Suction device

Abstract

A suction device comprises a suction nozzle, a suction nozzle bolt, a positioning plate and a fixing part, a through hole is formed in the suction nozzle, the suction nozzle bolt is arranged on the suction nozzle and provided with a vent hole communicated with the through hole, the positioning plate is arranged on the suction nozzle and clamps and fixes the suction nozzle bolt, and the fixing part is arranged on the positioning plate and used for fixing the positioning plate and the suction nozzle. According to the suction device, the positioning plate is additionally arranged on the suction nozzle, and meanwhile, the positioning plate and the suction nozzle are fixed through the fixing piece, so that the problems that the suction nozzle bolt is loosened, the suction nozzle is inclined and the like due to the fact that an existing suction nozzle bolt and the suction nozzle are only combined in a press-fit mode are solved.

Description

Technical Field

[0001] This application relates to a suction device, especially a suction device applied to semiconductor manufacturing processes. Background Art

[0002] With the booming development of the electronics industry, electronic products tend to be thinner, lighter, shorter, and smaller in form, and in terms of functions, they are developed towards high performance, high functionality, and high speed. Therefore, the products of the semiconductor industry are becoming increasingly precise, and the product volume is gradually reduced.

[0003] In the existing semiconductor components during the manufacturing process, a vacuum suction device 1 as shown in Figure 1 provides the functions of sucking and placing semiconductor components. The vacuum suction device 1 is driven by a robotic arm and is equipped with a vacuum pumping device to move the semiconductor components from the preparation area to the predetermined processing area.

[0004] However, in the existing vacuum suction device 1, the nozzle plug 11 and the nozzle 12 are only assembled in a press-fitting manner, and subsequent loosening and nozzle tilting are likely to occur, resulting in the disadvantage of misjudgment by the machine.

[0005] Therefore, how to overcome the above-mentioned problems of the existing technology has actually become an urgent issue to be solved currently. Utility Model Content

[0006] In view of the above-mentioned deficiencies of the existing technology, this application provides a suction device for picking and placing semiconductor components, including: a nozzle formed with a through hole; a nozzle plug disposed on the nozzle and formed with a vent hole communicating with the through hole; a positioning plate disposed on the nozzle to position the nozzle plug; and a fixing member disposed on the positioning plate to fix the positioning plate and the nozzle.

[0007] This application further provides an assembly method of a suction device for picking and placing semiconductor components, including: providing a nozzle and a nozzle plug, wherein the nozzle is formed with a through hole, the nozzle plug is formed with a vent hole communicating with the through hole, and inserting the nozzle plug into the nozzle; providing a positioning plate and disposing the positioning plate on the nozzle to position the nozzle plug; and fixing the positioning plate and the nozzle with a fixing member.

[0008] In the aforementioned suction device and its assembly method, the nozzle is used to contact and adsorb the semiconductor component.

[0009] In the aforementioned suction device and its assembly method, the nozzle is provided with a fixing seat, and the through hole penetrates through the fixing seat.

[0010] In the aforementioned suction device and its assembly method, the fixing seat is provided with a plurality of screw holes.

[0011] In the above-mentioned suction device and its assembly method, the nozzle plug is used to connect the robotic arm, and the ventilation hole communicates with the suction port of the vacuum pumping device.

[0012] In the above-mentioned suction device and its assembly method, the nozzle plug has a hollow structure and includes a body, a first cylinder, a second cylinder, and an extended flange. One end of the first cylinder is connected to the body, and the other end is connected to the second cylinder. An extended flange extending outward is provided between the first cylinder and the second cylinder.

[0013] In the above-mentioned suction device and its assembly method, the second cylinder of the nozzle plug is inserted into the through hole of the nozzle, so that the nozzle plug is tightly clamped on the nozzle.

[0014] In the above-mentioned suction device and its assembly method, two mutually parallel side edges are formed on the extended flange.

[0015] In the above-mentioned suction device and its assembly method, the nozzle is provided with a fixing seat, and a groove is provided on the upper surface of the fixing seat to accommodate the extended flange, and the two mutually parallel side edges of the extended flange are clamped on the side walls of the groove.

[0016] In the above-mentioned suction device and its assembly method, the positioning plate is provided with a notch extending from the side edge to the center for the nozzle plug to pass through.

[0017] In the above-mentioned suction device and its assembly method, the positioning plate is formed with a plurality of through holes for the fixing member to pass through the plurality of through holes.

[0018] As can be seen from the above, in the suction device and its assembly method of the present application, mainly by adding a positioning plate to the nozzle (fixing seat), the positioning plate positions the nozzle plug, and at the same time, the positioning plate and the nozzle are fixed by a fixing member (bolt) to solve the disadvantages of the existing nozzle plug and nozzle being combined only by press-fitting, such as the nozzle plug being easily loosened and the nozzle being inclined due to the press-in combination, resulting in misjudgment of the machine. Description of the Drawings

[0019] Figure 1 It is a process schematic diagram of an existing semiconductor component.

[0020] Figure 2 It is an application cross-sectional schematic diagram of the suction device of the present application.

[0021] Figure 3 It is a partial schematic diagram of the suction device of the present application.

[0022] Figure 4 It is a schematic diagram of the nozzle plug of the suction device of the present application.

[0023] Figures 5A to 5C It is a manufacturing cross-sectional schematic diagram of the suction device of the present application.

[0024] Description of Main Component Symbols

[0025] 1 Vacuum Suction Device

[0026] 11 Nozzle Plug

[0027] 12 Nozzle

[0028] 2 Suction Device

[0029] 21 Nozzle

[0030] 210 Through Hole

[0031] 211 Fixed Seat

[0032] 212 Groove

[0033] 2110 Threaded Hole

[0034] 22 Nozzle Plug

[0035] 220 Body

[0036] 221 First Cylinder

[0037] 222 Second Cylinder

[0038] 223 Extension Flange

[0039] 2230 Side

[0040] 224 Vent Hole

[0041] 23 Positioning Plate

[0042] 230 Through Hole

[0043] 231 Notch

[0044] 24 Fastening Piece

[0045] 3 Semiconductor Component. Specific Embodiments

[0046] The following describes the embodiments of the present application through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification.

[0047] It should be noted that the structures, proportions, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the implementation conditions of this application. Therefore, they do not have substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the efficacy that this application can produce and the purpose that can be achieved, should still fall within the scope covered by the technical content disclosed in this application. At the same time, terms such as "upper" and "one" cited in this specification are only for the convenience of clear narration and are not used to limit the scope of implementation of this application. The change or adjustment of their relative relationship, without substantial change in the technical content, should also be regarded as the scope within which this application can be implemented.

[0048] Please refer to Figure 2 and Figure 3 , which are the application sectional view and partial view of the suction device 2 of this application. The suction device 2 includes a suction nozzle 21, a suction nozzle plug 22, a positioning plate 23, and a fixing member 24. The suction device 2 is used to pick and place semiconductor components 3, and the semiconductor component 3 is, for example, a ball grid array package (BALL GRID ARRAY, BGA), or a land grid array package (LAND GRID ARRAY, LGA).

[0049] The suction nozzle 21 is formed of, for example, a soft elastic material, and the suction nozzle 21 is formed with at least one through hole 210 for contacting and adsorbing the semiconductor component 3.

[0050] In addition, a fixing seat 211 is fixedly provided on the suction nozzle 21, and the through hole 210 also penetrates through the fixing seat 211. The fixing seat 211 is formed of, for example, a metal material, and the fixing seat is provided with a plurality of screw holes 2110.

[0051] The suction nozzle plug 22 is provided on the suction nozzle 21 and is used to connect a pick-and-place device (not shown), such as a robotic arm.

[0052] Please also refer to Figure 4 , the suction nozzle plug 22 is a hollow structure, which includes a body 220, a first cylinder 221, a second cylinder 222, and an extended flange 223. One end of the first cylinder 221 is connected to the body 220, and the other end is connected to the second cylinder 222. An extended flange 223 extending outward is provided between the first cylinder 221 and the second cylinder 222, and the extended flange 223 is formed with two parallel sides 2230. In addition, the suction nozzle plug 22 is formed with a ventilation hole 224, and the ventilation hole 224 penetrates through the body 220, the first cylinder 221, the second cylinder 222, and the extended flange 223 and correspondingly communicates with the through hole 210.

[0053] In addition, the nozzle plug 22 is inserted into the through hole 210 of the nozzle 21 (fixed seat 211) with the second cylinder 222 of the nozzle plug 22, so that the nozzle plug 22 (the second cylinder 222) is tightly fitted and clamped in the nozzle 21 (the through hole 210), and the extension flange 223 abuts against the upper surface of the fixed seat 211.

[0054] In addition, a groove 212 communicating with the through hole 210 may be provided on the upper surface of the nozzle 21 (fixed seat 211). When the nozzle plug 22 is inserted into the through hole 210 of the fixed seat 211 with the second cylinder 222, the extension flange 223 can be accommodated and fixed in the groove 212. At the same time, the two mutually parallel sides 2230 of the extension flange 223 are clamped on the side walls of the groove 212 to position the direction of the nozzle plug 22.

[0055] Specifically, the suction device 2 is installed on a pick-and-place device such as a robotic arm. Among them, the vent hole 224 communicates with the suction port of a vacuum pumping device. When performing the suction operation of the semiconductor component 3, the suction device 2 can pump air through the vacuum pumping device, so that a vacuum suction force is generated at the through hole 210. The semiconductor component 3 will be adsorbed at the through hole 210 of the nozzle 21 due to the vacuum suction force and will abut against the nozzle 21. Then, after the suction device 2 is driven by the robotic arm to move to a predetermined working area, the operation of the vacuum pumping device is stopped, so that the vacuum suction force at the through hole 210 disappears, and the effect of placing the semiconductor component 3 can be achieved.

[0056] The positioning plate 23 is provided on the nozzle 21 (fixed seat 211) to position the nozzle plug 22. Among them, the positioning plate 23 is formed with a plurality of through holes 230 (in this embodiment, four through holes 230 are formed, and threads may be formed in the plurality of through holes 230). The plurality of through holes 230 correspond to the positions of the plurality of screw holes 2110, and the positioning plate 23 is provided with a notch 231 extending from the side to the center for the nozzle plug 22 to pass through. Among them, the position of the notch 231 corresponds to the position of the groove 212 of the fixed seat 211, so that the positioning plate 23 presses against the extension flange 223, and part of the first cylinder 221 is located in the notch 231 to position the direction of the nozzle plug 22, which is beneficial for subsequent connection to the robotic arm.

[0057] The fixing member 24 is provided on the positioning plate 23 to fix the positioning plate 23 and the nozzle 21 (fixed seat 211). The fixing member 24 is, for example, a plurality of bolts, which pass through the plurality of through holes 230 of the positioning plate 23 and are screwed into the plurality of screw holes 2110 of the fixed seat 211 to fix the nozzle plug 22, which can prevent the nozzle from loosening and tilting, resulting in image shadows and causing misjudgment problems of the machine.

[0058] Please also refer to Figures 5A to 5CThis is an assembly schematic diagram of the suction device 2 of the present application. Regarding the structure of the suction device 2, it is as Figures 2 to 4 described, and the parts of the same components will not be elaborated again.

[0059] As Figure 5A shown, a nozzle 21 and a nozzle plug 22 are provided, and the nozzle plug 22 is inserted into the through hole 210 of the fixed seat 211 of the nozzle 21 with its second cylinder 222, and the extended flange 223 is accommodated and clamped in the groove 212.

[0060] As Figure 5B shown, a positioning plate 23 is provided, and the positioning plate 23 is sleeved on the nozzle plug 22 with its notch 231 and erected on the nozzle 21 (fixed seat 211), and a plurality of through holes 230 of the positioning plate 23 correspond to a plurality of screw holes 2110 of the fixed seat 211.

[0061] As Figure 5C shown, the fixing member 24 (a plurality of bolts) is arranged in the plurality of through holes 230 and the plurality of screw holes 2110 to fix the positioning plate 23 and the nozzle 21 (fixed seat 211), and further position the nozzle plug 22 on the nozzle 21.

[0062] To sum up, for the suction device and its assembly method of the present application, mainly by adding a positioning plate on the nozzle (fixed seat), the positioning plate positions the nozzle plug, and at the same time, the positioning plate and the nozzle are fixed by a fixing member (bolt), so as to solve the disadvantages of the existing nozzle plug and nozzle being combined only by press-fitting, and the nozzle plug being prone to looseness and the nozzle being inclined due to the press-in assembly, resulting in misjudgment of the machine.

[0063] The above embodiments are only used to exemplarily illustrate the principle and its effects of the present application, rather than to limit the present application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of the present application. Therefore, the scope of the patent protection of the present application should be as listed in the claims.

Claims

1. A pickup device for picking up and placing semiconductor components, characterized in that: include: A suction nozzle formed with a through hole; A nozzle plug is provided on the nozzle and is formed with a vent hole connected to the through hole; A positioning plate, disposed on the nozzle to position the nozzle plug; and The fixing piece is arranged on the positioning plate and is used for fixing the positioning plate and the suction nozzle.

2. The suction device according to claim 1, characterized in that The suction nozzle is used for contacting and adsorbing the semiconductor element.

3. The suction device according to claim 1, characterized in that: The suction nozzle is provided with a fixing seat, and the through hole passes through the fixing seat.

4. The suction device according to claim 3, characterized in that: The fixing seat is provided with a plurality of screw holes.

5. The suction device according to claim 1, characterized in that: The nozzle plug is used to connect the robot arm, and the vent hole is connected to the air suction port of the vacuum pumping device.

6. The suction device according to claim 1, characterized in that: The nozzle plug is a hollow structure, which includes a body, a first column, a second column and an extension flange. One end of the first column is connected to the body, and the other end is connected to the second column. The extension flange extending outward is provided between the first column and the second column.

7. The suction device according to claim 6, characterized in that The nozzle bolt is inserted into the through hole of the nozzle by the second column, so that the nozzle bolt is tightly fitted and clamped on the nozzle.

8. The suction device according to claim 6, characterized in that: The extending flange is formed with two parallel side edges.

9. The suction device according to claim 8, characterized in that The suction nozzle is provided with a fixing seat, and a groove is provided on the upper surface of the fixing seat to accommodate the extension flange, and the two mutually parallel side edges of the extension flange are clamped on the side wall of the groove.

10. The suction device according to claim 1, characterized in that: The positioning plate is provided with a notch extending from the side to the center for the nozzle bolt to pass through.

11. The suction device according to claim 1, characterized in that: The positioning plate is formed with a plurality of through holes for the fixing member to pass through the plurality of through holes.

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