Circulating liquid cooling VC vapor chamber with concave and convex points on two sides

Abstract

The utility model relates to the technical field of heat dissipation of high-power electronic devices, and discloses a circulating liquid cooling VC vapor chamber with concave and convex points on two sides, which is characterized by comprising an upper cover, a liquid inlet is arranged at one end of the upper cover, and a liquid outlet is arranged at the other end of the upper cover; the heat exchange substrate is located below the upper cover, a cavity formed by welding the heat exchange substrate and the upper cover is a first cavity, and the first cavity is used for injecting a liquid medium; a plurality of convex points and concave points which are integrally formed are arranged on the upper surface and the lower surface of the heat exchange substrate; the convex points on the upper surface of the heat exchange substrate and the concave points on the lower surface of the heat exchange substrate are formed in a one-to-one correspondence mode, and the convex points on the lower surface of the heat exchange substrate and the concave points on the upper surface of the heat exchange substrate are formed in a one-to-one correspondence mode. The lower cover is located below the heat exchange substrate, a cavity defined by welding the lower cover and the heat exchange substrate is a second cavity, the second cavity is a vacuum cavity filled with a liquid medium, and the outer wall of the lower cover makes contact with a heating source. According to the technical scheme, the heat conduction efficiency is improved, and the manufacturing cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of high-power electronic devices, and relates to a circulating liquid-cooled VC heat spreader with concave and convex points on both sides. Background Technique

[0002] The traditional VC liquid-cooled heat dissipation technology adopts the VC (Vapor Chamber) vacuum chamber heat spreader technology, which is similar to a heat pipe in principle but different in the conduction mode. The heat pipe conducts heat in a one-dimensional linear manner, while the heat in the vacuum chamber heat spreader conducts on a two-dimensional plane, so the efficiency is higher. VC liquid cooling (vacuum chamber heat spreader technology, English name Vapor Chamber) is also called a heat equalizing plate, a heat spreader, etc., and is a highly efficient way to transfer heat. It was first provided by a Celsia heat dissipation manufacturer as a heat dissipation solution for AMD high-end graphics cards to replace heat pipe heat dissipation. For example, in a copper mesh heat spreader, the heat spreader base that needs to dissipate heat is heated when it comes into contact, and the heat source heats the copper mesh micro evaporator to absorb heat; the coolant (pure water) quickly evaporates into hot air (<104 Tor or less) under a vacuum ultra-low pressure environment - absorbing heat; the vapor chamber is designed with a vacuum, and the hot air circulates more quickly and conducts heat in the copper mesh micro environment; the hot air rises due to heat and dissipates heat after encountering the cold source at the upper part of the heat spreader and condenses back into a liquid again - dissipating heat; the condensed coolant flows back to the evaporation source at the bottom of the heat spreader through the capillary pipes of the copper micro structure, and the recycled coolant is vaporized again after being heated by the evaporator and absorbs heat, conducts heat, and dissipates heat through the copper mesh micro tubes, and so on. This is the second-generation cold liquid technology for a chamber. A simple heat spreader is composed of structures such as an upper sheet, a copper mesh, and a lower sheet, which are welded after being filled with water and evacuated, and then one end is in contact with the heat source and the other end is in contact with the low-temperature source to achieve fixed liquid-gas heat exchange and reduce heat. Obviously, the foregoing structure has the following disadvantages: on the one hand, because the contact space at both ends is limited and the heat exchange surface is small, the heat exchange efficiency is low; on the other hand, the heat exchange time is short, and when the user's usage frequency and duration are high, the heat dissipation is not timely, and the external experience is "hot".

[0003] With the development of vacuum heat dissipation technology, three-dimensional heat spreader has become the representative of the third generation of vacuum heat dissipation technology, which can achieve heat dissipation in three-dimensional space. Its structure generally includes a vacuum cavity with a capillary structure on the metal inner wall. When the heat generated by the device is conducted from the device surface to the VC evaporation zone, the working fluid in the cavity is heated to produce steam under a certain vacuum degree. The process is accompanied by rapid volume expansion. The vapor phase working fluid flows rapidly to the entire cavity under the action of a small pressure difference. When the vapor phase working medium contacts an environment slightly lower than the vapor phase change saturation temperature, a phase change condensation phenomenon of saturated steam will occur. The heat absorbed during evaporation is released through the condensation phenomenon. The condensed coolant will be transmitted back to the heat source evaporation zone through the capillary structure. This operation will be repeated in the cavity. For example, the patent number is ZL202222366950.9, and the name is a three-dimensional heat dissipation device, which includes a heat spreader and a heat pipe. Among them, the temperature equalizer is a hollow structure with a first cavity inside, and a first capillary structure is arranged on the inner wall of the temperature equalizer. The first surface of the temperature equalizer away from the heat source is recessed downward to form a mounting hole; the heat pipe is plugged and fixed in the mounting hole, and the heat pipe is a hollow structure with a second cavity inside, and a second capillary structure is arranged on the inner wall of the heat pipe; the first cavity and the second cavity are independent of each other, and both the first cavity and the second cavity are filled with working liquid. Working process: the bottom of the temperature equalizer is in contact with the heat source, and the heat is transferred to the working liquid in the first cavity through the bottom wall of the temperature equalizer. The working liquid is gasified and converted into steam, and the heat is transferred to the heat pipe. The liquid in the second cavity is gasified and converted into steam and transferred to the surrounding walls of the first cavity and the second cavity. The heat is extracted through the surrounding walls, and the liquid flows back through the capillary structure. The patent also discloses the connection method of the temperature equalizer and the heat pipe by welding. The three-dimensional heat dissipation method of the patent uses two separate chambers to generate hot vapor from the working liquid during the heat conduction process, and then extracts the heat to the outside. This patent obviously has the following defects. On the one hand, the heat conduction between the multiple second chambers and the first chamber is transferred through the contact surface between the heat pipe bodies. The contact area is small and the heat transfer efficiency is low. In addition, on the heat exchange surface, the contact surface between the steam surface in the first chamber and the working fluid in the second chamber is a circular tube point contact, which fails to maximize the utilization of the temperature equalizing plate surface; causing part of the heat to radiate back to the heat source side; secondly, the temperature equalizing plate and the heat pipe are welded and connected, the sealing is poor, and the process is more complicated.

[0004] Before applying for this patent, our company's researchers applied for a patent named "A circulating liquid-cooled VC heat spreader with an S-shaped flow channel". The design of the heat spreader is to fully exchange heat by extending the length of the liquid flow channel and expanding the contact area. Although the thermal conductivity and heat dissipation effect are efficient, the structure is relatively complex, the manufacturing process is relatively complex, and the cost is relatively high. In order to meet the market demand, this application designs a simpler and easier-to-process heat spreader based on the researchers' aforementioned research. Utility Model Content

[0005] Based on this, it is necessary to provide a circulating liquid-cooled VC heat pipe with concave and convex points on both sides to address the above technical problems. This heat pipe increases the heat exchange area and uses three-dimensional heat exchange, which is not only easy to process but also has good heat conduction effects.

[0006] The technical solution of the present utility model is as follows: A circulating liquid-cooled VC heat pipe with concave and convex points on both sides, characterized by comprising

[0007] An upper cover, with a liquid inlet at one end and a liquid outlet at the other end.

[0008] A heat exchange substrate, located below the upper cover. The cavity formed by welding with the upper cover is the first chamber, which is used for injecting a liquid medium. A number of integrally formed convex points and concave points are provided on both the upper surface and the lower surface of the heat exchange substrate.

[0009] The convex points on the upper surface of the heat exchange substrate correspond one-to-one with the concave points on the lower surface, and the convex points on the lower surface of the heat exchange substrate correspond one-to-one with the concave points on the upper surface.

[0010] A lower cover, located below the heat exchange substrate. The chamber surrounded by welding with the heat exchange substrate is the second chamber, which is a vacuum chamber filled with a liquid medium. The outer wall of the lower cover is in contact with the heat source.

[0011] Further, the concave points and convex points provided on the upper surface and the lower surface of the heat exchange substrate are evenly distributed in a staggered and orderly manner.

[0012] Further, a number of the concave points and convex points are evenly and staggeredly arranged on the upper surface and the lower surface of the heat exchange substrate, and are evenly distributed on the upper surface and the lower surface of the heat exchange substrate to form a number of columns and a number of rows.

[0013] Further, the convex points can be selected from one or a combination of two of a hollow semi-ellipsoid, a sphere, and a cylinder.

[0014] Further, the first chamber is formed by welding the upper cover with the convex points on the upper surface of the heat exchange substrate.

[0015] Further, the second chamber is formed by welding the lower cover with the convex points on the lower surface of the heat exchange substrate.

[0016] Further, capillary structures are provided on the upper and lower covers, the convex points, the concave points, and the upper and lower surfaces of the heat exchange substrate.

[0017] Beneficial effects:

[0018] By respectively arranging corresponding bumps and depressions in the circulating water cooling cavity and the vacuum vapor chamber (the first chamber and the second chamber), the surface area of contact between the two chambers is greatly increased. On the one hand, the surface area of contact between the heat transfer medium (such as liquid water) and the heat transfer substrate in the first chamber during circulation in the first chamber is increased. On the other hand, the vapor formed by heating in the second chamber can diffuse uniformly in the second chamber along the bumps or depressions, expanding the heat transfer surface between the heat transfer medium in the first chamber and the vapor formed in the vapor chamber, improving the heat conduction and heat dissipation efficiency, and achieving the purpose of three-dimensional efficient heat transfer.

[0019] The heat transfer substrate of this structure is simple in structure, easy to form and process, convenient for welding, and reduces the cost of the heat pipe. Brief Description of the Drawings

[0020] Figure 1 is a schematic diagram of the overall structure decomposition of the present invention;

[0021] Figure 2 is a cross-sectional view after welding of the present invention;

[0022] Figure 3 is a schematic diagram of the heat transfer substrate of the present invention.

[0023] In the figure: 1 - upper cover; 2 - heat transfer substrate; 3 - lower cover; 11 - liquid inlet; 12 - liquid outlet; 21 - bump; 22 - depression; 23 - first chamber; 24 - second chamber. Detailed Description of the Embodiment

[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0025] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0026] Embodiment 1

[0027] As Figures 1 to 3A circulating liquid-cooled VC vapor chamber with concave and convex points on both sides is shown, including an upper cover 1. An inlet 11 is provided at one end of the upper cover, and an outlet 12 is provided at the other end. A heat exchange substrate 2 is located below the upper cover 1. The cavity formed by welding with the upper cover 1 is the first chamber 23, which is used to inject a liquid medium. A number of integrally formed convex points 21 and concave points 22 are provided on both the upper surface and the lower surface of the heat exchange substrate 2. The convex points 21 on the upper surface of the heat exchange substrate 2 correspond one-to-one with the concave points 22 on the lower surface, and the convex points 21 on the lower surface of the heat exchange substrate correspond one-to-one with the concave points 22 on the upper surface. That is to say, the convex points 21 on the upper surface or the lower surface are concave points 22 on the lower surface or the upper surface. It is equivalent that after the convex points bulge on one side of the surface of the heat exchange substrate, a groove is formed on the other side surface, and this groove structure is the concave point 22. A lower cover 3 is located below the heat exchange substrate 3. The chamber surrounded by welding with the heat exchange substrate 3 is the second chamber 24, which is a vacuum chamber filled with a liquid medium, and the outer wall of the lower cover 3 is in contact with the heat source.

[0028] By respectively arranging corresponding convex points and concave points on the upper and lower surfaces of the heat exchange substrate, the contact surface area between the first chamber and the second chamber is greatly increased. On the one hand, the contact surface area between the heat-conducting medium, such as water, and the heat exchange substrate of the first chamber during the flow in the first chamber is increased. On the other hand, the vapor formed by heating in the second chamber can diffuse uniformly in the second chamber along the convex points or concave points, expanding the heat exchange surface between the heat-conducting medium in the first chamber and the vapor formed in the vacuum vapor chamber, improving the heat conduction and heat dissipation efficiency, and achieving the purpose of three-dimensional efficient heat exchange. And because the convex points and concave points on the surface of the above-mentioned heat exchange substrate are easy to process and manufacture, the cost is reduced.

[0029] In this embodiment, the concave points 22 and convex points 21 provided on the upper surface and the lower surface of the heat exchange substrate 2 are distributed in an orderly and uniform staggered manner.

[0030] In this embodiment, a number of concave points 22 and convex points 21 are evenly and staggeredly arranged on the upper surface and the lower surface of the heat exchange substrate 2, and are evenly distributed on the upper surface and the lower surface of the heat exchange substrate 2 to form a number of columns and a number of rows.

[0031] In this embodiment, the convex point 21 can be selected from one or a combination of two of a hollow semi-ellipsoid, a sphere, and a cylinder. That is to say, the corresponding concave points are semi-ellipsoidal grooves, hemispherical grooves, and cylindrical grooves.

[0032] In this embodiment, the first chamber 23 is formed by welding the upper cover 1 with the convex points 21 on the upper surface of the heat exchange substrate 2.

[0033] In this embodiment, the second chamber 24 is formed by welding the lower cover 3 with the convex points 21 on the lower surface of the heat exchange substrate 2.

[0034] In this embodiment, the upper cover 1 , the lower cover 3 , the protrusions 21 , the concave points 22 , and the upper and lower surfaces of the heat exchange substrate 2 are all provided with capillary structures (not shown in the figure).

[0035] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A circulating liquid cooling VC heat sink with concave and convex points on both sides, characterized in that: include An upper cover (1), wherein a liquid inlet (11) is provided at one end of the upper cover (1) and a liquid outlet (12) is provided at the other end; A heat exchange substrate (2) is located below the upper cover (1); a cavity formed by welding with the upper cover (1) is a first chamber (23); the first chamber (23) is used to inject a liquid medium; a plurality of integrally formed convex points (21) and concave points (22) are provided on the upper surface and the lower surface of the heat exchange substrate (2); The convex points (21) on the upper surface of the heat exchange substrate (2) and the concave points (22) on the lower surface are formed in a one-to-one correspondence, and the convex points (21) on the lower surface of the heat exchange substrate (2) and the concave points (22) on the upper surface are formed in a one-to-one correspondence; The lower cover (3) is located below the heat exchange substrate (2), and the chamber enclosed by welding with the heat exchange substrate (2) is the second chamber (24). The second chamber (24) is a vacuum chamber filled with a liquid medium, and the outer wall of the lower cover (3) is in contact with the heat source.

2. A circulating liquid cooling VC heat spreader with concave and convex points on both sides as claimed in claim 1, characterized in that: The concave points (22) and convex points (21) arranged on the upper surface and the lower surface of the heat exchange substrate (2) are staggered, orderly and evenly distributed.

3. A circulating liquid cooling VC heat spreader with concave and convex points on both sides as claimed in claim 2, characterized in that: A plurality of the concave points (22) and the convex points (21) are evenly and alternately arranged on the upper surface and the lower surface of the heat exchange substrate (2), and are evenly distributed on the upper surface and the lower surface of the heat exchange substrate (2) to form a plurality of columns and a plurality of rows.

4. A circulating liquid cooling VC heat spreader with concave and convex points on both sides as claimed in claim 3, characterized in that: The convex point (21) can be selected to be one or a combination of a hollow semi-ellipsoidal shape, a spherical shape and a cylindrical shape.

5. A circulating liquid cooling VC heat spreader with concave and convex points on both sides as claimed in claim 4, characterized in that: The first chamber (23) is formed by welding the upper cover (1) and the protrusions (21) on the upper surface of the heat exchange substrate (2).

6. A circulating liquid cooling VC heat spreader with concave and convex points on both sides as claimed in claim 5, characterized in that: The second chamber (24) is formed by welding the lower cover (3) and the protrusions (21) on the lower surface of the heat exchange substrate (2).

7. A circulating liquid cooling VC vapor chamber with concave and convex points on both sides as described in any one of claims 1 to 6, characterized in that: The upper cover, the lower cover, the convex points, the concave points, and the upper and lower surfaces of the heat exchange substrate are all provided with capillary structures.

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