Limit adjusting equipment suitable for wafer processing
By designing a limit adjustment device including a load base, a displacement adjustment device, a clamping device and a balance adjustment device, the problems of insufficient wafer limit and low rotation adjustment efficiency in existing wafer processing equipment are solved, and efficient limit and rotation of wafers are realized, adapting to the switching of wafers of different sizes, reducing costs and improving efficiency.
Patent Information
- Application Number
- CN202421667256.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-15
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-07-15
AI Technical Summary
The existing wafer processing limiting equipment has problems such as wafer bottom damage, insufficient edge limit, flat edge missing angles leading to clamping and low rotation adjustment efficiency in the pallet or array column mechanism.
A limit adjustment device including a load base, a mirror distribution displacement adjustment device, a bracket, an up and down clamping device, a balance adjustment device and a steering drive device are designed. The device realizes displacement adjustment through a linear motor, the clamping device realizes four-point contact limit and rotation, and the balance adjustment device performs balance adjustment through an adaptive adjustment assembly and contact head.
The four-point smooth contact limit and rotation of the wafer is achieved, adapting to the switching of 6-inch and 8-inch wafers, without the need to customize different limit systems, reducing implementation costs, improving processing efficiency, and avoiding wafer bottom pollution and contact loss.
Smart Images
Figure CN223023258U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to an adjusting device, in particular to a limit adjusting device suitable for wafer processing. Background Art
[0002] For wafer processing, in order to meet subsequent cleaning or surface processing, a limit device is often used to achieve temporary positioning of the wafer. Currently, the conventional method is to place the wafer through a tray, or to lift or clamp the wafer through some column mechanisms with an array distribution.
[0003] For the former, if the tray is not properly picked up and placed, it is easy to cause damage to the bottom of the wafer, and the loss during processing is relatively large. If the latter is adopted, during lifting, the edge of the wafer cannot be effectively limited, and if there is an external stress impact, it is easy to slide or fall. When clamping, once the wafer has defects such as flat edges and missing corners, the clamping will be unbalanced and there is still a possibility of falling.
[0004] At the same time, after the wafer is positioned by the traditional method, it is impossible to realize stable and convenient rotation adjustment of the wafer. It is necessary to insert additional steps for adjusting the picking and placing angle of the wafer in different processing steps, which reduces the processing efficiency.
[0005] In view of the above-mentioned defects, the designer actively conducts research and innovation in order to create a limit adjusting device suitable for wafer processing, making it more valuable in the industry. Summary of the Utility Model
[0006] In order to solve the above technical problems, the purpose of the utility model is to provide a limit adjusting device suitable for wafer processing.
[0007] The limit adjusting device suitable for wafer processing of the utility model includes a carrying base, wherein: displacement adjusting devices are arranged on the carrying base in a mirror image distribution, a supporting block is arranged on the displacement adjusting device, a wafer clamping device is arranged on the supporting block, the wafer clamping device includes an upper clamping device and a lower clamping device, a balance adjusting device is arranged between the upper clamping device and the lower clamping device, steering driving devices are arranged on both the upper clamping device and the lower clamping device, a contact head is arranged on the steering driving device, the balance adjusting device is configured with an adaptive adjusting component, a contact head is arranged on the adaptive adjusting component, a clamping adjustment area is formed between the upper clamping device and the lower clamping device, the wafer is located in the clamping adjustment area, and the wafer is in contact with the contact head.
[0008] Further, in the above-mentioned limit adjusting device suitable for wafer processing, the displacement adjusting device is a linear motor, and the supporting block is located on the moving component of the linear motor.
[0009] Furthermore, for the above-mentioned limit adjustment device applicable to wafer processing, wherein the supporting block includes a block body, the lower part of the block body is connected to the displacement adjustment device, a storage space is arranged inside the block body, the steering drive device and the adaptive adjustment component are installed in the storage space, a top cover is arranged above the storage space of the block body, a plurality of through holes are arranged on the top cover, the drive end of the steering drive device is connected to the contact head through the through hole, an adjustment hole is further arranged on the top cover, the drive end of the adaptive adjustment component is connected to the contact head through the adjustment hole, and the contact head is located at the upper end of the top cover.
[0010] Furthermore, for the above-mentioned limit adjustment device applicable to wafer processing, wherein the adaptive adjustment component is a clearance adjustment motor, or a clearance adjustment cylinder, or a clearance adjustment electric cylinder.
[0011] Furthermore, for the above-mentioned limit adjustment device applicable to wafer processing, wherein the contact head includes a conical base, a contact wheel is arranged at the upper end of the conical base, and a contact groove is arranged on the contact wheel.
[0012] Furthermore, for the above-mentioned limit adjustment device applicable to wafer processing, wherein chamfers are distributed at the upper and lower ends of the contact groove, and the angle of the chamfer is 5 to 35 degrees.
[0013] Furthermore, for the above-mentioned limit adjustment device applicable to wafer processing, wherein the steering drive device is a rotary motor.
[0014] Furthermore, for the above-mentioned limit adjustment device applicable to wafer processing, wherein a pressure sensor is arranged at the drive end of the rotary motor.
[0015] Still further, for the above-mentioned limit adjustment device applicable to wafer processing, wherein the steering drive device is configured with a speed synchronization module, and the speed synchronization module is a synchronous pulley or an electronic speed drive module.
[0016] By means of the above solution, the utility model has at least the following advantages:
[0017] 1. The upper clamping device and the lower clamping device can achieve four-point stable contact limit of the wafer and drive the wafer to rotate, meeting the need for displacement adjustment of the wafer during processing. There is no need to use a tray for cooperation, which will not cause pollution or contact loss at the bottom of the wafer.
[0018] 2. An independent balance adjustment device is provided, which can effectively cope with states such as flat edges and missing corners that the wafer may have, ensuring that both sides of the wafer can be properly clamped and limited at the same time, and there will be no improper displacement even when rotating.
[0019] 3. The displacement adjustment device can simultaneously meet the switching limit between 6-inch and 8-inch wafers, without the need to customize two different limit systems, thus reducing the implementation cost.
[0020] 4. By contacting the wafer with the contact head, effective limiting can be achieved, and no unnecessary shaking will occur during the wafer movement adjustment.
[0021] 5. The overall structure is simple and easy to manufacture. It can adapt to the use needs of multiple processing steps such as cleaning stations and inspection stations during wafer processing, and has good versatility.
[0022] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 It is a schematic diagram of the lateral structure of a limit adjustment device suitable for wafer processing.
[0024] Figure 2 It is a schematic diagram of the combination of an upper clamping device, a lower clamping device, a balance adjustment device and a wafer.
[0025] Figure 3 It is a schematic diagram of the structure of the contact head.
[0026] The meanings of the reference numerals in the drawings are as follows.
[0027] 1 Support base 2 Displacement adjustment device
[0028] 3 Support block 4 Upper clamping device
[0029] 5 Lower end clamping device 6 Balance adjustment device
[0030] 7 Steering drive 8 Contact head
[0031] 9 Adaptive adjustment component 10 Conical base
[0032] 11 contact wheel 12 wafer DETAILED DESCRIPTION
[0033] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0034] like Figures 1 to 3The limit adjustment device suitable for wafer processing includes a supporting base 1, which is different from the others in that: a displacement adjustment device 2 with mirror distribution is arranged on the supporting base 1, a support block 3 is arranged on the displacement adjustment device 2, and a wafer clamping device is arranged on the support block 3. In this way, the positioning needs of 6-inch and 8-inch wafers 12 can be met respectively according to the gap between the two displacement adjustment devices 2. At the same time, in order to meet the overall positioning of the wafer 12, the wafer clamping device used includes an upper clamping device 4 and a lower clamping device 5. In this way, through the mirror layout, contact positioning of at least four points on the side of the wafer 12 can be achieved. In addition, a balance adjustment device 6 is arranged between the upper clamping device 4 and the lower clamping device 5. In this way, when the wafer 12 has a non-circular shape such as a flat edge or a missing corner, effective clamping and limiting can still be achieved on both sides of the wafer 12. During the implementation, in order to facilitate the adjustment of the balance point of the current wafer 12, or to meet the regional conversion during the subsequent cleaning period, the upper clamping device 4 and the lower clamping device 5 are both provided with a steering drive device 7, and a contact head 8 is provided on the steering drive device 7. In this way, the contact head 8 contacts the outer edge of the wafer 12, and the contact head 8 can be rotated by the operation of the steering drive device 7. Under the premise of the operation of the corresponding steering drive device 7, the wafer 12 can be rotated clockwise or counterclockwise to adjust its placement position. In order to better deal with the lateral limit of the wafer 12 with a non-circular shape and avoid the unnecessary shaking of the wafer 12 during the adjustment period, the balance adjustment device 6 is equipped with an adaptive adjustment component 9, and a contact head 8 is provided on the adaptive adjustment component 9. The adaptive adjustment component 9 can be used to make the contact head 8 finally installed thereon better fit on both sides of the wafer 12, even if flat edges and missing corners appear, and can be in relatively close and stable contact with such structures. Therefore, during the implementation, a clamping adjustment area is formed between the upper clamping device 4 and the lower clamping device 5 , the wafer 12 is located in the clamping adjustment area, and the wafer 12 contacts the contact head 8 .
[0035] In combination with a preferred embodiment of the utility model, the displacement adjustment device 2 is a linear motor, and the support block 3 is located on the movable component of the linear motor. In this way, the gap between the two support blocks 3 can be adjusted to achieve rapid adjustment of the positioning gap of the 6-inch and 8-inch wafers 12. Of course, other devices for achieving displacement adjustment can also be used, which will not be repeated here.
[0036] Furthermore, in order to achieve stable load bearing, the supporting block 3 adopted includes a block body, and the lower part of the block body is connected to the displacement adjusting device 2. At the same time, a storage space is arranged inside the block body, and the steering drive device 7 and the adaptive adjustment component 9 are installed in the storage space. Moreover, a top cover is arranged above the storage space of the block body, and a number of through holes are arranged on the top cover. The driving end of the steering drive device 7 is connected to the contact head 8 through the through holes. Considering the convenience of gap adjustment, an adjustment hole is also arranged on the top cover, and the driving end of the adaptive adjustment component 9 is connected to the contact head 8 through the adjustment hole. Finally, the contact head 8 is located at the upper end of the top cover. Considering that the steering drive device 7 corresponding to the adaptive adjustment component 9 has a certain lateral movement stroke, the adjustment hole is preferably an oblong hole.
[0037] At the same time, in order to achieve convenient adaptive adjustment, the adaptive adjustment component 9 includes a gap adjustment motor, or a gap adjustment cylinder, or a gap adjustment electric cylinder. In this way, the contact head 8 connected thereto can be controlled to realize a certain lateral clamping gap adjustment, and the contact head 8 is used to contact non-circular shapes such as flat edges and chamfered corners to achieve contact filling. Of course, other devices such as a spring mechanism can also be used to form the adaptive adjustment component 9, as long as the contact head 8 connected thereto can be made to fit the outer edge of the wafer 12 as much as possible, which will not be elaborated here.
[0038] In combination with the actual implementation, the contact head 8 adopted in the present utility model includes a conical base 10, and a contact wheel 11 is arranged at the upper end of the conical base 10. At the same time, a contact groove is arranged on the contact wheel 11. In this way, the side edge of the wafer 12 contacts the contact groove. By rotating the contact wheel 11, the wafer 12 is driven to rotate. Moreover, oblique chamfers are distributed at the upper and lower ends of the contact groove, and the angle of the oblique chamfer is 5 to 35 degrees. In this way, when contacting the wafer 12, even if the initial placement angle of the wafer 12 is in a non-horizontal position, the edge of the wafer 12 can be stably contacted and limited, and the phenomenon of the wafer 12 slipping off will not occur.
[0039] Looking further, in order to achieve convenient rotation control, the steering drive device 7 is a rotary motor. At the same time, a pressure sensor can be arranged at the driving end of the rotary motor. In this way, if there is an abnormal change in the clamping pressure on the side of the wafer 12 due to rotation, it can be known in time, and the balance adjustment device 6 can be quickly intervened to effectively adaptively limit the possible flat edges and chamfered corners. Moreover, in order to make the upper clamping device 4 and the lower clamping device 5 operate better in synchronization and coordination, the steering drive device 7 to which they belong is configured with a rotation speed synchronization module, and the rotation speed synchronization module is a synchronous pulley. In this way, the contact heads 8 connected to the four steering drive devices 7 can rotate at the same speed. During the implementation, an electronic rotation speed drive module can also be selected to achieve more stable speed matching and coordination.
[0040] The working principle of the utility model is as follows:
[0041] The external feeding device feeds the wafer 12 into the clamping adjustment area. After that, the displacement adjustment device 2 starts to operate, so that the contact head 8 of the upper clamping device 4 and the lower clamping device 5 contacts the wafer 12 to achieve clamping limit.
[0042] Afterwards, along with the rotation of the contact head 8 of the upper clamping device 4 and the lower clamping device 5, the current state of the wafer 12 can be adjusted to achieve clockwise or counterclockwise rotation.
[0043] During this period, if the wafer 12 has flat edges, missing corners or other appearance defects, the contact head 8 belonging to the adaptive adjustment component 9 can stick to the outer edge of the wafer 12 to ensure that both ends of the wafer 12 are always in a fixed clamping state without shaking or tilting, let alone falling.
[0044] In this way, the upper clamping device 4 and the lower clamping device 5 are continuously operated. If used for cleaning, the external cleaning head can achieve full coverage spraying of the surface of the wafer 12 without any cleaning dead corners.
[0045] It can be seen from the above text description and the accompanying drawings that the following advantages are achieved after adopting the utility model:
[0046] 1. The upper clamping device and the lower clamping device can realize the four-point stable contact limit of the wafer and drive the wafer to rotate to meet the needs of wafer displacement adjustment during processing. No tray is required, and no contamination or contact loss will be caused to the bottom of the wafer.
[0047] 2. An independent balance adjustment device is set up to effectively deal with the flat edges, missing corners and other conditions that may exist on the wafer, ensuring that both sides of the wafer can be properly clamped and limited at the same time, and there will be no improper displacement even when rotating.
[0048] 3. The displacement adjustment device can simultaneously meet the switching limit between 6-inch and 8-inch wafers, without the need to customize two different limit systems, thus reducing the implementation cost.
[0049] 4. By contacting the wafer with the contact head, effective limiting can be achieved, and no unnecessary shaking will occur during the wafer movement adjustment.
[0050] 5. The overall structure is simple and easy to manufacture. It can adapt to the use needs of multiple processing steps such as cleaning stations and inspection stations during wafer processing, and has good versatility.
[0051] In addition, the orientation or positional relationship described in the present utility model is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or structure referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.
[0052] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present utility model, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present utility model.
Claims
1. A limit adjustment device suitable for wafer processing, comprising a bearing base, characterized in that: The supporting base is provided with a mirror-distributed displacement adjustment device, the displacement adjustment device is provided with a support block, the support block is provided with a wafer clamping device, the wafer clamping device includes an upper clamping device and a lower clamping device, a balance adjustment device is provided between the upper clamping device and the lower clamping device, the upper clamping device and the lower clamping device are both provided with a steering drive device, a contact head is provided on the steering drive device, the balance adjustment device is configured with an adaptive adjustment component, a contact head is provided on the adaptive adjustment component, a clamping adjustment area is formed between the upper clamping device and the lower clamping device, the wafer is located in the clamping adjustment area, and the wafer is in contact with the contact head.
2. The position limiting and adjusting device suitable for wafer processing according to claim 1 is characterized in that: The displacement adjustment device is a linear motor, and the support block is located on a movable component of the linear motor.
3. The position limiting and adjusting device suitable for wafer processing according to claim 1 is characterized in that: The support block includes a block body, the lower part of the block body is connected to the displacement adjustment device, a storage space is arranged in the block body, the steering drive device and the adaptive adjustment component are installed in the storage space, the block body is provided with a top cover above the storage space, a plurality of through holes are arranged on the top cover, the driving end of the steering drive device is connected to the contact head through the through hole, the top cover is also provided with an adjustment hole, the driving end of the adaptive adjustment component is connected to the contact head through the adjustment hole, and the contact head is located at the upper end of the top cover.
4. The position limiting and adjusting device suitable for wafer processing according to claim 1 is characterized in that: The self-adaptive adjustment component is a gap adjustment motor, or a gap adjustment cylinder, or a gap adjustment electric cylinder.
5. The position limiting and adjusting device suitable for wafer processing according to claim 1, characterized in that: The contact head comprises a conical base, a contact wheel is arranged at the upper end of the conical base, and a contact groove is arranged on the contact wheel.
6. The position limiting and adjusting device suitable for wafer processing according to claim 5, characterized in that: The upper and lower ends of the contact groove are provided with oblique chamfers, and the angle of the oblique chamfers is 5 to 35 degrees.
7. The position limiting and adjusting device suitable for wafer processing according to claim 1 is characterized in that: The steering drive device is a rotary motor.
8. The position limiting and adjusting device suitable for wafer processing according to claim 7, characterized in that: The driving end of the rotating motor is provided with a pressure sensor.
9. The position limiting and adjusting device suitable for wafer processing according to claim 1, characterized in that: The steering drive device is equipped with a speed synchronization module, and the speed synchronization module is a synchronous pulley or an electronic speed drive module.