Edge glue supplementing machine for wafer production

Abstract

The utility model belongs to the field of glue repairing machines, in particular to an edge glue repairing machine for wafer production, which comprises a glue repairing machine main body, an electrostatic adsorption platform and a needle telescopic mechanism, the electrostatic adsorption platform is rotatably mounted at the top of the glue repairing machine main body, and the needle telescopic mechanism is arranged at the top of the glue repairing machine main body. The needle telescopic mechanism is located on one side of the electrostatic adsorption platform, a display module is arranged on the glue supplementing machine body, a glue amount controller is installed on the glue supplementing machine body, the glue amount controller is located on one side of the display module and matched with the needle telescopic mechanism, and a wafer alignment mechanism is arranged at the top of the glue supplementing machine body. And the needle head telescoping mechanism comprises a mounting rack, a cylinder II and a glue supplementing needle. According to the utility model, the design is reasonable, the wafer can be positioned through the wafer alignment mechanism, and the purpose of automatically aligning the wafer and finding a glue filling point can be achieved through the rotation of the electrostatic adsorption platform and the glue filling needle.

Description

Technical Field

[0001] The utility model relates to the technical field of glue filling machines, in particular to an edge glue filling machine for wafer production. Background Art

[0002] A wafer refers to a silicon wafer used for fabricating silicon semiconductor integrated circuits. Since its shape is circular, it is called a wafer; various circuit element structures can be processed and fabricated on the silicon wafer to become an IC product with specific electrical functions. The raw material of the wafer is silicon.

[0003] Currently, a wafer bonding auxiliary glue filling device announced in a Chinese patent with the publication number CN219580968U belongs to the technical field of semiconductor equipment. It includes a platform for placing the component to be glue-filled; a glue filling component including a syringe, in which bonding glue is stored, and the glue outlet of the syringe is parallel to the position to be glue-filled of the component to be glue-filled. This utility model uses a syringe to facilitate precise alignment with the position to be glue-filled on the wafer, and at the same time can precisely control the amount of glue discharged from the bonding glue, thereby precisely filling the glue at the position to be glue-filled on the wafer, solving the problem of glue leakage caused by the glue coating process, improving the bonding yield of the wafer, supporting the wafer through the glue layer, reducing the problems of edge breakage or chip breakage in the subsequent thinning process, and at the same time avoiding the problems of low efficiency and increased cost caused by product rework.

[0004] In actual production, it is found that positioning through positioning marks results in deviations during the placement process, causing deviations in the positions of the edge glue filling points and affecting the glue filling quality of the wafer. Therefore, we propose an edge glue filling machine for wafer production to solve the above problems. Summary of the Utility Model

[0005] The purpose of the utility model is to solve the shortcomings existing in the prior art, and to propose an edge glue filling machine for wafer production.

[0006] To achieve the above purpose, the utility model adopts the following technical solutions:

[0007] An edge glue filling machine for wafer production includes a glue filling machine main body, an electrostatic adsorption platform, and a needle telescoping mechanism. The electrostatic adsorption platform is rotatably installed on the top of the glue filling machine main body, and a needle telescoping mechanism is provided on the top of the glue filling machine main body. The needle telescoping mechanism is located on one side of the electrostatic adsorption platform;

[0008] A display module is provided on the glue filling machine main body, and a glue amount controller is installed on the glue filling machine main body. The glue amount controller is located on one side of the display module and is adapted to the needle telescoping mechanism. A wafer alignment mechanism is provided on the top of the glue filling machine main body.

[0009] Preferably, the needle telescoping mechanism includes a mounting frame, a second cylinder, and a glue filling needle. The mounting frame is fixedly installed on the main body of the glue filling machine. A second cylinder is installed on the mounting frame, and a glue filling needle is installed on the output shaft of the second cylinder.

[0010] Preferably, a liquid supply pipeline is installed on the glue volume controller, and the liquid supply pipeline is connected to the glue filling needle.

[0011] Preferably, a connecting plate is installed on one side of the mounting frame. An electric push rod is provided on the connecting plate. A U-shaped frame is installed on the electric push rod, and a guide wheel is rotatably installed on the U-shaped frame.

[0012] Preferably, the wafer alignment mechanism includes a mounting plate, a first cylinder, and an arc-shaped positioning plate. The mounting plate is fixedly installed on the main body of the glue filling machine. The first cylinder is installed on the mounting plate, and an arc-shaped positioning plate adapted to the wafer is installed on the output shaft of the first cylinder.

[0013] Preferably, the display module controls the temperature of the electrostatic adsorption platform, the glue filling time, the rotation speed, and the adsorption value.

[0014] Preferably, the glue volume controller accurately controls the glue flow rate and the back suction volume.

[0015] Preferably, the electrostatic adsorption platform has the temperature level, the rotation speed, and the adsorption value size.

[0016] The beneficial effects of the present utility model are as follows:

[0017] In the glue filling process of the main body of the wafer edge glue filling machine, after setting parameters such as temperature, platform rotation time, platform electrostatic adsorption value, platform rotation speed, and glue flow rate through the touch screen software of the display module;

[0018] Put the wafer on the electrostatic adsorption platform, the electrostatic adsorption is automatically turned on. The wafer alignment mechanism drives the arc-shaped positioning plate to move to the specified position through the first cylinder. The needle telescoping mechanism can drive the glue filling needle to move to automatically align with the wafer to find the glue filling point. The wafer alignment mechanism returns to the initial point and starts to automatically fill the edge of the wafer with glue. The electrostatic adsorption platform starts to rotate and work. After the glue is filled, the needle telescoping mechanism starts to return to the initial point, the electrostatic adsorption of the electrostatic adsorption platform is turned off, and the wafer is taken out. Description of the Drawings

[0019] Figure 1 It is a three-dimensional structural schematic diagram of an edge glue filling machine for wafer production proposed by the present utility model;

[0020] Figure 2 It is a partial structural schematic diagram of part A of an edge glue filling machine for wafer production proposed by the present utility model;

[0021] Figure 3Schematic diagram of part B of an edge glue filling machine for wafer production proposed by the present utility model.

[0022] In the figure: 1, display module; 2, glue volume controller; 3, electrostatic adsorption platform; 4, needle telescoping mechanism; 5, wafer alignment mechanism; 6, three-color lamp; 7, glue filling machine main body; 8, mounting plate; 9, cylinder 1; 10, arc-shaped positioning plate; 11, mounting frame; 12, cylinder 2; 13, glue filling needle; 14, connecting plate; 15, electric push rod; 16, U-shaped frame; 17, guide wheel. Specific embodiments

[0023] The technical solutions of the present utility model will be clearly and completely described below in conjunction with specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0024] Refer to Figures 1-3 , an edge glue filling machine for wafer production, including a glue filling machine main body 7, an electrostatic adsorption platform 3 and a needle telescoping mechanism 4. The electrostatic adsorption platform 3 is rotatably installed on the top of the glue filling machine main body 7. A needle telescoping mechanism 4 is provided on the top of the glue filling machine main body 7. The needle telescoping mechanism 4 is located on one side of the electrostatic adsorption platform 3. A three-color lamp 6 is provided on the glue filling machine main body 7. A display module 1 is provided on the glue filling machine main body 7. And a glue volume controller 2 is installed on the glue filling machine main body 7. The glue volume controller 2 is located on one side of the display module 1. And the glue volume controller 2 is adapted to the needle telescoping mechanism 4. A wafer alignment mechanism 5 is provided on the top of the glue filling machine main body 7. The glue filling process of the glue filling machine main body 7 of the wafer edge glue filling machine is to set parameters such as temperature, platform rotation time, platform electrostatic adsorption value, platform rotation speed, and glue flow through the touch screen software of the display module 1.

[0025] In this embodiment, the needle telescoping mechanism 4 includes a mounting frame 11, a cylinder 2 12 and a glue filling needle 13. The mounting frame 11 is fixedly installed on the glue filling machine main body 7. The cylinder 2 12 is installed on the mounting frame 11. The glue filling needle 13 is installed on the output shaft of the cylinder 2 12. The glue filling needle 13 can be driven to move through the cylinder 2 12, so as to achieve the purpose of controlling the position of the glue filling needle 13.

[0026] In this embodiment, a liquid supply pipeline is installed on the glue volume controller 2, and the liquid supply pipeline is connected to the glue filling needle 13. By providing the liquid supply pipeline, the flow of the glue can be guided, and the purpose of supplying the glue to the glue filling needle 13 can be achieved.

[0027] In this embodiment, a connecting plate 14 is installed on one side of the mounting bracket 11. An electric push rod 15 is provided on the connecting plate 14. A U-shaped bracket 16 is installed on the electric push rod 15. A guide wheel 17 is rotatably installed on the U-shaped bracket 16. The wafer alignment mechanism 5 includes a mounting plate 8, a first cylinder 9 and an arc-shaped positioning plate 10. The mounting plate 8 is fixedly installed on the glue filling machine main body 7. The first cylinder 9 is installed on the mounting plate 8. An arc-shaped positioning plate 10 adapted to the wafer is installed on the output shaft of the first cylinder 9. The purpose of accurately positioning the wafer can be achieved through the arc-shaped positioning plate 10, thereby reducing the error of glue filling.

[0028] In this embodiment, the display module 1 controls the temperature of the electrostatic adsorption platform 3, the glue filling time, the rotation speed, the adsorption value, and the glue volume controller 2 accurately controls the glue flow rate, the back suction volume, and the electrostatic adsorption platform 3 controls the temperature, the rotation speed, and the adsorption value.

[0029] In the present utility model, the glue filling process of the glue filling machine main body 7 of the wafer edge glue filling machine is as follows: after setting parameters such as temperature, platform rotation time, platform electrostatic adsorption value, platform rotation speed, and glue flow rate through the touch screen software of the display module 1, the wafer is placed on the electrostatic adsorption platform 3, and the electrostatic adsorption is automatically turned on. The wafer alignment mechanism 5 drives the arc-shaped positioning plate 10 to move to the designated position through the first cylinder 9. The needle telescoping mechanism 4 can drive the glue filling needle to move and start automatic alignment with the wafer to find the glue filling point. The wafer alignment mechanism 5 returns to the initial point and starts automatic glue filling on the wafer edge. The electrostatic adsorption platform 3 starts to rotate and work. After the glue is filled, the needle telescoping mechanism 4 starts to return to the initial point, the electrostatic adsorption of the electrostatic adsorption platform 3 is turned off, and the wafer is taken out.

[0030] The above has introduced in detail a kind of edge glue filling machine for wafer production provided by the present utility model. Specific embodiments are used herein to elaborate on the principle and implementation manner of the present utility model. The description of the above embodiments is only used to help understand the method and its core idea of the present utility model. It should be noted that for those of ordinary skill in the art of this technology, without departing from the principle of the present utility model, several improvements and modifications can be made to the present utility model, and these improvements and modifications also fall within the protection scope of the claims of the present utility model.

Claims

1. An edge glue filling machine for wafer production, characterized in that: The invention comprises a glue repairing machine body (7), an electrostatic adsorption platform (3) and a needle telescopic mechanism (4), wherein the top of the glue repairing machine body (7) is rotatably mounted with the electrostatic adsorption platform (3), the top of the glue repairing machine body (7) is provided with a needle telescopic mechanism (4), the needle telescopic mechanism (4) is located on one side of the electrostatic adsorption platform (3), and a three-color lamp (6) is provided on the glue repairing machine body (7); The glue filling machine body (7) is provided with a display module (1), and a glue quantity controller (2) is installed on the glue filling machine body (7), the glue quantity controller (2) is located on one side of the display module (1), and the glue quantity controller (2) is compatible with the needle telescopic mechanism (4), and a wafer alignment mechanism (5) is provided on the top of the glue filling machine body (7).

2. The edge glue filling machine for wafer production according to claim 1, characterized in that: The needle retractable mechanism (4) comprises a mounting frame (11), a second cylinder (12) and a glue repair needle (13); the mounting frame (11) is fixedly mounted on a glue repair machine body (7); the second cylinder (12) is mounted on the mounting frame (11); and the glue repair needle (13) is mounted on an output shaft of the second cylinder (12).

3. The edge glue filling machine for wafer production according to claim 1, characterized in that: A liquid supply pipeline is installed on the glue quantity controller (2), and the liquid supply pipeline is connected to the glue replenishing needle (13).

4. The edge glue filling machine for wafer production according to claim 2, characterized in that: A connecting plate (14) is installed on one side of the mounting frame (11), an electric push rod (15) is provided on the connecting plate (14), a U-shaped frame (16) is installed on the electric push rod (15), and a guide wheel (17) is rotatably installed on the U-shaped frame (16).

5. The edge glue filling machine for wafer production according to claim 1, characterized in that: The wafer alignment mechanism (5) comprises a mounting plate (8), a cylinder (9) and an arc-shaped positioning plate (10); the mounting plate (8) is fixedly mounted on the glue filling machine body (7); the cylinder (9) is mounted on the mounting plate (8); and an arc-shaped positioning plate (10) adapted to the wafer is mounted on the output shaft of the cylinder (9).

6. The edge glue filling machine for wafer production according to claim 1, characterized in that: The display module (1) controls the temperature, glue filling time, rotation speed and adsorption value of the electrostatic adsorption platform (3).

7. The edge glue filling machine for wafer production according to claim 1, characterized in that: The glue quantity controller (2) is used to accurately control the glue flow rate and the amount of glue back-sucking.

8. The edge glue filling machine for wafer production according to claim 1, characterized in that: The electrostatic adsorption platform (3): temperature, rotation speed, and adsorption value.

Images