Silicon carbide crystal ingot edge grinding device

By designing a silicon carbide ingot edge grinding device that integrates positioning edge milling unit and surface grinding unit, the problems of low production efficiency and low integration in traditional technology are solved, and efficient silicon carbide ingot processing is achieved.

CN223029296UActive Publication Date: 2025-06-27JIANGSU HUANYANG COMBINATION MACHINE
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Patent Information

Application Number
CN202422082730.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-27
Publication Date
2025-06-27
Estimated Expiration
2034-08-27

AI Technical Summary

Technical Problem

During the milling and edge cutting and grinding process, traditional silicon carbide ingots have low production efficiency and low integration, resulting in long intermediate transport time, easy to bump, and affecting product quality.

Method used

A silicon carbide ingot edge grinding device is designed, including a positioning edge milling unit and a surface grinding unit, both installed on a supporting base plate, milling and grinding are achieved through a milling grinding wheel and a grinding motor, and a chamfering grinding unit is integrated in the device for grinding the milling grinding wheel.

Benefits of technology

It effectively reduces the time spent on silicon carbide ingots in milling and grinding, improves processing efficiency, reduces turnover time and collision risks, and improves product quality.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223029296U_ABST
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Abstract

The utility model relates to an edge grinding device for a silicon carbide crystal ingot. The edge grinding device is characterized by comprising a positioning edge milling unit and a surface grinding unit, the positioning edge milling unit and the surface grinding unit are both mounted on a supporting bottom plate; according to the utility model, a milling structure and a grinding structure of the silicon carbide crystal ingot and a structure for grinding the milling grinding wheel are integrated on the device, so that the milling and grinding time of the silicon carbide crystal ingot can be effectively shortened, and the milling and grinding efficiency of the silicon carbide crystal ingot is improved; and the turnover time of the silicon carbide crystal ingot is shortened, and meanwhile the collision risk is reduced.
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Description

Technical Field

[0001] The utility model relates to the technical field of silicon carbide ingot processing, in particular to a silicon carbide ingot edge grinding and lapping device. Background Technique

[0002] Silicon carbide (SiC) is a third-generation semiconductor material with excellent physical properties such as a large bandgap, high thermal conductivity, and high saturated electron mobility. It is often used in fields such as high temperature, high frequency, radiation resistance, energy conservation, and communication. The produced SiC-based electronic devices have the advantages of small size, small forward conduction resistance, low switching loss, and high response frequency.

[0003] When processing a silicon carbide ingot, it is necessary to mill a positioning edge on the silicon carbide ingot and then perform lapping subsequently. Conventional silicon carbide ingots are milled and lapped on two sets of equipment during processing. The intermediate transfer time is long, the processing efficiency is not high, and it is easy to have bumps during the transfer process, affecting the product quality. Due to the high hardness of the silicon carbide ingot and the serious wear of the conventional grinding wheel structure during milling the silicon carbide, it is easy to have problems with unsmooth milling edges. It is necessary to frequently polish to maintain the sharpness and efficiency of milling. It is more inconvenient to change the grinding wheel for polishing, and the operation is troublesome. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is to provide a silicon carbide ingot edge grinding and lapping device, which can solve the problems of low production efficiency and low integration degree in the milling and lapping of traditional silicon carbide ingots.

[0005] To solve the above technical problems, the technical solution of the utility model is: a silicon carbide ingot edge grinding and lapping device, and its innovation lies in: including a positioning edge milling unit and a surface lapping unit; both the positioning edge milling unit and the surface lapping unit are installed on a support bottom plate;

[0006] The positioning edge milling unit includes a support frame, a positioning seat, an edge grinding table, a cylinder arm, a pressing cylinder, and a milling grinding wheel. The support frame is arranged vertically at a position near the edge of the support bottom plate. The positioning seat is in a plate-like structure and is arranged vertically on the top of the support frame. At the edge of the positioning seat, there are several U-shaped bolt locking grooves, and locking blocks are connected by bolts at the bolt locking grooves. The edge grinding table is arranged on one side of the positioning seat, and the edge grinding table is fixedly locked on the surface of the positioning seat by the cooperation of the locking block and the bolt. The top of the edge grinding table is horizontally formed into a milling platform, and the overall outer contour is in a superior arc structure. The cylinder arm is in an L-shaped structure, and one end of the cylinder arm is connected to the positioning seat. The other side surface of the cylinder arm horizontally extends to the surface of the edge grinding table and is parallel to the surface of the edge grinding table. A pressing cylinder is horizontally arranged on the side surface of the cylinder arm parallel to the edge grinding table, and the axis direction of the pressing cylinder is perpendicular to the surface of the edge grinding table. The output end of the pressing cylinder is provided with a pressing block, and a clamping gap for accommodating the silicon carbide ingot is formed between the pressing block and the edge grinding table. The milling grinding wheel is horizontally arranged above the edge grinding table, and the milling grinding wheel is driven to rotate by a milling motor. The milling motor is driven by a three-degree-of-freedom power source to move in the horizontal direction, vertical direction, and front-back direction, and drives the milling grinding wheel driven by the milling motor to mill a straight positioning edge on the silicon carbide ingot clamped on the edge grinding table.

[0007] The surface grinding unit includes a support base, a silicon carbide ingot clamping table, and a grinding motor. The support base is arranged on the upper surface of the support bottom plate, and a silicon carbide ingot clamping table is installed at the top of the support base. A concave cavity for accommodating the silicon carbide ingot is formed at the center of the upper surface of the silicon carbide ingot clamping table, and a straight side wall for cooperating with the straight positioning edge on the silicon carbide ingot is arranged in the concave cavity. Positioning blocks are arranged at the edge of the concave cavity on the silicon carbide ingot clamping table, and the positioning blocks are locked at the edge of the silicon carbide ingot clamping table by bolts. The positioning blocks extend above the concave cavity and are locked and pressed on the silicon carbide ingot in the concave cavity by bolts. The grinding motor is arranged above the concave cavity of the silicon carbide ingot clamping table, and a grinding disc is horizontally arranged at the output end of the grinding motor. The grinding motor is driven by a three-degree-of-freedom power source to move in the horizontal direction, vertical direction, and front-back direction, and drives the grinding disc driven by the grinding motor to grind the surface of the silicon carbide ingot.

[0008] Further, a chamfer grinding unit is provided between the support frame and the support base on the support bottom plate; the chamfer grinding unit includes a grinding frame, a grinding seat, a grinding motor and a grinding wheel; the grinding frame is installed on the support bottom plate; the grinding seat is arranged obliquely on the grinding frame; the grinding motor is installed on the grinding seat, and a grinding wheel is arranged at the output end of the grinding motor; the axis direction of the grinding wheel is inclined at an angle to the axis direction of the milling wheel. By moving the milling wheel to the position of the grinding wheel, the outer contour of the milling wheel is ground sharp by the grinding wheel, so as to improve the milling efficiency of the edge of the milling wheel.

[0009] The advantages of the present utility model are as follows:

[0010] 1) In the present utility model, the milling structure, grinding structure of the silicon carbide ingot and the structure for grinding the milling wheel are all integrated on the device, which can effectively reduce the time spent in milling and grinding the silicon carbide ingot, improve the milling and grinding efficiency of the silicon carbide ingot; reduce the turnover time of the silicon carbide ingot, and at the same time reduce the risk of bumping. Description of the Drawings

[0011] The following further describes the present utility model in detail with reference to the drawings and specific embodiments.

[0012] Figure 1 It is the front view of a silicon carbide ingot edge grinding and grinding device of the present utility model.

[0013] Figure 2 It is the side view of a silicon carbide ingot edge grinding and grinding device of the present utility model. Specific Embodiments

[0014] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model. Obviously, the described embodiments are some but not all of the embodiments of the present utility model. Usually, the components of the embodiments of the present utility model described and shown here can be arranged and designed in various different configurations.

[0015] Therefore, the following detailed description of the embodiments of the present utility model provided in the drawings is not intended to limit the scope of the present utility model to be protected, but merely represents the selected embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the protection scope of the present utility model.

[0016] Such as Figure 1 Figure 2A silicon carbide ingot edge grinding and lapping device as shown includes a positioning edge milling unit 1 and a surface lapping unit 2; the positioning edge milling unit 1 and the surface lapping unit 2 are both installed on a support base plate 3.

[0017] The positioning edge milling unit 1 includes a support frame 11, a positioning seat 12, an edge grinding table 13, a cylinder arm 14, a pressing cylinder 15, and a milling grinding wheel 16; the support frame 11 is arranged along the vertical direction at a position close to the edge on the support base plate 3; the positioning seat 12 is in a plate-like structure and is arranged along the vertical direction at the top of the support frame 11; several U-shaped bolt locking grooves are arranged at the edge of the positioning seat 12, and locking blocks are connected by bolts at the bolt locking grooves; the edge grinding table 13 is arranged on one side of the positioning seat 12, and the edge grinding table 13 is fixedly locked on the surface of the positioning seat 12 through the cooperation of the locking block and the bolt; the top of the edge grinding table 13 is horizontal to form a milling platform, and the overall outer contour is in a superior arc structure; the cylinder arm 14 is in an L-shaped structure, and one end of the cylinder arm 14 is connected to the positioning seat 12, the other side surface of the cylinder arm 14 horizontally extends to the surface of the edge grinding table 13 and is parallel to the surface of the edge grinding table 13, and a pressing cylinder 15 is horizontally arranged on the side surface of the cylinder arm 14 parallel to the edge grinding table 13, and the axis direction of the pressing cylinder 15 is perpendicular to the surface of the edge grinding table 13; a pressing block is arranged at the output end of the pressing cylinder 15, and a clamping gap for accommodating the silicon carbide ingot is formed between the pressing block and the edge grinding table 13; the milling grinding wheel 16 is horizontally arranged above the edge grinding table 13, and the milling grinding wheel 16 is driven to rotate by a milling motor 17, and the milling motor 17 is driven by a three-degree-of-freedom power source to realize movements in the horizontal direction, vertical direction, and front-back direction, and drives the milling grinding wheel 16 driven by the milling motor to mill a straight positioning edge on the silicon carbide ingot clamped on the edge grinding table 13.

[0018] The surface lapping unit 2 includes a support base 21, a silicon carbide ingot clamping table 22, and a lapping motor 23; the support base 21 is arranged on the upper surface of the support base plate 3, and a silicon carbide ingot clamping table 22 is installed at the top of the support base 21; a concave cavity for accommodating the silicon carbide ingot is opened at the center of the upper surface of the silicon carbide ingot clamping table 22, and a straight side wall for cooperating with the straight positioning edge on the silicon carbide ingot is arranged in the concave cavity; positioning blocks 24 are arranged at the edge of the concave cavity on the silicon carbide ingot clamping table 22, and the positioning blocks 24 are locked by bolts at the edge of the silicon carbide ingot clamping table, and the positioning blocks 24 extend above the concave cavity and are locked and pressed on the silicon carbide ingot in the concave cavity by bolts; the lapping motor 23 is arranged above the concave cavity of the silicon carbide ingot clamping table 22, and a lapping disc is horizontally arranged at the output end of the lapping motor 23; the lapping motor 23 is driven by a three-degree-of-freedom power source to realize movements in the horizontal direction, vertical direction, and front-back direction, and drives the lapping disc driven by the lapping motor to lap the surface of the silicon carbide ingot.

[0019] A chamfer grinding unit 4 is arranged on the support base plate 3 between the support frame and the support base; the chamfer grinding unit 4 includes a grinding frame 41, a grinding seat 42, a grinding motor 43 and a grinding wheel 44; the grinding frame 41 is installed on the support base plate 3; the grinding seat 42 is arranged obliquely on the grinding frame 41; the grinding motor 43 is installed on the grinding seat 42, and a grinding wheel 44 is arranged at the output end of the grinding motor 43; the axial direction of the grinding wheel 44 forms an inclined angle with the axial direction of the milling wheel 16. By moving the milling wheel 16 to the position of the grinding wheel 44, the outer contour of the milling wheel 16 is ground sharp by the grinding wheel 44, so as to improve the milling efficiency of the edge of the milling wheel 16.

[0020] The working principle of the present utility model is that the milling structure, grinding structure of the silicon carbide ingot and the structure for grinding the milling wheel are all integrated on this device, which can effectively reduce the time spent on milling and grinding the silicon carbide ingot, improve the milling and grinding efficiency of the silicon carbide ingot; reduce the turnover time of the silicon carbide ingot, and at the same time reduce the risk of bumping.

[0021] Those skilled in the art should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principle of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed.

Claims

1. A silicon carbide ingot edge grinding device, characterized in that: It includes a positioning edge milling unit and a surface grinding unit; the positioning edge milling unit and the surface grinding unit are both mounted on a supporting base plate; The positioning edge milling unit comprises a support frame, a positioning seat, an edge grinding table, a cylinder arm, a clamping cylinder and a milling grinding wheel; the support frame is arranged at a position close to the edge of the support base plate along the vertical direction; the positioning seat is a plate-shaped structure and is arranged on the top end of the support frame along the vertical direction; a plurality of U-shaped bolt locking grooves are arranged at the edge of the positioning seat, and a locking block is connected to the bolt locking groove by bolts; the edge grinding table is arranged on one side of the positioning seat, and the edge grinding table is fixed to the surface of the positioning seat by locking the locking block and the bolts; the top end of the edge grinding table is horizontal to form a milling platform, and the overall outer contour is an arc structure; the cylinder arm is an L-shaped structure, and one end of the cylinder arm is connected to the Connected to the positioning seat, the other side of the cylinder arm horizontally extends to the surface of the edge grinding table and is parallel to the surface of the edge grinding table, and a clamping cylinder is horizontally arranged on the side of the cylinder arm parallel to the edge grinding table, and the axial direction of the clamping cylinder is perpendicular to the surface of the edge grinding table; a clamping block is arranged at the output end of the clamping cylinder, and a clamping gap for accommodating the silicon carbide ingot is formed between the clamping block and the edge grinding table; the milling wheel is horizontally arranged above the edge grinding table, and the milling wheel is driven to rotate by a milling motor, and the milling motor is driven by a three-degree-of-freedom power source to realize horizontal, vertical and front-to-back movements, and drives the milling wheel driven by the milling motor to mill a straight positioning edge for the silicon carbide ingot clamped on the edge grinding table; The surface grinding unit comprises a support base, a silicon carbide ingot clamping platform and a grinding motor; the support base is arranged on the upper surface of the support bottom plate and the silicon carbide ingot clamping platform is installed on the top of the support base; the upper surface of the silicon carbide ingot clamping platform is provided with a concave cavity for accommodating the silicon carbide ingot at the center, and the concave cavity is provided with a straight side wall matched with the straight positioning edge on the silicon carbide ingot; a positioning block is arranged on the silicon carbide ingot clamping platform at the edge of the concave cavity, and the positioning block is locked at the edge of the silicon carbide ingot clamping platform by bolts, and the positioning block extends to the top of the concave cavity and is locked and pressed on the silicon carbide ingot in the concave cavity by bolts; the grinding motor is arranged above the concave cavity of the silicon carbide ingot clamping platform, and a grinding disc is horizontally arranged at the output end of the grinding motor; the grinding motor is driven by a three-degree-of-freedom power source to realize horizontal, vertical and front-back movements, and drives the grinding disc driven by the grinding motor to grind the surface of the silicon carbide ingot.

2. The silicon carbide ingot edge grinding and polishing device according to claim 1, characterized in that: A chamfering grinding unit is arranged on the supporting base plate between the supporting frame and the supporting base; the chamfering grinding unit includes a grinding frame, a grinding seat, a grinding motor and a grinding wheel; the grinding frame is installed on the supporting base plate; the grinding seat is arranged on the grinding frame in an inclined state; the grinding motor is installed on the grinding seat, and a grinding wheel is arranged at the output end of the grinding motor; the axial direction of the grinding wheel is at an inclined angle to the axial direction of the milling wheel, and the milling wheel is moved to the grinding wheel, and the outer contour of the milling wheel is sharpened by the grinding wheel, thereby improving the efficiency of milling the edge of the milling wheel.