Ultrasonic cleaning device for stably cleaning semiconductor wafer

Abstract

The utility model relates to the technical field of semiconductor wafer processing, in particular to an ultrasonic cleaning device for stably cleaning a semiconductor wafer, which comprises a base, sliding blocks are connected to the inner walls of the two sides of the base in a sliding manner, a frame is fixedly connected between the side walls of the two sliding blocks, and grooves are formed in the inner walls of the two sides of the base; a cavity is formed in the movable plate, and a plurality of holes are formed in the lower end of the movable plate at equal intervals. The sliding block drives the frame body to slide downwards, when the sliding block slides downwards, the sliding groove limits the sliding block, dislocation during sliding of the sliding block is avoided, the frame body and the semiconductor wafer are soaked in the cleaning liquid, then the ultrasonic generator operates, and the semiconductor wafer is cleaned in cooperation with the cleaning liquid. Clean water in the cavity is sprayed to the surface of the semiconductor wafer through the multiple holes, so that secondary cleaning is carried out on the semiconductor wafer, and possible residual cleaning liquid or chemical components on the surface of the semiconductor wafer are removed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip processing, in particular to an ultrasonic cleaning device for stable cleaning of semiconductor chips. Background Technique

[0002] A semiconductor chip, also known as a wafer, is a circular thin slice made of high-purity single-crystal silicon material. As a kind of semiconductor material, silicon has the property of conducting electricity under specific conditions, making it an ideal material for manufacturing integrated circuits. The ultrasonic cleaning device for semiconductor chips utilizes the cavitation effect, acceleration effect, and rectilinear flow effect of ultrasonic waves in a liquid to efficiently clean the surface of the chips.

[0003] After retrieval, the utility model patent with the Chinese patent publication number CN220781583U discloses an ultrasonic cleaning device, belonging to the general cleaning technology field. An ultrasonic cleaning device provided by the utility model includes an ultrasonic cleaning machine and a cleaning rack. The cleaning rack is arranged inside the ultrasonic cleaning machine. The cleaning rack includes multiple groups of cleaning frames. Each cleaning frame includes a cleaning column, a filtering side plate, a filtering bottom plate, and a lifting component. The lifting component includes a lifting sliding column and a lifting cross beam. An upper sliding groove and a lower sliding groove are arranged on the cleaning column. The width of the upper sliding groove is smaller than that of the lower sliding groove. A sliding clamping block is arranged at the lower end of the lifting sliding column. The sliding clamping block is slidably arranged in the lower sliding groove. The lifting sliding column is slidably arranged in the upper sliding groove. The upper top wall of the lower sliding groove limits the sliding of the sliding clamping block. The lifting cross beam is erected at the upper ends of two adjacent groups of lifting sliding columns in the front and back. The ultrasonic cleaning device provided by the utility model places parts in the cleaning frame, avoiding stacking, expanding the cleaning area, improving the cleaning efficiency, and facilitating the taking and placing of the cleaning frame.

[0004] After retrieval, the above patent processes the ultrasonic cleaning of materials. However, after the ultrasonic cleaning of materials by this device, it fails to perform secondary cleaning on the materials. If the materials are not cleaned again, the cleaning effect on the surface of the materials may be affected by various factors such as the type, concentration, and temperature of the cleaning liquid, resulting in unstable cleaning effects. Content of the Utility Model

[0005] The purpose of the utility model is to provide an ultrasonic cleaning device for stable cleaning of semiconductor chips, achieving the effect of facilitating multiple cleaning of semiconductor chips through this device, so as to solve the problem in the prior art that it is not convenient to perform multiple cleaning on semiconductor chips.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] An ultrasonic cleaning device for stable cleaning of semiconductor wafers, comprising a base, a cleaning tank is arranged at the upper end of the base, sliders are slidably connected to the inner walls of both sides of the base, a frame body is fixedly connected between the side walls of the two sliders, the frame body is arranged in a mesh shape, and grooves are arranged on the inner walls of both sides of the base; a movable plate, the movable plate is arranged inside the base, the movable plate is slidably connected to the groove, a cavity is arranged inside the movable plate, a plurality of holes are equidistantly arranged at the lower end of the movable plate, and the holes are communicated with the cavity.

[0008] Preferably, two electric push rods are fixedly connected to the upper end of the base, chutes are arranged on the inner walls of both sides of the base, the sliders are slidably connected to the chutes, and the output ends of the electric push rods are fixedly connected to the upper ends of the sliders.

[0009] Preferably, a motor is fixedly connected to the side wall of the base, a screw rod is rotatably connected inside the base, and the end of the screw rod is fixedly connected to the output end of the motor.

[0010] Preferably, an auxiliary rod is fixedly connected between the inner walls of both sides of the base, the auxiliary rod is slidably connected through the movable plate, and the movable plate is threadedly rotated with the screw rod.

[0011] Preferably, a liquid storage tank is fixedly connected to the side wall of the base, a water pump is arranged inside the liquid storage tank, and a connecting pipe is connected between the output end of the water pump and the cavity.

[0012] Preferably, one end of the connecting pipe is fixedly connected through the upper end of the liquid storage tank, the other end of the connecting pipe is fixedly connected through the side wall of the movable plate, and the connecting pipe is slidably connected through the side wall of the base.

[0013] Compared with the prior art, the advantages of the present utility model are as follows:

[0014] 1. The operator places the semiconductor wafer inside the frame body, and the electric push rod is used to push the slider to slide downward. At the same time, the slider drives the frame body to slide downward. When the slider slides downward, the chute limits the slider to prevent the slider from being misaligned during sliding, so that the frame body and the semiconductor wafer are immersed in the cleaning liquid. Then the ultrasonic generator operates, and the semiconductor wafer is cleaned in cooperation with the cleaning liquid, so as to facilitate the stable ultrasonic cleaning of the semiconductor wafer. At the same time, the frame body is driven by the slider to automatically slide longitudinally, which is convenient for the placement and taking of the semiconductor wafer.

[0015] 2. For the cleaned semiconductor wafer, the slider drives the frame body to slide upward, so that the semiconductor wafer is taken out from the cleaning liquid. Then the movable plate slides, and through the water pump and the connecting pipe, the clean water inside the liquid storage tank is conveyed to the cavity. During the sliding process of the movable plate, the clean water inside the cavity is sprayed out from a plurality of holes onto the surface of the semiconductor wafer, so as to perform secondary cleaning on the semiconductor wafer and remove the cleaning liquid or chemical components that may remain on the surface of the semiconductor wafer. Brief Description of the Drawings

[0016] Figure 1 It is a front view external structure schematic diagram of an ultrasonic cleaning device for stable cleaning of semiconductor wafers proposed by the present utility model.

[0017] Figure 2 It is a rear view external structure schematic diagram of an ultrasonic cleaning device for stable cleaning of semiconductor wafers proposed by the present utility model.

[0018] Figure 3 It is a side view sectional structure schematic diagram of an ultrasonic cleaning device for stable cleaning of semiconductor wafers proposed by the present utility model.

[0019] Figure 4 It is a rear view sectional structure schematic diagram of an ultrasonic cleaning device for stable cleaning of semiconductor wafers proposed by the present utility model.

[0020] Figure 5 It is a front view sectional structure schematic diagram of an ultrasonic cleaning device for stable cleaning of semiconductor wafers proposed by the present utility model.

[0021] In the figure: 1 base, 2 cleaning tank, 3 electric push rod, 4 sliding groove, 5 slider, 6 frame body, 7 motor, 8 screw rod, 9 auxiliary rod, 10 groove, 11 movable plate, 12 cavity, 13 hole, 14 liquid storage tank, 15 water pump, 16 connecting pipe. Detailed Description of the Preferred Embodiment

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments.

[0023] Refer to Figures 1-5, an ultrasonic cleaning device for stable cleaning of semiconductor wafers, including a base 1, a cleaning tank 2 is arranged at the upper end of the base 1, both inner walls of the base 1 are slidably connected with sliders 5, a frame 6 is fixedly connected between the side walls of the two sliders 5, the frame 6 is arranged in a net shape, and grooves 10 are arranged on both inner walls of the base 1; a movable plate 11, the movable plate 11 is arranged inside the base 1, the movable plate 11 is slidably connected with the groove 10, a cavity 12 is arranged inside the movable plate 11, a plurality of holes 13 are equidistantly arranged at the lower end of the movable plate 11, the holes 13 are communicated with the cavity 12, the liquid level of the cleaning liquid inside the cleaning tank 2 is located in the middle and lower section inside the cleaning tank 2, an ultrasonic generator is arranged inside the base 1, the oscillator end of the ultrasonic generator is located inside the cleaning tank 2, the operator places the semiconductor wafer inside the frame 6, the slider 5 drives the frame 6 to slide downwards, so that the frame 6 and the semiconductor wafer are immersed in the cleaning liquid, then the ultrasonic generator operates, and the semiconductor wafer is stably cleaned in cooperation with the cleaning liquid. After cleaning the semiconductor wafer, the slider 5 drives the frame 6 to slide upwards, so that the semiconductor wafer is taken out from the cleaning liquid, then the movable plate 11 slides, and clean water flows inside the cavity 12. During the sliding process of the movable plate 11, the clean water inside the cavity 12 is sprayed out from the plurality of holes 13 onto the surface of the semiconductor wafer, so as to perform secondary cleaning on the semiconductor wafer. When not in use, the movable plate 11 slides into the corresponding groove 10, and the movable plate 11 is stored through the groove 10.

[0024] Two electric push rods 3 are fixedly connected to the upper end of the base 1, sliding grooves 4 are arranged on both inner walls of the base 1, the sliders 5 are slidably connected with the sliding grooves 4, and the output ends of the electric push rods 3 are fixedly connected to the upper ends of the sliders 5, and the sliders 5 are pushed or pulled to slide up and down through the electric push rods 3.

[0025] A motor 7 is fixedly connected to the side wall of the base 1, a screw rod 8 is rotatably connected inside the base 1, and the end of the screw rod 8 is fixedly connected to the output end of the motor 7, and the screw rod 8 is driven to rotate through the motor 7.

[0026] An auxiliary rod 9 is fixedly connected between both inner walls of the base 1, the auxiliary rod 9 is slidably connected through the movable plate 11, the movable plate 11 is in threaded rotation connection with the screw rod 8, when the screw rod 8 rotates, the movable plate 11 slides horizontally, and at the same time the auxiliary rod 9 assists the movable plate 11 to slide.

[0027] A liquid storage tank 14 is fixedly connected to the side wall of the base 1, a water pump 15 is arranged inside the liquid storage tank 14, and a connecting pipe 16 is connected between the output end of the water pump 15 and the cavity 12. The clean water inside the liquid storage tank 14 is conveyed into the cavity 12 through the water pump 15 and the connecting pipe 16.

[0028] One end of the connecting pipe 16 is fixedly connected through the upper end of the liquid storage tank 14, the other end of the connecting pipe 16 is fixedly connected through the side wall of the movable plate 11, the connecting pipe 16 is slidably connected through the side wall of the base 1, and the connecting pipe 16 is a telescopic hose.

[0029] In the present utility model, an operator places a semiconductor wafer inside the frame body 6, and the electric push rod 3 is used to push the slider 5 to slide downward. At the same time, the slider 5 drives the frame body 6 to slide downward. When the slider 5 slides downward, the chute 4 limits the slider 5 to prevent the slider 5 from being misaligned during sliding, so that the frame body 6 and the semiconductor wafer are immersed in the cleaning liquid. Then, the ultrasonic generator operates, and the semiconductor wafer is stably cleaned in cooperation with the cleaning liquid.

[0030] For the cleaned semiconductor wafer, the slider 5 drives the frame body 6 to slide upward, so that the semiconductor wafer is taken out from the cleaning liquid. Then, the movable plate 11 slides, and through the water pump 15 and the connecting pipe 16, the clear water inside the liquid storage tank 14 is conveyed into the cavity 12. During the sliding process of the movable plate 11, the clear water inside the cavity 12 is sprayed out from a plurality of holes 13 onto the surface of the semiconductor wafer, thereby performing a secondary cleaning on the semiconductor wafer.

[0031] The above is only a preferred specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution and the inventive concept of the present utility model, makes equivalent substitutions or changes, and all should be covered within the protection scope of the present utility model.

Claims

1. An ultrasonic cleaning device for stable cleaning of semiconductor wafers, characterized in that: include A base (1), wherein a cleaning tank (2) is arranged at the upper end of the base (1), sliders (5) are slidably connected to the inner walls on both sides of the base (1), a frame (6) is fixedly connected between the side walls of the two sliders (5), the frame (6) is arranged in a mesh shape, and grooves (10) are arranged on the inner walls on both sides of the base (1); A movable plate (11), the movable plate (11) being arranged inside the base (1), the movable plate (11) being slidably connected to the groove (10), a cavity (12) being arranged inside the movable plate (11), a plurality of holes (13) being equidistantly arranged at the lower end of the movable plate (11), and the holes (13) being connected to the cavity (12).

2. The ultrasonic cleaning device for stable cleaning of semiconductor wafers according to claim 1, characterized in that: Two electric push rods (3) are fixedly connected to the upper end of the base (1), and slide grooves (4) are provided on the inner walls on both sides of the base (1). The slide block (5) is slidably connected to the slide groove (4), and the output end of the electric push rod (3) is fixedly connected to the upper end of the slide block (5).

3. The ultrasonic cleaning device for stable cleaning of semiconductor wafers according to claim 1, characterized in that: A motor (7) is fixedly connected to the side wall of the base (1), a screw rod (8) is rotatably connected inside the base (1), and the end of the screw rod (8) is fixedly connected to the output end of the motor (7).

4. The ultrasonic cleaning device for stable cleaning of semiconductor wafers according to claim 3, characterized in that: An auxiliary rod (9) is fixedly connected between the inner walls on both sides of the base (1); the auxiliary rod (9) is slidably connected to a movable plate (11); and the movable plate (11) is threadedly connected to a screw rod (8).

5. The ultrasonic cleaning device for stable cleaning of semiconductor wafers according to claim 1, characterized in that: A liquid storage tank (14) is fixedly connected to the side wall of the base (1), a water pump (15) is arranged inside the liquid storage tank (14), and a connecting pipe (16) is connected between the output end of the water pump (15) and the cavity (12).

6. The ultrasonic cleaning device for stable cleaning of semiconductor wafers according to claim 5, characterized in that: One end of the connecting tube (16) is fixedly connected to the upper end of the liquid storage tank (14), the other end of the connecting tube (16) is fixedly connected to the side wall of the movable plate (11), and the connecting tube (16) is slidably connected to the side wall of the base (1).

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