Power interface and electronic equipment

Abstract

The utility model discloses a power interface and electronic equipment, and belongs to the technical field of electronic equipment. The power interface comprises a circuit board which is provided with a plurality of grounding terminals; the first end of the heat conduction part is connected with at least one grounding terminal; the first end of the temperature-sensitive element is connected to the second end of the heat conduction part; and the sampling circuit is connected to the second end of the temperature-sensitive element and is used for collecting voltage parameters in the temperature-sensitive element.

Description

Technical Field

[0001] This application belongs to the technical field of electronic devices, and particularly relates to a power interface and an electronic device. Background Art

[0002] In related technologies, as Figure 1 shown, in the power interface of an electronic device, a thermistor 102' is provided. One end of the thermistor 102' is grounded, and the other end is connected to a sampling circuit 104'. Thus, when the temperature of the power interface changes, the sampling circuit 104' samples the voltage value of the thermistor 102' to determine whether the temperature of the power interface abnormally rises.

[0003] Generally, as Figure 2 shown, the thermistor 102' is arranged on a circuit board 106' and grounded through the ground layer of the circuit board 106', and the ground layer of the circuit board 106' is grounded through the housing of the power interface. That is, the thermistor 102' is indirectly grounded through the ground layer of the circuit board 106' and the housing of the power interface. This causes the thermistor 102' to be unable to promptly sense the temperature change when the temperature of the power interface rises, resulting in deviation in temperature detection accuracy and lag in detection time. Summary of the Utility Model

[0004] This application aims to provide a power interface and an electronic device, which can solve the technical problem of low detection accuracy for temperature changes of the power interface in related technologies.

[0005] In a first aspect, an embodiment of this application provides a power interface, including:

[0006] A circuit board, on which a plurality of grounding terminals are arranged;

[0007] A heat conducting part, the first end of which is connected to at least one grounding terminal;

[0008] A temperature sensitive element, the first end of which is connected to the second end of the heat conducting part;

[0009] A sampling circuit, connected to the second end of the temperature sensitive element, for collecting voltage parameters in the temperature sensitive element.

[0010] In a second aspect, an embodiment of this application provides an electronic device, including: the power interface as in the first aspect.

[0011] The power interface according to the embodiment of the present application is provided with a heat conduction part, so that the temperature-sensitive element is connected to at least one grounding terminal on the circuit board through the heat conduction part, which not only realizes the grounding of the temperature-sensitive element, but also can conduct heat through the heat conduction part. When the temperature of the power interface rises abnormally, the heat can be directly conducted to the temperature-sensitive element through the heat conduction part. Compared with the method of connecting the temperature-sensitive element to the grounding layer of the circuit board and grounding through the grounding layer of the circuit board in the related art, the temperature-sensitive element can quickly sense the temperature change of the power interface. Especially when the temperature of the power interface rises due to a short circuit, the temperature-sensitive element is directly connected to the grounding terminal through the heat conduction part, so that the temperature-sensitive element can quickly sense the temperature change of the grounding terminal, ensuring the accuracy of temperature detection and avoiding the lag of temperature detection.

[0012] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0014] Figure 1 The circuit diagram of the power interface in the related art is shown;

[0015] Figure 2 The structural schematic diagram of the power interface in the related art is shown;

[0016] Figure 3 One of the structural schematic diagrams of the power interface according to the embodiment of the present application is shown;

[0017] Figure 4 The circuit diagram of the power interface according to the embodiment of the present application is shown;

[0018] Figure 5 Another structural schematic diagram of the power interface according to the embodiment of the present application is shown;

[0019] Figure 6 Another structural schematic diagram of the power interface according to the embodiment of the present application is shown;

[0020] Figure 7 The structural schematic diagram of the electronic device according to the embodiment of the present application is shown;

[0021] Figure 8 One of the structural schematic diagrams of the power supply cable in the related art is shown;

[0022] Figure 9 Another structural schematic diagram of the power supply cable in the related art is shown;

[0023] Figure 10 Shows a schematic structural diagram of the connection state between a power supply cable and a connector assembly in the related art;

[0024] Figure 11 Shows a schematic structural diagram of the connector assembly according to an embodiment of the present application;

[0025] Figure 12 Shows a schematic structural diagram of the connection state between a power supply cable and a connector assembly according to an embodiment of the present application;

[0026] Figure 13 Shows a block diagram of the structure of an electronic device according to an embodiment of the present application.

[0027] Reference numerals:

[0028] 102'thermistor, 104'sampling circuit, 106'circuit board, 108'contact, 110'grounding pin;

[0029] 100 power interface, 102 circuit board, 104 grounding terminal, 106 heat conducting part, 108 temperature sensitive element, 110 sampling circuit, 112 metal wire, 114 connector assembly, 116 substrate, 118 grounding pin, 120 heat conducting plate, 122 conducting part, 124 abutting part, 126 guiding surface, 128 metal shell, 200 electronic device, 202 power supply cable, 204 grounding pin. Detailed implementation manners

[0030] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for explaining the present application and should not be construed as limiting the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0031] The terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0032] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", and "linked" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0033] The following will be combined with Figures 3 to 7 , Figures 11 to 13 to describe the power interface and the electronic device according to the embodiments of the present application.

[0034] In some embodiments of the present application, a power interface is provided. Figure 3 One of the structural schematic diagrams of the power interface according to the embodiments of the present application is shown. As Figure 3 shown, the power interface 100 includes: a circuit board 102, on which at least one grounding terminal 104 is provided; a heat conduction part 106, the first end of the heat conduction part 106 is connected to at least one grounding terminal 104; a temperature-sensitive element 108, the first end of the temperature-sensitive element 108 is connected to the second end of the heat conduction part 106; a sampling circuit 110, connected to the second end of the temperature-sensitive element 108, and used to collect the voltage parameter in the temperature-sensitive element 108.

[0035] In the embodiments of the present application, the power interface 100 can be arranged in the electronic device 200. Through the power interface 100, connection with the power supply device can be realized. Specifically, it can be connected to the power supply cable 202 of the power supply device, so as to supply the electric energy provided by the power supply device to the electronic device 200 to realize power supply to the electronic device 200.

[0036] Specifically, the power interface 100 includes a circuit board 102. The circuit board 102 can be connected to the main board of the electronic device 200. Electrical components are arranged on the circuit board 102 to process the current provided by the power supply device, so as to realize power supply to the electronic device 200. Among them, at least one grounding terminal 104 is provided on the circuit board 102. Through at least one grounding terminal 104, grounding can be realized to ensure the normal flow of current. According to different models of the power interface 100, the number of grounding terminals 104 is different. For example, in the TYPE-C power interface, the number of grounding terminals 104 is four, and the four grounding terminals 104 are grounded for different current loops respectively to ensure the normal operation of the TYPE-C power interface.

[0037] Further, the power interface 100 further includes a heat conduction part 106 and a temperature-sensitive element 108. Among them, the temperature-sensitive element 108 is used to sense the temperature of the power interface 100. That is, the resistance value of the temperature-sensitive element 108 can change with its own temperature. By setting the temperature-sensitive element 108, when the temperature of the power interface 100 changes, the temperature change can be sensed, and then its own resistance value can be changed according to the temperature of the power interface 100.

[0038] Further, the first end of the heat conduction part 106 is connected to at least one ground terminal 104, and the second end of the heat conduction part 106 is connected to the first end of the temperature-sensitive element 108. That is, the temperature-sensitive element 108 is connected to the ground terminal 104 of the power interface 100 through the heat conduction part 106. Compared with the related art in which the temperature-sensitive element is connected to the ground layer of the circuit board and grounded through the ground layer of the circuit board, in this application, the temperature-sensitive element 108 is directly connected to at least one ground terminal 104 of the power interface 100 through the heat conduction part 106, so that not only the grounding of the temperature-sensitive element 108 is achieved through the heat conduction part 106, but also the heat conduction part 106 can be used to conduct heat, so that the temperature-sensitive element 108 can quickly sense the temperature change of the power interface 100. Especially when the temperature of the power interface 100 rises due to a short circuit, a large amount of current flows to the ground terminal 104, causing the temperature of the ground terminal 104 to rise rapidly. At this time, since the temperature-sensitive element 108 is directly connected to the ground terminal 104 through the heat conduction part 106, the temperature-sensitive element 108 can quickly sense the temperature change of the ground terminal 104, ensuring the accuracy of temperature detection and avoiding the lag of temperature detection, and improving the safety of the power interface 100 when connected to the power supply.

[0039] It should be noted that the number of ground terminals 104 on the circuit board 102 can be multiple. The thermally conductive part 106 and the temperature-sensitive element 108 can be connected to one of the multiple ground terminals 104 and one ground terminal 104, or the temperature-sensitive element 108 can be connected to multiple ones of the multiple ground terminals 104. Specifically, it can be set according to the function of each ground terminal 104 among the multiple ground terminals 104. For example, in some TYPE-C power interfaces, the number of ground terminals 104 is four, and one of the ground terminals 104 is used to detect whether the power supply cable 202 is connected to the power interface 100. Therefore, in order to avoid the thermally conductive part 106 affecting the detection result of whether the power supply cable 202 is connected, the thermally conductive part 106 can not be connected to this ground terminal 104, but only connected to the other three ground terminals 104. On the contrary, if the thermally conductive part 106 does not affect the normal operation of all the ground terminals 104 in the power interface 100, then the thermally conductive part 106 can be connected to all the ground terminals 104, that is, without affecting the normal operation of the power interface 100, the temperature-sensitive element 108 can be connected to as many ground terminals 104 as possible through the thermally conductive part 106, so as to further improve the accuracy of temperature detection.

[0040] In addition, Figure 4 The circuit diagram of the power interface according to the embodiment of the present application is shown. As Figure 4 shown, on the basis of connecting the temperature-sensitive element 108 to at least one ground terminal 104 through the thermally conductive part 106, the temperature-sensitive element 108 can also be connected to the ground layer of the circuit board 102, that is, the temperature-sensitive element 108 can also be grounded through the ground layer of the circuit board 102 to ensure that the temperature-sensitive element 108 can be correctly grounded and ensure the accuracy of temperature detection.

[0041] Furthermore, the power interface 100 further includes a sampling circuit 110. The sampling circuit 110 is connected to the second end of the temperature-sensitive element 108. Through the sampling circuit 110, the voltage parameter in the temperature-sensitive element 108 can be collected, that is, the voltage value of the temperature-sensitive element 108 is collected through the sampling circuit 110. Thus, it can be determined whether the current temperature of the power interface 100 is too high according to the voltage parameter in the temperature-sensitive element 108. Furthermore, when it is determined that the current temperature of the power interface 100 is too high, corresponding processing can be carried out in time to avoid combustion due to too high temperature.

[0042] The power interface 100 of the embodiment of the present application is provided with a heat conduction part 106, so that the temperature-sensitive element 108 is connected to at least one ground terminal 104 on the circuit board 102 through the heat conduction part 106, realizing the grounding of the temperature-sensitive element 108 and also being able to conduct heat through the heat conduction part 106. When the temperature of the power interface 100 rises abnormally, the heat can be directly conducted to the temperature-sensitive element 108 through the heat conduction part 106. Compared with the related technology of connecting the temperature-sensitive element to the grounding layer of the circuit board and grounding through the grounding layer of the circuit board, the temperature-sensitive element 108 can quickly sense the temperature change of the power interface 100. Especially when the temperature of the power interface 100 rises due to a short circuit, the temperature-sensitive element 108 is directly connected to the ground terminal 104 through the heat conduction part 106, so that the temperature-sensitive element 108 can quickly sense the temperature change of the ground terminal 104, ensuring the accuracy of temperature detection and avoiding the lag of temperature detection.

[0043] In some embodiments of the present application, the heat conduction part 106 includes: a metal wire 112 disposed on the surface of the circuit board 102, a first end of the metal wire 112 is connected to at least one ground terminal 104, and a second end of the metal wire 112 is connected to the temperature-sensitive element 108.

[0044] In the embodiment of the present application, as Figure 3 shown, the heat conduction part 106 may include a metal wire 112. Through the metal wire 112, the temperature-sensitive element 108 can be connected to the ground terminal 104, and the heat conduction can be realized by using the high thermal conductivity of the metal wire 112, ensuring that the temperature-sensitive element 108 can quickly sense the temperature change of the power interface 100.

[0045] Specifically, a first end of the metal wire 112 is connected to at least one ground terminal 104, and a second end of the metal wire 112 is connected to the temperature-sensitive element 108.

[0046] Furthermore, the metal wire 112 may be disposed on the surface of the circuit board 102, so as to improve the heat conduction efficiency of the metal wire 112. It can be understood that generally, in the inner layer of the circuit board 102, the heat loss is large. If the metal wire 112 is disposed in the inner layer of the circuit board 102, the large heat loss will reduce the heat transfer efficiency of the metal wire 112.

[0047] In addition, the metal wire 112 can be arranged according to the electrical components and wiring on the circuit board 102, so as to avoid interference between the metal wire 112 and the electrical components on the circuit board 102. At the same time, the metal wire 112 is arranged as far as possible from the wiring with a large current on the circuit board 102, such as the wiring related to the charging process, so as to avoid the influence of the temperature of the wiring with a large current on the heat conduction of the metal wire 112. At the same time, on the basis of ensuring that the metal wire 112 does not interfere with the electrical components and other wiring on the circuit board 102, the contact area between the metal wire 112 and the circuit board 102 can be increased, so as to further improve the heat conduction efficiency of the metal wire 112.

[0048] In some embodiments of the present application, the power interface 100 further includes a connector assembly 114 for connecting to the power supply cable 202. The connector assembly 114 includes: a substrate 116 connected to the circuit board 102, and a plurality of ground pins 118 are arranged on the substrate 116, and the plurality of ground pins 118 are connected to at least one ground terminal 104 in one-to-one correspondence; the heat conduction part 106 includes: a heat conduction plate 120 covering the substrate 116, the heat conduction plate 120 is electrically connected to at least one ground pin 118, and the heat conduction plate 120 is electrically connected to the temperature-sensitive element 108.

[0049] In the embodiments of the present application, Figure 5 FIG. 2 shows a second structural schematic diagram of the power interface according to the embodiment of the present application. As Figure 5 shown, the power interface 100 further includes a connector assembly 114. By providing the connector assembly 114, it is possible to connect to the power supply cable 202 of the power supply device, so as to receive the electric energy transmitted by the power supply cable 202. Among them, the connector assembly 114 includes a substrate 116, the substrate 116 is connected to the circuit board 102, and at the same time, a plurality of ground pins 118 are arranged on the substrate 116, and the plurality of ground pins 118 are connected to at least one ground terminal 104 on the circuit board 102 in one-to-one correspondence.

[0050] Furthermore, the heat conduction part 106 may include a heat conduction plate 120 covering the substrate 116, and the heat conduction plate 120 is connected to at least one ground pin 118 on the substrate 116. At the same time, the heat conduction plate 120 is also connected to the temperature-sensitive element 108. That is, the temperature-sensitive element 108 can be connected to the ground terminal 104 on the circuit board 102 through the heat conduction plate 120 and the ground pin 118, so as to realize the electrical connection between the temperature-sensitive element 108 and the ground terminal 104 to ensure the correct setting of the temperature-sensitive element 108.

[0051] By setting the heat-conducting part 106 as the heat-conducting plate 120 and covering the heat-conducting plate 120 on the substrate 116 of the joint assembly 114, the contact area between the heat-conducting part 106 and the substrate 116 of the joint assembly 114 can be increased, and thus the heat conduction efficiency of the heat-conducting part 106 for the heat generated by the power interface 100 can be effectively improved. Moreover, since the ground pin 118 on the substrate 116 is connected to the power supply cable 202, in the case of a short circuit, the current of the ground pin 118 rises rapidly, resulting in a rapid increase in the temperature of the substrate 116. Attaching the heat-conducting plate 120 to the substrate 116 can quickly conduct the temperature of the substrate 116 to the temperature-sensitive element 108, enabling the temperature-sensitive element 108 to quickly sense the increase in the temperature of the substrate 116 and improving the accuracy of temperature detection.

[0052] In addition, it should be noted that the substrate 116 is usually made of an insulating material such as plastic to prevent short circuits between the multiple pins on the substrate 116. The heat-conducting plate 120 can be made of a metal material to ensure the heat conduction efficiency of the heat-conducting plate 120. The heat-conducting plate 120 can be directly covered on the substrate 116, and an insulating layer can be provided between the heat-conducting plate 120 and the substrate 116. Specifically, the insulating layer can be set by an insulating coating process to prevent short circuits between the heat-conducting plate 120 and the pins on the substrate 116 other than the ground pin 118, ensuring the normal operation of the power interface 100.

[0053] Furthermore, Figure 6 FIG. 3 shows a third structural schematic diagram of the power interface according to an embodiment of the present application. As Figure 6 shown, the joint assembly 114 is further provided with a metal shell 128, and the substrate 116 and the pins on the substrate 116 are both arranged inside the metal shell 128, thereby protecting the substrate 116 and the pins through the metal shell 128. Correspondingly, an insulating layer can also be set between the heat-conducting plate 120 and the metal shell 128 by an insulating coating process to prevent short circuits between the heat-conducting plate 120 and the metal shell 128.

[0054] In some embodiments of the present application, the heat-conducting part 106 further includes: at least one conductive part 122, connected to the heat-conducting plate 120, with the first end of the conductive part 122 connected to the ground pin 118 and the second end of the conductive part 122 connected to the temperature-sensitive element 108.

[0055] In the embodiment of the present application, as Figure 5 shown, the heat-conducting part 106 further includes at least one conductive part 122. Through the conductive part 122, electrical connections between the heat-conducting plate 120 and the ground pin 118, and between the heat-conducting plate 120 and the temperature-sensitive element 108 can be achieved.

[0056] Specifically, the body of the conductive part 122 can be directly disposed on the heat conducting plate 120. Meanwhile, the first end of the conductive part 122 is connected to at least one ground pin 118, and the second end of the conductive part 122 is connected to the temperature sensitive element 108. Additionally, the conductive part 122 can also be made of a metal material. On the basis of ensuring the conductive function of the conductive part 122, it can also ensure the heat conduction efficiency of the conductive part 122, thereby ensuring that the temperature sensitive element 108 can quickly sense the temperature change of the base, improving the accuracy of temperature detection, and shortening the response time of the electronic device 200 to over-temperature protection.

[0057] In some embodiments of the present application, the conductive part 122 and the heat conducting plate 120 are of an integrally formed structure.

[0058] In the embodiments of the present application, the conductive part 122 and the heat conducting plate 120 can be arranged in an integrally formed structure. That is, the conductive part 122 and the heat conducting plate 120 can be made of the same metal material, and through an integrally formed process, the integrally formed structure of the conductive part 122 and the heat conducting plate 120 is realized, which can not only ensure the connection stability between the conductive part 122 and the heat conducting plate 120, but also reduce the manufacturing difficulty of the heat conducting part 106.

[0059] In some embodiments of the present application, the joint assembly 114 further includes: at least one abutting part 124, which is disposed on the plurality of ground pins 118, and the abutting part 124 is used for electrically connecting to the ground pin 204 of the power supply cable 202 when the joint assembly 114 is connected to the power supply cable 202.

[0060] In the embodiments of the present application, Figure 7 shows a schematic structural diagram of the electronic device according to the embodiments of the present application; Figure 11 shows a schematic structural diagram of the joint assembly according to the embodiments of the present application, as Figure 7 and Figure 11 shown, the joint assembly 114 may further include at least one abutting part 124, the abutting part 124 may be disposed on the plurality of ground pins 118, and when the joint assembly 114 is connected to the power supply cable 202, electrical connection to the ground pin 204 of the power supply cable 202 can be achieved through the at least one abutting part 124.

[0061] It should be noted that, Figure 7 shows a schematic structural diagram of the electronic device according to the embodiments of the present application; Figure 8 shows one of the schematic structural diagrams of the power supply cable in the related art; Figure 9 shows another schematic structural diagram of the power supply cable in the related art; Figure 10 shows the schematic structural diagram of the connection state between the power supply cable and the joint assembly in the related art, as Figure 7 、 Figure 8, Figure 9 and Figure 10 As shown, generally, a contact 108' is provided on the grounding pin of the power supply cable. When the power supply cable is connected to the connector assembly, the grounding pin of the power supply cable is electrically connected to the grounding pin 110' of the connector assembly through this contact 108'. In the case of a short circuit, most of the heat is generated by the current transfer on the power supply cable. However, when there is only one contact 108' for electrical connection between the grounding pin of the power supply cable and the grounding pin 110' of the connector assembly, the current cannot flow quickly to the grounding pin 110', resulting in a large loss of heat on the power supply cable and unable to be transferred to the grounding pin 110' of the connector assembly in time. Furthermore, in the case of a short circuit, it takes a longer time for the temperature of the connector assembly to rise, so that the temperature-sensitive element cannot quickly sense the temperature rise caused by the short circuit. Figure 12 The structural schematic diagram of the power supply cable and the connector assembly in the connection state according to the embodiment of the present application is shown. As Figure 12 shown, by providing at least one abutting portion 124 on the grounding pin 118 of the connector assembly 114, and electrically connecting the at least one abutting portion 124 to the grounding pin 204 of the power supply cable 202, thus in the case of a short circuit, more transmission channels are provided for the current, and then the current can flow quickly to the grounding pin 118 of the connector assembly 114. Furthermore, in the case of a short circuit, the temperature of the connector assembly 114 can rise quickly, so that the temperature-sensitive element 108 can quickly sense the temperature change and improve the efficiency of temperature detection.

[0062] In some embodiments of the present application, the abutting portion 124 is provided on the surface of the grounding pin 118, and the abutting portion 124 includes a guiding surface 126 for guiding the grounding pin 204 of the power supply cable 202 during the insertion and extraction of the power supply cable 202.

[0063] In the embodiment of the present application, as Figure 11 shown, the abutting portion 124 can be provided on the surface of the grounding pin 118. In this way, when the power supply cable 202 is connected to the connector assembly 114, it can be ensured that the abutting portion 124 on the surface of the grounding pin 118 can be in contact with the grounding pin 204 of the power supply cable 202.

[0064] In addition, it can be understood that the power supply cable 202 and the connector assembly 114 are usually connected and separated in the form of a plug board. Therefore, a guiding surface 126 can be provided on the abutting portion 124, so that during the insertion and extraction of the power supply cable 202, the grounding pin 204 of the power supply cable 202 can be guided, avoiding the abutting portion 124 from affecting the plug board process of the power supply cable 202 and ensuring that the power supply cable 202 can be normally connected and separated from the structural component.

[0065] Further, as Figure 11 shown, the angle between the guiding surface 126 and the surface of the grounding pin 118 can be set to be less than or equal to the first angle, such as Figure 11 α in. Thus, it is possible to avoid an excessive angle between the guiding surface 126 and the surface of the grounding pin 118, which may cause significant wear to the abutting portion 124 and the grounding pin 204 of the power supply cable 202 during the insertion and extraction of the power supply cable 202, and ensure the service life of the power interface 100 and the power supply cable 202.

[0066] Moreover, setting the angle between the guiding surface 126 and the surface of the grounding pin 118 to be less than or equal to the first angle can also prevent foreign matters from accumulating around the abutting portion 124, enabling debris and other foreign matters generated during the insertion and extraction of the power supply cable 202 to be discharged outside the joint assembly 114 in a timely manner.

[0067] Specifically, the first angle can be set to 10 degrees, which can meet the general processing accuracy standard, reduce the processing difficulty, and be suitable for most power supply cables 202.

[0068] In some embodiments of the present application, the abutting portion 124 and the grounding pin 118 are integrally formed structures.

[0069] In the embodiments of the present application, the abutting portion 124 and the grounding pin 118 can be integrally formed structures. Specifically, the abutting portion 124 and the grounding pin 118 can be made of the same material. During the manufacturing process of the grounding pin 118, the abutting portion 124 can be directly provided on the surface of the grounding pin 118 by using an integral forming process. This can not only ensure the connection stability between the grounding pin 118 and the abutting portion 124, but also reduce the manufacturing difficulty of the grounding pin 118.

[0070] In some embodiments of the present application, the number of the abutting portions 124 is less than or equal to three.

[0071] In the embodiments of the present application, as Figure 11 shown, the number of the abutting portions 124 can be set to be less than or equal to three. Specifically, the number can be set according to the length of the grounding pin 118, so as to avoid the distance between the abutting portions 124 being too small, which may cause foreign matters to be stored between the abutting portions 124, and further avoid blockage of the joint assembly 114.

[0072] The embodiments of the present application further provide an electronic device 200. Figure 13 The structural block diagram of the electronic device according to the embodiments of the present application is shown. As Figure 13 shown, the electronic device 200 includes the power interface 100 according to any one of the above embodiments.

[0073] Since the electronic device 200 provided by the embodiment of the present application has the power interface 100 as described in any of the above embodiments, it has the beneficial effects of any of the above embodiments, which will not be elaborated here one by one.

[0074] In the description of this specification, the descriptions with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0075] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A power interface, characterized in that: include: A circuit board, wherein at least one ground terminal is provided on the circuit board; a heat conducting portion, a first end of the heat conducting portion being connected to at least one of the ground terminals; a temperature-sensitive element, wherein a first end of the temperature-sensitive element is connected to a second end of the heat-conducting portion; The sampling circuit is connected to the second end of the temperature-sensitive element and is used to collect voltage parameters in the temperature-sensitive element.

2. The power interface according to claim 1, characterized in that: The heat conducting part comprises: A metal wire is arranged on the surface of the circuit board, a first end of the metal wire is connected to at least one of the ground terminals, and a second end of the metal wire is connected to the temperature sensitive element.

3. The power interface according to claim 1, characterized in that: The power interface further includes a connector assembly, which is used to connect to a power supply cable, and the connector assembly includes: A substrate, the substrate is connected to the circuit board, a plurality of ground pins are arranged on the substrate, and the plurality of ground pins are connected to the plurality of ground terminals in a one-to-one correspondence; The heat conducting part comprises: A heat conducting plate, the heat conducting plate covers the substrate, the heat conducting plate is electrically connected to at least one of the ground pins, and the heat conducting plate is electrically connected to the temperature sensitive element.

4. The power interface according to claim 3, characterized in that: The heat conducting part further comprises: At least one conductive part is connected to the heat conducting plate, a first end of the conductive part is connected to the ground pin, and a second end of the conductive part is connected to the temperature sensitive element.

5. The power interface according to claim 4, characterized in that: The conductive part and the heat conducting plate are an integrally formed structure.

6. The power interface according to claim 3, characterized in that: The joint assembly also includes: At least one abutment portion is provided on the plurality of ground pins, and the abutment portion is used to be electrically connected to the ground pin of the power supply cable when the connector assembly is connected to the power supply cable.

7. The power interface according to claim 6, characterized in that: The abutment portion is arranged on the surface of the ground pin, and the abutment portion includes a guide surface, and the guide surface is used to guide the ground pin of the power supply cable during the process of inserting and removing the power supply cable.

8. The power interface according to claim 7, characterized in that: The abutting portion and the grounding pin are an integrally formed structure.

9. The power interface according to claim 7, characterized in that: The number of the abutting portions is less than or equal to three.

10. An electronic device, characterized in that: include: A power interface as claimed in any one of claims 1 to 9.

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