Heat dissipation structure of modular power supply

Abstract

The utility model discloses a heat dissipation structure of a modularized power supply, which comprises a heat dissipation fan, a plurality of fixed clapboards and a heat dissipation block, the plurality of fixed clapboards are arranged on a power supply box body in parallel at intervals, heat dissipation through holes are arranged on the fixed clapboards, and the heat dissipation fan is arranged close to the fixed clapboards on one side of the power supply box body. A plurality of heat dissipation blocks are arranged between every two adjacent fixed partition plates side by side, heat dissipation channels are formed in the heat dissipation blocks, and the heat dissipation channels in the heat dissipation blocks arranged side by side are communicated through heat dissipation through holes to form a fan hot air channel. The power supply module has the advantages that the heat dissipation channels on the heat dissipation blocks in the power supply box body are communicated through the heat dissipation through holes on the fixed partition plate to form a fan-out air duct, so that the air duct in the power supply module circulates, and the heat dissipation capability of the power supply module is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, and particularly to a heat dissipation structure for a modular power supply. Background Art

[0002] With the development of technology, the applications of power semiconductor IGBT and MOSFET modules have been gradually popularized. During the device R & D process, manufacturing process and before application, it is necessary to evaluate their reliability. During the testing process, different power conditions need to be applied to the device under test to measure its performance under specific power conditions, such as insulation ability and conduction loss and other information.

[0003] In conventional testing, there is a test called conduction voltage drop test. The method is to apply a given current to the device under test and measure the voltage difference generated on the device under test when the current flows through it. Since the current in this test is very large (1000A - 4000A) and the test time is very short (usually 500 - 1000uS), a special power supply is required to provide this current. And this special modular power supply will generate a large amount of heat during testing. Due to the small volume of the modular power supply and the non - circulation of the internal channels, it is difficult to dissipate heat inside the power supply. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is how to improve the heat dissipation ability of the modular power supply.

[0005] To solve the above - mentioned technical problem, the utility model provides the following technical solutions:

[0006] A heat dissipation structure for a modular power supply, including a heat dissipation fan, fixed partitions, and heat dissipation blocks. A plurality of fixed partitions are arranged in parallel at intervals on the power supply box body. Heat dissipation through - holes are opened on the fixed partitions. The heat dissipation fan is arranged on the fixed partition close to one side of the power supply box body. A plurality of heat dissipation blocks are arranged side by side between adjacent fixed partitions. Heat dissipation channels are provided on the heat dissipation blocks. The heat dissipation channels on the juxtaposed heat dissipation blocks are connected through the heat dissipation through - holes to form a fan - heated air duct.

[0007] The heat dissipation channels on the heat dissipation blocks in the power supply box body are connected through the heat dissipation through - holes on the fixed partitions to form a fan - heated air duct. The heat dissipation fan is turned on, and the cooling air flow is inhaled into the heat dissipation channel of one side of the heat dissipation block to absorb heat, and then enters the heat dissipation channel on the other side after passing through the heat dissipation through - hole to absorb heat again and is discharged from the heat dissipation through - hole on the outermost fixed partition, so that the internal air duct of the power module is circulated, and the heat dissipation ability of the power module is improved.

[0008] Preferably, an installation groove for installing a PCB board is further opened on the fixed partition.

[0009] Preferably, the heat dissipation block is fixed on the PCB board.

[0010] Preferably, the number of the fixed partitions is three, which are respectively arranged on both sides and in the middle of the power supply box body.

[0011] Preferably, the heat dissipation block is made of aluminum alloy profile.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0013] The heat dissipation through holes on the fixed partition communicate with the heat dissipation channels on the heat dissipation block in the power supply box body to form a hot air duct. The heat dissipation fan is turned on, and the cooling air flow is sucked into the heat dissipation channels of one side heat dissipation block to absorb heat, and then enters the heat dissipation channels of the other side after passing through the heat dissipation through holes to absorb heat again, and then is discharged from the heat dissipation through holes on the outermost fixed partition, so that the air duct inside the power module circulates, and the heat dissipation capacity of the power module is improved. Description of the Drawings

[0014] Figure 1 It is a partial structural schematic diagram of an embodiment of the present utility model;

[0015] Figure 2 It is another partial structural schematic diagram of an embodiment of the present utility model;

[0016] Figure 3 It is Figure 2 The enlarged view of A in Detailed Embodiments

[0017] For the convenience of those skilled in the art to understand the technical solution of the present utility model, the technical solution of the present utility model will be further described below in conjunction with the accompanying drawings of the specification.

[0018] In this application, unless otherwise clearly specified and limited, the terms "installation", "connection", "connection", "fixation" and other terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or a communication; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

[0019] In this application, unless otherwise clearly specified and limited, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, "a plurality" means two or more, unless otherwise clearly specifically limited.

[0020] Refer toFigures 1 to 3 , the modular power supply of the embodiment of the present utility model includes a power supply box body 1 and a PCB board 2, and both the PCB board 2 and the heat dissipation structure in this embodiment are arranged inside the power supply box body 1.

[0021] Specifically, the heat dissipation structure in this embodiment includes a heat dissipation fan 3, a fixed partition 4, and a heat dissipation block 5. A plurality of fixed partitions 4 are arranged in parallel at intervals on the power supply box body 1, and each fixed partition 4 is provided with a heat dissipation through hole 41.

[0022] In this embodiment, 3 fixed partitions 4 are arranged in parallel, which are respectively arranged on both sides and in the middle of the power supply box body 1. Among them, a plurality of vertically parallel installation grooves 42 are opened on both sides of the fixed partition 4 arranged in the middle, and an installation groove 42 is opened on one side of the fixed partition 4 arranged on both sides of the power supply box body 1 and close to the middle fixed plate 4. The PCB board 2 is installed on the installation grooves 42 in the same row between adjacent fixed partitions 4.

[0023] The heat dissipation fan 3 is arranged close to the fixed partition 4 on one side of the power supply box body 1.

[0024] A plurality of heat dissipation blocks 5 are arranged side by side between adjacent fixed partitions 4, so that two groups of heat dissipation blocks 5 are arranged side by side on the left and right sides of the power supply box body 1. Specifically, the heat dissipation blocks 5 are fixed at the bottom of one side of the PCB board 2, and other electronic devices such as capacitors are installed on the upper part of the PCB board 2. The heat dissipation blocks 5 are provided with heat dissipation channels, and the heat dissipation channels on the heat dissipation blocks 5 arranged side by side on the left and right sides of the power supply box body 1 are communicated through the heat dissipation through holes 41 to form a fan heat duct.

[0025] Further, in this embodiment, the heat dissipation block 5 is made of aluminum alloy profile, and the heat dissipation channel is the channel inside the aluminum alloy profile.

[0026] The working principle of this embodiment is as follows:

[0027] Turn on the heat dissipation fan 3, suck the cooling air flow into the heat dissipation channel of one side of the heat dissipation block 5 to absorb heat, and then enter the heat dissipation channel on the other side after passing through the heat dissipation through hole 41 to absorb heat and then discharge from the heat dissipation through hole 41 on the outermost fixed partition 4, so that the internal air duct of the power module circulates and improves the heat dissipation capacity of the power module.

[0028] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-mentioned exemplary embodiments, and the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present utility model, and any reference signs in the claims should not be regarded as limiting the claims involved.

[0029] The above-mentioned embodiments only represent the implementation manners of the utility model. The protection scope of the present utility model is not limited to the above-mentioned embodiments only. For those skilled in the art, without departing from the concept of the present utility model, several deformations and improvements can be made, and these all belong to the protection scope of the present utility model.

Claims

1. A heat dissipation structure of a modular power supply, characterized in that: It includes a cooling fan, a fixed partition, and a cooling block. A plurality of fixed partitions are arranged in parallel and at intervals on a power supply box. The fixed partitions are provided with cooling holes. The cooling fan is arranged on the fixed partition on one side of the power supply box. A plurality of cooling blocks are arranged in parallel between adjacent fixed partitions. The cooling blocks are provided with cooling channels. The cooling channels on the cooling blocks arranged in parallel are connected through the cooling holes to form a fan hot air duct.

2. The heat dissipation structure of a modular power supply according to claim 1, characterized in that: The fixed partition is also provided with a mounting groove for mounting a PCB board.

3. The heat dissipation structure of a modular power supply according to claim 1, characterized in that: The heat sink is fixed on the PCB.

4. The heat dissipation structure of a modular power supply according to claim 1, characterized in that: There are three fixed partitions, which are respectively arranged on both sides and the middle of the power supply box.

5. The heat dissipation structure of a modular power supply according to claim 1, characterized in that: The heat sink block is made of aluminum alloy.

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