Bubble eliminating device for microsection

Abstract

The utility model relates to a bubble eliminating device for microsection, which comprises a seat body, a vibration component arranged in the seat body and a glue filling mould, the seat body comprises a top support plate, the vibration component and the glue filling mould are respectively positioned on the inner side and the outer side of the top support plate, and the vibration component and the glue filling mould are respectively positioned on the inner side and the outer side of the top support plate. When the vibration assembly vibrates, vibration force can be transmitted into the glue pouring mold through the supporting plate. A supporting piece is arranged in the glue pouring mold, one end of the supporting piece is connected with the bottom of the glue pouring mold, and the other end of the supporting piece protrudes upwards relative to the bottom of the glue pouring mold. The supporting piece can support a micro-slice, so that the micro-slice is parallel to the bottom of the glue pouring mold; according to the bubble removing device for the microsection, bubbles in glue are removed in a vibration mode, meanwhile, gaps of holes with small hole diameters can be better filled with the glue after vibration, and the situation that air exists in the holes and the glue cannot be filled into the holes is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board microsectioning, and particularly relates to a bubble elimination device for microsectioning. Background Art

[0002] The quality of a circuit board, the occurrence and solution of problems, and the improvement of the manufacturing process all require microsectioning as the basis for observation, research, and judgment. The main process is generally as follows: First, a smaller-sized specimen (i.e., a microsection) is obtained by cutting on the circuit board. Then, the specimen is placed in a mold, glue is poured into the mold, and after standing for a period of time, the mold can be demolded after the glue solidifies. Then, steps such as polishing and photographing the sample are carried out. By judging whether the specimen is qualified, the quality of the circuit board can be determined. However, usually in the step of pouring glue, since the pore diameters of some specimens are small and the bubbles are discharged relatively slowly, there will be a situation where the bubbles have not completely overflowed, but the glue has already solidified at this time, that is, the bubbles cannot be completely discharged, and finally accurate detection data of the microsection cannot be obtained, and misjudgment is likely to occur.

[0003] Therefore, it is necessary to improve on the basis of the existing technology to provide a device that can accelerate the discharge speed of microsection bubbles by vibration to improve the final detection quality of microsections. Summary of the Utility Model

[0004] Aiming at the deficiencies of the existing technology, the utility model provides a bubble elimination device for microsectioning with better bubble discharge effect.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is as follows:

[0006] A bubble elimination device for microsectioning includes a base body, a vibration assembly disposed inside the base body, and a glue pouring mold. The base body includes a top support plate. The vibration assembly and the glue pouring mold are respectively located inside and outside the top support plate. When the vibration assembly vibrates, the vibration force can be transmitted to the inside of the glue pouring mold through the support plate. A support member is disposed inside the glue pouring mold. One end of the support member is connected to the bottom of the glue pouring mold, and the other end protrudes upward relative to the bottom of the glue pouring mold. The support member can support the microsection to make the microsection parallel to the bottom of the glue pouring mold.

[0007] Preferably, the vibration assembly includes a mounting base and a vibration source. One end of the mounting base is connected to the support plate, and the other end protrudes downward relative to the support plate. An installation cavity is formed by enclosing the mounting base and the support plate. The vibration source is located in the installation cavity and is closely attached to the top support plate. A wire groove is also formed in the mounting base, and the wire groove runs through the mounting base in the thickness direction thereof. The power cord of the vibration source can extend out of the installation cavity through the wire groove to be connected to the outside.

[0008] Preferably, the vibration source is a vibration motor. There are multiple vibration motors, and the multiple vibration motors are arranged at intervals around the top support plate.

[0009] Preferably, it further includes a power supply and a control board. A baffle is also arranged in the seat body. The baffle divides the seat body into an upper cavity and a lower cavity. The vibration assembly is located in the upper cavity, and the power supply and the control board are arranged in the lower cavity at intervals. The vibration source, the control board, and the power supply are electrically connected in sequence.

[0010] Preferably, heat dissipation grooves are formed in the baffle, and the heat dissipation grooves extend along the radial direction of the baffle. The upper cavity communicates with the lower cavity through the heat dissipation grooves. There are multiple heat dissipation grooves, and the multiple heat dissipation grooves are arranged at intervals on the baffle.

[0011] Preferably, a locking assembly is further arranged on the top support plate. The locking assembly is arranged at intervals on both sides of the potting mold. The locking assembly includes a fixed seat and a movable rod. One end of the fixed seat is connected to the top support plate, and the other end protrudes upward relative to the top support plate. The movable rod is movably connected to the end of the fixed seat away from the top support plate, and the movable rod can reciprocate in the direction of the potting mold.

[0012] Preferably, a through hole is formed in the fixed seat, and the through hole runs through the fixed seat in the thickness direction thereof. One end of the movable rod can pass through the through hole to abut against the potting mold.

[0013] Preferably, mounting blocks are further arranged on the outer wall of the seat body. One end of the mounting block is connected to the seat body, and the other end extends outward relative to the seat body. There are multiple mounting blocks, and the multiple mounting blocks are arranged at intervals around the seat body. Mounting holes are formed in the mounting blocks, and the mounting holes run through the mounting blocks in the thickness direction thereof.

[0014] Preferably, it further includes a cover body. The cover body is detachably connected to the seat body, and the diameter of the cover body is greater than or equal to the diameter of the seat body. The height of the cover body is greater than the height of the potting mold.

[0015] The beneficial effects of the present utility model are mainly reflected in that the bubble elimination device for microsection provided by the present utility model can remove the bubbles in the glue by vibration during the glue filling step through the setting of a vibration component. At the same time, for some holes with smaller apertures, the glue can better fill the gaps after vibration, avoiding the situation where the glue cannot fill the holes due to the presence of air in the holes. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present utility model will become clearer about the above and other objects, features and advantages through the preferred embodiments of the present utility model shown in the drawings. The same reference numerals in all the drawings indicate the same parts, and the drawings are not deliberately drawn to scale in actual size, with the focus on showing the gist of the present utility model.

[0017] Figure 1 It is a schematic diagram of the overall structure of the bubble elimination device in the present utility model;

[0018] Figure 2 It is a schematic diagram of the cross-sectional view of the bubble elimination device in the present utility model;

[0019] Figure 3 It is a schematic diagram of the cross-sectional structure of the baffle in the present utility model;

[0020] Figure 4 It is a schematic diagram of the cross-sectional structure of the connection between the fixed seat and the movable rod in the present utility model.

[0021] In the figure: seat body 1, upper cavity 101, lower cavity 102, top support plate 11, baffle 12, heat dissipation groove 120, mounting block 13, mounting hole 130, mounting seat 20, mounting cavity 201, glue filling mold 3, support member 30, power supply 4, control board 5, control switch 50, locking assembly 6, fixed seat 60, through hole 601, movable rod 61. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] To facilitate the understanding of the present utility model, the present utility model will be described more comprehensively with reference to the relevant drawings.

[0023] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element and integrated with it, or there may be an intermediate element at the same time. The terms "installation", "one end", "the other end" and similar expressions used herein are only for the purpose of illustration.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this technology belongs. The terms used in the description of this specification are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0025] Referring Figures 1-4 , the present utility model provides a bubble elimination device for microtomy, which includes a base body 1, a vibration component arranged inside the base body 1, and a resin injection mold 3. A glue accommodating cavity for curing the glue is arranged inside the resin injection mold 3. The base body 1 includes a top support plate 11. The vibration component and the resin injection mold 3 are respectively located on the inner and outer sides of the top support plate 11; Referring Figure 2 , the inner side of the top support plate 11 refers to the side close to the inside of the base body 1 (i.e., Figure 2 below the middle support plate), and the outer side refers to the side facing the outside (i.e., Figure 2 above the middle support plate); When the vibration component vibrates, the vibration force can be transmitted to the inside of the resin injection mold 3 through the support plate; Under the action of the vibration force, the bubbles in the glue rise and separate from the glue; A support member 30 is arranged inside the resin injection mold 3. One end of the support member 30 is connected to the bottom of the resin injection mold 3, and the other end protrudes upward relative to the bottom of the resin injection mold 3; The support member 30 can support the microtome so that the microtome is parallel to the bottom of the resin injection mold 3. In this embodiment, the support member 30 is detachably connected to the resin injection mold 3. The support member 30 can be a glue stick. When in use, the glue stick can be bonded to the bottom of the mold to make it relatively fixed.

[0026] The specific working process of the bubble elimination device for microtomy provided by the present utility model is as follows:

[0027] When in use, the position of the microtome sample near the edge can be first adhered to the support member 30 (of course, it can also be directly placed on the support member 30), so as to avoid the support member 30 blocking the hole positions of the sample. The sample is placed parallel on two support members 30. In this step, keep the orifice of the microtome sample facing upward, that is, place it horizontally. In the traditional manufacturing method, the section sample is usually placed perpendicular to the bottom of the mold, resulting in the orifice direction being parallel to the bottom of the mold. This method is not conducive to the discharge of bubbles. By placing the section sample horizontally with its orifice facing upward, it is more conducive to the discharge of bubbles; Then pour glue into the resin injection mold 3 until the glue completely submerges the sample; After the resin injection is completed, start the vibration source to generate vibration, and at the same time transmit the vibration force to the glue inside the mold. During the vibration process, the bubbles in the glue rise and are discharged to the outside. After the vibration source works for a few minutes (the specific time depends on the actual situation), the vibration source can be turned off to stop the vibration. After the glue is cured, the next grinding process can be carried out.

[0028] The bubble elimination device for microsection provided in this embodiment has the following beneficial effects compared with the traditional ones:

[0029] By setting the vibration component, during the glue filling step of the sample, the air bubbles in the glue can be removed by vibration. At the same time, for some holes with smaller apertures, after vibration, the glue can better fill the gaps, avoiding the situation where the glue cannot fill the holes due to the presence of air inside.

[0030] Reference Figure 1 and 2 In a preferred embodiment, the vibration component further includes a mounting base 20. One end of the mounting base 20 is connected to the support plate, and the other end protrudes downward (i.e., the downward direction in Figure 2 ) relative to the support plate. An installation cavity 201 is formed by enclosing the mounting base 20 and the top support plate 11, and the vibration source is located in the installation cavity 201; a wire groove is also provided on the mounting base 20, and the installation cavity 201 is communicated with the outside through the wire groove. The mounting base 20 mainly plays a role in supporting, fixing, and protecting the vibration source. During use, the vibration source is installed in the installation cavity 201 and is closely arranged against the top support plate 11 to facilitate better transmission of the vibration force; the power cord 4 of the vibration source can extend out of the cavity through the wire groove and be connected to external equipment.

[0031] In a preferred embodiment, the vibration source is a vibration motor (not shown in the figure). The vibration motor is preferably a micro vibration motor, which can provide a certain vibration force while being convenient for installation and saving space; there are multiple vibration motors, and the multiple vibration motors are arranged at intervals around the top support plate 11. Reference Figure 2 On the side of the top support plate 11 close to the inside of the seat body 1, multiple mounting bases 20 are arranged at intervals, and a vibration motor is installed in each mounting base 20. When the multiple vibration motors work simultaneously, the speed of bubble elimination can be further improved.

[0032] Reference Figure 2 In a preferred embodiment, it further includes a power supply 4 and a control board 5. A baffle 12 is further arranged in the seat body 1. The baffle 12 divides the inside of the seat body 1 into an upper cavity 101 and a lower cavity 102. The vibration component is located in the upper cavity 101, and the power supply 4 and the control board 5 are arranged at intervals in the lower cavity 102; the vibration source, the control board 5, and the power supply 4 are electrically connected in sequence. In this embodiment, the power supply 4 mainly provides electrical energy for the control board 5, and the control board 5 is used to control the opening or closing of the vibration source; in a further preferred embodiment, a control switch 50 is further arranged on the outer side wall of the seat body 1, and the control switch 50 is electrically connected to the control board 5 to facilitate the operator to control the operation of the vibration source through the control switch 50.

[0033] Reference Figure 2 and 3, in a preferred embodiment, heat dissipation grooves 120 are formed in the baffle 12, and the heat dissipation grooves 120 extend along the radial direction of the baffle 12; the upper cavity 101 communicates with the lower cavity 102 through the heat dissipation grooves 120; there are a plurality of heat dissipation grooves 120, and the plurality of heat dissipation grooves 120 are arranged at intervals on the baffle 12. In this embodiment, on the one hand, the baffle 12 serves to separate the upper and lower cavities 102, and on the other hand, the heat dissipation grooves 120 provided on the baffle 12 can achieve a better heat dissipation effect; at the same time, the power supply 4 wires of the vibration motor can extend into the lower cavity 102 through the lower heat dissipation grooves 120 after coming out of the wire groove and are connected to the control board 5, which also avoids the situation of the wires in the base body 1 being entangled and messy with each other. In a further preferred embodiment, heat dissipation holes are provided on the outer wall of the base body 1, and the heat dissipation holes communicate the lower cavity 102 with the outside, and the heat inside the base body 1 can be discharged to the outside through the heat dissipation holes.

[0034] Reference Figures 1-4 , in a preferred embodiment, a locking assembly 6 is further provided on the top support plate 11, and the locking assembly 6 is arranged at intervals on both sides of the potting mold 3. The locking assembly 6 includes a fixed seat 60 and a movable rod 61. One end of the fixed seat 60 is connected to the top support plate 11, and the other end protrudes upward relative to the top support plate 11. The movable rod 61 is movably connected to the end of the fixed seat 60 away from the top support plate 11, and the movable rod 61 can reciprocate in the direction of the potting mold 3. Reference Figure 2 and 4 , the locking assembly 6 is provided on both sides of the potting mold 3. After the mold is potted, the movable rods 61 on both sides can move towards the mold respectively until the movable rods 61 abut against the mold. Under the action of the two movable rods 61, a relative clamping effect can be exerted on the mold to prevent the mold from undergoing a large displacement under the action of the vibration force, and the stability is better. It should be noted that in this embodiment, the movable rod 61 only needs to provide a certain pre-tightening force to the mold. However, in actual use, it can be determined according to the situation. When it is necessary to completely fix the mold, the mold can also be in a completely clamped state through the movable rod 61.

[0035] Reference Figure 2 and 4, in a preferred embodiment, a through hole 601 is formed in the fixed seat 60. The through hole 601 runs through the fixed seat 60 along the thickness direction thereof. One end of the movable rod 61 can pass through the through hole 601 and abut against the potting die 3. In this embodiment, the movable rod 61 is threadedly connected to the fixed seat 60. In a further preferred embodiment, internal threads are provided in the through hole 601, and external threads are provided on the outer wall of the movable rod 61. Under the cooperation of the internal threads and the external threads, one end of the movable rod 61 passes through the through hole 601, and by rotating the movable rod 61 clockwise, the movable rod 61 can move towards the potting die 3; when the movable rod 61 is rotated counterclockwise, the movable rod 61 can be moved away from the potting die 3. In this embodiment, clockwise and counterclockwise are only for illustrative purposes and do not represent a limitation thereto.

[0036] Reference Figure 1 and 2 , in a preferred embodiment, mounting blocks 13 are further provided on the outer wall of the seat body 1. One end of the mounting block 13 is connected to the seat body 1, and the other end extends outward relative to the seat body 1; there are a plurality of mounting blocks 13, and the plurality of mounting blocks 13 are arranged at intervals around the seat body 1; mounting holes 130 are formed in the mounting blocks 13, and the mounting holes 130 run through the mounting blocks 13 along the thickness direction thereof. The device can be fixed to the experimental table by driving screws into the mounting holes 130, which is convenient for installation and disassembly.

[0037] In a preferred embodiment, a cover body (not shown in the figure) is further included. The cover body is detachably connected to the seat body 1, and the diameter of the cover body is greater than or equal to the diameter of the seat body 1; the height of the cover body is greater than the height of the potting die 3. The cover body mainly plays a role in dust prevention and protection; after the potting die 3 is potted, the cover body can be covered on the seat body 1 to prevent impurities from accidentally falling into the glue in the die. In this embodiment, the cover body is preferably made of acrylic plastic material or can also be made of transparent glass for convenient observation.

[0038] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.

Claims

1. A degassing device for microsectioning, characterized in that: The invention comprises a seat body, a vibration component arranged in the seat body, and a glue pouring mold, wherein the seat body comprises a top support plate, the vibration component and the glue pouring mold are respectively located at the inner and outer sides of the top support plate, and when the vibration component vibrates, the vibration force can be transmitted to the glue pouring mold through the support plate; a support member is arranged in the glue pouring mold, one end of the support member is connected to the bottom of the glue pouring mold, and the other end is arranged to protrude upward relative to the bottom of the glue pouring mold; The support member can support the micro-slice so that the micro-slice is parallel to the bottom of the glue-filling mold.

2. The degassing device for microsectioning according to claim 1, characterized in that: The vibration assembly includes a mounting seat and a vibration source, one end of the mounting seat is connected to the support plate, and the other end protrudes downward relative to the support plate, the mounting seat and the support plate form a mounting cavity, the vibration source is located in the mounting cavity, and the vibration source is arranged closely against the top support plate; the mounting seat is also provided with a wiring groove, and the wiring groove is arranged to penetrate along the thickness direction of the mounting seat; the power cord of the vibration source can extend out of the mounting cavity through the wiring groove and be connected to the outside.

3. The degassing device for microsectioning as claimed in claim 2, characterized in that: The vibration source is a vibration motor, and there are multiple vibration motors, which are arranged around the top support plate at intervals.

4. The degassing device for microsectioning as claimed in claim 2, characterized in that: It also includes a power supply and a control board. A baffle is also provided in the base body. The baffle separates the base body into an upper cavity and a lower cavity. The vibration component is located in the upper cavity, and the power supply and the control board are spaced apart in the lower cavity. The vibration source, the control board and the power supply are electrically connected in sequence.

5. The degassing device for microsectioning according to claim 4, characterized in that: The baffle is provided with a heat dissipation groove, which is extended along the radial direction of the baffle; the upper cavity is connected with the lower cavity through the heat dissipation groove; there are multiple heat dissipation grooves, and the multiple heat dissipation grooves are arranged on the baffle at intervals.

6. The degassing device for microsectioning according to claim 1, characterized in that: A locking assembly is also provided on the top support plate, and the locking assembly is spaced apart on both sides of the glue pouring mold. The locking assembly includes a fixed seat and a movable rod. One end of the fixed seat is connected to the top support plate, and the other end is protruded upward relative to the top support plate. The movable rod is movably connected to one end of the fixed seat away from the top support plate, and the movable rod can reciprocate toward the glue pouring mold.

7. The degassing device for microsectioning according to claim 6, characterized in that: The fixing seat is provided with a through hole, and the through hole is arranged to penetrate along the thickness direction of the fixing seat. One end of the movable rod can pass through the through hole and abut against the glue injection mold.

8. The degassing device for microsectioning according to claim 1, characterized in that: A mounting block is also provided on the outer wall of the base body, one end of the mounting block is connected to the base body, and the other end is extended outward relative to the base body; there are multiple mounting blocks, and the multiple mounting blocks are arranged around the base body at intervals; a mounting hole is opened on the mounting block, and the mounting hole is arranged through the thickness direction of the mounting block.

9. The degassing device for microsectioning according to claim 1, characterized in that: It also includes a cover body, which is detachably connected to the base body, and the diameter of the cover body is greater than or equal to the diameter of the base body; the height of the cover body is greater than the height of the glue pouring mold.

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