That is, one side surface of the flexible body 400 is integrally attached to the surface of the flexible member 300 facing the bearing surface.
[0044] In one embodiment, the flexible body 400 may include a silica gel pad.
[0045] Among them, the flexible member 300 may include an airbag, and the material of the airbag may be a material that can expand under force.
[0046] In this embodiment, the hardness of the flexible body 400 is less than that of the flexible member 300, that is, the flexible body 400 is softer and more wrap-around than the flexible member 300.
[0047] In one embodiment, the thickness of the flexible body 400 is 1 mm to 3 mm. Specifically, the thickness of the flexible body 400 may be 1 mm or 1.5 mm or 2 mm or 2.5 mm or 3 mm, etc.
[0048] In one embodiment, the area of the flexible body 400 is greater than or equal to the area of the flexible member 300.
[0049] When it is necessary to manually connect the flexible body 400 to the flexible member 300 or remove the flexible body 400 from the flexible member 300, the area of the flexible body 400 may also be smaller than the area of the flexible member 300.
[0050] In one embodiment, a film pressing system is provided. The film pressing system provided in this embodiment includes the film pressing mechanism as described above, and also includes a wafer 500 and a film 600 to be pressed. Among them, the wafer 500 is disposed on the bearing surface. The film 600 to be pressed covers one side surface of the wafer 500 away from the bearing surface. For the specific structure of the above film pressing mechanism, please refer to the specific description in the film pressing mechanism provided in the foregoing embodiment, and details will not be described herein again.
[0051] The number of wafers 500 may be multiple, and there is a certain gap between two adjacent wafers 500. The film 600 to be pressed may be spread over each wafer 500, that is, the film 600 to be pressed not only covers each wafer 500, but also covers the gap between two adjacent wafers 500. When the film pressing mechanism is used to press the film 600 to be pressed and the wafer 500, the flexible member 300 may expand in the direction of the film 600 to be pressed and the wafer 500 when subjected to an external pressure, thereby driving the flexible body 400 to apply pressure to the film 600 to be pressed, so as to squeeze the film 600 to be pressed and the wafer 500, so that the film 600 to be pressed and the wafer 500 are tightly combined. At the same time, since the hardness of the flexible body 400 is smaller than that of the flexible member 300, the flexible member 300 can also drive the flexible body 400 to squeeze the film 600 to be pressed located between two adjacent wafers 500, that is, the film 600 to be pressed between two adjacent wafers 500 can be attached to the gap between two adjacent wafers 500, so that the gap between two adjacent wafers 500 can be well filled.
[0052] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.
[0053] The above-described embodiments only represent several implementation manners of the present application, and the description is relatively specific and detailed. However, it should not be construed as a limitation to the scope of the patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.
Claims
1. A film pressing mechanism, characterized in that: include: frame; A carrier, connected to the frame, the carrier having a bearing surface; A flexible member connected to the frame, wherein the flexible member is adapted to expand toward the bearing surface under external pressure; The flexible body is connected to a side of the flexible member facing the bearing surface, and the hardness of the flexible body is less than the hardness of the flexible member.
2. The film pressing mechanism according to claim 1, characterized in that: The Shore hardness of the flexible member is between 40HS and 60HS, and the Shore hardness of the flexible body is between 10HS and 30HS.
3. The film pressing mechanism according to claim 1, characterized in that: The edge of the flexible body is fixedly connected to the flexible member.
4. The film pressing mechanism according to claim 1, characterized in that: The flexible body is adhered to a surface of the flexible component facing the bearing surface.
5. The film pressing mechanism according to claim 1, characterized in that: The flexible body includes a silicone pad.
6. The film pressing mechanism according to claim 1, characterized in that: The thickness of the flexible body is 1 mm to 3 mm.
7. The film pressing mechanism according to claim 1, characterized in that: The area of the flexible body is greater than or equal to the area of the flexible member.
8. The film pressing mechanism according to claim 1, characterized in that: The bearing surface includes a plurality of bearing positions arranged at intervals.
9. A film pressing system, characterized in that: include: The film pressing mechanism according to any one of claims 1 to 8; A wafer is disposed on the carrying surface; The film to be pressed covers a surface of the wafer on one side away from the carrying surface.