Copper-clad substrate

Abstract

The utility model discloses a copper-clad substrate, which comprises at least two copper foils and at least one aerogel composite film, the at least two copper foils are arranged at intervals along the thickness direction of the copper foils, and the aerogel composite film is arranged between the two adjacent copper foils. And the aerogel composite film is tightly combined with the copper foil through a hot-pressing composite process. According to the utility model, the aerogel composite film is used as a reinforcing material of the copper-clad substrate, and the aerogel composite film and the copper foil are compounded into the copper-clad substrate, so that the heat insulation performance of aerogel is reasonably utilized, and the heat insulation effect of the copper-clad substrate is improved; moreover, the bonding between the aerogel composite film and the copper foil is promoted by applying heat and pressure, so that the aerogel composite film and the copper foil can be tightly combined, the overall structural stability and mechanical strength are improved, the shell meets the requirements in different scenes, and therefore, the composite film can be widely applied to various electronic products.

Description

Technical Field

[0001] The utility model relates to the field of copper clad laminates, and particularly to a copper clad substrate. Background Art

[0002] As a key component in electronic and communication devices, the copper clad substrate undertakes the important functions of power conduction and signal transmission. With the rapid development of technologies in the communication field, especially the increasing application of high-operation devices such as GPUs (Graphics Processing Units) and other high-performance chips, these devices generate a large amount of heat during operation. The high temperature generated by heat dissipation not only affects the performance of the devices but may also cause premature aging or even failure of components. However, the existing copper clad laminates usually lack sufficient heat insulation ability, or sacrifice other key properties such as mechanical strength or processing performance while providing heat insulation function, thus affecting the performance of the overall composite material and making it difficult to meet the requirements in different scenarios. Summary of the Utility Model

[0003] Embodiments of the utility model provide a copper clad substrate to solve the problem that the copper clad substrate cannot balance heat insulation function, mechanical strength, and processing performance, so as to be widely applied to various electronic products.

[0004] Specifically, the utility model provides a copper clad substrate, including at least two copper foils and at least one aerogel composite film. The at least two copper foils are arranged at intervals along their thickness directions, and the aerogel composite film is arranged between two adjacent copper foils. The aerogel composite film is tightly bonded to the copper foil through a hot pressing composite process.

[0005] Optionally, the number of the copper foils is two, and the number of the aerogel composite films is one.

[0006] Optionally, the number of the copper foils is n, and the number of the aerogel composite films is n - 1; where n is a positive integer greater than or equal to 2.

[0007] The copper foils and the aerogel composite films are arranged alternately.

[0008] Optionally, the thickness of the copper foil is 0.015 mm - 0.35 mm.

[0009] And / or, the thickness of the aerogel composite film is 0.015 mm - 50 mm.

[0010] Optionally, the thickness of the copper foil is 0.015 mm - 0.14 mm.

[0011] Optionally, the thickness of the aerogel composite film is 0.015 mm - 10 mm.

[0012] Optionally, the aerogel composite film includes an aerogel body and a protective film. The protective film is disposed on both sides of the aerogel body and is connected to the copper foil.

[0013] Optionally, the thickness of the protective film is 0.01 mm - 0.4 mm.

[0014] Optionally, the protective film is a PET film.

[0015] Optionally, the copper foil is an electrolytic copper foil, a reverse copper foil, an HTE copper foil, a low-profile copper foil, or a rolled copper foil.

[0016] The beneficial effects of the present utility model are as follows:

[0017] In the copper-clad substrate provided by the present utility model, since the aerogel composite film is used as the reinforcing material of the copper-clad substrate, and the aerogel composite film and the copper foil are compounded into the copper-clad substrate, the heat insulation performance of the aerogel is reasonably utilized to improve the heat insulation effect of the copper-clad substrate; moreover, since the adhesion between the gel composite film and the copper foil is promoted by applying heat and pressure, the aerogel composite film and the copper foil can be tightly combined, thereby improving the overall structural stability and mechanical strength, and can meet the requirements in different scenarios. Therefore, it can be widely applied to various electronic products. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments of the present utility model. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 is a schematic exploded view of a copper-clad substrate in an embodiment of the present utility model;

[0020] Figure 2 is a schematic structural view of a copper-clad substrate in another embodiment of the present utility model.

[0021] In the figure: 100, copper foil; 200, aerogel composite film; 210, aerogel body; 220, protective film. Detailed Embodiments

[0022] In order to make the technical problems, technical solutions and beneficial effects solved by the present utility model clearer, the following will further describe the present utility model in detail with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0023] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality of" is two or more than two.

[0024] In the description of the present utility model, it should be noted that, unless otherwise clearly defined and limited, the terms "installation", "connection" and "coupling" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model may be understood according to specific circumstances.

[0025] Figure 1 is a schematic exploded view of a copper-clad substrate in an embodiment of the present utility model, as Figure 1 shown, and referring to Figure 2 , an embodiment of the present utility model provides a copper-clad substrate, which includes at least two copper foils 100 and at least one aerogel composite film 200. The at least two copper foils 100 are arranged at intervals along their thickness directions, and the aerogel composite film 200 is disposed between two adjacent copper foils 100. The aerogel composite film 200 is tightly bonded to the copper foil 100 through a hot pressing composite process.

[0026] In the embodiment of the present utility model, the aerogel composite film 200 is used as a reinforcing material for the copper-clad substrate, and the aerogel composite film 200 and the copper foil 100 are compounded into a copper-clad substrate, reasonably utilizing the heat insulation performance of the aerogel to improve the heat insulation effect of the copper-clad substrate; moreover, since heat and pressure are applied to promote the adhesion between the gel composite film and the copper foil 100, the aerogel composite film 200 can be tightly bonded to the copper foil 100, thereby improving the overall structural stability and mechanical strength, and meeting the requirements in different scenarios. Therefore, it can be widely applied to various electronic products.

[0027] Furthermore, since both the particle phase and pore size of the aerogel are in the nanometer range, with a quite high specific surface area and porosity, these structural features provide numerous adsorption sites for gases. Therefore, the aerogel can adsorb harmful gases such as H2S, SiO2, NO2, and CO in the air, and can also remove organic substances in the air, thereby achieving the purpose of purifying the air. After installing the copper-clad substrate in the VOC (air testing equipment), the same function can be exerted. Moreover, the dielectric constant of the aerogel is extremely low (close to that of air). Using the aerogel as the substrate material can significantly reduce the overall dielectric constant of the circuit. Materials with a low dielectric constant can effectively reduce the capacitive coupling between adjacent circuit elements, thereby effectively solving problems such as crosstalk, interconnect delay, and increased power loss that are prone to occur inside the circuit. In addition, as a material with an extremely low thermal conductivity and high porosity, the aerogel not only performs excellently in blocking infrared radiation but also can achieve a good light-transmitting effect. After applying it to the copper-clad substrate, it can effectively block infrared radiation and achieve a light-transmitting effect to effectively control the temperature during battery operation, avoid overheating, extend the battery life, and by adjusting the refractive index of the aerogel, the copper-clad substrate can be used to determine parameters such as the mass and charge of high-energy particles.

[0028] As Figure 1 shown, in an embodiment of the present invention, the number of the copper foils 100 is two, and the number of the aerogel composite films 200 is one.

[0029] In an alternative embodiment of the present invention, the number of the copper foils 100 is n, the number of the aerogel composite films 200 is n - 1, and the copper foils 100 and the aerogel composite films 200 are arranged alternately; where n is a positive integer greater than 2. Such a setting makes both sides of the copper-clad substrate be copper foils 100 for later applications. Specifically, as Figure 2 shown, the number of the copper foils 100 is four, and the number of the aerogel composite films 200 is three. One aerogel composite film 200 is arranged between every two adjacent copper foils 100.

[0030] In an embodiment of the present utility model, the thickness of the copper foil 100 is 0.015 mm - 0.35 mm. If the copper foil 100 is too thin, it may lead to problems such as increased processing difficulty, easy damage, and decreased electrical performance of the copper-clad substrate. While if the copper foil 100 is too thick, it may lead to problems such as difficult bending of the copper-clad substrate and increased cost. The thickness of the aerogel composite film 200 is 0.015 mm - 50 mm. If the aerogel composite film 200 as the substrate is too thin, it may lead to insufficient mechanical strength, poor heat dissipation performance, and easy warping of the copper-clad substrate; if the aerogel composite film 200 is too thick, it will lead to an increase in the weight of the copper-clad substrate, an increase in cost, and difficult processing. Specifically, the thickness of the copper foil 100 is 0.015 mm, 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.10 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, 0.20 mm, 0.25 mm, 0.30 mm or 0.35 mm; the thickness of the aerogel composite film 200 is 0.015 mm, 0.5 mm, 1 mm, 2 mm, 5 mm, 8 mm, 10 mm, 12 mm, 15 mm, 18 mm, 20 mm, 25 mm, 30 mm, 35 mm, 40 mm, 45 mm or 50 mm.

[0031] Preferably, the thickness of the copper foil 100 is 0.015 mm - 0.14 mm. The thickness of the aerogel composite film 200 is 0.015 mm - 10 mm.

[0032] In an embodiment of the present utility model, the aerogel composite film 200 includes an aerogel body 210 and a protective film 220. The protective film 220 is disposed on both sides of the aerogel body 210 and is connected to the copper foil 100; the protective film 220 is a PET film with a thickness of 0.01 mm - 0.4 mm.

[0033] The aerogel body 210 is an aerogel sheet in the prior art or is prepared by the following method:

[0034] Dissolve silicate and silicon dioxide in water to form a homogeneous sol. Add a certain amount of acid or base during the dissolution process to promote the reaction. Place the prepared sol at a certain temperature and humidity, and make it form a solid gel through hydrolysis, hydration or gel reaction. Place the solid gel in a dry environment for drying treatment to remove the moisture and solvent therein, obtaining a flaky aerogel body 210; the purpose of drying is to remove moisture, form a pore structure, and increase the hardness and strength of the aerogel. Heat-treat the dried aerogel at a certain temperature to enhance its mechanical properties and heat insulation properties. Coat PET (polyethylene terephthalate) on both sides of the aerogel body 210, and the PET cures to form a PET film, obtaining an aerogel composite film 200. Then bake the aerogel composite film 200 in a horizontal tunnel (five temperature zones (one zone at 80 ± 3 °C (2 minutes), one zone at 120 ± 3 °C (5 minutes), one zone at 150 ± 3 °C (10 minutes), one zone at 100 ± 3 °C (3 minutes), one zone at 30 ± 3 °C (2 minutes))).

[0035] In order to improve the surface properties of the aerogel composite film 200, perform nanometer treatment, coat functional materials, etc. on the aerogel composite film 200 to improve its corrosion resistance and oxidation resistance. Then stack copper foils 100 on both sides of the aerogel composite film 200 and perform hot pressing at a high temperature (425 °C ± 30 °C) to form a copper-clad substrate.

[0036] In an embodiment of the present invention, the copper foil 100 is an ED copper foil (electrolytic copper foil), an RTF copper foil (reverse-treated foil), an HTE copper foil (high-temperature extensible copper foil), a low-profile copper foil or a rolled copper foil.

[0037] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A copper-clad substrate, characterized in that: It comprises at least two copper foils and at least one aerogel composite film, wherein at least two of the copper foils are spaced apart in the thickness direction thereof, the aerogel composite film is arranged between two adjacent copper foils, and the aerogel composite film is tightly combined with the copper foils through a hot pressing composite process.

2. The copper-clad substrate according to claim 1, characterized in that: The number of the copper foils is n, and the number of the aerogel composite films is n-1; wherein n is a positive integer greater than or equal to 2; The copper foils and the aerogel composite films are arranged alternately.

3. The copper-clad substrate according to claim 2, characterized in that: The number of the copper foils is two, and the number of the aerogel composite film is one.

4. The copper-clad substrate according to claim 1, characterized in that: The thickness of the copper foil is 0.015mm-0.35mm; And / or, the thickness of the aerogel composite film is 0.015mm-50mm.

5. The copper-clad substrate according to claim 4, characterized in that: The thickness of the copper foil is 0.015 mm-0.14 mm.

6. The copper-clad substrate according to claim 4, characterized in that: The thickness of the aerogel composite film is 0.015 mm-10 mm.

7. The copper-clad substrate according to claim 1, characterized in that: The aerogel composite film comprises an aerogel body and a protective film, wherein the protective film is arranged on both sides of the aerogel body and connected to the copper foil.

8. The copper-clad substrate according to claim 7, characterized in that: The thickness of the protective film is 0.01 mm-0.4 mm.

9. The copper-clad substrate according to claim 7, characterized in that: The protective film is a PET film.

10. The copper-clad substrate according to claim 1, characterized in that: The copper foil is an electrolytic copper foil, a reverse copper foil, a HTE copper foil, a low-profile copper foil or a rolled copper foil.

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