Silicon rod cutting machine for wafer manufacturing

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and discloses a silicon rod cutting machine for wafer manufacturing, which comprises a machine body, the top end of the machine body is provided with a sliding chute, the bottom end of the inner wall of the machine body is fixedly connected with a clamping assembly for fixing a silicon crystal rod, and the top end of the clamping assembly is rotatably connected with two clamping plates. The bottom end of the clamping plate is fixedly connected with two limiting rods, the top end of the machine body is fixedly connected with a moving assembly for controlling the cutter to adjust the position, the driving end of the moving assembly is fixedly connected with a chassis, and the inner wall of the bottom end of the chassis is detachably connected with a laser. The inner wall of the chassis is in sliding connection with a trigger assembly used for controlling the clamping state. According to the laser cutting device, the button is pressed to drive the rolling ball to extrude the clamping block, so that the clamping block is separated from the laser, at the moment, the laser can be quickly overhauled and replaced, the shutdown time is shortened, and the cutting efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a silicon rod cutting machine for wafer manufacturing. Background Art

[0002] Semiconductor manufacturing technology refers to the technical process of converting semiconductor materials into electronic devices or integrated circuits with specific electrical properties by using physical and chemical methods. In the semiconductor manufacturing process, materials such as silicon go through steps such as wafer preparation, lithography, etching, doping, deposition, etc. to form tiny electronic circuits and devices. These technologies require extremely high precision and cleanliness and are the foundation of modern electronics industry.

[0003] In the prior art, the cutters of some silicon rod cutting machines cannot be quickly disassembled, which makes it necessary for the staff to replace the entire machine when they need to repair or replace the corresponding model, increasing the downtime and reducing the cutting efficiency. For this reason, a silicon rod cutting machine for wafer manufacturing is proposed to solve the above problems. Content of the Utility Model

[0004] In order to make up for the above deficiencies, the utility model provides a silicon rod cutting machine for wafer manufacturing, aiming to improve the problem that the cutters of some silicon rod cutting machines in the prior art cannot be quickly disassembled, which makes it necessary for the staff to replace the entire machine when they need to repair or replace the corresponding model, increasing the downtime and reducing the cutting efficiency.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0006] A silicon rod cutting machine for wafer manufacturing, including a machine body, a chute is opened at the top end of the machine body, a clamping assembly for fixing a silicon ingot is fixedly connected to the bottom end of the inner wall of the machine body, two clamping plates are rotatably connected to the top end of the clamping assembly, two limiting rods are fixedly connected to the bottom end of the clamping plate, a moving assembly for controlling the position adjustment of the cutter is fixedly connected to the top end of the machine body, a chassis is fixedly connected to the driving end of the moving assembly, a laser is detachably connected to the inner wall of the bottom end of the chassis, a trigger assembly for controlling the clamping state is slidably connected to the inner wall of the chassis, two limiting blocks are slidably connected to the inner wall of the chassis, a side column is fixedly connected to the outer side wall of the limiting block, a spring is sleeved on the outside of the side column, a clamping block is fixedly connected to the outer side wall of the side column, the clamping block is in a clamping relationship with the laser, and a cleaning assembly for cleaning the debris on the top end of the machine body is rotatably connected to the left side of the machine body;

[0007] As a further description of the above technical solution:

[0008] The clamping assembly includes a motor, the bottom end of the motor is fixedly connected to the bottom end of the inner wall of the body, the driving end of the motor is fixedly connected with a top plate, the bottom end of the top plate is fixedly connected with a limiting ring, the top end of the top plate is rotatably connected with two support rods, and the other end of the support rod is rotatably connected with a top column;

[0009] As a further description of the above technical solution:

[0010] The moving assembly includes two slide rails, the bottom ends of the slide rails are fixedly connected to the top end of the body, the top ends of the two slide rails are slidably connected with a slide frame, the inner wall top end of the slide frame is slidably connected with a slider, and the bottom end of the slider is fixedly connected with a cylinder one;

[0011] As a further description of the above technical solution:

[0012] The triggering assembly includes two buttons, the outside of the buttons is slidably connected to the inner wall of the chassis, the outside of the buttons is fixedly connected with a limiting ring, and the inner side wall of the buttons is fixedly connected with a rolling ball;

[0013] As a further description of the above technical solution:

[0014] The cleaning assembly includes a rotating shaft, the outside of the rotating shaft is rotatably connected to the left side of the body, the outside of the rotating shaft is fixedly connected with a bottom block, one side of the bottom block is fixedly connected with a cylinder two, the driving end of the cylinder two is fixedly connected with a cleaning plate, the bottom left side of the body is fixedly connected with a base, the bottom right side of the body is fixedly connected with two slide bars, and the outside of the two slide bars is slidably connected with a storage box;

[0015] As a further description of the above technical solution:

[0016] The bottom end of the limiting ring is rotatably connected to the bottom end of the inner wall of the body, and the outside of the limiting rod is slidably connected to the inner wall of the body;

[0017] As a further description of the above technical solution:

[0018] One end of the spring is fixedly connected to one side of the limiting block, and the other end of the spring is fixedly connected to one side of the clamping block;

[0019] As a further description of the above technical solution:

[0020] The outside of the clamping block is slidably connected to the inner wall of the chassis, and the outside of the limiting ring is slidably connected to the inner wall of the chassis;

[0021] As a further description of the above technical solution:

[0022] The outer side wall of the cleaning plate is in contact with the top end of the base, and the inner side wall of the cleaning plate is slidably connected to the inner wall of the chute.

[0023] The utility model has the following beneficial effects:

[0024] 1. In the utility model, when the button is pressed, it drives the rolling ball to squeeze the clamping block, so that it is disengaged from the laser, and at this time, the laser can be quickly overhauled and replaced, reducing the downtime and thus improving the cutting efficiency.

[0025] 2. In the utility model, after the silicon rod is cut, the bottom block can be rotated to rotate around the rotating shaft, so as to drive the cleaning plate to be lifted by the cylinder two. Then the cleaning plate will fall on the inner wall of the chute. At this time, the cylinder two can be started to drive the cleaning plate to push to the right, so as to push the chips generated during cutting into the interior of the storage box for collection, preventing the chips from affecting the quality of the silicon rod to be cut in the next part; at the same time, after the storage box is full, the staff can pull out the storage box to recycle the chips inside, which is convenient for subsequent recycling. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a three-dimensional schematic diagram of a silicon rod cutting machine for wafer manufacturing proposed by the utility model;

[0027] Figure 2 is a structural schematic diagram of the top plate of a silicon rod cutting machine for wafer manufacturing proposed by the utility model;

[0028] Figure 3 is a structural schematic diagram of the carriage of a silicon rod cutting machine for wafer manufacturing proposed by the utility model;

[0029] Figure 4 is a structural schematic diagram of the button of a silicon rod cutting machine for wafer manufacturing proposed by the utility model;

[0030] Figure 5 is a structural schematic diagram of the storage box of a silicon rod cutting machine for wafer manufacturing proposed by the utility model.

[0031] Legend:

[0032] 1. Machine body; 2. Chute; 3. Motor; 4. Top plate; 5. Limiting ring; 6. Support rod; 7. Top column; 8. Clamping plate; 9. Limiting rod; 10. Slide rail; 11. Carriage; 12. Slide block; 13. Cylinder 1; 14. Chassis; 15. Laser; 16. Button; 17. Limiting ring; 18. Rolling ball; 19. Limiting block; 20. Side column; 21. Spring; 22. Clamping block; 23. Rotating shaft; 24. Bottom block; 25. Cylinder 2; 26. Cleaning plate; 27. Base; 28. Slide bar; 29. Storage box. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] Next, in combination with the accompanying drawings in the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] Refer to Figures 1 - 3 , an embodiment provided by the present invention: a silicon rod cutting machine for wafer manufacturing, including a machine body 1. An elliptical chute 2 is opened at the top end of the machine body 1. Different-sized silicon rods can be placed in the chute 2, thereby improving the practicability of this device. A clamping assembly for fixing the silicon ingot is fixedly connected to the bottom end of the inner wall of the machine body 1. The clamping assembly includes a motor 3. The bottom end of the motor 3 is fixedly connected to the bottom end of the inner wall of the machine body 1. Here, the machine body 1 plays a supporting role for the motor 3. The driving end of the motor 3 is fixedly connected to a top plate 4. After the motor 3 starts, it can drive the top plate 4 to rotate. A limiting ring 5 is fixedly connected to the bottom end of the top plate 4. Here, the limiting ring 5 can ensure the stability of the top plate 4 during rotation. The bottom end of the limiting ring 5 is rotatably connected to the bottom end of the inner wall of the machine body 1. Two support rods 6 are rotatably connected to the top end of the top plate 4. Here, when the top plate 4 rotates, it can drive the support rods 6 to rotate together;

[0035] The other end of the support rod 6 is rotatably connected to a top post 7. Two clamping plates 8 are rotatably connected to the top end of the clamping assembly. Here, the clamping plates 8 are used to fix the silicon rod. Two limiting rods 9 are fixedly connected to the bottom end of the clamping plates 8. The outside of the limiting rods 9 is slidably connected to the inner wall of the machine body 1. Here, the limiting rods 9 can ensure the stability of the clamping plates 8 during movement. A moving assembly for controlling the position adjustment of the cutter is fixedly connected to the top end of the machine body 1. The moving assembly includes two slide rails 10. Here, the machine body 1 provides stable support for the slide rails 10. The bottom end of the slide rails 10 is fixedly connected to the top end of the machine body 1. A sliding frame 11 is slidably connected to the top ends of the two slide rails 10. Here, the sliding frame 11 can slide on the slide rails 10, and a slider 12 can slide on the top end of the inner wall of the sliding frame 11, which is prior art and will not be elaborated here. A slider 12 is slidably connected to the top end of the inner wall of the sliding frame 11. A cylinder 13 is fixedly connected to the bottom end of the slider 12. Here, when the slider 12 moves, it can drive the cylinder 13 to adjust its position. The driving end of the moving assembly is fixedly connected to a chassis 14.

[0036] Refer to Figure 1 , Figure 3 and Figure 4The bottom inner wall of the chassis 14 is detachably connected with a laser 15. The cylinder 13 here can drive the chassis 14 to rise and fall. At the same time, the laser 15 here is a laser cutting device for cutting silicon rods. The inner wall of the chassis 14 is slidably connected with a trigger component for controlling the engagement state. The trigger component includes two buttons 16. The outer part of the button 16 is slidably connected to the inner wall of the chassis 14. The chassis 14 here provides a stable sliding space for the button 16. The outer part of the button 16 is fixedly connected to the limit ring 1 7. The outer portion of the limit ring 17 is slidably connected to the inner wall of the chassis 14. The limit ring 17 here can ensure that the button 16 will not slide off the inner wall of the chassis 14. The inner wall of the button 16 is fixedly connected with a rolling ball 18. The inner wall of the chassis 14 is slidably connected with two limit blocks 19. The outer wall of the limit block 19 is fixedly connected with a side column 20. The limit block 19 here can ensure the stability of the side column 20 when moving. The outer sleeve of the side column 20 is provided with a spring 21, and the outer wall of the side column 20 is fixedly connected with a block 22;

[0037] One end of the spring 21 is fixedly connected to one side of the limit block 19, and the other end of the spring 21 is fixedly connected to one side of the block 22. The spring 21 here is used to provide a reaction force to the block 22 to reset it. The block 22 is in a clamping relationship with the laser 15. The button 16 is pressed here to drive the ball 18 to squeeze the block 22 so that it is out of the clamping range of the laser 15. The laser 15 can be disassembled and repaired or replaced with an adapted size. The outside of the block 22 is slidably connected to the inner wall of the chassis 14. The left side of the body 1 is rotatably connected with a cleaning component for cleaning the debris at the top of the body 1. The cleaning component includes a rotating shaft 23. The outside of the rotating shaft 23 is rotatably connected to the left side of the body 1. The body 1 here provides a stable support for the rotating shaft 23. The outside of the rotating shaft 23 is fixedly connected with a bottom block 24. The bottom block 24 can be pulled up here to rotate around the rotating shaft 23.

[0038] Reference Figure 1 and Figure 5 , one side of the bottom block 24 is fixedly connected with a cylinder 25, and the driving end of the cylinder 25 is fixedly connected with a cleaning plate 26. The inner side wall of the cleaning plate 26 is slidably connected to the inner wall of the slide 2. After rotating 180 degrees, the cleaning plate 26 will fall on the inner wall of the slide 2. At this time, the cylinder 25 can be started to push the cleaning plate 26 to clean the silicon rod debris on the inner wall of the slide 2 to prevent affecting the subsequent silicon rod quality. A base 27 is fixedly connected to the left side of the bottom end of the body 1. The outer side wall of the cleaning plate 26 contacts the top of the base 27. The cleaning plate 26 here will be supported by the base 27 when it is put down, which plays a role in stable placement. Two slide bars 28 are fixedly connected to the right side of the bottom end of the body 1. The outer side of the two slide bars 28 is slidably connected with a storage box 29. The storage box 29 here is used to collect silicon rod debris. When it is full, the handle on the right side can be pulled out for processing, which is convenient for subsequent use.

[0039] Working principle: First, place the silicon rod to be cut on the inner wall of the chute 2 at the top of the machine body 1. At this time, start the motor 3 to drive the rotation of the top plate 4, thereby driving the rotation of the two support rods 6, which drives the top column 7 and the clamping plate 8 to clamp towards the center, thus fixing the silicon rod. The limit rod 9 here can ensure the stability and accuracy of the clamping plate 8 during movement, preventing deviation. At this time, the carriage 11 can be operated to slide on the slide rail 10 to adjust the position to be cut. After completion, control the cylinder 13 to drive the chassis 14 and the laser 15 to descend, and then control the slider 12 to slide back and forth on the inner top of the carriage 11, thereby realizing the cutting of the silicon rod.

[0040] After long-term use, the laser 15 needs to be overhauled and it is convenient to replace it when different specifications of lasers 15 are required. At this time, press the buttons 16 on both sides. The buttons 16 will drive the rolling balls 18 to squeeze the clamping blocks 22, so that they are disengaged from the clamping of the laser 15. At this time, the laser 15 can be easily disassembled. After completion, when reinstalling, continue to press the button 16, insert the laser 15, and release the hand when the clamping block 22 moves to a suitable distance for clamping with the laser 15. At this time, under the action of the spring 21, the limit block 19 will drive the side column 20 to reset, so that the clamping block 22 is engaged with the laser 15.

[0041] After cutting, take away the silicon rod. At this time, the bottom block 24 can be pulled up to rotate 180 degrees around the rotating shaft 23, so that one side of the cleaning plate 26 is attached to the inner wall of the chute 2. At this time, the cylinder 25 can be started to push the cleaning plate 26 to push the cutting silicon rod debris on the inner wall of the chute 2 to the rightmost side of the machine body 1, and then it falls into the internal part of the storage box 29, thus completing the cleaning and preventing the quality of the subsequent silicon rod from being affected by the silicon rod debris. After the storage box 29 is full, the handle on the right side can be pulled to pull out the storage box 29 to process the silicon rod debris inside. After completion, align it with the slide bar 28 and reinsert it into the right bottom end of the machine body 1.

[0042] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A silicon rod cutting machine for wafer production, comprising a machine body (1), characterized in that: The top of the machine body (1) is provided with a slide groove (2), the bottom end of the inner wall of the machine body (1) is fixedly connected to a clamping assembly for fixing a silicon crystal rod, the top of the clamping assembly is rotatably connected to two clamping plates (8), the bottom end of the clamping plates (8) is fixedly connected to two limit rods (9), the top of the machine body (1) is fixedly connected to a moving assembly for controlling the cutter to adjust the position, the driving end of the moving assembly is fixedly connected to a chassis (14), the bottom inner wall of the chassis (14) is detachably connected to a laser (15), and the chassis (1 The inner wall of the chassis (14) is slidably connected to a trigger component for controlling the engaging state, the inner wall of the chassis (14) is slidably connected to two limit blocks (19), the outer wall of the limit block (19) is fixedly connected to a side column (20), the outer sleeve of the side column (20) is provided with a spring (21), the outer wall of the side column (20) is fixedly connected to a clamping block (22), the clamping block (22) is in a clamping relationship with the laser (15), and the left side of the body (1) is rotatably connected to a cleaning component for cleaning debris at the top of the body (1).

2. The silicon rod cutting machine for wafer production according to claim 1, characterized in that: The clamping assembly comprises a motor (3), the bottom end of the motor (3) is fixedly connected to the bottom end of the inner wall of the machine body (1), the driving end of the motor (3) is fixedly connected to a top plate (4), the bottom end of the top plate (4) is fixedly connected to a limiting ring (5), the top end of the top plate (4) is rotatably connected to two support rods (6), and the other end of the support rod (6) is rotatably connected to a top column (7).

3. The silicon rod cutting machine for wafer production according to claim 1, characterized in that: The moving assembly comprises two slide rails (10), the bottom ends of the slide rails (10) are fixedly connected to the top end of the machine body (1), the top ends of the two slide rails (10) are slidably connected to a slide frame (11), the top end of the inner wall of the slide frame (11) is slidably connected to a slider (12), and the bottom end of the slider (12) is fixedly connected to a cylinder 1 (13).

4. The silicon rod cutting machine for wafer production according to claim 1, characterized in that: The trigger assembly comprises two buttons (16), the outside of the buttons (16) being slidably connected to the inner wall of the chassis (14), the outside of the buttons (16) being fixedly connected to a limit ring (17), and the inner wall of the buttons (16) being fixedly connected to a rolling ball (18).

5. The silicon rod cutting machine for wafer production according to claim 1, characterized in that: The cleaning assembly comprises a rotating shaft (23), the outer portion of the rotating shaft (23) is rotatably connected to the left side of the machine body (1), the outer portion of the rotating shaft (23) is fixedly connected to a bottom block (24), one side of the bottom block (24) is fixedly connected to a second cylinder (25), the driving end of the second cylinder (25) is fixedly connected to a cleaning plate (26), the left side of the bottom end of the machine body (1) is fixedly connected to a base (27), the right side of the bottom end of the machine body (1) is fixedly connected to two slide bars (28), and the outer portions of the two slide bars (28) are slidably connected to a storage box (29).

6. The silicon rod cutting machine for wafer production according to claim 2, characterized in that: The bottom end of the limiting ring (5) is rotatably connected to the bottom end of the inner wall of the machine body (1), and the outside of the limiting rod (9) is slidably connected to the inner wall of the machine body (1).

7. The silicon rod cutting machine for wafer production according to claim 1, characterized in that: One end of the spring (21) is fixedly connected to one side of the limit block (19), and the other end of the spring (21) is fixedly connected to one side of the clamping block (22).

8. The silicon rod cutting machine for wafer production according to claim 4, characterized in that: The outside of the clamping block (22) is slidably connected to the inner wall of the chassis (14), and the outside of the limiting ring (17) is slidably connected to the inner wall of the chassis (14).

9. The silicon rod cutting machine for wafer production according to claim 5, characterized in that: The outer side wall of the cleaning plate (26) contacts the top of the base (27), and the inner side wall of the cleaning plate (26) is slidably connected to the inner wall of the slide groove (2).

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