Multilayer substrate

Abstract

Provided is a multilayer substrate in which a reference conductor layer overlapping with an eleventh interlayer connection conductor among a first reference conductor layer and a second reference conductor layer is provided with a first opening overlapping with a signal conductor layer when viewed in the Z-axis direction. When viewed in the Z-axis direction, the first opening is positioned closer to the negative direction of the X-axis than the vicinity of a first reference line connecting the second interlayer connection conductor and the fifth interlayer connection conductor. When viewed in the Z-axis direction, the first opening is positioned closer to the positive direction of the X-axis than the eleventh interlayer connection conductor.

Description

Technical Field

[0001] The present utility model relates to a multilayer substrate having a signal conductor layer. Background Art

[0002] As an invention related to a conventional multilayer substrate, for example, a transmission line described in Patent Document 1 is known. The transmission line includes a signal line, two ground conductors, and a plurality of GND vias. The signal line is located between the two ground conductors in the vertical direction. The signal line extends in the front-rear direction. The plurality of GND vias electrically connect the two ground conductors. The plurality of GND vias are located on both the left and right sides of the signal line. The plurality of GND vias are arranged along the signal line.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2010-28306 Summary of the Utility Model

[0006] Problems to be Solved by the Utility Model

[0007] However, in the transmission line described in Patent Document 1, the intervals of the plurality of GND vias are not uniform. Therefore, the characteristic impedance generated by the signal line is also not uniform. In this case, propagation modes other than a desired propagation mode (for example, TEM mode) (hereinafter, unwanted propagation modes) are generated. As a result, the unwanted propagation modes flow in the two ground conductors. Such unwanted propagation modes radiate as noise outside the transmission line from between two GND vias having a relatively large interval among the plurality of GND vias. As a result, noise is generated in the transmission line.

[0008] Accordingly, an object of the present utility model is to provide a multilayer substrate capable of suppressing the generation of noise.

[0009] Technical Solution for Solving the Problem

[0010] A multilayer substrate according to an aspect of the present utility model includes:

[0011] A laminate having a structure in which a plurality of insulator layers are laminated in the Z-axis direction;

[0012] A signal conductor layer provided on the laminate and having a linear shape extending along the X-axis direction orthogonal to the Z-axis direction;

[0013] A first reference conductor layer provided on the laminate, located at a position in the positive Z-axis direction with respect to the signal conductor layer, and overlapping the signal conductor layer when viewed in the Z-axis direction;

[0014] A second reference conductor layer, which is disposed in the laminate and is located in a position in the negative direction of the Z-axis relative to the signal conductor layer, and overlaps with the signal conductor layer when viewed in the Z-axis direction;

[0015] A first interlayer connection conductor, a second interlayer connection conductor, and a third interlayer connection conductor, which electrically connect the first reference conductor layer and the second reference conductor layer, and are located in a position in the positive direction of the Y-axis orthogonal to the X-axis direction and the Z-axis direction relative to the signal conductor layer, and are arranged in sequence along the signal conductor layer toward the positive direction of the X-axis;

[0016] A fourth interlayer connection conductor, a fifth interlayer connection conductor, and a sixth interlayer connection conductor, which electrically connect the first reference conductor layer and the second reference conductor layer, and are located in a position in the negative direction of the Y-axis relative to the signal conductor layer, and are arranged in sequence along the signal conductor layer toward the positive direction of the X-axis; and

[0017] An eleventh interlayer connection conductor, which is connected to the signal conductor layer and is located in a position in the positive direction of the Z-axis relative to the signal conductor layer, and penetrates through one or more of the plurality of insulator layers along the Z-axis,

[0018] The distance in the X-axis direction between the second interlayer connection conductor and the third interlayer connection conductor is longer than the distance in the X-axis direction between the first interlayer connection conductor and the second interlayer connection conductor,

[0019] The distance in the X-axis direction between the fifth interlayer connection conductor and the sixth interlayer connection conductor is longer than the distance in the X-axis direction between the fourth interlayer connection conductor and the fifth interlayer connection conductor,

[0020] In the reference conductor layer of the first reference conductor layer and the second reference conductor layer that overlaps with the eleventh interlayer connection conductor, a first opening that overlaps with the signal conductor layer when viewed in the Z-axis direction is provided,

[0021] When viewed in the Z-axis direction, the first opening is located in a position in the negative direction of the X-axis relative to the vicinity of the first reference line connecting the second interlayer connection conductor and the fifth interlayer connection conductor,

[0022] When viewed in the Z-axis direction, the first opening is located in a position in the positive direction of the X-axis relative to the eleventh interlayer connection conductor.

[0023] Utility model effect

[0024] According to the multi-layer substrate of the present utility model, the generation of noise can be suppressed. Description of the drawings

[0025] Figure 1 is an exploded perspective view of the multi-layer substrate 10.

[0026] Figure 2 is a top view of the insulator layer 16c.

[0027] Figure 3 is a cross-sectional view of the multi-layer substrate 10.

[0028] Figure 4 is a front view of the multi-layer substrate 10 when in use.

[0029] Figure 5 is a top view of the insulator layer 16c.

[0030] Figure 6 is an exploded perspective view of the multi-layer substrate 10b.

[0031] Figure 7 is a cross-sectional view of the multi-layer substrate 10b.

[0032] Figure 8 is a top view of the insulator layer 16c.

[0033] Figure 9 is a cross-sectional view of the multi-layer substrate 10d.

[0034] Figure 10 is a cross-sectional view of the multi-layer substrate 10e.

[0035] Figure 11 is a top view of the insulator layer 16c.

[0036] Figure 12 is a cross-sectional view of the multi-layer substrate 10g.

[0037] Figure 13 is a top view of the insulator layer 16c. DETAILED DESCRIPTION

[0038] (Embodiment)

[0039] [Structure of Multi-Layer Substrate]

[0040] Hereinafter, with reference to the drawings, the structure of the multi-layer substrate 10 according to the embodiment of the present invention will be described. Figure 1 is an exploded perspective view of the multi-layer substrate 10. Figure 2 is a top view of the insulator layer 16c. In Figure 2 the signal conductor layer 20 is shown overlapping. Figure 3 is a cross-sectional view of the multi-layer substrate 10. Figure 4 is a front view of the multi-layer substrate 10 when in use.

[0041] In this specification, directions are defined as follows. The stacking direction of the stacked body 12 of the multilayer substrate 10 is defined as the vertical direction. In addition, the vertical direction coincides with the Z-axis direction. The upward direction is the positive direction of the Z-axis. The downward direction is the negative direction of the Z-axis. In addition, the direction in which the signal conductor layer 20 of the multilayer substrate 10 extends is defined as the left-right direction. The left-right direction coincides with the X-axis direction. The right direction is the positive direction of the X-axis. The left direction is the negative direction of the X-axis. In addition, the line width direction of the signal conductor layer 20 when viewed in the vertical direction is defined as the front-back direction. The front-back direction coincides with the Y-axis direction. The front direction is the positive direction of the Y-axis. The back direction is the negative direction of the Y-axis. The vertical direction, the front-back direction, and the left-right direction are orthogonal to each other. It should be noted that the upward and downward directions of the vertical direction can be swapped, the left and right directions of the left-right direction can be swapped, and the front and back directions of the front-back direction can be swapped.

[0042] Hereinafter, X is a component or member of the multilayer substrate 10. In this specification, unless otherwise specified, each part of X is defined as follows. The front part of X refers to the front half of X. The rear part of X refers to the rear half of X. The left part of X refers to the left half of X. The right part of X refers to the right half of X. The upper part of X refers to the upper half of X. The lower part of X refers to the lower half of X. The front end of X refers to the end in the front direction of X. The rear end of X refers to the end in the rear direction of X. The left end of X refers to the end in the left direction of X. The right end of X refers to the end in the right direction of X. The upper end of X refers to the end in the upward direction of X. The lower end of X refers to the end in the downward direction of X. The front end portion of X refers to the front end of X and its vicinity. The rear end portion of X refers to the rear end of X and its vicinity. The left end portion of X refers to the left end of X and its vicinity. The right end portion of X refers to the right end of X and its vicinity. The upper end portion of X refers to the upper end of X and its vicinity. The lower end portion of X refers to the lower end of X and its vicinity.

[0043] First, refer to Figure 1 to describe the structure of the multilayer substrate 10. The multilayer substrate 10 transmits high-frequency signals. The multilayer substrate 10 is used to electrically connect two circuits in electronic devices such as smartphones. As Figure 1 shown, the multilayer substrate 10 includes a stacked body 12, a signal conductor layer 20, a first reference conductor layer 22, a second reference conductor layer 24, signal terminals 26a, 26b, interlayer connection conductors v1 to v8, v11, v12, a plurality of interlayer connection conductors v9, and a plurality of interlayer connection conductors v10.

[0044] The stacked body 12 has a plate shape. Therefore, the stacked body 12 has an upper main surface and a lower main surface. The upper main surface and the lower main surface of the stacked body 12 have a rectangular shape including a long side extending in the left-right direction. Therefore, the length of the stacked body 12 in the left-right direction is longer than the length of the stacked body 12 in the front-back direction. The stacked body 12 has flexibility.

[0045] AsFigure 1 As shown, the laminate 12 has a structure in which insulator layers 16a to 16c and protective layers 18a and 18b are laminated in the Z-axis direction. The protective layers 18a, the insulator layers 16a to 16c, and the protective layer 18b are arranged in order from top to bottom. The insulator layers 16a to 16c have upper main surfaces and lower main surfaces arranged in the vertical direction. The material of the insulator layers 16a to 16c is a thermoplastic resin. The thermoplastic resin is, for example, a liquid crystal polymer. The insulator layers 16a to 16c are fused to each other between adjacent insulator layers in the vertical direction. The protective layers 18a and 18b will be described later.

[0046] A high-frequency signal is transmitted through the signal conductor layer 20. The signal conductor layer 20 is provided on the laminate 12. In the present embodiment, the signal conductor layer 20 is located on the upper main surface of the insulator layer 16b. The signal conductor layer 20 has a linear shape extending in the left-right direction (X-axis direction).

[0047] As Figure 1 shown, a first reference conductor layer 22 is provided on the laminate 12. The first reference conductor layer 22 is located at a position above (in the positive Z-axis direction) the signal conductor layer 20 and overlaps the signal conductor layer 20 when viewed in the vertical direction (Z-axis direction). In the present embodiment, the first reference conductor layer 22 is located on the upper main surface of the insulator layer 16a. The first reference conductor layer 22 covers substantially the entire upper main surface of the insulator layer 16a. A reference potential is connected to the first reference conductor layer 22. The reference potential is, for example, a ground potential.

[0048] As Figure 1 shown, a second reference conductor layer 24 is provided on the laminate 12. The second reference conductor layer 24 is located at a position below (in the negative Z-axis direction) the signal conductor layer 20 and overlaps the signal conductor layer 20 when viewed in the vertical direction (Z-axis direction). In the present embodiment, the second reference conductor layer 24 is located on the lower main surface of the insulator layer 16c. The second reference conductor layer 24 covers substantially the entire lower main surface of the insulator layer 16c. A reference potential is connected to the second reference conductor layer 24. The reference potential is, for example, a ground potential. The signal conductor layer 20, the first reference conductor layer 22, and the second reference conductor layer 24 as described above have a stripline structure.

[0049] In the reference conductor layer among the first reference conductor layer 22 and the second reference conductor layer 24 that overlaps the interlayer connection conductor v11 (the eleventh interlayer connection conductor), a first opening Op1 that overlaps the signal conductor layer 20 when viewed in the vertical direction (Z-axis direction) is provided. In the present embodiment, the interlayer connection conductor v11 overlaps the second reference conductor layer 24 and does not overlap the first reference conductor layer 22. Thus, in the second reference conductor layer 24, a first opening Op1 that overlaps the signal conductor layer 20 when viewed in the vertical direction (Z-axis direction) is provided. The structure of the first opening Op1 will be described later.

[0050] The signal terminal 26a is provided at the left end portion of the stacked body 12. More specifically, the signal terminal 26a is located on the upper main surface of the stacked body 12 (the main surface in the positive direction of the Z axis). The signal terminal 26a overlaps with the left end portion of the signal conductor layer 20 when viewed in the vertical direction. The signal terminal 26a has a circular shape when viewed in the vertical direction. The signal terminal 26a is an external terminal for inputting and outputting high-frequency signals. The signal terminal 26a does not contact the first reference conductor layer 22.

[0051] The interlayer connection conductor v11 (the eleventh interlayer connection conductor) electrically connects the signal terminal 26a and the left end portion of the signal conductor layer 20. The interlayer connection conductor v11 penetrates through the insulator layer 16a in the vertical direction. The structures of the signal terminal 26b and the interlayer connection conductor v12 are symmetric to the structures of the signal terminal 26a and the interlayer connection conductor v11, and thus the description thereof is omitted.

[0052] As Figure 1 shown, the interlayer connection conductor v1 (the first interlayer connection conductor), the interlayer connection conductor v2 (the second interlayer connection conductor), the interlayer connection conductor v3 (the third interlayer connection conductor), the interlayer connection conductor v7 (the seventh interlayer connection conductor), and a plurality of interlayer connection conductors v9 electrically connect the first reference conductor layer 22 and the second reference conductor layer 24. As Figure 2 shown, the interlayer connection conductor v1 (the first interlayer connection conductor), the interlayer connection conductor v2 (the second interlayer connection conductor), the interlayer connection conductor v3 (the third interlayer connection conductor), the interlayer connection conductor v7 (the seventh interlayer connection conductor), and a plurality of interlayer connection conductors v9 are located at a position in front of (in the positive direction of the Y axis) the signal conductor layer 20. The interlayer connection conductor v7, the interlayer connection conductor v1 (the first interlayer connection conductor), the interlayer connection conductor v2 (the second interlayer connection conductor), the interlayer connection conductor v3 (the third interlayer connection conductor), and a plurality of interlayer connection conductors v9 are arranged in sequence along the signal conductor layer 20 toward the right direction (the positive direction of the X axis).

[0053] The distance D2 in the left - right direction (X - axis direction) between the inter - layer connection conductor v2 (the second inter - layer connection conductor) and the inter - layer connection conductor v3 (the third inter - layer connection conductor) is longer than the distance D1 in the left - right direction (X - axis direction) between the inter - layer connection conductor v1 (the first inter - layer connection conductor) and the inter - layer connection conductor v2 (the second inter - layer connection conductor). The distance D4 in the left - right direction between the inter - layer connection conductor v7 and the inter - layer connection conductor v1 is shorter than the distance D2 in the left - right direction between the inter - layer connection conductor v2 and the inter - layer connection conductor v3. The distance D5 in the left - right direction between the left - most inter - layer connection conductor v9 among the multiple inter - layer connection conductors v9 and the inter - layer connection conductor v3 is shorter than the distance D2 in the left - right direction between the inter - layer connection conductor v2 and the inter - layer connection conductor v3. Additionally, the interval D6 in the left - right direction of the multiple inter - layer connection conductors v9 is shorter than the distance D2 in the left - right direction between the inter - layer connection conductor v2 and the inter - layer connection conductor v3. In the present embodiment, the distance D1, the distance D4, the distance D5, and the distance D6 are equal to each other.

[0054] As Figure 1 shown, the inter - layer connection conductor v4 (the fourth inter - layer connection conductor), the inter - layer connection conductor v5 (the fifth inter - layer connection conductor), the inter - layer connection conductor v6 (the sixth inter - layer connection conductor), the inter - layer connection conductor v8 (the eighth inter - layer connection conductor), and the multiple inter - layer connection conductors v10 electrically connect the first reference conductor layer 22 and the second reference conductor layer 24. As Figure 2 shown, the inter - layer connection conductor v4 (the fourth inter - layer connection conductor), the inter - layer connection conductor v5 (the fifth inter - layer connection conductor), the inter - layer connection conductor v6 (the sixth inter - layer connection conductor), the inter - layer connection conductor v8 (the eighth inter - layer connection conductor), and the multiple inter - layer connection conductors v10 are located at a position behind (in the negative Y - axis direction) the signal conductor layer 20. The inter - layer connection conductor v8, the inter - layer connection conductor v4 (the fourth inter - layer connection conductor), the inter - layer connection conductor v5 (the fifth inter - layer connection conductor), the inter - layer connection conductor v6 (the sixth inter - layer connection conductor), and the multiple inter - layer connection conductors v10 are arranged in sequence along the signal conductor layer 20 toward the right direction (the positive X - axis direction).

[0055] The distance D12 in the left - right direction (X - axis direction) between the inter - layer connection conductor v5 (the fifth inter - layer connection conductor) and the inter - layer connection conductor v6 (the sixth inter - layer connection conductor) is longer than the distance D11 in the left - right direction (X - axis direction) between the inter - layer connection conductor v4 (the fourth inter - layer connection conductor) and the inter - layer connection conductor v5 (the fifth inter - layer connection conductor). The distance D14 in the left - right direction between the inter - layer connection conductor v8 and the inter - layer connection conductor v4 is shorter than the distance D12 in the left - right direction between the inter - layer connection conductor v5 and the inter - layer connection conductor v6. The distance D15 in the left - right direction between the left - most inter - layer connection conductor v10 among the multiple inter - layer connection conductors v10 and the inter - layer connection conductor v6 is shorter than the distance D12 in the left - right direction between the inter - layer connection conductor v5 and the inter - layer connection conductor v6. Additionally, the interval D16 in the left - right direction of the multiple inter - layer connection conductors v10 is shorter than the distance D12 in the left - right direction between the inter - layer connection conductor v5 and the inter - layer connection conductor v6. In the present embodiment, the distance D11, the distance D14, the distance D15, and the distance D16 are equal to each other.

[0056] In the present embodiment, the inter - layer connection conductor v1 overlaps with the inter - layer connection conductor v4 when viewed in the front - rear direction. The inter - layer connection conductor v2 overlaps with the inter - layer connection conductor v5 when viewed in the front - rear direction. The inter - layer connection conductor v3 overlaps with the inter - layer connection conductor v6 when viewed in the front - rear direction. The inter - layer connection conductor v7 overlaps with the inter - layer connection conductor v8 when viewed in the front - rear direction. Each of the multiple inter - layer connection conductors v9 overlaps with each of the multiple inter - layer connection conductors v10.

[0057] However, the inter - layer connection conductor v1 may not overlap with the inter - layer connection conductor v4 when viewed in the front - rear direction. The inter - layer connection conductor v2 may not overlap with the inter - layer connection conductor v5 when viewed in the front - rear direction. The inter - layer connection conductor v3 may not overlap with the inter - layer connection conductor v6 when viewed in the front - rear direction. The inter - layer connection conductor v7 may not overlap with the inter - layer connection conductor v8 when viewed in the front - rear direction. Each of the multiple inter - layer connection conductors v9 may not overlap with each of the multiple inter - layer connection conductors v10, respectively.

[0058] In addition, as Figure 2 shown, the inter - layer connection conductor v11 (the eleventh inter - layer connection conductor) is located in the region surrounded by the inter - layer connection conductor v1 (the first inter - layer connection conductor), the inter - layer connection conductor v2 (the second inter - layer connection conductor), the inter - layer connection conductor v4 (the fourth inter - layer connection conductor), the inter - layer connection conductor v5 (the fifth inter - layer connection conductor), the inter - layer connection conductor v7 (the seventh inter - layer connection conductor), and the inter - layer connection conductor v8 (the eighth inter - layer connection conductor). Moreover, the distance D50 in the left - right direction between the inter - layer connection conductor v11 and the first reference line X1 (described later) is shorter than half of the wavelength of the high - frequency signal transmitted in the signal conductor layer 20. In addition, as Figure 3As shown, the interlayer connection conductor v11 does not overlap with the first opening Op1 described later when viewed in the vertical direction.

[0059] The first reference conductor layer 22, the second reference conductor layer 24, and the signal terminals 26a and 26b as described above are formed, for example, by etching a metal foil provided on the upper main surface or the lower main surface of the insulator layers 16a to 16c. The metal foil is, for example, a copper foil.

[0060] In addition, the interlayer connection conductors v1 to v8, v11, v12, and the plurality of interlayer connection conductors v9 and v10 are, for example, via conductors. By forming through holes in the insulator layers 16a to 16c, filling the through holes with a conductive paste, and sintering the conductive paste, the via conductors are manufactured. The materials of the interlayer connection conductors v1 to v8, v11, v12, and the plurality of interlayer connection conductors v9 and v10 are mixtures of resin and metal.

[0061] Here, the first reference line X1 is a line connecting the interlayer connection conductor v2 (the second interlayer connection conductor) and the interlayer connection conductor v5 (the fifth interlayer connection conductor). Moreover, the intersection point of the first reference line X1 and the center line CL of the signal conductor layer 20 when viewed in the vertical direction (Z-axis direction) is defined as the first intersection point P1.

[0062] In addition, the second reference line X2 is a line passing through the interlayer connection conductor v3 (the third interlayer connection conductor) and the interlayer connection conductor v6 (the sixth interlayer connection conductor). Moreover, the intersection point of the second reference line X2 and the center line CL of the signal conductor layer 20 when viewed in the vertical direction (Z-axis direction) is defined as the second intersection point P2.

[0063] In addition, the interval between the first intersection point P1 and the second intersection point P2 is equally divided into four by the first point p1, the second point p2, and the third point p3 arranged in the right direction (the positive direction of the X-axis). And the point separated from the first intersection point P1 by the distance between the first point p1 and the second point p2 in the left direction (the negative direction of the X-axis) is defined as the fourth point p4.

[0064] Hereinafter, the structure of the first opening Op1 will be described. The first opening Op1 has a slit shape extending in the front-rear direction. Therefore, the width of the first opening Op1 in the front-rear direction (Y-axis direction) is larger than the width of the first opening Op1 in the left-right direction (X-axis direction). Moreover, the width of the first opening Op1 in the front-rear direction (Y-axis direction) is more than half of the distance D60 in the front-rear direction (Y-axis direction) between the rear end (the end in the negative direction of the Y-axis) of the interlayer connection conductor v2 (the second interlayer connection conductor) and the front end (the end in the positive direction of the Y-axis) of the interlayer connection conductor v5 (the fifth interlayer connection conductor).

[0065] In addition, the first opening Op1 is located near the interlayer connection conductors v2 and v5. More specifically, when viewed in the up-down direction (Z-axis direction), the first opening Op1 is located near and to the right (positive direction of the X-axis) of the first reference straight line X1 connecting the second interlayer connection conductor v2 and the fifth interlayer connection conductor v5. It should be noted that being located near the first reference straight line X1 means being located to the left of the first straight line L1 and to the right of the second straight line L2.

[0066] The first straight line L1 is a line passing through the first point p1 and being orthogonal to the signal conductor layer 20. The second straight line L2 is a line passing through the fourth point p4 and being orthogonal to the signal conductor layer 20. When viewed in the up-down direction (Z-axis direction), the center C1 of the first opening Op1 in the front-back direction and the left-right direction (X-axis direction) is located between the first straight line L1 and the second straight line L2. In the present embodiment, when viewed in the up-down direction (Z-axis direction), the first opening Op1 is located between the first straight line L1 and the second straight line L2.

[0067] In addition, when viewed in the up-down direction (Z-axis direction), the first opening Op1 is located to the right (in the positive direction of the X-axis) of the interlayer connection conductor v11 (the eleventh interlayer connection conductor). Furthermore, when viewed in the up-down direction (Z-axis direction), the left end (in the negative direction of the X-axis) of the first opening Op1 is located to the right (in the positive direction of the X-axis) of the straight line X3 connecting the interlayer connection conductor v1 (the first interlayer connection conductor) and the interlayer connection conductor v4 (the fourth interlayer connection conductor). In the present embodiment, when viewed in the up-down direction (Z-axis direction), the left end (in the negative direction of the X-axis) of the first opening Op1 is located to the right (in the positive direction of the X-axis) of the right end (in the positive direction of the X-axis) of the interlayer connection conductor v1 (the first interlayer connection conductor) and the right end (in the positive direction of the X-axis) of the interlayer connection conductor v4 (the fourth interlayer connection conductor).

[0068] When viewed in the up-down direction (Z-axis direction), the right end (the end in the positive direction of the X-axis) of the first opening Op1 is located to the left (in the negative direction of the X-axis) of the third straight line L3 that passes through the second point p2 and is orthogonal to the signal conductor layer 20. It should be noted that in this embodiment, when viewed in the up-down direction (Z-axis direction), the entire first opening Op1 is located between the first straight line L1 and the second straight line L2. More precisely, the first opening Op1 is located between the first reference straight line X1 and the first straight line L1.

[0069] In addition, the front end of the first opening Op1 (the end in the positive direction of the Y axis) is located at a position behind (in the negative direction of the Y axis) the front end of the interlayer connection conductor v2 (the second interlayer connection conductor). The rear end of the first opening Op1 (the end in the negative direction of the Y axis) is located at a position in front (in the positive direction of the Y axis) of the rear end of the interlayer connection conductor v5 (the fifth interlayer connection conductor).

[0070] In addition, when viewed in the vertical direction (Z-axis direction), there are no openings other than the first opening Op1 on the third straight line L3. That is, no openings are provided on the third straight line L3. Also, no openings are provided at positions to the right of the first opening Op1 and to the left of the second reference straight line X2.

[0071] As described above, no openings are provided in the first reference conductor layer 22 provided at the same position as the signal terminal 26a in the vertical direction. Moreover, a first opening Op1 is provided in the second reference conductor layer 24 provided at a position different from the signal terminal 26a in the vertical direction.

[0072] In addition, in the multilayer substrate 10, no openings are provided in the interval between the first straight line L1 and the second reference straight line X2. The fourth straight line L4 is a line passing through the third point p3 and orthogonal to the signal conductor layer 20.

[0073] The protective layer 18a is an insulating layer that covers the upper main surface of the insulating layer 16a. Thus, the protective layer 18a protects the first reference conductor layer 22. However, openings h1 to h6 are provided in the protective layer 18a. The opening h1 overlaps with the signal terminal 26a when viewed in the vertical direction. Thus, the signal terminal 26a is exposed from the multilayer substrate 10 to the outside. The opening h2 is located behind the opening h1. A part of the first reference conductor layer 22 is exposed from the multilayer substrate 10 to the outside via the opening h2. The opening h3 is located in front of the opening h1. A part of the first reference conductor layer 22 is exposed from the multilayer substrate 10 to the outside via the opening h3. Thus, a part of the first reference conductor layer 22 functions as a ground terminal. It should be noted that the structures of the openings h4 to h6 are symmetric to the left and right of the structures of the openings h1 to h3, so the description thereof is omitted.

[0074] The protective layer 18b is a protective layer that covers the lower main surface of the insulating layer 16c. Thus, the protective layer 18b protects the second reference conductor layer 24.

[0075] The multilayer substrate 10 as described above has flexibility. Therefore, as Figure 4As shown, the multilayer substrate 10 can be bent. Specifically, the multilayer substrate 10 has a first section A1, a second section A2, and a third section A3. The first section A1, the second section A2, and the third section A3 are arranged in sequence from left to right when the multilayer substrate 10 is in an unbent state. As Figure 2 shown, the first section A1 is the section to the left of the first reference line X1 connecting the interlayer connection conductor v2 and the interlayer connection conductor v5. The second section A2 is the section between the first reference line X1 connecting the interlayer connection conductor v2 and the interlayer connection conductor v5 and the second reference line X2 connecting the interlayer connection conductor v3 and the interlayer connection conductor v6. The third section A3 is the section to the right of the second reference line X2 connecting the interlayer connection conductor v3 and the interlayer connection conductor v6.

[0076] Moreover, a part a2 of the second section A2 is bent downward with respect to the first section A1. That is, the multilayer substrate 10 is bent at a part a2 of the second section A2 between the first reference line X1 connecting the interlayer connection conductor v2 (the second interlayer connection conductor) and the interlayer connection conductor v5 (the fifth interlayer connection conductor) and the second reference line X2 connecting the interlayer connection conductor v3 (the third interlayer connection conductor) and the interlayer connection conductor v6 (the sixth interlayer connection conductor). The end in the negative X-axis direction of the part a2 is located at a position in the positive X-axis direction compared to the end in the negative X-axis direction of the second section A2. The end in the positive X-axis direction of the part a2 is located at a position in the negative X-axis direction compared to the end in the positive X-axis direction of the second section A2. On the other hand, the first section A1 and the third section A3 are not bent. However, the first section A1 and the third section A3 may also be slightly bent. In this case, the radius of curvature of the first section A1 and the radius of curvature of the third section A3 are larger than the radius of curvature of the part a2 of the second section A2.

[0077] [Effect]

[0078] (a) According to the multilayer substrate 10, the generation of noise can be suppressed. More specifically, in the multilayer substrate 10, the lateral distance D2 between the interlayer connection conductor v2 and the interlayer connection conductor v3 is longer than the lateral distance D1 between the interlayer connection conductor v1 and the interlayer connection conductor v2. The lateral distance D12 between the interlayer connection conductor v5 and the interlayer connection conductor v6 is longer than the lateral distance D11 between the interlayer connection conductor v4 and the interlayer connection conductor v5. Therefore, the characteristic impedance generated in the signal conductor layer 20 is likely to become uneven. In this case, a propagation mode other than the desired propagation mode (TEM mode) (hereinafter, an unwanted propagation mode) is generated. As a result, the unwanted propagation mode may be radiated as noise from the region between the first reference line X1 and the second reference line X2.

[0079] Thus, in the multilayer substrate 10, when viewed in the vertical direction, the first opening Op1 is located at a position near the left side of the first reference line X1 connecting the second interlayer connection conductor v2 and the fifth interlayer connection conductor v5. In addition, when viewed in the vertical direction, the first opening Op1 is located at a position to the right of the eleventh interlayer connection conductor v11. Thus, the first opening Op1 is located near the interlayer connection conductors v2 and v5. The center C1 of the first opening Op1 is located near the first reference line X1 in the left-right direction and is not located near the interlayer connection conductors v2 and v5. Therefore, even if the unwanted propagation mode flows in the rightward direction in the second reference conductor layer 24, the flow of the unwanted propagation mode is blocked by the first opening Op1. Therefore, the radiation of the unwanted propagation mode as noise from the region between the first reference line X1 and the second reference line X2 is suppressed. Also, the unwanted resonance caused by the unwanted propagation mode is suppressed.

[0080] (b) According to the multilayer substrate 10, the width of the first opening Op1 in the front-rear direction is more than half of the distance D60 in the front-rear direction between the rear end of the interlayer connection conductor v2 and the front end of the interlayer connection conductor v5. Thus, the flow of the unwanted propagation mode propagating in the second reference conductor layer 24 is efficiently obstructed by the first opening Op1. Therefore, the radiation of the unwanted propagation mode as noise from between the interlayer connection conductor v2 and the interlayer connection conductor v3 and between the interlayer connection conductor v5 and the interlayer connection conductor v6 is suppressed. In addition, by not providing an opening at a position to the right of the first opening Op1 and to the left of the second reference line X2, the strength of the multilayer substrate 10 can be maintained.

[0081] (c) A part a2 of the second interval A2 between the first reference line X1 connecting the interlayer connection conductor v2 and the interlayer connection conductor v5 and the second reference line X2 connecting the interlayer connection conductor v3 and the interlayer connection conductor v6 of the multilayer substrate 10 is bent. There is no interlayer connection conductor in the part a2 of the second interval A2. Therefore, even if a part a2 of the second interval A2 is bent, it is difficult for the distance between the signal conductor layer 20 and the interlayer connection conductor to change in the part a2 of the second interval A2. As a result, it is difficult for the characteristic impedance of the signal conductor layer 20 to change in the part a2 of the second interval A2. Therefore, according to the multilayer substrate 10, the change in the characteristic impedance of the signal conductor layer 20 from the desired characteristic impedance (e.g., 50 Ω) is suppressed.

[0082] (d) In the multilayer substrate 10, the width of the first opening Op1 in the front-rear direction is larger than the width of the first opening Op1 in the left-right direction. That is, the first opening Op1 has a long side direction in the front-rear direction. Therefore, the first opening Op1 obstructs the flow of the unwanted propagation mode in the right direction. Also, since the width of the first opening Op1 in the left-right direction is small, the area of the first opening Op1 does not become too large. As a result, radiation noise from the first opening Op1 is suppressed. In addition, the strength of the multilayer substrate 10 can be maintained.

[0083] (e) In the multilayer substrate 10, the front end of the first opening Op1 is located at a position behind the front end of the interlayer connection conductor v2. The rear end of the first opening Op1 is located at a position in front of the rear end of the interlayer connection conductor v5. Thereby, the length of the first opening Op1 in the front-rear direction does not become too long. As a result, the strength of the second reference conductor layer 24 is less likely to become low, and breakage of the second reference conductor layer 24 is suppressed. In addition, the strength of the multilayer substrate 10 can be maintained.

[0084] (f) According to the multilayer substrate 10, generation of noise can be suppressed. More specifically, the characteristic impedance in the section including the interlayer connection conductor v11 and its front and rear is likely to vary from the desired characteristic impedance. Therefore, an unwanted propagation mode is likely to be generated in the interlayer connection conductor v11. Thereby, the unwanted propagation mode flows in the right direction in the second reference conductor layer 24 near the first reference straight line X1.

[0085] Then, the interlayer connection conductor v11 is located in the section where the interlayer connection conductors v1, v2, v4, v5, v7, and v8 are provided. Thereby, the unwanted propagation mode is suppressed from radiating outside the multilayer substrate 10 as noise by the interlayer connection conductors v1, v2, v4, v5, v7, and v8.

[0086] (First modification example)

[0087] Hereinafter, the multilayer substrate 10a according to the first modification example will be described with reference to the drawings. Figure 5 It is a top view of the insulator layer 16c.

[0088] The difference between the multilayer substrate 10a and the multilayer substrate 10 is that second openings Op2 to Op5, a third opening Op6, and fourth openings Op7 to Op10 are provided in the second reference conductor layer 24. The second opening Op2 is located diagonally left front of the first opening Op1. The second opening Op3 is located diagonally left rear of the first opening Op1. The second opening Op4 is located diagonally right front of the first opening Op1. The second opening Op5 is located diagonally right rear of the first opening Op1. Further, when viewed in the left-right direction, the front end portion of the first opening Op1 overlaps with the rear end portions of the second opening Op2 and the second opening Op4. When viewed in the left-right direction, the rear end portion of the first opening Op1 overlaps with the front end portions of the second opening Op3 and the second opening Op5. The front-back direction widths of the second openings Op2 to Op5 are each larger than the left-right direction widths of the second openings Op2 to Op5.

[0089] However, the second openings Op2 to Op5 are located between the first straight line L1 and the second straight line L2. In the present embodiment, the centers C2 to C5 in the left-right direction (X-axis direction) of the second openings Op2 to Op5 are located between the first straight line L1 and the second straight line L2. And, when viewed in the left-right direction (X-axis direction), the front-back direction (Y-axis direction) width W1 of the region where the first opening Op1 and the second openings Op2 to Op5 are present is more than half of the front-back direction (Y-axis direction) distance D60 between the rear end (the end in the negative Y-axis direction) of the interlayer connection conductor v2 (the second interlayer connection conductor) and the front end (the end in the positive Y-axis direction) of the interlayer connection conductor v5 (the fifth interlayer connection conductor).

[0090] The third opening Op6 and the fourth openings Op7 to Opl0 are located near the interlayer connection conductor v12. Moreover, the third opening Op6 has a structure that is left-right symmetric with the first opening Op1. Further, the fourth openings Op7 to Op10 have a structure that is left-right symmetric with the second openings Op2 to Op5. Therefore, the description of the structures of the third opening Op6 and the fourth openings Op7 to Op10 is omitted. Thereby, the noise generated by the interlayer connection conductor v12 is suppressed from being radiated. In addition, since there are no openings between the first straight line L1 and the straight line L4, it is possible to maintain the strength of the multilayer substrate 10a while suppressing noise leakage. Other structures of the multilayer substrate 10a are the same as those of the multilayer substrate 10, and thus the description thereof is omitted. The multilayer substrate 10a can achieve the effects of (a), (c), (d), (e), and (f).

[0091] (g)According to the multilayer substrate 10a, when viewed in the left - right direction, the width W1 in the front - rear direction of the region where the first opening Op1 and the second openings Op2 to Op5 exist is more than half of the distance D60 in the front - rear direction between the rear end of the inter - layer connection conductor v2 and the front end of the inter - layer connection conductor v5. Thus, the flow of the unwanted propagation mode propagating in the second reference conductor layer 24 is efficiently obstructed by the first opening Opl and the second openings Op2 to Op5. Therefore, the radiation of the unwanted propagation mode as noise from between the inter - layer connection conductor v2 and the inter - layer connection conductor v3 and between the inter - layer connection conductor v5 and the inter - layer connection conductor v6 is suppressed.

[0092] (h)In the multilayer substrate 10a, the third opening Op6 has a structure that is line - symmetric with the first opening Op1 with respect to the third straight line L3. In addition, the fourth openings Op7 to Op10 have a structure that is line - symmetric with the second openings Op2 to Op5 with respect to the third straight line L3. Thus, even if the unwanted propagation mode flows in the left direction in the second reference conductor layer 24 near the second reference straight line X2, the flow of the unwanted propagation mode is obstructed by the third opening Op6 and the fourth openings Op7 to Op10. Therefore, the radiation of the unwanted propagation mode as noise from between the inter - layer connection conductor v2 and the inter - layer connection conductor v3 and between the inter - layer connection conductor v5 and the inter - layer connection conductor v6 is suppressed.

[0093] (Second modified example)

[0094] Hereinafter, the multilayer substrate 10b according to the second modified example will be described with reference to the drawings. Figure 6 is an exploded perspective view of the multilayer substrate 10b. Figure 7 is a cross - sectional view of the multilayer substrate 10b.

[0095] The difference between the multilayer substrate 10b and the multilayer substrate 10 is that an opening Op30 is provided in the first reference conductor layer 22. The opening Op30 does not overlap with the first opening Op1 when viewed in the up - down direction. Thus, it is difficult for the characteristic impedance of the signal conductor layer 20 to change. In addition, since the first opening Op1 is located near the inter - layer connection conductor v11 compared to the opening Op30, the influence of noise is suppressed. Other structures of the multilayer substrate 10b are the same as those of the multilayer substrate 10, so the description thereof is omitted. The multilayer substrate 10b can achieve the effects of (a) to (f). In addition, according to the multilayer substrate 10b, the change of the characteristic impedance generated in the signal conductor layer 20 from the desired characteristic impedance is suppressed.

[0096] (Third modified example)

[0097] Hereinafter, the multilayer substrate 10c according to the third modified example will be described with reference to the drawings. Figure 8 is a top view of the insulator layer 16c.

[0098] The difference between the multi-layer substrate 10c and the multi-layer substrate 10 is that when viewed in the up-down direction, the line width w1 of the portion where the signal conductor layer 20 overlaps with the first opening Op1 is thicker than the line width w2 of the portion where the signal conductor layer 20 does not overlap with the first opening Op1. Other structures of the multi-layer substrate 10c are the same as those of the multi-layer substrate 10, so the description thereof is omitted. The multi-layer substrate 10c can achieve the effects (a) to (f).

[0099] In addition, the characteristic impedance generated in the signal conductor layer 20 is suppressed from varying from the desired characteristic impedance. More specifically, at the portion where the signal conductor layer 20 overlaps with the first opening Op1 when viewed in the up-down direction, it is difficult to form a capacitance between the signal conductor layer 20 and the second reference conductor layer 24. Therefore, the characteristic impedance generated at the portion where the signal conductor layer 20 overlaps with the first opening Op1 when viewed in the up-down direction is likely to be higher than the desired characteristic impedance.

[0100] Thus, the line width w1 of the portion where the signal conductor layer 20 overlaps with the first opening Op1 when viewed in the up-down direction is thicker than the line width w2 of the portion where the signal conductor layer 20 does not overlap with the first opening Op1 when viewed in the up-down direction. The characteristic impedance generated at the portion where the signal conductor layer 20 overlaps with the first opening Op1 when viewed in the up-down direction approaches the desired characteristic impedance.

[0101] (Fourth modification example)

[0102] Hereinafter, the multi-layer substrate 10d according to the fourth modification example will be described with reference to the drawings. Figure 9 It is a cross-sectional view of the multi-layer substrate 10d.

[0103] The difference between the multi-layer substrate 10d and the multi-layer substrate 10 is that it further includes a conductor 50. The conductor 50 is filled in the first opening Op1. The conductivity of the conductor 50 is lower than the conductivity of the second reference conductor layer 24. Other structures of the multi-layer substrate 10d are the same as those of the multi-layer substrate 10, so the description thereof is omitted. The multi-layer substrate 10d can achieve the effects (a) to (f).

[0104] (i) In the multi-layer substrate 10d, the conductor 50 is filled in the first opening Op1. Moreover, the conductivity of the conductor 50 is lower than the conductivity of the second reference conductor layer 24. Therefore, even if the unwanted propagation mode flows in the right direction in the second reference conductor layer 24, it is attenuated by the conductor 50. Therefore, the radiation of the unwanted propagation mode as noise from between the interlayer connection conductor v2 and the interlayer connection conductor v3 and between the interlayer connection conductor v5 and the interlayer connection conductor v6 is suppressed.

[0105] (i) In the multi-layer substrate 10d, the conductor 50 is filled in the first opening Op1. Thereby, the intrusion of noise from the first opening Op1 into the multi-layer substrate 10d is suppressed. In addition, the radiation of noise from the first opening Op1 to the outside of the multi-layer substrate 10d is suppressed.

[0106] (Fifth Modified Example)

[0107] Hereinafter, the multi-layer substrate 10e according to the fifth modified example will be described with reference to the drawings. Figure 10 It is a cross-sectional view of the multi-layer substrate 10e.

[0108] The difference between the multi-layer substrate 10e and the multi-layer substrate 10 is that it further includes an insulator 60 and a conductor 62. The insulator 60 is filled in the first opening Op1. The material of the insulator 60 may be the same as or different from the materials of the insulator layers 16a to 16c. In addition, the material of the insulator 60 may be the same as or different from the materials of the protective layers 18a and 18b. The conductor 62 covers the insulator 60. The conductivity of the conductor 62 is lower than the conductivity of the second reference conductor layer 24. The other structures of the multi-layer substrate 10e are the same as those of the multi-layer substrate 10, so the description thereof is omitted. The multi-layer substrate 10e can achieve the effects of (a) to (f), (i), and (i).

[0109] (Sixth Modified Example)

[0110] Hereinafter, the multi-layer substrate 10f according to the sixth modified example will be described with reference to the drawings. Figure 11 It is a top view of the insulator layer 16c.

[0111] The difference between the multi-layer substrate 10f and the multi-layer substrate 10 is that it includes a plurality of interlayer connection conductors v7 and a plurality of interlayer connection conductors v8. The plurality of interlayer connection conductors v7 (seventh interlayer connection conductors) are arranged along the signal conductor layer 20 at a position to the left (negative X-axis direction) of the interlayer connection conductor v1 (first interlayer connection conductor). The interval D7 in the left-right direction (X-axis direction) of the plurality of interlayer connection conductors v7 (seventh interlayer connection conductors) is shorter than the distance D2 in the left-right direction (X-axis direction) between the interlayer connection conductor v2 (second interlayer connection conductor) and the interlayer connection conductor v3 (third interlayer connection conductor). And, the distance D8 in the left-right direction (X-axis direction) between the interlayer connection conductor v7 (seventh interlayer connection conductor) located at the rightmost (positive X-axis direction) position among the plurality of interlayer connection conductors v7 (seventh interlayer connection conductors) and the interlayer connection conductor v1 (first interlayer connection conductor) is shorter than the distance D2 in the left-right direction (X-axis direction) between the interlayer connection conductor v2 (second interlayer connection conductor) and the interlayer connection conductor v3 (third interlayer connection conductor). The interval D7 and the distance D8 are equal to the distance D1.

[0112] A plurality of interlayer connection conductors v8 (the eighth interlayer connection conductor) are arranged along the signal conductor layer 20 at a position to the left (negative X-axis direction) of the interlayer connection conductor v4 (the fourth interlayer connection conductor). The interval D17 in the left-right direction (X-axis direction) of the plurality of interlayer connection conductors v8 (the eighth interlayer connection conductor) is shorter than the distance D12 in the left-right direction (X-axis direction) between the interlayer connection conductor v5 (the fifth interlayer connection conductor) and the interlayer connection conductor v6 (the sixth interlayer connection conductor). Moreover, the distance D18 in the left-right direction (X-axis direction) between the interlayer connection conductor v8 (the eighth interlayer connection conductor) located at the rightmost position (positive X-axis direction) among the plurality of interlayer connection conductors v8 (the eighth interlayer connection conductor) and the interlayer connection conductor v4 (the fourth interlayer connection conductor) is shorter than the distance D12 in the left-right direction (X-axis direction) between the interlayer connection conductor v5 (the fifth interlayer connection conductor) and the interlayer connection conductor v6 (the sixth interlayer connection conductor). The interval D17 and the distance D18 are equal to the distance D11.

[0113] The interlayer connection conductor v11 (the eleventh interlayer connection conductor) is located in an area surrounded by the interlayer connection conductor v1 (the first interlayer connection conductor), the interlayer connection conductor v2 (the second interlayer connection conductor), the interlayer connection conductor v4 (the fourth interlayer connection conductor), the interlayer connection conductor v5 (the fifth interlayer connection conductor), the plurality of interlayer connection conductors v7 (the seventh interlayer connection conductor), and the plurality of interlayer connection conductors v8 (the eighth interlayer connection conductor). Since other structures of the multilayer substrate 10f are the same as those of the multilayer substrate 10, the description thereof is omitted. The multilayer substrate 10f can achieve the effects (a) to (f).

[0114] (Seventh modification example)

[0115] Hereinafter, the multilayer substrate 10g according to the seventh modification example will be described with reference to the drawings. Figure 12 It is a cross-sectional view of the multilayer substrate 10g.

[0116] The difference between the multi-layer substrate 10g and the multi-layer substrate 10 is that it further includes a signal conductor layer 21, a first reference conductor layer 22a, an insulator layer 16d, and interlayer connection conductors v15 and v16. The insulator layer 16d is laminated on the insulator layer 16a. However, the insulator layer 16d is only provided at the left end portion of the multi-layer substrate 10g. The signal conductor layer 21 is located on the upper main surface of the insulator layer 16a. The interlayer connection conductor v15 penetrates the insulator layer 16a in the vertical direction. The interlayer connection conductor v15 electrically connects the left end portion of the signal conductor layer 20 to the right end portion of the signal conductor layer 21. The interlayer connection conductor v11 electrically connects the left end portion of the signal conductor layer 21 to the signal terminal 26a. Moreover, the interlayer connection conductors v11 and v15 do not overlap with the first opening Op1 when viewed in the vertical direction. The first reference conductor layer 22a is located on the upper main surface of the insulator layer 16a. The interlayer connection conductor v16 electrically connects the first reference conductor layer 22a to the first reference conductor layer 22. The other structures of the multi-layer substrate 10g are the same as those of the multi-layer substrate 10, so the description is omitted. The multi-layer substrate 10g can achieve the effects (a) to (f).

[0117] (Eighth modified example)

[0118] Hereinafter, the multi-layer substrate 10h according to the eighth modified example will be described with reference to the drawings. Figure 13 It is a top view of the insulator layer 16c.

[0119] The difference between the multi-layer substrate 10h and the multi-layer substrate 10 is that when viewed in the vertical direction, the first opening Op1 is located between the first reference line X1 and the line X3. More precisely, the first opening Op1 is located at a position to the left of the first reference line X1 and at a position to the right of the line X3. The other structures of the multi-layer substrate 10h are the same as those of the multi-layer substrate 10, so the description is omitted. The multi-layer substrate 10h can achieve the effects (a) to (f).

[0120] (Other embodiments)

[0121] The multi-layer substrate related to the present utility model is not limited to the multi-layer substrates 10, 10a to 10h, and can be changed within the scope of its gist. In addition, the structures of the multi-layer substrates 10, 10a to 10h can be arbitrarily combined.

[0122] It should be noted that in the multi-layer substrate 10a, the number of the second openings is not limited to 4. The number of the second openings can also be 1 or more and 3 or less, or 5 or more.

[0123] It should be noted that the signal conductor layer 20 can also be bent when viewed in the vertical direction. In this case, the multi-layer substrates 10, 10a to 10g include an interval where the X-axis direction is the same as the left-right direction and an interval where the X-axis direction is not the same as the left-right direction.

[0124] It should be noted that the first opening Op1 may not be provided in the second reference conductor layer 24, but in the first reference conductor layer 22. In this case, there is no conductor layer in the first opening Op1. Therefore, the first opening Op1 is different from, for example, the opening provided in the first reference conductor layer 22 for the signal terminal 26a.

[0125] It should be noted that the signal conductor layer 20 may also be bent forward or backward when viewed in the up and down direction.

[0126] It should be noted that in Figure 12 the opening Op1 may also be provided in the first reference conductor layer 22. The purpose of the multilayer substrates 10, 10a to 10h is to remove the noise caused by the capacitance formed between the reference conductor overlapping the interlayer connection conductor v11 and the interlayer connection conductor v11. Therefore, in the multilayer substrate 10g, it is sufficient that the first opening Op1 is provided in the reference conductor overlapping the interlayer connection conductor v11. Thus, it may be provided in the first reference conductor layer 22 or may be provided in the second reference conductor layer 24.

[0127] Description of Reference Numerals

[0128] 10, 10a to 10h: Multilayer substrates;

[0129] 12: Stack;

[0130] 16a to 16d: Insulator layers;

[0131] 18a, 18b: Protective layers;

[0132] 20, 21: Signal conductor layers;

[0133] 22: First reference conductor layer;

[0134] 24: Second reference conductor layer;

[0135] 26a, 26b: Signal terminals;

[0136] 50, 62: Conductors;

[0137] 60: Insulator;

[0138] A1: First interval;

[0139] A2: Second interval;

[0140] A3: Third interval;

[0141] C1 to C5: Center;

[0142] CL: Center line;

[0143] L1: The first straight line;

[0144] L2: The second straight line;

[0145] L3: The third straight line;

[0146] Op1: The first opening;

[0147] Op2 to Op5: The second opening;

[0148] Op30: The opening;

[0149] Op6: The third opening;

[0150] Op7 to Op10: The fourth opening;

[0151] P1: The first intersection point;

[0152] P2: The second intersection point;

[0153] p1: The first point;

[0154] p2: The second point;

[0155] p3: The third point;

[0156] p4: The fourth point;

[0157] v1 to v12, v15: Interlayer connection conductors.

Claims

1. A multi-layer substrate, characterized in that: The multi-layer substrate includes: A laminate having a structure in which a plurality of insulator layers are laminated in the Z-axis direction; A signal conductor layer provided on the laminate and having a linear shape extending along the X-axis direction orthogonal to the Z-axis direction; A first reference conductor layer provided on the laminate, located at a position in the positive direction of the Z-axis relative to the signal conductor layer, and overlapping the signal conductor layer when viewed in the Z-axis direction; A second reference conductor layer provided on the laminate, located at a position in the negative direction of the Z-axis relative to the signal conductor layer, and overlapping the signal conductor layer when viewed in the Z-axis direction; A first interlayer connection conductor, a second interlayer connection conductor, and a third interlayer connection conductor that electrically connect the first reference conductor layer and the second reference conductor layer, and are located at a position in the positive direction of the Y-axis orthogonal to the X-axis direction and the Z-axis direction relative to the signal conductor layer, and are arranged in sequence along the signal conductor layer toward the positive direction of the X-axis; A fourth interlayer connection conductor, a fifth interlayer connection conductor, and a sixth interlayer connection conductor that electrically connect the first reference conductor layer and the second reference conductor layer, and are located at a position in the negative direction of the Y-axis relative to the signal conductor layer, and are arranged in sequence along the signal conductor layer toward the positive direction of the X-axis; And An eleventh interlayer connection conductor that is connected to the signal conductor layer, located at a position in the positive direction of the Z-axis relative to the signal conductor layer, and penetrates through one or more of the plurality of insulator layers along the Z-axis; The distance in the X-axis direction between the second interlayer connection conductor and the third interlayer connection conductor is longer than the distance in the X-axis direction between the first interlayer connection conductor and the second interlayer connection conductor; The distance in the X-axis direction between the fifth interlayer connection conductor and the sixth interlayer connection conductor is longer than the distance in the X-axis direction between the fourth interlayer connection conductor and the fifth interlayer connection conductor; In the reference conductor layer among the first reference conductor layer and the second reference conductor layer that overlaps the eleventh interlayer connection conductor, a first opening that overlaps the signal conductor layer when viewed in the Z-axis direction is provided; When viewed in the Z-axis direction, the first opening is located at a position in the negative direction of the X-axis relative to the vicinity of a first reference line connecting the second interlayer connection conductor and the fifth interlayer connection conductor; When viewed in the Z-axis direction, the first opening is located at a position in the positive direction of the X-axis relative to the eleventh interlayer connection conductor, and no other conductor is arranged in the first opening.

2. The multi-layer substrate according to claim 1, characterized in that: Defining the intersection point of the first reference line and the center line of the signal conductor layer when viewed in the Z-axis direction as a first intersection point; Defining the intersection point of the second reference line connecting the third interlayer connection conductor and the sixth interlayer connection conductor and the center line of the signal conductor layer when viewed in the Z-axis direction as a second intersection point; The interval between the first intersection point and the second intersection point is equally divided into four parts by a first point, a second point, and a third point arranged in the positive direction of the X-axis. A point that is separated from the first intersection point by the distance between the first point and the second point in the negative direction of the X-axis is defined as a fourth point. When viewed in the Z-axis direction, the first opening is located between a first straight line and a second straight line. The first straight line passes through the first point and is orthogonal to the signal conductor layer, and the second straight line passes through the fourth point and is orthogonal to the signal conductor layer.

3. The multilayer substrate according to claim 1 or 2, wherein: The multilayer substrate further includes: A plurality of seventh interlayer connection conductors that electrically connect the first reference conductor layer and the second reference conductor layer and are located at a position on the positive Y-axis side of the signal conductor layer; A plurality of eighth interlayer connection conductors that electrically connect the first reference conductor layer and the second reference conductor layer and are located at a position on the negative Y-axis side of the signal conductor layer; And A signal terminal located on the main surface of the laminate on the positive Z-axis side, The eleventh interlayer connection conductor electrically connects the signal terminal and the signal conductor layer, The plurality of seventh interlayer connection conductors are arranged along the signal conductor layer in the negative X-axis direction as compared with the first interlayer connection conductor, The interval in the X-axis direction of the plurality of seventh interlayer connection conductors is shorter than the distance in the X-axis direction between the second interlayer connection conductor and the third interlayer connection conductor, The distance in the X-axis direction between the seventh interlayer connection conductor located at the position closest to the positive X-axis among the plurality of seventh interlayer connection conductors and the first interlayer connection conductor is shorter than the distance in the X-axis direction between the second interlayer connection conductor and the third interlayer connection conductor, The plurality of eighth interlayer connection conductors are arranged along the signal conductor layer in the negative X-axis direction as compared with the fourth interlayer connection conductor, The interval in the X-axis direction of the plurality of eighth interlayer connection conductors is shorter than the distance in the X-axis direction between the fifth interlayer connection conductor and the sixth interlayer connection conductor, The distance in the X-axis direction between the eighth interlayer connection conductor located at the position closest to the positive X-axis among the plurality of eighth interlayer connection conductors and the fourth interlayer connection conductor is shorter than the distance in the X-axis direction between the fifth interlayer connection conductor and the sixth interlayer connection conductor, The eleventh interlayer connection conductor is located in an interval surrounded by the first interlayer connection conductor, the second interlayer connection conductor, the fourth interlayer connection conductor, the fifth interlayer connection conductor, the plurality of seventh interlayer connection conductors, and the plurality of eighth interlayer connection conductors.

4. The multilayer substrate according to claim 2, wherein: No opening is provided in the interval between the first straight line and the second reference straight line.

5. The multilayer substrate according to claim 1 or 2, wherein: When viewed in the direction of the Z axis, the end of the first opening in the negative X-axis direction is located in a position closer to the positive X-axis direction than the end of the first interlayer connection conductor in the positive X-axis direction and the end of the fourth interlayer connection conductor in the positive X-axis direction.

6. The multilayer substrate according to claim 1 or 2, characterized in that the end of the first opening in the positive Y-axis direction is located in a position closer to the negative Y-axis direction than the end of the second interlayer connection conductor in the positive Y-axis direction, the end of the first opening in the negative Y-axis direction is located in a position closer to the positive Y-axis direction than the end of the fifth interlayer connection conductor in the negative Y-axis direction.

7. The multilayer substrate according to claim 1 or 2, characterized in that the width of the first opening in the Y-axis direction is larger than the width of the first opening in the X-axis direction.

8. The multilayer substrate according to claim 1 or 2, characterized in that the width of the first opening in the Y-axis direction is more than half of the distance in the Y-axis direction between the end of the second interlayer connection conductor in the negative Y-axis direction and the end of the fifth interlayer connection conductor in the positive Y-axis direction.

9. The multilayer substrate according to claim 1, characterized in that one or more second openings are provided in the second reference conductor layer, defining the intersection point of the first reference straight line and the center line of the signal conductor layer when viewed in the direction of the Z axis as the first intersection point, defining the intersection point of the second reference straight line connecting the third interlayer connection conductor and the sixth interlayer connection conductor and the center line of the signal conductor layer when viewed in the direction of the Z axis as the second intersection point, the interval between the first intersection point and the second intersection point is equally divided into four parts by the first point, the second point, and the third point arranged in the positive X-axis direction, defining the point separated from the first intersection point in the negative X-axis direction by the distance between the first point and the second point as the fourth point, the first straight line is a line passing through the first point and orthogonal to the signal conductor layer, the second straight line is a line passing through the fourth point and orthogonal to the signal conductor layer, the one or more second openings are located between the first straight line and the second straight line, when viewed in the X-axis direction, the width of the region where the first opening and the one or more second openings exist in the Y-axis direction is more than half of the distance in the Y-axis direction between the end of the second interlayer connection conductor in the negative Y-axis direction and the end of the fifth interlayer connection conductor in the positive Y-axis direction.

10. The multilayer substrate according to claim 1 or 2, characterized in that a part of the interval between the straight line connecting the second interlayer connection conductor and the fifth interlayer connection conductor and the straight line connecting the third interlayer connection conductor and the sixth interlayer connection conductor of the multilayer substrate is bent.

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