Electronic device

Abstract

The utility model discloses electronic equipment, and belongs to the technical field of audio. The electronic equipment comprises a shell, a decoration assembly, a connection circuit board, a conductive shielding layer and a microphone assembly. The conductive shielding layer is arranged between the microphone assembly and the decoration assembly, so that after the decoration assembly releases static electricity, the released static electricity can be adsorbed by the conductive shielding layer before the static electricity reaches the microphone assembly, and the microphone assembly cannot be influenced by the static electricity released by the decoration assembly. Thus, additional metal elastic pieces can be avoided, other electronic elements can be arranged at the positions where the metal elastic pieces are originally arranged, the internal space of the electronic equipment is utilized more efficiently on the premise that the function integrity of the electronic equipment is guaranteed, and it is guaranteed that the space utilization rate of the electronic equipment is high.

Description

Technical Field

[0001] This application relates to the field of audio technology, and particularly to an electronic device. Background Art

[0002] With the progress of technology, electronic devices have more and more functions, and the microphone is an indispensable component among them. A microphone is a component in an electronic device that captures sound and converts the mechanical vibration caused by the sound into a corresponding electronic signal.

[0003] Generally, microphones are divided into a main microphone and a secondary microphone, and in some high-end intelligent electronic devices, a third microphone is also added. This third microphone can be used to implement functions such as stereo recording and intelligent noise reduction to further improve the audio processing ability. To ensure the aesthetic appearance of the electronic device, the third microphone is usually placed under the decorative part (such as Deco) of the electronic device. However, since the decorative part is prone to adsorbing charges, and when the charges accumulate to a certain extent, there will be a phenomenon of electrostatic discharge. To ensure that the microphone will not be damaged due to electrostatic discharge, it is necessary to connect the decorative part to the grounding layer of the electronic device through a metal shrapnel, so that the charges adsorbed by the decorative part can be conducted to the grounding layer to reduce the probability of electrostatic discharge.

[0004] However, the metal shrapnel will occupy the internal space of the electronic device, resulting in a low space utilization rate of the electronic device. Summary of the Utility Model

[0005] Embodiments of this application provide an electronic device, which can solve the problem of low space utilization rate of the existing electronic device. The technical solution is as follows:

[0006] On the one hand, an electronic device is provided, including:

[0007] A housing, a decorative component, a connection circuit board, a conductive shielding layer, and a microphone component;

[0008] The housing includes: a middle frame, and a rear cover connected to the middle frame. The middle frame is used to enclose an accommodation space, and the rear cover has an installation groove communicating with the accommodation space;

[0009] The decorative component is connected to the rear cover at the installation groove, and the decorative component has a first sound channel;

[0010] The connection circuit board is fixed in the accommodation space, and one side of the connection circuit board facing away from the decorative component is connected to the microphone component, and the microphone component is correspondingly distributed with the first sound channel;

[0011] The conductive shielding layer is electrically connected to the side of the connection circuit board facing away from the microphone assembly, and the orthographic projection of the conductive shielding layer on the target plane overlaps with the orthographic projection of the microphone assembly on the target plane; the target plane is a plane parallel to the connection circuit board.

[0012] Optionally, the orthographic projection of the microphone assembly on the target plane is located within the region enclosed by the outer boundary of the orthographic projection of the conductive shielding layer on the target plane.

[0013] Optionally, the conductive shielding layer has a first sound hole, and the microphone assembly has a second sound channel, and the first sound hole is respectively communicated with the first sound channel and the second sound channel.

[0014] Optionally, the connection circuit board has a second sound hole, and the second sound hole is respectively communicated with the first sound hole and the second sound channel.

[0015] Optionally, the aperture of the first sound hole is smaller than the aperture of the second sound channel.

[0016] Optionally, the connection circuit board has a ground layer, and the conductive shielding layer is electrically connected to the ground layer.

[0017] Optionally, the electronic device further includes a conductive adhesive located between the conductive shielding layer and the connection circuit board, and the conductive shielding layer is connected to the ground layer through the conductive adhesive.

[0018] Optionally, the electronic device further includes: a reinforcing layer connected to the side of the connection circuit board facing away from the decorative component, the reinforcing layer has a hollow area, and the microphone assembly passes through the hollow area and is fixedly connected to the connection circuit board.

[0019] Optionally, the orthographic projection of the conductive shielding layer on the target plane covers the orthographic projection of the hollow area on the target plane.

[0020] Optionally, both the conductive shielding layer and the reinforcing layer are sheet-like structures made of metal materials.

[0021] The beneficial effects brought by the technical solution provided by the embodiments of the present application at least include:

[0022] An electronic device includes: a housing, a decorative component, a connection circuit board, a conductive shielding layer, and a microphone component. By providing a conductive shielding layer between the microphone component and the decorative component, after the decorative component releases static electricity, the released static electricity will be adsorbed by the conductive shielding layer before reaching the microphone component, so that the microphone component will not be affected by the static electricity released by the decorative component. In this way, even if there is no metal shrapnel provided for connecting the decorative component to the ground layer of the electronic device, the static charge released from the decorative component can be first absorbed by the conductive shielding layer located between the decorative component and the microphone component by utilizing the conductive shielding layer between the microphone component and the decorative component. And, since the conductive shielding layer is electrically connected to the connection circuit board, the static charge adsorbed on the conductive shielding layer can be conducted to the ground layer of the connection circuit board to reduce the probability of static electricity release. In this way, additional metal shrapnel can be avoided, so that other electronic components can be provided at the position of the original metal shrapnel of the device, making more efficient use of the internal space of the electronic device on the premise of ensuring functional integrity, so as to ensure a high space utilization rate of this electronic device. In addition, since the use of metal shrapnel is omitted, the material cost can be reduced. Description of the Drawings

[0023] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1 is a top view of an electronic device provided by an embodiment of the present application;

[0025] Figure 2 is a schematic structural diagram of a housing provided by an embodiment of the present application;

[0026] Figure 3 is a partial view of an electronic device provided by an embodiment of the present application with the rear cover removed;

[0027] Figure 4 is a schematic structural diagram of a decorative component provided by an embodiment of the present application;

[0028] Figure 5 is a schematic structural diagram of a connection circuit board provided by an embodiment of the present application;

[0029] Figure 6 is Figure 1 a cross-sectional view at A-A';

[0030] Figure 7It is a top view of a connection circuit board provided by an embodiment of the present application;

[0031] Figure 8 It is a schematic diagram of a connection circuit board provided by an embodiment of the present application from another perspective;

[0032] Figure 9 It is a partial view of another electronic device with the back cover removed in an embodiment of the present application;

[0033] Figure 10 It is a schematic structural diagram of another decorative component provided by an embodiment of the present application. Detailed implementation manners

[0034] To make the objectives, technical solutions, and advantages of the present application clearer, the following will further describe the embodiments of the present application in detail with reference to the accompanying drawings.

[0035] In the related art, in order to ensure the aesthetic appearance of an electronic device, a third microphone is usually placed under the decorative part (i.e., Deco) of the electronic device. However, since the decorative part is prone to adsorbing charges, and when the charges accumulate to a certain extent, there will be a phenomenon of electrostatic discharge. However, in order to ensure that the microphone will not be damaged due to electrostatic discharge, it is necessary to connect the decorative part to the ground layer of the electronic device through a metal shrapnel, so that the charges adsorbed by the decorative part can be conducted to the ground layer to reduce the probability of electrostatic discharge. In this way, the metal shrapnel will occupy the internal space of the electronic device, resulting in a low space utilization rate of the electronic device.

[0036] An embodiment of the present application provides an electronic device, which can be a mobile phone, a tablet computer, a laptop computer, etc. Please refer to Figure 1 , Figure 1 It is a top view of an electronic device provided by an embodiment of the present application. The electronic device 000 may include: a housing 100, a decorative component 200, a connection circuit board 300, a conductive shielding layer 400, and a microphone component 500. It should be noted that Figure 1 only shows the distribution of the housing 100 and the decorative component 200 in the electronic device 000, and does not show the connection circuit board 300, the conductive shielding layer 400, and the microphone component 500. These structures will be shown in the subsequent drawings.

[0037] To more clearly see the structure of the housing in the electronic device 000, please refer to Figure 2 , Figure 2It is a schematic structural diagram of a housing provided by an embodiment of the present application. The housing 100 in the electronic device 000 may include: a middle frame 101 and a rear cover 102 connected to the middle frame 101. Here, the rear cover 102 in the housing 100 can usually also be called a battery cover, which can be used to encapsulate and protect the battery in the electronic device 000. One side of the middle frame 101 in the housing 100 facing away from the rear cover 101 can be connected to the display screen in the electronic device 000.

[0038] As Figure 3 shown, Figure 3 It is a partial view of an electronic device removing the rear cover in an embodiment of the present application. The middle frame 101 in the housing 100 can be used to enclose an accommodation space C, and the connection circuit board 300 in the electronic device 000 can be fixed in this accommodation space C.

[0039] As Figure 2 shown, the rear cover 102 in the housing 100 can have a mounting groove L communicating with the accommodation space C. The decoration component 200 in the electronic device 000 can be connected to the rear cover 102 at the mounting groove L. Exemplarily, the decoration component 200 in the electronic device 000 is connected to the rear cover 102 by an adhesive manner at the mounting groove L. Here, after the decoration component 200 in the electronic device 000 is connected to the rear cover 102, the decoration component 200 can play a decorative role on the back of the electronic device 000.

[0040] In the present application, as Figure 3 shown, the electronic device 000 may further include: a camera module 600. The camera module 600 can be fixed in the accommodation space C enclosed by the middle frame 102. Exemplarily, the electronic device 000 may further include: a main board 700 fixed in the accommodation space C, and the camera module 600 can be fixedly connected to the main board 700 in the accommodation space C. Here, the camera module 600 can leak out through the mounting groove L provided on the rear cover 101. For this reason, the decoration component 200 fixed at the mounting groove L can not only play a decorative role on the back of the electronic device 000, but also play a protective role on the camera module 600.

[0041] As Figure 4 shown, Figure 4 It is a schematic structural diagram of a decoration component provided by an embodiment of the present application. The decoration component 200 in the electronic device 000 has a first sound channel M1.

[0042] As Figure 5 shown, Figure 5It is a schematic structural diagram of a connection circuit board provided by an embodiment of the present application. On the side of the connection circuit board 300 in the electronic device 000 facing away from the decoration component 200, it can be connected to the microphone component 500. In this way, the microphone component 500 can be fixed in the accommodation space C through the connection circuit board 300. Here, the microphone component 500 can be correspondingly distributed with the first sound channel M1 of the decoration component 200. That is to say, the microphone component 500 can be connected and communicated with the first sound channel M1. In this case, external sounds can enter the microphone component 500 through the first sound channel M1. In the present application, the connection circuit board 300 can be connected to the main board in the electronic device 000, so that the main board 700 in the electronic device 000 can obtain the sounds in the external environment through the microphone component 500.

[0043] In the present application, as Figure 5 shown, the conductive shielding layer 400 in the electronic device 000 is electrically connected to the side of the connection circuit board 300 facing away from the microphone component 500, and the orthographic projection of the conductive shielding layer 400 on the target plane intersects with the orthographic projection of the microphone component 500 on the target plane. Among them, the target plane is a plane parallel to the connection circuit board 300. By way of example, the conductive shielding layer 400 can be made of a metal steel sheet with conductive properties.

[0044] In a possible case, after the static electricity accumulated in the decoration component 200 reaches a certain level, the static electricity will suddenly be released, thereby generating a current impact, which will further damage sensitive electronic components, such as microphones.

[0045] For this purpose, a conductive shielding layer 400 can be provided between the microphone component 500 and the decorative component 200. After the decorative component 200 releases static electricity, the released static electricity will be adsorbed by the conductive shielding layer 400 before reaching the microphone component 500, so that the microphone component 500 will not be affected by the static electricity released by the decorative component 200. In this way, even if there is no metal shrapnel for connecting the decorative component 200 to the ground layer (not shown) of the electronic device 000, the static charges released from the decorative component 200 can be first adsorbed by the conductive shielding layer 400 located between the decorative component 200 and the microphone component 500 by using the conductive shielding layer 400 between the microphone component 500 and the decorative component 200. Moreover, since the conductive shielding layer 400 is electrically connected to the connection circuit board 300, the static charges adsorbed on the conductive shielding layer 400 can be conducted to the ground layer of the connection circuit board 300 to reduce the probability of static electricity release. In this way, additional metal shrapnel (not shown) can be avoided, so that other electronic components can be provided at the position of the original metal shrapnel of the device, making the internal space of the electronic device 000 more efficiently utilized on the premise of ensuring the functional integrity, so as to ensure a high space utilization rate of this electronic device 000. In addition, since the use of metal shrapnel is omitted, the material cost can be reduced.

[0046] In summary, the electronic device provided by the embodiment of the present application includes: a housing, a decorative component, a connection circuit board, a conductive shielding layer, and a microphone component. By providing a conductive shielding layer between the microphone component and the decorative component, after the decorative component releases static electricity, the released static electricity will be adsorbed by the conductive shielding layer before reaching the microphone component, so that the microphone component will not be affected by the static electricity released by the decorative component. In this way, even if there is no metal shrapnel for connecting the decorative component to the ground layer of the electronic device, the static charges released from the decorative component can be first absorbed by the conductive shielding layer located between the decorative component and the microphone component by using the conductive shielding layer between the microphone component and the decorative component. Moreover, since the conductive shielding layer is electrically connected to the connection circuit board, the static charges adsorbed on the conductive shielding layer can be conducted to the ground layer of the connection circuit board to reduce the probability of static electricity release. In this way, additional metal shrapnel can be avoided, so that other electronic components can be provided at the position where the metal shrapnel was originally provided, making the internal space of the electronic device more efficiently utilized on the premise of ensuring the functional integrity, so as to ensure a high space utilization rate of this electronic device. In addition, since the use of metal shrapnel is omitted, the material cost can be reduced.

[0047] In an embodiment of the present application, the orthographic projection of the microphone assembly 500 in the electronic device 000 on the target plane is located within the region enclosed by the outer boundary of the orthographic projection of the conductive shielding layer 400 on the target plane.

[0048] In this case, the conductive shielding layer 400 in the electronic device 000 can more effectively intercept the static charges released by the decorative component 200, ensuring that these static charges are fully captured before reaching the microphone assembly 500, preventing the static electricity from directly acting on the microphone assembly 500, protecting the microphone assembly 500 from damage caused by static electricity release, and improving the stability of the electronic device 000.

[0049] Exemplarily, please refer to Figure 6 , Figure 6 is Figure 1 a cross-sectional view taken at A-A'. The conductive shielding layer 400 in the electronic device 000 has a first sound hole K1, and the microphone assembly 500 has a second sound channel M2. The first sound hole K1 is respectively connected to the first sound channel M1 and the second sound channel M2.

[0050] In this case, by providing the first sound hole K1 on the conductive shielding layer 400, it is ensured that the sound signal can be transmitted from the first sound channel M1 on the decorative component 200 to the second sound channel M2 of the microphone assembly 500 without obstruction, effectively improving the clarity of sound collection, thereby avoiding attenuation of the sound signal due to physical obstacles during transmission, and further ensuring that the microphone assembly 500 can receive high-quality sound signals.

[0051] In an embodiment of the present application, as Figure 6 shown, the connection circuit board 300 in the electronic device 000 has a second sound hole K2, and the second sound hole K2 is respectively connected to the first sound hole K1 and the second sound channel M2. Exemplarily, the electronic device 000 further includes a buffer layer 800 located between the housing 100 and the conductive shielding layer 400. For example, the buffer layer 800 can be made of foam material.

[0052] In the present application, the buffer layer 800 has a third sound hole K3, wherein the orthographic projections of the first sound hole K1, the second sound hole K2, and the third sound hole K3 on the target plane are all located within the orthographic projection of the second sound channel M2 on the target plane.

[0053] In this case, a connecting channel can be formed among the first sound hole K1, the second sound hole K2 and the third sound hole K3 to ensure that the sound signal is transmitted from the first sound channel M1 in the decorative component 200 to the second sound channel M2 on the microphone component 500 via the channel composed of multiple sound holes, thereby reducing the attenuation of the sound during transmission and enhancing the clarity of the sound signal received by the microphone component 500.

[0054] For example, the aperture of the first sound hole K1 in the conductive shielding layer 400 is smaller than the aperture of the second sound channel M2. In this way, not only can the smoothness of the sound transmission path be ensured, but also the effective area of ​​the conductive shielding layer 400 can be increased by reducing the aperture of the first sound hole K1, and the larger conductive shielding area can more effectively absorb the static electricity released by the decorative component 200, reduce the risk of static electricity directly acting on the microphone component 500, and protect the microphone component 500 from static electricity damage.

[0055] In the embodiment of the present application, the connection circuit board 300 in the electronic device 000 has a ground layer (not shown), and the conductive shielding layer 400 is electrically connected to the ground layer.

[0056] In this case, the conductive shielding layer 400 is connected to the ground layer in the circuit board 300, which can provide a quick release path for static electricity, so that the static electricity accumulated on the conductive shielding layer 400 can be released through the ground layer, thereby avoiding excessive accumulation of static electricity on the conductive shielding layer 400.

[0057] Exemplarily, the electronic device 000 further includes a conductive adhesive (not shown) located between the conductive shielding layer 400 and the connection circuit board 300 , and the conductive shielding layer 400 is connected to the ground layer through the conductive adhesive.

[0058] In this case, the conductive glue, as a special adhesive, can ensure the electrical continuity between the conductive shielding layer 400 and the grounding layer, and maintain a stable low-resistance connection even under conditions of slight mechanical vibration or thermal expansion, thereby effectively preventing the shielding effectiveness from being reduced due to poor contact.

[0059] In the examples of this application, please refer to Figure 7 and Figure 8 , Figure 7 is a top view of a connection circuit board provided in an embodiment of the present application, Figure 8 2 is a schematic diagram of a connection circuit board provided in an embodiment of the present application from another perspective. The electronic device 000 may further include: a reinforcement layer 900 connected to the side of the connection circuit board 300 away from the decorative component 200. The reinforcement layer 900 has a hollow area P, and the microphone component 500 passes through the hollow area P and is fixedly connected to the connection circuit board 300.

[0060] For example, the connecting circuit board 300 is a bendable flexible circuit board. Since the connecting circuit board 300 is connected to the reinforcing layer 900, the reinforcing layer 900 can support the connecting circuit board 300, so that the structure of the connecting circuit board 300 in this area is relatively stable, and the probability of deformation of the connecting circuit board 300 due to external force is effectively reduced.

[0061] Exemplarily, the orthographic projection of the conductive shielding layer 400 in the electronic device 000 on the target plane covers the orthographic projection of the hollow area P on the target plane. In this way, even if a hollow area P for connecting the microphone assembly 500 is provided on the reinforcement layer 900, the conductive shielding layer 400 can provide additional structural support for the hollow area P, so that various parts of the connection circuit board 300 can be effectively supported.

[0062] In the embodiment of the present application, the conductive shielding layer 400 and the reinforcing layer 900 in the electronic device 000 are both sheet structures made of metal materials. In this case, since the metal material has good rigidity, the conductive shielding layer 400 and the reinforcing layer 900 can provide strong support for the connected circuit board 300, prevent the circuit board from being deformed due to external force or its own weight, and maintain the structural stability of the circuit board.

[0063] In the examples of this application, please refer to Figure 9 and Figure 10 , Figure 9 is a partial view of another electronic device in an embodiment of the present application with the back cover removed, Figure 10 2 is a schematic diagram of the structure of another decorative component provided in an embodiment of the present application. A flashlight 301 is also provided on the side of the connecting circuit board 300 facing the decorative component 200, and a first light hole 201 is provided on the decorative component 200. The flashlight 301 can be transmitted through the light hole 201. In addition, the distribution positions of the microphone component 500 and the flashlight 301 can be integrated together.

[0064] In summary, the electronic device provided by the embodiment of the present application includes: a housing, a decorative component, a connecting circuit board, a conductive shielding layer and a microphone component. By setting a conductive shielding layer between the microphone component and the decorative component, after the decorative component is electrostatically released, the released static electricity will be absorbed by the conductive shielding layer before reaching the microphone component, so that the microphone component will not be affected by the static electricity released by the decorative component. In this way, even if a metal spring is not provided for connecting the decorative component to the ground layer of the electronic device, the electrostatic charge released from the decorative component can be absorbed by the conductive shielding layer between the decorative component and the microphone component before reaching the microphone component by utilizing the conductive shielding layer between the microphone component and the decorative component. In addition, since the conductive shielding layer is electrically connected to the connecting circuit board, the electrostatic charge absorbed on the conductive shielding layer can be conducted to the ground layer of the connecting circuit board to reduce the probability of electrostatic discharge. In this way, it is possible to avoid adding additional metal springs, so that other electronic components can be set at the position where the metal springs were originally set, so that the internal space of the electronic device is more efficiently utilized under the premise of ensuring functional integrity, so as to ensure that the space utilization rate of such electronic device is high. In addition, since the use of metal shrapnel is omitted, the material cost can be reduced.

[0065] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0066] The above description is only an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. An electronic device, characterized in that: include: A housing (100), a decoration component (200), a connection circuit board (300), a conductive shielding layer (400) and a microphone component (500); The housing (100) comprises: a middle frame (101), and a back cover (102) connected to the middle frame (101), the middle frame (101) being used to enclose a containing space (C), and the back cover (102) having a mounting groove (L) communicating with the containing space (C); The decoration component (200) is connected to the back cover (102) at the installation groove (L), and the decoration component (200) has a first sound channel (M1); The connecting circuit board (300) is fixed in the accommodating space (C), and a side of the connecting circuit board (300) facing away from the decorative component (200) is connected to the microphone component (500), and the microphone component (500) is distributed corresponding to the first sound channel (M1); The conductive shielding layer (400) is electrically connected to a side of the connecting circuit board (300) facing away from the microphone assembly (500), and the orthographic projection of the conductive shielding layer (400) on a target plane overlaps with the orthographic projection of the microphone assembly (500) on the target plane; the target plane is a plane parallel to the connecting circuit board (300).

2. The electronic device according to claim 1, characterized in that: The orthographic projection of the microphone assembly (500) on the target plane is located within a region enclosed by an outer boundary of the orthographic projection of the conductive shielding layer (400) on the target plane.

3. The electronic device according to claim 1, characterized in that: The conductive shielding layer (400) has a first sound hole (K1), the microphone assembly (500) has a second sound channel (M2), and the first sound hole (K1) is respectively connected to the first sound channel (M1) and the second sound channel (M2).

4. The electronic device according to claim 3, characterized in that: The connecting circuit board (300) has a second sound hole (K2), and the second sound hole (K2) is respectively connected to the first sound hole (K1) and the second sound channel (M2).

5. The electronic device according to claim 3, characterized in that: The aperture of the first sound hole (K1) is smaller than the aperture of the second sound channel (M2).

6. The electronic device according to any one of claims 1 to 5, characterized in that: The connection circuit board (300) has a grounding layer, and the conductive shielding layer (400) is electrically connected to the grounding layer.

7. The electronic device according to claim 6, characterized in that: The electronic device further comprises a conductive adhesive located between the conductive shielding layer (400) and the connecting circuit board (300), and the conductive shielding layer (400) is connected to the grounding layer via the conductive adhesive.

8. The electronic device according to any one of claims 1 to 5, characterized in that: The electronic device further comprises: a reinforcing layer (900) connected to a side of the connecting circuit board (300) facing away from the decorative component (200), the reinforcing layer (900) having a hollow area (P), and the microphone component (500) is fixedly connected to the connecting circuit board (300) after passing through the hollow area (P).

9. The electronic device according to claim 8, characterized in that: The orthographic projection of the conductive shielding layer (400) on the target plane covers the orthographic projection of the hollow area (P) on the target plane.

10. The electronic device according to claim 8, characterized in that: The conductive shielding layer (400) and the reinforcing layer (900) are both sheet structures made of metal materials.

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