Full-automatic welding machine for semiconductor chilling plate

Abstract

The utility model discloses a full-automatic welding machine for semiconductor chilling plates, which comprises a mounting seat, a position adjusting mechanism, a semiconductor chilling plate placing table and a welding mechanism, and the welding mechanism is erected above the mounting seat; the semiconductor chilling plate placing table is arranged in the welding mechanism in a horizontal moving and vertical moving mode through the position adjusting mechanism. The welding mechanism comprises a fixing frame, a heating welding assembly and a cooling assembly. The heating welding assembly and the cooling assembly are both located above the semiconductor chilling plate containing table. The heating and welding assembly is provided with a heating and welding end, the cooling assembly is provided with a cooling end, and the heating and welding end and the cooling end both face the placing face of the semiconductor chilling plate placing table. According to the full-automatic welding machine for the semiconductor chilling plate, welding of the semiconductor chilling plate can be efficiently achieved, the welding precision and the welding efficiency of the semiconductor chilling plate are improved, and the defects in the prior art are overcome.

Description

Technical Field

[0001] The utility model relates to the field of welding equipment, in particular to a welding machine for a full-automatic semiconductor refrigeration sheet. Background Art

[0002] A semiconductor refrigeration sheet is made by using the Peltier effect of semiconductor materials and can produce refrigeration or heating effects. It has the characteristics of small volume, compact structure, and convenient control of refrigeration capacity, and is widely used in products such as small refrigerators like wine refrigerators, automotive hot and cold dual-use boxes, and electronic ice cream machines. During the production and application of semiconductor refrigeration sheets, it is often necessary to weld the semiconductor refrigeration sheets to ensure their firmness.

[0003] Traditional semiconductor refrigeration sheets are mainly welded by manually holding an electric soldering iron, which has the disadvantages of large workload, poor welding stability, and low efficiency. Moreover, due to long-term repetitive manual operations, it is easy to increase work fatigue, and may also lead to welding errors due to long-term work, reducing the product yield.

[0004] In order to improve the defects caused by manual flipping, the prior art usually uses a semi-automatic welding machine to complete the welding of semiconductor refrigeration sheets. However, the above welding method still results in a relatively high labor intensity for workers, leading to a still slow welding speed and low welding efficiency; due to the high dependence of the semi-automatic welding machine on workers, after long-term repetitive manual operations by workers, it is easy to increase work fatigue, and may also lead to welding errors due to long-term work, reducing the welding precision. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a welding machine for a full-automatic semiconductor refrigeration sheet, which can efficiently realize the welding of the semiconductor refrigeration sheet, improve the welding precision and welding efficiency of the semiconductor refrigeration sheet, so as to overcome the deficiencies in the prior art.

[0006] To achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A welding machine for a full-automatic semiconductor refrigeration sheet, comprising a mounting base, a position adjusting mechanism, a semiconductor refrigeration sheet placement table, and a welding mechanism, wherein the welding mechanism is erected above the mounting base;

[0008] The position adjusting mechanism is installed on the top of the mounting base, the semiconductor refrigeration sheet placement table is installed on the top of the position adjusting mechanism, and the semiconductor refrigeration sheet placement table is horizontally and vertically movable through the position adjusting mechanism and is arranged inside the welding mechanism; the semiconductor refrigeration sheet placement table is used for placing the semiconductor refrigeration sheet to be welded, and the welding mechanism is used for heating, welding, and cooling the semiconductor refrigeration sheet to be welded;

[0009] The welding mechanism includes a fixing frame, a heating and welding component, and a cooling component. The fixing frame is erected above the mounting base. The heating and welding component and the cooling component are installed on the inner top of the fixing frame, and both the heating and welding component and the cooling component are located above the semiconductor refrigeration sheet placement table.

[0010] The heating and welding component is provided with a heating and welding end, and the cooling component is provided with a cooling end. Both the heating and welding end and the cooling end face the placement surface of the semiconductor refrigeration sheet placement table.

[0011] Further, the heating and welding component includes a first mounting rod and a heating block. The top end of the first mounting rod is connected to the inner top of the fixing frame. The heating block is prominently connected to the end of the first mounting rod, and the heating block is provided with the heating and welding end.

[0012] Further, the cooling component includes a second mounting rod and a cooling block. The top end of the second mounting rod is connected to the inner top of the fixing frame.

[0013] The cooling block is prominently connected to the end of the second mounting rod, and the cooling block is provided with the cooling end.

[0014] Further, the lower end faces of the heating and welding end and the cooling end are on the same horizontal line.

[0015] Further, the fixing frame includes a fixing plate and a plurality of vertical support rods. The plurality of vertical support rods are arranged around the mounting base. The fixing plate is erected above the mounting base through the plurality of vertical support rods.

[0016] The top ends of the first mounting rod and the second mounting rod are both connected to the bottom of the fixing plate. The vertical support rods are parallel to the first mounting rod, and the vertical support rods are parallel to the second mounting rod.

[0017] Further, the position adjusting mechanism includes a horizontal driver and a vertical adjusting component. The horizontal driver is installed on the top of the mounting base, and the horizontal output end of the horizontal driver is detachably connected to the vertical adjusting component. The vertical adjusting component is installed on the top of the mounting base through the horizontal driver.

[0018] The semiconductor refrigeration sheet placement table is installed on the top of the vertical adjusting component, and the semiconductor refrigeration sheet placement table is connected to the vertical output end of the vertical adjusting component.

[0019] The thermoelectric cooler placement table is horizontally movably installed inside the welding mechanism through the horizontal driver, and the thermoelectric cooler placement table is vertically movably installed inside the welding mechanism through the vertical adjustment assembly.

[0020] Further, the vertical adjustment assembly includes a vertical driver and a first vertical guide rod. The vertical driver is detachably connected to the horizontal output end of the horizontal driver, and the vertical output end of the vertical driver is connected to the bottom of the thermoelectric cooler placement table.

[0021] The first vertical guide rod is located between the thermoelectric cooler placement table and the vertical driver. The top end of the first vertical guide rod is connected to the bottom of the thermoelectric cooler placement table, and the end of the first vertical guide rod passes through the upper end surface of the vertical driver and can move up and down relative to the vertical driver.

[0022] Further, the position adjustment mechanism further includes a connecting seat. The connecting seat is horizontally movably installed on the top of the mounting seat, and the connecting seat is connected to the horizontal output end of the horizontal driver. The horizontal driver is used to drive the horizontal movement of the connecting seat.

[0023] The shape of the connecting seat is U-shaped, and the vertical driver is detachably installed inside the connecting seat.

[0024] Further, the thermoelectric cooler placement table includes a horizontal plate, a placement plate, and a telescopic member.

[0025] The vertical output end of the vertical driver is connected to the middle of the horizontal plate, and the first vertical guide rod is connected to the edge of the horizontal plate.

[0026] The placement plate is arranged above the horizontal plate, and the placement plate can move up and down relative to the horizontal plate.

[0027] The telescopic member is arranged between the placement plate and the horizontal plate. The placement plate is connected to the horizontal plate through the telescopic member, and the placement plate can move up and down relative to the horizontal plate through the telescopic member.

[0028] Further, the vertical driver is any one of a cylinder, an oil cylinder, and a motor; the horizontal driver is a rod-guided rodless cylinder.

[0029] The technical solutions provided by the embodiments of the present application may include the following beneficial effects: According to the relative position between the semiconductor refrigeration sheet to be welded and the heating welding assembly, the position adjusting mechanism is used to adjust the horizontal position and vertical position of the semiconductor refrigeration sheet placement table, so as to adjust the horizontal position and vertical position of the semiconductor refrigeration sheet to be welded. After the relative position between the semiconductor refrigeration sheet to be welded and the heating welding assembly is appropriate, the heating welding assembly heats the semiconductor refrigeration sheet to be welded until the solder paste applied at the welding position of the semiconductor refrigeration sheet to be welded melts, and the heating welding is completed; when the heating welding of the semiconductor refrigeration sheet to be welded is completed, the position adjusting mechanism is used to adjust the horizontal position and vertical position of the semiconductor refrigeration sheet placement table again, so as to adjust the relative position between the heated and welded semiconductor refrigeration sheet and the cooling assembly. After the relative position between the heated and welded semiconductor refrigeration sheet and the cooling assembly is appropriate, the cooling assembly cools and solidifies the heated and welded semiconductor refrigeration sheet. After the solder paste melted by heating cools and solidifies, the welding of the semiconductor refrigeration sheet is completed. A welding machine for a fully automatic semiconductor refrigeration sheet proposed by this solution can efficiently realize the welding of the semiconductor refrigeration sheet and improve the welding accuracy and welding efficiency of the semiconductor refrigeration sheet. Description of the Drawings

[0030] Figure 1 is a schematic structural diagram of a welding machine for a fully automatic semiconductor refrigeration sheet of the present utility model.

[0031] Figure 2 is a schematic structural diagram of another angle of a welding machine for a fully automatic semiconductor refrigeration sheet of the present utility model.

[0032] Figure 3 is a schematic structural diagram of the welding mechanism 4 in a welding machine for a fully automatic semiconductor refrigeration sheet of the present utility model.

[0033] Wherein: mounting seat 1, position adjusting mechanism 2, horizontal driver 21, vertical driver 22, first vertical guide rod 23, connecting seat 24, semiconductor refrigeration sheet placement table 3, horizontal plate 31, placement plate 32, second vertical guide rod 33, welding mechanism 4, fixing frame 41, fixing plate 411, vertical support rod 412, heating welding assembly 42, first mounting rod 421, heating block 422, cooling assembly 43, second mounting rod 431, cooling block 432. Detailed Embodiments

[0034] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation of the present utility model.

[0035] This technical solution provides a welding machine for a fully automatic semiconductor refrigeration chip, including a mounting base 1, a position adjusting mechanism 2, a semiconductor refrigeration chip placing table 3, and a welding mechanism 4. The welding mechanism 4 is erected above the mounting base 1;

[0036] The position adjusting mechanism 2 is installed on the top of the mounting base 1. The semiconductor refrigeration chip placing table 3 is installed on the top of the position adjusting mechanism 2, and the semiconductor refrigeration chip placing table 3 is horizontally and vertically movable through the position adjusting mechanism 2 and is arranged inside the welding mechanism 4. The semiconductor refrigeration chip placing table 3 is used to place the semiconductor refrigeration chip to be welded, and the welding mechanism 4 is used to heat-weld and cool the semiconductor refrigeration chip to be welded;

[0037] The welding mechanism 4 includes a fixing frame 41, a heating welding assembly 42, and a cooling assembly 43. The fixing frame 41 is erected above the mounting base 1. The heating welding assembly 42 and the cooling assembly 43 are installed on the inner top of the fixing frame 41, and both the heating welding assembly 42 and the cooling assembly 43 are located above the semiconductor refrigeration chip placing table 3;

[0038] The heating welding assembly 42 is provided with a heating welding end, and the cooling assembly 43 is provided with a cooling end, and both the heating welding end and the cooling end face the placing surface of the semiconductor refrigeration chip placing table 3.

[0039] In order to overcome the technical problems of low welding efficiency and low welding precision of the semiconductor refrigeration chip welding machine in the prior art, this technical solution proposes a welding machine for a fully automatic semiconductor refrigeration chip, as Figures 1 to 3 shown, including a mounting base 1, a position adjusting mechanism 2, a semiconductor refrigeration chip placing table 3, and a welding mechanism 4; the welding mechanism 4 is erected above the mounting base 1; the position adjusting mechanism 2 is installed on the top of the mounting base 1; the semiconductor refrigeration chip placing table 3 is located above the position adjusting mechanism 2, and the semiconductor refrigeration chip placing table 3 is horizontally and vertically movable through the position adjusting mechanism 2 and is arranged inside the welding mechanism 4. The semiconductor refrigeration chip placing table 3 is used to place the semiconductor refrigeration chip to be welded, so that the position adjusting mechanism 2 can adjust the position of the semiconductor refrigeration chip to be welded inside the welding mechanism 4 according to the position of the semiconductor refrigeration chip to be welded inside the welding mechanism 4, making the position of the semiconductor refrigeration chip to be welded inside the welding mechanism 4 appropriate, and then using the welding mechanism 4 to heat-weld and cool the semiconductor refrigeration chip to be welded, which is beneficial to improving the welding precision of the semiconductor refrigeration chip and at the same time improving the applicability of the device.

[0040] Furthermore, the welding mechanism 4 includes a fixing frame 41, a heating and welding component 42, and a cooling component 43. Both the heating and welding component 42 and the cooling component 43 are located above the semiconductor refrigeration sheet placement table 3. The heating and welding component 42 is provided with a heating and welding end, and the cooling component 43 is provided with a cooling end. Both the heating and welding end and the cooling end face the placement surface of the semiconductor refrigeration sheet placement table 3. The heating and welding component 42 is used to heat and weld the semiconductor refrigeration sheet to be welded, and the cooling component 43 is used to cool and solidify the semiconductor refrigeration sheet after heating and welding, avoiding affecting the yield of the semiconductor refrigeration sheet after heating and welding due to insufficient cooling and solidification.

[0041] The working process of the welding machine in this technical solution is as follows: According to the relative position between the semiconductor refrigeration sheet to be welded and the heating and welding component 42, the position adjustment mechanism 2 is used to adjust the horizontal position and vertical position of the semiconductor refrigeration sheet placement table 3, so as to adjust the horizontal position and vertical position of the semiconductor refrigeration sheet to be welded. After the relative position between the semiconductor refrigeration sheet to be welded and the heating and welding component 42 is appropriate, the heating and welding component 42 heats the semiconductor refrigeration sheet to be welded until the solder paste applied to the welding area of the semiconductor refrigeration sheet to be welded melts, completing the heating and welding. When the semiconductor refrigeration sheet to be welded is completed with heating and welding, the position adjustment mechanism 2 is used again to adjust the horizontal position and vertical position of the semiconductor refrigeration sheet placement table 3, so as to adjust the relative position between the semiconductor refrigeration sheet after heating and welding and the cooling component 43. After the relative position between the semiconductor refrigeration sheet after heating and welding and the cooling component 43 is appropriate, the cooling component 43 cools and solidifies the semiconductor refrigeration sheet after heating and welding. After the melted solder paste cools and solidifies, the welding of the semiconductor refrigeration sheet is completed. A fully automatic welding machine for semiconductor refrigeration sheets proposed in this solution can efficiently realize the welding of semiconductor refrigeration sheets, improving the welding accuracy and welding efficiency of semiconductor refrigeration sheets.

[0042] It should be noted that the semiconductor refrigeration sheet in this technical solution generally includes a hot end substrate, a cold end substrate, and a P-N type thermocouple pair (leg) disposed between the hot end substrate and the cold end substrate. One end of the P-N type thermocouple pair is connected to the hot end substrate through an electrode, and the other end of the P-N type thermocouple pair is connected to the cold end substrate through another electrode. The semiconductor refrigeration sheet mainly utilizes the Peltier effect of the thermoelectric semiconductor material of the P-N type thermocouple pair (the Peltier effect refers to the phenomenon that when a direct current passes through an electric couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat) to achieve one end being cold and the other end being hot, forming a temperature difference at both ends of the semiconductor refrigeration sheet. When the heat at the hot end of the semiconductor refrigeration sheet is released, a certain amount of cold is generated at the cold end of the semiconductor refrigeration sheet, completing the refrigeration.

[0043] Further explanation, the heating and welding assembly 42 includes a first mounting rod 421 and a heating block 422. The top end of the first mounting rod 421 is connected to the inner top of the fixing frame 41. The heating block 422 is prominently connected to the end of the first mounting rod 421, and the heating and welding end is provided on the heating block 422.

[0044] In a preferred embodiment of this technical solution, the heating and welding assembly 42 includes a first mounting rod 421 and a heating block 422. The heating and welding assembly 42 is mounted on the inner top of the fixing frame 41 by using the first mounting rod 421, and the thermoelectric cooler to be welded is heated and welded by using the thermal welding end of the heating block 422, thus successfully completing the heating and welding process, which is simple and convenient.

[0045] It should be noted that the heating block 422 can be heated by a heating rod. Among them, the heating rod has a fast temperature rise and can increase the upper limit of the heating temperature of the heating block 422. At the same time, the heating plate can also be heated by semiconductor heating, which is not limited herein.

[0046] Further explanation, the cooling assembly 43 includes a second mounting rod 431 and a cooling block 432. The top end of the second mounting rod 431 is connected to the inner top of the fixing frame 41;

[0047] The cooling block 432 is prominently connected to the end of the second mounting rod 431, and the cooling end is provided on the cooling block 432.

[0048] In a preferred embodiment of this technical solution, the cooling assembly 43 includes a second mounting rod 431 and a cooling block 432. The cooling assembly 43 is mounted on the inner top of the fixing frame 41 by using the second mounting rod 431, and the thermoelectric cooler after heating and welding is cooled and solidified by using the cooling end of the cooling block 432, thus successfully completing the cooling and solidification process, which is simple and convenient.

[0049] It should be noted that the cooling block 432 can use external water circulation to cool down to achieve the purpose of rapid cooling. At the same time, the cooling block 432 can also use semiconductor cooling and normal temperature cooling, which is not limited herein.

[0050] Further explanation, the lower end surfaces of the heating and welding end and the cooling end are located on the same horizontal line.

[0051] In a preferred embodiment of this technical solution, by limiting the lower end surfaces of the heating and welding end and the cooling end to be on the same horizontal line, after the thermoelectric cooler is heated and welded, only horizontal position adjustment is required to cool and solidify the thermoelectric cooler after heating and welding by using the cooling end, thus improving the welding efficiency.

[0052] Further illustration, the fixing frame 41 includes a fixing plate 411 and a plurality of vertical support rods 412. The plurality of vertical support rods 412 are arranged around the mounting base 1, and the fixing plate 411 is erected above the mounting base 1 through the plurality of vertical support rods 412;

[0053] The top ends of the first mounting rod 421 and the second mounting rod 431 are both connected to the bottom of the fixing plate 412, and the vertical support rod 412 is parallel to the first mounting rod 421, and the vertical support rod 412 is parallel to the second mounting rod 431.

[0054] In a preferred embodiment of the present technical solution, by providing the fixing plate 411 and a plurality of vertical support rods 412, the installation firmness of the welding mechanism 4 is ensured, which is beneficial to improving the welding precision.

[0055] Further illustration, the position adjusting mechanism 2 includes a transverse driver 21 and a vertical adjusting component; the transverse driver 21 is installed on the top of the mounting base 1, and the transverse output end of the transverse driver 21 is detachably connected to the vertical adjusting component, and the vertical adjusting component is installed on the top of the mounting base 1 through the transverse driver 21;

[0056] The semiconductor refrigeration sheet placing table 3 is installed on the top of the vertical adjusting component, and the semiconductor refrigeration sheet placing table 3 is connected to the vertical output end of the vertical adjusting component;

[0057] The semiconductor refrigeration sheet placing table 3 is horizontally movably installed inside the welding mechanism 4 through the transverse driver 21, and the semiconductor refrigeration sheet placing table 3 is vertically movably installed inside the welding mechanism 4 through the vertical adjusting component.

[0058] In a preferred embodiment of the present technical solution, the horizontal displacement and vertical movement of the semiconductor refrigeration sheet placing table 3 are adjusted by providing the transverse driver 21 and the vertical adjusting component. Specifically: the semiconductor refrigeration sheet placing table 3 horizontally moves inside the welding mechanism 4 through the transverse driver 21, so that the distance in the horizontal direction of the semiconductor refrigeration sheet placing table 3 can be adjusted; the semiconductor refrigeration sheet placing table 3 vertically moves inside the welding mechanism 4 through the vertical adjusting component, so that the position in the vertical direction of the semiconductor refrigeration sheet placing table 3 can be adjusted. Thus, the position adjusting mechanism 2 can adjust the position of the semiconductor refrigeration sheet to be welded inside the welding mechanism 4 according to the position of the semiconductor refrigeration sheet to be welded on the semiconductor refrigeration sheet placing table 3 inside the welding mechanism 4, so that the position of the semiconductor refrigeration sheet to be welded inside the welding mechanism 4 is appropriate, which is beneficial to improving the welding precision of the semiconductor refrigeration sheet and at the same time improving the applicability of the device, and the adjustment process is simple and efficient.

[0059] Further explanation, the vertical adjustment component includes a vertical driver 22 and a first vertical guide rod 23. The vertical driver 22 is detachably connected to the horizontal output end of the horizontal driver 21, and the vertical output end of the vertical driver 22 is connected to the bottom of the semiconductor refrigeration sheet placement table 3;

[0060] The first vertical guide rod 23 is located between the semiconductor refrigeration sheet placement table 3 and the vertical driver 22. The top end of the first vertical guide rod 23 is connected to the bottom of the semiconductor refrigeration sheet placement table 3, and the end of the first vertical guide rod 23 passes through the upper end surface of the vertical driver 22 and can move up and down relative to the vertical driver 22.

[0061] In a preferred embodiment of this technical solution, by setting the vertical driver 22, the vertical movement of the semiconductor refrigeration sheet placement table 3 is realized by using the vertical driver 22; by setting the first vertical guide rod 23, it plays a guiding role in the vertical movement of the semiconductor refrigeration sheet placement table 3, making the vertical movement of the semiconductor refrigeration sheet placement table 3 more stable, thereby further improving the welding accuracy.

[0062] Further explanation, the position adjustment mechanism 2 further includes a connecting seat 24. The connecting seat 24 is horizontally movably installed on the top of the mounting seat 1, and the connecting seat 24 is connected to the horizontal output end of the horizontal driver 21. The horizontal driver 21 is used to drive the horizontal movement of the connecting seat 24;

[0063] The connecting seat 24 is in a U shape, and the vertical driver 22 is detachably installed inside the connecting seat 24.

[0064] In a preferred embodiment of this technical solution, by setting the connecting seat 24, the horizontal driver 21 and the vertical adjustment component are detachably connected. When one of them is damaged, it is convenient to replace or repair it.

[0065] Further explanation, the semiconductor refrigeration sheet placement table 3 includes a horizontal plate 31, a placement plate 32 and a telescopic member;

[0066] The vertical output end of the vertical driver 22 is connected to the middle of the horizontal plate 31, and the first vertical guide rod 23 is connected to the edge of the horizontal plate 31;

[0067] The placement plate 32 is arranged above the horizontal plate 31, and the placement plate 32 can move up and down relative to the horizontal plate 31;

[0068] A telescopic member is provided between the placement plate 32 and the horizontal plate 31. The placement plate 32 is connected to the horizontal plate 31 through the telescopic member, and the placement plate 32 can move up and down relative to the horizontal plate 31 through the telescopic member.

[0069] In a preferred embodiment of the present technical solution, by providing a horizontal plate 31, a placement plate 32, and a telescopic member (not shown in the figure), the vertical movement of the horizontal plate 31 is driven by the vertical driver 22, thereby driving the up and down movement of the placement plate 32 and the telescopic member, and finally realizing the up and down movement of the semiconductor refrigeration chip placement table 3, which is simple and efficient.

[0070] Furthermore, due to the provision of the telescopic member, when the semiconductor refrigeration chip to be welded is too tightly pressed against the heating and welding assembly 42 and the semiconductor refrigeration chip after heating and welding is too tightly pressed against the cooling assembly 43, the telescopic member enables the placement plate 32 to move up and down relative to the horizontal plate 31, thereby finely adjusting the distance between the semiconductor refrigeration chip to be welded and the heating and welding assembly 42 and between the semiconductor refrigeration chip after heating and welding and the cooling assembly 43, and avoiding damage to the semiconductor refrigeration chip.

[0071] In some embodiments, the telescopic member includes a second vertical guide rod 33 and a spring; the second vertical guide rod 33 is provided between the horizontal plate 31 and the placement plate 32, and the top end of the second vertical guide rod 33 is connected to the placement plate 32. The end of the second vertical guide rod 33 passes through the horizontal plate 31 and can move up and down relative to the horizontal plate 31; the spring is sleeved outside the second vertical guide rod 33, and one end of the spring abuts against the top of the horizontal plate 31, and the other end of the spring abuts against the bottom of the placement plate 32.

[0072] By providing the second vertical guide rod 33 and the spring, the spring is used to connect the horizontal plate 31 and the placement plate 32, and the placement plate 32 can move up and down relative to the horizontal plate 31. The second vertical guide rod 33 is used to improve the connection firmness between the horizontal plate 31 and the placement plate 32 and the stability of the up and down movement of the placement plate 32 relative to the horizontal plate 31, thereby improving the stability of the semiconductor refrigeration chip placement table 3.

[0073] Further explanation, the vertical driver 22 is any one of a cylinder, an oil cylinder, and a motor; the horizontal driver 21 is a rod-guided rodless cylinder.

[0074] In a preferred embodiment of the present technical solution, since the cylinder, the oil cylinder, and the motor have the characteristics of simple structure and high cost performance, the vertical adjustment assembly in the present technical solution selects a cylinder, an oil cylinder, or a motor to meet the actual use requirements.

[0075] Compared with ordinary cylinders, the rodless cylinder with guide rods can save half of the installation space under the same stroke, featuring space saving and precise positioning. At the same time, the guide rods in the rodless cylinder with guide rods can guide the sliding of the slider (i.e., the lateral output end) in the rodless cylinder, ensuring the stability of horizontal movement.

[0076] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular forms are also intended to include the plural forms. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they specify the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0077] Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be regarded as part of the authorized specification. In all the examples shown and discussed here, any specific value should be interpreted as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0078] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom" are generally based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description. Without contrary description, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus should not be construed as limiting the protection scope of the present invention; the orientation words "inner, outer" refer to the inside and outside relative to the contour of each component itself.

[0079] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0080] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0081] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0082] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A fully automatic semiconductor refrigeration plate welding machine, characterized in that: It includes a mounting seat, a position adjustment mechanism, a semiconductor cooling sheet placement platform and a welding mechanism, wherein the welding mechanism is arranged above the mounting seat; The position adjustment mechanism is installed on the top of the mounting seat, the semiconductor refrigeration plate placement platform is installed on the top of the position adjustment mechanism, and the semiconductor refrigeration plate placement platform is arranged inside the welding mechanism through horizontal and vertical movement of the position adjustment mechanism; the semiconductor refrigeration plate placement platform is used to place the semiconductor refrigeration plate to be welded, and the welding mechanism is used to heat, weld and cool the semiconductor refrigeration plate to be welded; The welding mechanism comprises a fixing frame, a heating welding assembly and a cooling assembly, wherein the fixing frame is mounted above the mounting seat, the heating welding assembly and the cooling assembly are mounted on the inner top of the fixing frame, and the heating welding assembly and the cooling assembly are both located above the semiconductor refrigeration sheet placement table; The heating welding component is provided with a heating welding end, and the cooling component is provided with a cooling end, and both the heating welding end and the cooling end face the placement surface of the semiconductor refrigeration plate placement table.

2. The fully automatic semiconductor refrigeration plate welding machine according to claim 1 is characterized in that: The heating and welding assembly includes a first mounting rod and a heating block, the top end of the first mounting rod is connected to the inner top of the fixing frame, the heating block is protrudingly connected to the end of the first mounting rod, and the heating block is provided with the heating and welding end.

3. The fully automatic semiconductor refrigeration plate welding machine according to claim 2, characterized in that: The cooling assembly includes a second mounting rod and a cooling block, wherein the top end of the second mounting rod is connected to the inner top of the fixing frame; The cooling block is protrudingly connected to the end of the second mounting rod, and the cooling block is provided with the cooling end.

4. The fully automatic semiconductor refrigeration plate welding machine according to claim 1, characterized in that: The lower end surface of the heating and welding end and the lower end surface of the cooling end are located on the same horizontal line.

5. The fully automatic semiconductor refrigeration plate welding machine according to claim 3 is characterized in that: The fixing frame includes a fixing plate and a plurality of vertical supporting rods, the plurality of vertical supporting rods are arranged around the mounting seat, and the fixing plate is mounted above the mounting seat through the plurality of vertical supporting rods; The top ends of the first mounting rod and the second mounting rod are both connected to the bottom of the fixing plate, and the vertical support rod is parallel to the first mounting rod, and the vertical support rod is parallel to the second mounting rod.

6. The fully automatic semiconductor refrigeration plate welding machine according to claim 1, characterized in that: The position adjustment mechanism includes a transverse driver and a vertical adjustment component; the transverse driver is installed on the top of the mounting seat, and the transverse output end of the transverse driver is detachably connected to the vertical adjustment component, and the vertical adjustment component is installed on the top of the mounting seat through the transverse driver; The semiconductor refrigeration plate placement platform is installed on the top of the vertical adjustment component, and the semiconductor refrigeration plate placement platform is connected to the vertical output end of the vertical adjustment component; The semiconductor refrigeration plate placement table is installed in the interior of the welding mechanism in a horizontally movable manner through the transverse driver, and the semiconductor refrigeration plate placement table is installed in the interior of the welding mechanism in a vertically movable manner through the vertical adjustment component.

7. The fully automatic semiconductor refrigeration plate welding machine according to claim 6, characterized in that: The vertical adjustment assembly includes a vertical driver and a first vertical guide rod, wherein the vertical driver is detachably connected to a horizontal output end of the horizontal driver, and the vertical output end of the vertical driver is connected to the bottom of the semiconductor cooling sheet placement table; The first vertical guide rod is located between the semiconductor refrigeration plate placement platform and the vertical driver, and the top end of the first vertical guide rod is connected to the bottom of the semiconductor refrigeration plate placement platform, and the end of the first vertical guide rod passes through the upper end surface of the vertical driver and can move up and down relative to the vertical driver.

8. The fully automatic semiconductor refrigeration plate welding machine according to claim 7, characterized in that: The position adjustment mechanism further comprises a connecting seat, which is horizontally movably mounted on the top of the mounting seat, and the connecting seat is connected to the horizontal output end of the horizontal driver, and the horizontal driver is used to drive the horizontal movement of the connecting seat; The connection seat is in a U-shape, and the vertical driver is detachably mounted inside the connection seat.

9. The fully automatic semiconductor refrigeration plate welding machine according to claim 7, characterized in that: The semiconductor refrigeration plate placement table includes a horizontal plate, a placement plate and a telescopic member; The vertical output end of the vertical driver is connected to the middle of the horizontal plate, and the first vertical guide rod is connected to the edge of the horizontal plate; The placing plate is arranged above the horizontal plate, and the placing plate can move up and down relative to the horizontal plate; The telescopic member is arranged between the placement plate and the horizontal plate, the placement plate is connected to the horizontal plate via the telescopic member, and the placement plate can move up and down relative to the horizontal plate via the telescopic member.

10. The fully automatic semiconductor refrigeration plate welding machine according to claim 7, characterized in that: The vertical driver is any one of an air cylinder, an oil cylinder and a motor; the transverse driver is a rodless air cylinder with a guide rod.

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