Wafer positioning mechanism and film uncovering device

Abstract

The utility model provides a wafer positioning mechanism and a film uncovering device, the wafer positioning mechanism comprises a base, a plurality of positioning members, a plurality of detection members and a controller, a wafer is placed on the base, the plurality of positioning members are arranged on the side wall of the base, extend outwards and are used for supporting and clamping the wafer, each positioning member is provided with the detection member, and the controller is connected with the controller. The detection piece is used for detecting position information of the wafer and transmitting the position information to the controller, and the controller judges whether the wafer deviates or not according to the position information. By arranging the detection piece on the wafer positioning mechanism, whether the wafer deviates or not can be detected in time, and if the wafer deviates, an alarm can be given immediately, so that an operator can adjust the wafer in time, the problem that the wafer falls off is avoided, and the production yield is effectively improved; the wafer film uncovering device provided by the utility model comprises the wafer positioning mechanism, so that accurate alignment of a subsequent process is ensured, defects and waste products caused by inaccurate positioning are reduced, and the wafer film uncovering device is beneficial to improving the production efficiency.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor manufacturing, and specifically relates to a wafer positioning mechanism and a film peeling device. Background Art

[0002] During the storage process, the wafer needs to be covered with a transparent protective film on its surface to prevent the wafer surface from being scratched due to friction. Before processing the semiconductor wafer, the surface protective film needs to be peeled off before processing. In the prior art, a film peeling device is usually used to peel off the film. The transmission mechanism places the wafer on the positioning mechanism, and the positioning mechanism loads the wafer for the subsequent film peeling process. However, during the above process, the position of the wafer on the transmission mechanism may be offset, thereby causing the position of the wafer placed on the positioning mechanism to be offset, which can easily cause the wafer to fall from the positioning mechanism, causing damage to the wafer, reducing the production yield, and also causing economic losses. Utility Model Content

[0003] In view of the shortcomings of the prior art described above, the utility model provides a wafer positioning mechanism and a film peeling device. The wafer positioning mechanism includes a base, a plurality of positioning members, a plurality of detection members and a controller. The wafer is placed on the base. The plurality of positioning members are arranged on the side wall of the base and extend outwardly to support and clamp the wafer. Each positioning member is provided with a detection member, which is used to detect the position information of the wafer and transmit the position information to the controller. The controller determines whether the wafer is offset according to the above position information. By arranging the detection member on the wafer positioning mechanism, it is possible to detect whether the wafer is offset in time. If offset occurs, an alarm can be immediately issued so that the operator can make timely adjustments, thereby avoiding the problem of wafer falling and effectively improving the production yield. The wafer peeling device provided by the utility model includes the above wafer positioning mechanism, thereby ensuring the precise alignment of the subsequent process, reducing defects and waste caused by inaccurate positioning, and is conducive to improving production efficiency.

[0004] In order to achieve the above-mentioned purpose and other related purposes, the utility model provides a wafer positioning mechanism, comprising:

[0005] A base for placing the wafer;

[0006] A plurality of positioning members are evenly spaced and arranged on the side wall of the base and extend outward from the side wall of the base;

[0007] A plurality of detection members, respectively disposed on the plurality of positioning members, for detecting the position of the wafer on the base;

[0008] A controller is communicatively connected with the plurality of detection elements.

[0009] Optionally, the positioning member includes:

[0010] A support rod, located in the same plane as the base, extending radially outward from a side wall of the base;

[0011] A positioning pin is located at one end of the support rod away from the base and protrudes from the plane where the base is located, and is used to clamp the wafer.

[0012] Optionally, the detection member is arranged at one end of the support rod connected to the positioning pin.

[0013] Optionally, the detection element is an optical sensor.

[0014] Optionally, the number of the positioning members is at least three.

[0015] Optionally, the controller has an alarm unit.

[0016] Optionally, the controller is a programmable controller.

[0017] The utility model also provides a wafer film peeling device, comprising a feeding mechanism, a transmission mechanism, a positioning mechanism, a UV debonding chamber and a film peeling mechanism, wherein the positioning mechanism is any of the wafer positioning mechanisms described above.

[0018] The wafer positioning mechanism and film peeling device provided by the utility model have at least the following beneficial effects:

[0019] The wafer positioning mechanism provided by the utility model is provided with a detection component, which can timely detect whether the wafer is offset. If offset occurs, an alarm can be immediately issued so that the operator can make timely adjustments, thereby avoiding the problem of wafer falling and effectively improving the production yield.

[0020] The wafer film peeling device provided by the utility model comprises the above-mentioned wafer positioning mechanism, thereby ensuring the accurate alignment of subsequent processes, reducing defects and waste caused by inaccurate positioning, and being conducive to improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Shown is a structural schematic diagram of the wafer positioning mechanism provided in Example 1.

[0022] Component number description

[0023] 1 Base

[0024] 2 Positioning parts

[0025] 3 Detection parts

[0026] 4 Controller

[0027] 21 Support rod

[0028] 22 Locating pin Detailed implementation manners

[0029] The following uses specific specific examples to illustrate the implementation manners of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0030] It should be noted that the diagrams provided in this embodiment only illustrate the basic concept of the present invention in a schematic manner. Although only the components related to the present invention are shown in the diagrams, rather than being drawn according to the number, shape, and size of the components in actual implementation, the forms, quantities, positional relationships, and proportions of the components in actual implementation can be arbitrarily changed on the premise of implementing the technical solution of the present invention, and the component layout form may also be more complex.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the description of this application herein are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0032] In the description of this application, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating relative importance or implicitly indicating the quantity of the indicated technical features. Thus, unless otherwise stated, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features; the meaning of "a plurality" is two or more. The term "comprising" and any variation thereof mean inclusive inclusion, and there may be one or more other features, integers, steps, operations, units, components, and / or combinations thereof.

[0033] In addition, terms indicating orientation or positional relationships such as "center", "transverse", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are described based on the orientation or relative positional relationship shown in the drawings. They are only for the convenience of describing the present application in a simplified manner and do not indicate that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to this application.

[0034] In addition, unless otherwise clearly defined and limited, the terms "installed", "connected", and "coupled" shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0035] The present application will be described in detail below with reference to the accompanying drawings and optional embodiments. It should be noted that, on the premise of no conflict, the following-described embodiments or technical features can be combined arbitrarily to form new embodiments.

[0036] Embodiment 1

[0037] This embodiment provides a wafer positioning mechanism, as Figure 1 shown, including a base 1, a plurality of positioning members 2, a plurality of detection members 3, and a controller 4.

[0038] As Figure 1 shown, the base 1 is a circular structure, and its diameter is smaller than the diameter of the wafer. When positioning the wafer, the base 1 is used to place the wafer.

[0039] As Figure 1 shown, a plurality of positioning members 2 are evenly spaced on the side wall of the base 1 and extend outward from the side wall of the base 1. The positioning members 2 are used to support and clamp the wafer. As an example, the number of the positioning members 2 is at least three to form a stable support structure to prevent the wafer from slipping or shifting, keep its position fixed, and ensure its precise alignment in the automated equipment. In this embodiment, the number of the positioning members 2 is three.

[0040] As Figure 1 shown, the positioning member 2 includes a support rod 21 and a positioning pin 22.

[0041] As an example, the support rod 21 is in the same plane as the base 1 and extends radially outward from the side wall of the base 1. When the wafer is placed on the base 1, the wafer extends beyond the base 1, and the support rod 21 provides support for the extended part of the wafer. This design not only enhances the stability of the wafer, prevents it from tilting or slipping during the automated operation, ensures the safety of the wafer in various operating environments, but also helps to protect the wafer from potential damage, improving the efficiency and reliability of the entire processing flow.

[0042] As an example, the positioning pin 22 is located at one end of the support rod 21 away from the base 1 and protrudes from the plane where the base 1 is located. When the wafer is placed on the base 1, the positioning pin 22 contacts the edge of the wafer to clamp the wafer, providing the necessary clamping force to prevent the wafer from sliding or shifting on the base 1, thereby ensuring the stability of the wafer during processing, testing, or transportation. This clamping mechanism is crucial for maintaining the precise alignment of the wafer during precision processing, and also helps to protect the wafer from accidental damage, ensuring the continuity of the production process and the high-quality standard of the wafer.

[0043] As Figure 1 shown, each positioning member 2 is provided with a detecting member 3. Specifically, the detecting member 3 is arranged at one end of the support rod 21 connected to the positioning pin 22, and the positions of the plurality of detecting members 3 on the plurality of support rods 21 are the same. As an example, the number of detecting members 3 is the same as the number of positioning members 2. That is, in this embodiment, three detecting members 3 are provided.

[0044] As an example, the detecting member 3 can be an optical sensor, a capacitive sensor, an electromagnetic sensor, etc. They measure the distance between themselves and the edge of the wafer in a contact or non-contact manner. In this embodiment, the detecting member 3 is an optical sensor. The plurality of detecting members 3 are used to detect the position of the wafer on the base 1. Specifically, each detecting member 3 detects the distance information between itself and the edge of the wafer and sends the distance information to the controller 4.

[0045] As Figure 1 shown, the controller 4 is communicatively connected to the plurality of detecting members 3 and can receive the distance information output by the plurality of detecting members 3. As an example, the controller 4 is a programmable controller. After receiving the above distance information, through algorithm processing, it can accurately determine the position and posture of the wafer and detect whether the wafer is offset to ensure the precise alignment of the subsequent processing or detection process. This high-precision position detection is crucial for an automated production line. It can improve production efficiency, reduce defects and waste caused by inaccurate positioning, and also provide technical support for implementing more complex wafer processing technologies.

[0046] As an example, the controller 4 has an alarm unit. If it is detected that the wafer is offset on the positioning mechanism, the alarm unit is immediately activated to emit an audible and visual or other form of alarm signal. This immediate alarm mechanism can effectively remind the operator to pay attention and take timely measures to correct it, thereby avoiding possible damage or defects of the wafer during subsequent processing. The setting of the alarm unit is crucial for maintaining the stability of the production line and improving product quality, and also reduces production interruptions and cost losses caused by operating errors.

[0047] The wafer positioning mechanism provided in this embodiment can promptly detect whether the wafer is offset. If offset occurs, an alarm can be immediately issued so that the operator can make timely adjustments, thereby avoiding the problem of wafer falling and effectively improving the production yield.

[0048] Embodiment 2

[0049] This embodiment provides a wafer film peeling device, including a feeding mechanism, a transmission mechanism, a positioning mechanism, a UV debonding chamber and a film peeling mechanism, wherein the positioning mechanism is the wafer positioning mechanism provided in the first embodiment.

[0050] As an example, the feeding mechanism includes a lifting mechanism and a material storage box arranged on the lifting mechanism. In this embodiment, the lifting mechanism can be a known feasible structure, such as a hydraulic cylinder or an electric cylinder; a plurality of wafer placement layers are formed on the material storage box, and each wafer placement layer includes two support plates of equal height and a gap, and the spacing between the two support plates is smaller than the width of the wafer, so that the wafer can be effectively mounted on the two support plates.

[0051] As an example, the transmission mechanism takes out the wafer from the feeding mechanism and places it on the positioning mechanism. In this embodiment, the transmission mechanism can be a robot, and the robot can be a pneumatic clamp or an electric clamp, etc., as long as it can realize wafer transmission, and there is no limitation here.

[0052] As an example, the positioning mechanism is used to position and clamp the wafer for subsequent film stripping process. Figure 1 As shown, the positioning mechanism includes a base 1, a plurality of positioning members 2, a plurality of detection members 3 and a controller 4. The specific structure thereof is described in the first embodiment and will not be described in detail here.

[0053] As an example, the UV debonding chamber is used to perform debonding treatment on the wafer, so that the UV adhesive film on the surface of the wafer is cured and hardened, thereby reducing its viscosity to ensure that the film removal process is carried out smoothly while avoiding damage to the wafer. In this embodiment, the UV debonding chamber includes a UV irradiation table and ultraviolet lamps located in the chamber. The specific position and number of the ultraviolet lamps can be designed according to the actual processing needs and are not limited here.

[0054] As an example, the film stripping mechanism is used to remove the UV adhesive film on the surface of the wafer, and the wafer after film stripping is returned to the feeding mechanism through the conveying mechanism.

[0055] The wafer peeling device provided in this embodiment includes the wafer positioning mechanism provided in the first embodiment, which ensures accurate alignment of the process, reduces defects and waste caused by inaccurate positioning, and is conducive to improving production efficiency.

[0056] The above embodiments are only illustrative of the principles and effects of the present utility model, and are not intended to limit the present utility model. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present utility model. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present utility model should still be covered by the claims of the present utility model.

Claims

1. A wafer positioning mechanism, characterized in that: include: A base for placing the wafer; A plurality of positioning members are evenly spaced and arranged on the side wall of the base and extend outward from the side wall of the base; A plurality of detection members, respectively disposed on the plurality of positioning members, for detecting the position of the wafer on the base; A controller is communicatively connected with the plurality of detection elements.

2. The wafer positioning mechanism according to claim 1, characterized in that: The positioning member comprises: A support rod, located in the same plane as the base, extending radially outward from a side wall of the base; A positioning pin is located at one end of the support rod away from the base and protrudes from the plane where the base is located, and is used to clamp the wafer.

3. The wafer positioning mechanism according to claim 2, characterized in that: The detection member is arranged at one end of the support rod connected to the positioning pin.

4. The wafer positioning mechanism according to claim 1, characterized in that: The detection element is an optical sensor.

5. The wafer positioning mechanism according to claim 1, characterized in that: The number of the positioning members is at least three.

6. The wafer positioning mechanism according to claim 1, characterized in that: The controller has an alarm unit.

7. The wafer positioning mechanism according to claim 1, characterized in that: The controller is a programmable controller.

8. A wafer peeling device, characterized in that: The invention comprises a feeding mechanism, a transmission mechanism, a positioning mechanism, a UV debonding chamber and a film peeling mechanism, wherein the positioning mechanism is the wafer positioning mechanism according to any one of claims 1 to 7.

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