Bionic micro-channel radiator assembly

Abstract

The utility model provides a bionic micro-channel radiator assembly, which relates to the technical field of bionic micro-channel radiators and comprises a radiating shell, an inner circuit board arranged at the bottom of an inner cavity of the radiating shell, an outer circuit board arranged on the side face of the radiating shell, a heat conduction mechanism arranged on the inner side of the radiating shell, and a radiating mechanism arranged on the top of the heat conduction mechanism. The heat-conducting mechanism is located at the top of the inner circuit board. The cooling groove is used for storing cooling liquid, the top of the cooling groove is sealed under the action of the sealing cover plate, the cooling liquid is prevented from leaking outwards, the cooling liquid can cool the heat dissipation shell, the inner circuit board and the outer circuit board are further cooled, the heat conduction mechanism is used for guiding out heat generated by the inner circuit board, and the heat dissipation efficiency is improved. Heat generated by the inner circuit board is rapidly conducted out, the heat conduction efficiency of the inner circuit board is improved, the heat dissipation mechanism is arranged to dissipate heat of the heat conduction mechanism, the heat conducted out by the heat conduction mechanism is taken away through the cooling liquid, and the heat dissipation effect of the inner circuit board is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of bionic microchannel radiators, and more particularly, to a bionic microchannel radiator assembly. Background Technique

[0002] The bionic microchannel radiator is an efficient thermal management technology inspired by nature, which mimics the fine vascular system in organisms or the vein structure of plants. This design uses tiny channels to increase the surface area, thereby improving the heat transfer efficiency. Compared with traditional radiators, the microchannel radiator can more effectively remove heat from heat sources (such as high-performance electronic devices, LED lights, or electric vehicle batteries).

[0003] When the bionic microchannel radiator dissipates heat from the circuit board, since the circuit board is installed inside the bionic microchannel radiator and the contact area with the bionic microchannel radiator is limited, the heat dissipation effect of the circuit board is not good, which easily causes the circuit board to overheat during use and affects the normal use of the circuit. Summary of the Utility Model

[0004] The main purpose of the utility model is to provide a bionic microchannel radiator assembly, which can effectively solve the problems raised in the background technique.

[0005] To achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0006] A bionic microchannel radiator assembly includes a heat dissipation shell. The bottom of the inner cavity of the heat dissipation shell is provided with an inner circuit board. The side of the heat dissipation shell is provided with an outer circuit board. The inner side of the heat dissipation shell is provided with a heat conduction mechanism. The top of the heat conduction mechanism is provided with a heat dissipation mechanism. The heat conduction mechanism is located on the top of the inner circuit board. The top of the heat dissipation shell is provided with a cooling groove, and the top of the cooling groove is provided with a sealing cover plate.

[0007] Preferably, the heat conduction mechanism includes a heat conduction plate. The top of the heat conduction plate is fixedly installed with evenly distributed heat conduction tubes. The top of the heat conduction tubes is fixedly installed with a heat dissipation frame.

[0008] Preferably, the bottom of the heat conduction plate is provided with a groove. The inside of the groove is provided with heat conduction silicone grease. The bottom of the heat conduction silicone grease is attached to the top of the inner circuit board.

[0009] Preferably, the heat dissipation mechanism includes a box body. The front and back of the box body are both provided with a first communication groove. The box body is communicated with the cooling groove. The top of the box body is fixedly installed with a heat conduction housing. The top of the box body is provided with a second communication groove. The box body is communicated with the heat conduction housing through the second communication groove. The arc surface of the heat conduction housing is provided with evenly distributed aluminum heat dissipation fins.

[0010] Preferably, the top of the heat pipe extends to the inside of the box, and the heat dissipation frame is located inside the box.

[0011] Preferably, a convex plate is fixedly mounted on the inner wall of the heat dissipation shell, a spring is fixedly mounted on the bottom of the convex plate, and the bottom of the spring is fixedly connected to the top of the box body.

[0012] Preferably, a corrugated hose is provided on the front and back of the box body, and both ends of the corrugated hose are respectively connected to the first connecting groove and the interior of the cooling groove.

[0013] Preferably, the aluminum heat sink has a corrugated shape.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] A cooling groove is provided for storing coolant, and the top of the cooling groove is closed under the action of a sealing cover plate to prevent leakage of the coolant. The coolant will cool the heat dissipation shell, and further cool the inner circuit board and the outer circuit board. A heat conducting mechanism is provided to conduct the heat generated by the inner circuit board, and the heat generated by the inner circuit board is quickly conducted away, thereby improving the thermal conduction efficiency of the inner circuit board. A heat dissipation mechanism is provided to dissipate the heat from the heat conducting mechanism, and the heat conducted by the heat conducting mechanism is taken away by the coolant, thereby improving the heat dissipation effect on the inner circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a three-dimensional schematic diagram of the heat conduction mechanism and the heat dissipation mechanism in the utility model;

[0018] Figure 3 A three-dimensional schematic diagram of the local structure of the heat conduction mechanism in the utility model Figure 1 ;

[0019] Figure 4 A three-dimensional schematic diagram of the local structure of the heat conduction mechanism in the utility model Figure 2 ;

[0020] Figure 5 It is a schematic diagram of the cross-sectional structure of the heat dissipation mechanism in the utility model.

[0021] In the figure: 1. heat dissipation shell; 2. heat conduction mechanism; 201. heat conduction plate; 202. heat conduction pipe; 203. heat dissipation frame; 204. groove; 205. thermal grease; 206. convex plate; 207. spring; 3. heat dissipation mechanism; 301. box body; 302. first connecting groove; 303. second connecting groove; 304. heat conduction shell; 305. aluminum heat sink; 4. inner circuit board; 5. cooling groove; 6. sealing cover plate; 7. outer circuit board. DETAILED DESCRIPTION

[0022] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] like Figure 1 As shown in FIG. 2 , a bionic microfluidic heat sink assembly comprises a heat sink shell 1, an inner circuit board 4 is arranged at the bottom of the inner cavity of the heat sink shell 1, an outer circuit board 7 is arranged on the side of the heat sink shell 1, a heat conducting mechanism 2 is arranged on the inner side of the heat sink shell 1, a heat dissipation mechanism 3 is arranged on the top of the heat conducting mechanism 2, the heat conducting mechanism 2 is located on the top of the inner circuit board 4, a cooling groove 5 is opened on the top of the heat sink shell 1, and a sealing cover plate 6 is arranged on the top of the cooling groove 5.

[0024] The effects achieved by the above components are as follows: by setting a cooling groove 5 for storing coolant, the top of the cooling groove 5 is closed under the action of the sealing cover plate 6 to prevent the coolant from leaking out, the coolant will cool the heat dissipation shell 1, and further cool the inner circuit board 4 and the outer circuit board 7. By setting a heat conducting mechanism 2 for conducting away the heat generated by the inner circuit board 4, and allowing the heat generated by the inner circuit board 4 to be quickly conducted away, the heat conduction efficiency of the inner circuit board 4 is improved, and by setting a heat dissipation mechanism 3 for dissipating the heat from the heat conducting mechanism 2, the heat conducted away by the heat conducting mechanism 2 is taken away by the coolant, thereby improving the heat dissipation effect on the inner circuit board 4.

[0025] like Figure 3 As shown in FIG. 4 , the heat-conducting mechanism 2 includes a heat-conducting plate 201 , and evenly distributed heat-conducting pipes 202 are fixedly installed on the top of the heat-conducting plate 201 , and a heat-dissipating frame 203 is fixedly installed on the top of the heat-conducting pipes 202 .

[0026] The effect achieved by the above components is: a heat conducting plate 201 is provided to absorb the heat generated by the inner circuit board 4, and the heat is conducted to the heat dissipation frame 203 through the heat conducting pipe 202. The heat dissipation frame 203 dissipates the heat, so that the coolant absorbs the dissipated heat, thereby improving the heat dissipation effect of the inner circuit board 4.

[0027] As shown Figure 4 in the figure, a groove 204 is formed at the bottom of the heat conduction plate 201, a heat conduction silicone grease 205 is arranged inside the groove 204, and the bottom of the heat conduction silicone grease 205 is attached to the top of the inner circuit board 4.

[0028] The effects achieved by the above components are as follows: by providing the groove 204 to limit the heat conduction silicone grease 205, the heat conduction efficiency between the heat conduction plate 201 and the inner circuit board 4 is improved under the action of the heat conduction silicone grease 205, so that the heat generated by the inner circuit board 4 can be quickly exported, and the heat dissipation effect of the inner circuit board 4 is improved.

[0029] As shown Figure 5 in the figure, the heat dissipation mechanism 3 includes a box body 301. First communication grooves 302 are formed on both the front and back surfaces of the box body 301. The box body 301 is communicated with the cooling groove 5. A heat conduction shell body 304 is fixedly installed on the top of the box body 301. A second communication groove 303 is formed on the top of the box body 301. The box body 301 is communicated with the heat conduction shell body 304 through the second communication groove 303. Aluminum heat dissipation fins 305 are evenly distributed on the arc surface of the heat conduction shell body 304.

[0030] The effects achieved by the above components are as follows: by providing the box body 301 and the heat conduction shell body 304 to store the coolant, when the heat conduction mechanism 2 conducts the heat generated by the inner circuit board 4 into the box body 301, the coolant absorbs the heat and causes its own temperature to rise. The aluminum heat dissipation fins 305 dissipate heat and cool the rising coolant, improving the heat dissipation effect of the coolant on the heat conduction mechanism 2 and further improving the heat dissipation effect on the inner circuit board 4.

[0031] As shown Figure 5 in the figure, the top of the heat conduction pipe 202 extends into the box body 301, and the heat dissipation frame 203 is located inside the box body 301.

[0032] As shown Figure 5 in the figure, a convex plate 206 is fixedly installed on the inner wall of the heat dissipation shell 1. A spring 207 is fixedly installed at the bottom of the convex plate 206. The bottom of the spring 207 is fixedly connected to the top of the box body 301.

[0033] The effects achieved by the above components are as follows: by providing the convex plate 206 to fix the spring 207, under the action of the spring 207, an elastic force is applied to the box body 301, and then the box body 301 is extruded, so that the heat conduction silicone grease 205 at the bottom of the heat conduction plate 201 is closely attached to the inner circuit board 4, avoiding poor attachment effect between the heat conduction silicone grease 205 and the inner circuit board 4 and increasing the thermal resistance, thereby improving the heat conduction efficiency of the heat conduction mechanism 2.

[0034] As shown Figure 2 and Figure 5As shown, a corrugated hose is provided on the front and back of the box body 301, and both ends of the corrugated hose are respectively connected to the first connecting groove 302 and the inside of the cooling groove 5.

[0035] The effect achieved by the above components is: by setting a corrugated hose to connect the cooling groove 5 and the box body 301, the coolant inside the cooling groove 5 enters the inside of the box body 301, and then the coolant quickly takes away the heat exported by the heat conduction mechanism 2, thereby improving the heat dissipation effect on the internal circuit board 4.

[0036] like Figure 5 As shown, the aluminum heat sink 305 has a corrugated shape.

[0037] The effect achieved by the above components is: by setting the aluminum heat sink 305 to be corrugated to increase the heat dissipation area of ​​the aluminum heat sink 305, the heat dissipation effect of the aluminum heat sink 305 is improved, and then the heat dissipation effect of the internal circuit board 4 is improved.

[0038] The working principle of a bionic microfluidic radiator assembly:

[0039] The heat conducting plate 201 absorbs the heat generated by the inner circuit board 4 and conducts it to the heat dissipation frame 203 through the heat conducting pipe 202. The heat dissipation frame 203 dissipates the heat, so that the coolant absorbs the dissipated heat, thereby improving the heat dissipation effect on the inner circuit board 4. When the heat conducting mechanism 2 introduces the heat generated by the inner circuit board 4 into the box body 301, the coolant absorbs the heat and increases its own temperature. The aluminum heat sink 305 dissipates the heat and cools the rising coolant, thereby improving the heat dissipation effect of the coolant on the heat conducting mechanism 2, and further improving the heat dissipation effect on the inner circuit board 4.

[0040] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made on the basis of the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the protection scope of the present invention.

Claims

1. A bionic microfluidic channel heat sink assembly, comprising a heat sink shell (1), characterized in that: An inner circuit board (4) is arranged at the bottom of the inner cavity of the heat dissipation shell (1), an outer circuit board (7) is arranged on the side of the heat dissipation shell (1), a heat conduction mechanism (2) is arranged on the inner side of the heat dissipation shell (1), a heat dissipation mechanism (3) is arranged on the top of the heat conduction mechanism (2), the heat conduction mechanism (2) is located on the top of the inner circuit board (4), a cooling groove (5) is opened on the top of the heat dissipation shell (1), and a sealing cover plate (6) is arranged on the top of the cooling groove (5).

2. The bionic microchannel heat sink assembly according to claim 1, characterized in that: The heat conduction mechanism (2) comprises a heat conduction plate (201), the top of the heat conduction plate (201) is fixedly mounted with evenly distributed heat conduction pipes (202), and the top of the heat conduction pipes (202) is fixedly mounted with a heat dissipation frame (203).

3. The bionic microchannel heat sink assembly according to claim 2, characterized in that: The bottom of the heat conducting plate (201) is provided with a groove (204), the interior of the groove (204) is provided with heat conducting silicone grease (205), and the bottom of the heat conducting silicone grease (205) is in contact with the top of the inner circuit board (4).

4. The bionic microchannel heat sink assembly according to claim 1, characterized in that: The heat dissipation mechanism (3) comprises a box body (301), the front and back sides of the box body (301) are both provided with a first connecting groove (302), the box body (301) is connected to the cooling groove (5), a heat-conducting shell (304) is fixedly installed on the top of the box body (301), a second connecting groove (303) is provided on the top of the box body (301), the box body (301) and the heat-conducting shell (304) are connected via the second connecting groove (303), and the arc surface of the heat-conducting shell (304) is provided with evenly distributed aluminum heat sinks (305).

5. The bionic microchannel heat sink assembly according to claim 2, characterized in that: The top of the heat conducting pipe (202) extends to the interior of the box (301), and the heat dissipation frame (203) is located inside the box (301).

6. The bionic microchannel heat sink assembly according to claim 1, characterized in that: A convex plate (206) is fixedly mounted on the inner wall of the heat dissipation shell (1), a spring (207) is fixedly mounted on the bottom of the convex plate (206), and the bottom of the spring (207) is fixedly connected to the top of the box body (301).

7. The bionic microchannel heat sink assembly according to claim 4, characterized in that: The front and back sides of the box body (301) are both provided with corrugated hoses, and the two ends of the corrugated hoses are respectively connected to the first connecting groove (302) and the inside of the cooling groove (5).

8. The bionic microchannel heat sink assembly according to claim 4, characterized in that: The aluminum heat sink (305) has a corrugated shape.

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